Adjustable cleaning device for chip etching interface

Abstract

The utility model discloses a kind of adjustable cleaning devices for chip corrosion interface, it is related to chip cleaning technical field, including cleaning tank, the bottom of cleaning tank is funnel shape, and the bottom end of cleaning tank is sealed, the outer wall bottom of cleaning tank is fixed with U-shaped frame, ultrasonic cleaning assembly is installed at the bottom end of cleaning tank, the inner wall of cleaning tank is fixed with support plate, the middle part of support plate is provided with cleaning frame, the top of the outer wall side of cleaning tank is fixed with high-pressure water pump, the one end of water outlet pipe connected with the water outlet end of high-pressure water pump extends to the inside of cleaning tank, and the water outlet pipe is installed with spray head on the top of cleaning frame. In the utility model, mechanical vibration is formed by ultrasonic cleaning assembly to generate cavitation bubble, and cavitation bubble is closed to generate shock wave to destroy insoluble dirt on chip surface, and by adjusting and switching high-pressure water pump to pump high-purity water to flush, it can effectively remove strongly adherent particulate matter, and cleaning tank inner wall can also be flushed, to avoid residual influence subsequent use.

Description

Technical Field

[0001] This utility model relates to the field of chip cleaning technology, and in particular to an adjustable cleaning device for chip etching interfaces. Background Technology

[0002] Cleaning after bevel etching of power devices is a critical step in the manufacturing process. After etching, chemical etching solutions, metal ions, or particulate matter may remain on the surface. These residues can lead to a decrease in the device's breakdown voltage, an increase in leakage current, and a reduction in reliability. Thorough cleaning can prevent the degradation of electrical performance.

[0003] Currently, the industry commonly uses jet etching technology, followed by automatic high-purity water rinsing. Most companies' jet etching machines utilize factory-sourced high-purity water, with pressure reduced and angle adjusted at the machine end for spraying. However, this method is ineffective at removing highly adhesive particulate matter. Therefore, this paper presents an adjustable cleaning device for chip etching interfaces. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides an adjustable cleaning device for chip corrosion interfaces. It utilizes an ultrasonic cleaning component to generate mechanical vibrations that create cavitation bubbles. The closing of these bubbles generates shock waves that break down insoluble contaminants on the chip surface. Furthermore, by adjusting and switching a high-pressure water pump to deliver high-purity water for rinsing, it effectively removes highly adhesive particulate matter and also cleans the inner wall of the cleaning chamber, preventing residues from affecting subsequent use. This overcomes the deficiencies of existing technologies.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An adjustable cleaning device for chip etching interfaces includes a cleaning tank with a funnel-shaped bottom that is sealed at the bottom. A U-shaped frame is fixed to the bottom of the outer wall of the cleaning tank. An ultrasonic cleaning assembly is installed at the bottom of the cleaning tank. A support plate is fixed to the inner wall of the cleaning tank. A cleaning frame is provided in the middle of the support plate. A high-pressure water pump is fixed to the top of one side of the outer wall of the cleaning tank. One end of a water outlet pipe connected to the outlet of the high-pressure water pump extends into the interior of the cleaning tank. A nozzle is installed on the water outlet pipe above the cleaning frame.

[0006] As a further improvement of this utility model: the pumping end of the high-pressure water pump is connected to a pumping pipe, and one end of the pumping pipe is connected to a water storage container.

[0007] As a further embodiment of this utility model: the ultrasonic cleaning assembly includes a transducer installed at the bottom of the cleaning tank, and an ultrasonic generator is installed on one side of the inner wall of the U-shaped frame, with the transducer and the ultrasonic generator being electrically connected.

[0008] As a further improvement of this utility model: a control switch is installed on the outer wall of the cleaning tank, and the high-pressure water pump, ultrasonic generator and transducer are all electrically connected to the control switch.

