A semiconductor wafer single wafer cleaning apparatus

Abstract

The utility model relates to the technical field of semiconductor wafer cleaning, concretely to a semiconductor wafer single wafer cleaning device, including the body, the inside fixed connection of body has the mounting bracket, the bottom fixed connection of mounting bracket has two connecting pipes, the outside of connecting pipe has set up two clamping grooves, the inside joint of clamping groove has the clamping block, the outside sliding connection of clamping block has the spray head, the spray head cover sets up in the outside of connecting pipe, the inside of spray head has set up two installation slots, the fixed connection of clamping block far away from clamping groove one end has the installation piece, the fixed connection of installation piece far away from clamping block one end has the pull rope, through the spray head cover setting in the connecting pipe, and utilize the clamping block to limit the spray head, and then make the spray head convenient installation and disassembly, make the replacement efficiency higher, thereby not only reduced the cost of employing people, and improved the use efficiency, and then make the use economy is better.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer cleaning technology, and more specifically, to a single-wafer cleaning device for semiconductor wafers. Background Technology

[0002] Semiconductor wafers undergo complex processes such as cutting, grinding, polishing, and cleaning during production. The final cleaning process, which uses ultrasonic cleaning technology or water washing, removes impurities remaining on the surface of the semiconductor wafer and is an important process in semiconductor wafer production.

[0003] A search revealed a single-wafer cleaning device in the prior art, with patent publication number CN221407242U. The specification describes a method where the cleaning solution is thoroughly atomized and mixed through a nozzle, and then sprayed onto the wafer surface under pressure for cleaning. This atomization and mixing method reduces solution consumption and significantly improves cleaning efficiency. The device can also be customized to handle wafers of different sizes by adjusting the length of the sliding track.

[0004] However, in actual use, the nozzle will gradually age after a long period of use, and then it needs to be replaced. Since it is usually installed on the machine body by threads, tools are needed to disassemble it during replacement, which makes the replacement efficiency low and thus the use economy low. Utility Model Content

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a semiconductor wafer single-wafer cleaning device to solve the problem that the prior art requires the use of tools to replace the nozzle, resulting in low replacement efficiency and thus low economic efficiency.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a semiconductor wafer single-wafer cleaning device, comprising a body, an installation frame fixedly connected inside the body, two connecting tubes fixedly connected to the bottom end of the installation frame, two slots opened on the outside of the connecting tubes, a locking block being engaged inside the slots, and a nozzle being slidably connected to the outside of the locking block, the nozzle being sleeved on the outside of the connecting tube.

[0007] The nozzle has two mounting slots inside. The end of the locking block away from the slot is fixedly connected to a mounting plate. The end of the mounting plate away from the locking block is fixedly connected to a pull rope. The other end of the pull rope is fixedly connected to a pull ring. An elastic element is sleeved on the outside of the pull rope.

[0008] The inner side of the pull ring is fixedly connected to a limiting ring, and the inner side of the limiting ring is provided with multiple slots. The outer side of the nozzle is provided with a sliding groove, and the inner side of the sliding groove is provided with two limiting grooves. The inner wall of the limiting groove is fixedly connected with multiple inserts.

[0009] The card block is slidably connected inside the mounting groove, the mounting plate is slidably connected inside the mounting groove, and the pull rope is slidably connected inside the mounting groove.

[0010] One end of the elastic element is fixedly connected to the inner wall of the mounting groove, and the other end of the elastic element is fixedly connected to the mounting plate.

[0011] The pull ring is slidably connected inside the slide groove, and the limiting ring is slidably connected inside the slide groove.

[0012] The limiting ring fits into the inside of the limiting groove, and the insert block is inserted into the inside of the slot.

[0013] Compared with the prior art, the beneficial effects of this utility model are: In the above solution, by fitting the nozzle onto the connecting pipe and using a locking block to limit the nozzle, the nozzle can be easily installed and removed, resulting in high replacement efficiency. This not only reduces labor costs but also improves usage efficiency, thus making it more economical to use. Attached Figure Description

[0014] Figure 1 This is a perspective view of the present utility model; Figure 2 This is a front view of the nozzle of this utility model; Figure 3 For the present utility model Figure 2 Cross-sectional view of the structure at point AA; Figure 4 For the present utility model Figure 3 Enlarged view of the structure at point A in the middle; Figure 5 For the present utility model Figure 3 Enlarged view of the structure at point B in the middle.

[0015] [Figure Labels] 1. Body; 2. Connecting pipe; 3. Slot; 4. Block; 5. Nozzle; 6. Mounting bracket; 7. Mounting groove; 8. Mounting plate; 9. Pull rope; 10. Elastic element; 11. Pull ring; 12. Limiting ring; 13. Slot; 14. Slide groove; 15. Limiting groove; 16. Insert block. Detailed Implementation

[0016] To make the technical problems, technical solutions and advantages of this utility model clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0017] Example 1: Please refer to Figures 1 to 5 This utility model provides a technical solution: a semiconductor wafer single-wafer cleaning device, including a body 1, an installation frame 6 fixedly connected inside the body 1, two connecting tubes 2 fixedly connected to the bottom end of the installation frame 6, the installation frame 6 provides installation space for the connecting tubes 2, two slots 3 are opened on the outside of the connecting tubes 2, a locking block 4 is locked inside the slots 3, and a nozzle 5 is slidably connected to the outside of the locking block 4, so that the nozzle 5 can be limited and the nozzle 5 is sleeved on the outside of the connecting tube 2, thereby making the nozzle 5 stably installed.