[0009] As a further improvement of this utility model: the cleaning rack includes a through hole fixed in the middle of the support plate, the lower end of the through hole is connected to a tube, and the lower end of the tube is provided with a support net.

[0010] As a further improvement of this utility model, a support frame is fixed in the middle of the inner wall of the tube.

[0011] As a further improvement of this utility model: a drain valve is installed at the bottom of the side wall of the cleaning tank, and connection holes are provided at the four corners of the horizontal section of the U-shaped frame.

[0012] The beneficial effects of this utility model are as follows: 1. The ultrasonic cleaning component generates mechanical vibration to form cavitation bubbles. The closing of these bubbles produces shock waves that break down insoluble contaminants on the chip surface. By adjusting and switching the high-pressure water pump to pump high-purity water for rinsing, it can effectively remove strongly adhering particulate matter and also rinse the inner wall of the cleaning chamber to avoid residues affecting subsequent use.

[0013] 2. The support frame helps the chip stand upright, making it easier for particles to fall off. The control switch centrally controls each component, and the drain valve quickly discharges sewage. The overall design optimizes the cleaning process and helps to efficiently complete the cleaning of the chip corrosion interface. Attached Figure Description

[0014] Figure 1 This is a first-view three-dimensional structural diagram of an adjustable cleaning device for chip etching interfaces proposed in this utility model.

[0015] Figure 2 This is a second-view three-dimensional structural diagram of an adjustable cleaning device for chip etching interfaces proposed in this utility model.

[0016] Figure 3 This is a third-view perspective three-dimensional structural diagram of an adjustable cleaning device for chip etching interfaces proposed in this utility model.

[0017] Figure 4 This invention proposes an adjustable cleaning device for chip etching interfaces. Figure 3 Enlarged structural diagram at point A in the middle.

[0018] In the diagram: 1. Cleaning tank; 2. Control switch; 3. U-shaped frame; 4. Drain valve; 5. Support net; 6. High-pressure water pump; 7. Water suction pipe; 8. Support plate; 9. Water outlet pipe; 10. Nozzle; 11. Pipe body; 12. Ultrasonic generator; 13. Transducer; 14. Connection hole; 15. Support frame. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Example 1, referring to Figure 1-4 An adjustable cleaning device for chip etching interfaces includes a cleaning tank 1 with a funnel-shaped bottom and a sealed bottom. A U-shaped frame 3 is fixed to the bottom of the outer wall of the cleaning tank 1. An ultrasonic cleaning assembly is installed at the bottom of the cleaning tank 1. A support plate 8 is fixed to the inner wall of the cleaning tank 1. A cleaning frame is provided in the middle of the support plate 8. A high-pressure water pump 6 is fixed to the top of one side of the outer wall of the cleaning tank 1. One end of a water outlet pipe 9 connected to the outlet of the high-pressure water pump 6 extends into the interior of the cleaning tank 1. A nozzle 10 is installed on the water outlet pipe 9 and above the cleaning frame.

[0021] The pumping end of the high-pressure water pump 6 is connected to a pumping pipe 7, and one end of the pumping pipe 7 is connected to a water storage container.

[0022] The ultrasonic cleaning assembly includes a transducer 13 installed at the bottom of the cleaning tank 1, and an ultrasonic generator 12 installed on one side of the inner wall of the U-shaped frame 3. The transducer 13 is electrically connected to the ultrasonic generator 12.

[0023] The outer wall of the cleaning tank 1 is equipped with a control switch 2. The high-pressure water pump 6, ultrasonic generator 12 and transducer 13 are all electrically connected to the control switch 2.

[0024] The cleaning rack includes a through hole fixed in the middle of the support plate 8, and a pipe 11 is connected to the lower end of the through hole. A support net 5 is provided at the lower end of the pipe 11.

[0025] A drain valve 4 is installed on the bottom side wall of the cleaning tank 1. Connection holes 14 are provided at the four corners of the horizontal section of the U-shaped frame 3. The U-shaped frame 3 can be fixed to the installation position by bolts through the connection holes 14.

[0026] Add cleaning fluid to the cleaning tank 1 until it submerges the tube 11. Place the chip on the support mesh 5 of the tube 11. Turn on the ultrasonic generator 12 and transducer 13. The ultrasonic generator 12 generates a high-frequency electrical signal, which is converted into mechanical vibration by the transducer 13. This creates alternating dense and sparse waves in the cleaning fluid. These waves cause the liquid to generate tens of thousands of tiny bubbles, or cavitation bubbles. These cavitation bubbles vibrate under the action of the sound field. When the sound pressure reaches a certain value, they grow rapidly and then suddenly close. At the moment of closure, a powerful shock wave is generated, which can effectively destroy the insoluble dirt on the chip surface and disperse it in the cleaning fluid. After the ultrasonic cleaning is completed, turn off the ultrasonic generator 12 and transducer 13, and open the drain valve 4 to drain the wastewater. Then turn on the high-pressure water pump 6 to pump high-purity water from the water storage container and spray it onto the chip from the nozzle 10. This allows the high-pressure water to further wash away the attached particulate matter on the chip, improving the cleaning efficiency. The high-pressure water can also clean the inner wall of the cleaning tank 1.

[0027] Example 2 is an optimization based on Example 1, specifically: A support frame 15 is fixed in the middle of the inner wall of the tube 11. The chip is placed on the support mesh 5 from inside the support frame 15. The support of the support frame 15 makes it easy for the chip to stand up and for the adhering particles to fall off the chip during cleaning.

[0028] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. An adjustable cleaning device for chip etching interfaces, comprising a cleaning tank (1), characterized in that, The bottom of the cleaning box (1) is funnel-shaped and sealed at the bottom. A U-shaped frame (3) is fixed to the bottom of the outer wall of the cleaning box (1). An ultrasonic cleaning assembly is installed at the bottom of the cleaning box (1). A support plate (8) is fixed to the inner wall of the cleaning box (1). A cleaning frame is provided in the middle of the support plate (8). A high-pressure water pump (6) is fixed to the top of one side of the outer wall of the cleaning box (1). One end of the water outlet pipe (9) connected to the water outlet of the high-pressure water pump (6) extends into the interior of the cleaning box (1). A nozzle (10) is installed on the water outlet pipe (9) and above the cleaning frame.

2. The adjustable cleaning device for chip etching interfaces according to claim 1, characterized in that, The high-pressure water pump (6) is connected to a pumping pipe (7) at its pumping end, and one end of the pumping pipe (7) is connected to a water storage container.

3. The adjustable cleaning device for chip etching interfaces according to claim 2, characterized in that, The ultrasonic cleaning assembly includes a transducer (13) installed at the bottom of the cleaning tank (1), and an ultrasonic generator (12) installed on one side of the inner wall of the U-shaped frame (3). The transducer (13) is electrically connected to the ultrasonic generator (12).

4. The adjustable cleaning device for chip etching interfaces according to claim 1, characterized in that, The outer wall of the cleaning tank (1) is equipped with a control switch (2), and the high-pressure water pump (6), ultrasonic generator (12) and transducer (13) are all electrically connected to the control switch (2).

5. The adjustable cleaning device for chip etching interfaces according to claim 1, characterized in that, The cleaning rack includes a through hole fixed in the middle of the support plate (8), and a tube (11) is connected to the lower end of the through hole. A support net (5) is provided at the lower end of the tube (11).

6. The adjustable cleaning device for chip etching interfaces according to claim 5, characterized in that, A support frame (15) is fixed in the middle of the inner wall of the tube (11).

7. The adjustable cleaning device for chip etching interfaces according to claim 1, characterized in that, The bottom of the side wall of the cleaning tank (1) is equipped with a drain valve (4), and the four corners of the horizontal section of the U-shaped frame (3) are provided with connection holes (14).

Images