[0018] When the nozzle 5 needs to be disassembled, the two locking blocks 4 are moved to opposite sides, allowing the locking blocks 4 to slide into the interior of the nozzle 5, thus freeing the nozzle 5 from restriction. The nozzle 5 is then pulled down, allowing it to detach from the outside of the connecting pipe 2. Conversely, by placing the nozzle 5 on the outside of the connecting pipe 2 and moving the locking blocks 4 inward, the locking blocks 4 can engage with the inside of the locking slot 3, ensuring stable installation of the nozzle 5 and convenient replacement. This not only reduces labor costs but also improves efficiency, resulting in better economic benefits.

[0019] Example 2: Based on Example 1, in order to facilitate the pulling of the locking block 4, two mounting grooves 7 are opened inside the nozzle 5. The locking block 4 is slidably connected inside the mounting groove 7, and the locking block 4 limits the mounting groove 7, so that the mounting groove 7 can slide smoothly. The end of the locking block 4 away from the locking groove 3 is fixedly connected to the mounting piece 8. The mounting piece 8 is slidably connected inside the mounting groove 7, and the mounting groove 7 limits the mounting piece 8, so that the mounting piece 8 will not deviate when sliding. The end of the mounting piece 8 away from the locking block 4 is fixedly connected to the pull rope 9. The pull rope 9 is slidably connected inside the mounting groove 7, and the mounting groove 7 limits the pull rope 9, so that the pull rope 9 can slide smoothly. The other end of the pull rope 9 is fixedly connected to the pull ring 11. An elastic element 10 is sleeved on the outside of the pull rope 9. One end of the elastic element 10 is fixedly connected to the inner wall of the mounting groove 7, and the other end of the elastic element 10 is fixedly connected to the mounting piece 8.

[0020] When the locking block 4 needs to be pulled, the pull ring 11 is pulled downwards, causing one end of the pull rope 9 to move downwards. This causes the other end of the pull rope 9 to pull the mounting piece 8 inwards, causing the mounting piece 8 to compress the elastic element 10 and deform, thus driving the locking block 4 into the interior of the mounting groove 7. Conversely, by releasing the pull ring 11, the elastic element 10 is reset, causing it to push the mounting piece 8 inwards, thus allowing the mounting piece 8 to push the locking block 4 into the interior of the locking groove 3.

[0021] Example 3: Based on Example 2, in order to limit the pull ring 11, a limiting ring 12 is fixedly connected to the inner side of the pull ring 11. Multiple slots 13 are provided on the inner side of the limiting ring 12. A sliding groove 14 is provided on the outer side of the nozzle 5. The pull ring 11 is slidably connected to the inside of the sliding groove 14. The sliding groove 14 limits the pull ring 11, allowing the pull ring 11 to slide smoothly. The limiting ring 12 is slidably connected to the inside of the sliding groove 14, allowing the sliding groove 14 to compress the limiting ring 12 and cause deformation. Two limiting grooves 15 are provided inside the sliding groove 14. The limiting ring 12 fits into the inside of the limiting groove 15, allowing the pull ring 11 to be limited. Multiple inserts 16 are fixedly connected to the inner wall of the limiting groove 15. The inserts 16 are inserted into the inside of the slots 13, allowing the pull ring 11 to be limited again.

[0022] When the pull ring 11 is pulled downwards, the pull ring 11 pulls the limiting ring 12 downwards, allowing the limiting ring 12 to disengage from the inside of the upper limiting groove 15 and the insert 16 to disengage from the inside of the slot 13. When the bottom end of the pull ring 11 is in contact with the lower side of the inner wall of the slide groove 14, the limiting ring 12 can move back to its original position, allowing the limiting ring 12 to fill the inside of the lower limiting groove 15 and allowing the insert 16 to be inserted into the inside of the slot 13, thereby limiting the pull ring 11.

[0023] The working process of this utility model is as follows: When nozzle 5 needs to be installed, pulling the pull ring 11 downwards moves the limiting ring 12 downwards, causing the limiting ring 12 to disengage from the upper limiting groove 15 and the insert block 16 to disengage from the slot 13. This also causes the pull ring 11 to pull one end of the pull rope 9 downwards, which in turn pulls the mounting piece 8 inwards. The mounting piece 8 then compresses the elastic element 10, causing deformation and sliding the locking block 4 into the mounting groove 7. Once the bottom end of the pull ring 11 is in contact with the lower inner wall of the slide groove 14, the limiting ring 12 returns to its original position, filling the lower limiting groove 15 and allowing the insert block 16 to be inserted into the slot 13. The pull ring 11 is limited inside the tube 2. The nozzle 5 is then fitted onto the outside of the connecting pipe 2, and the pull ring 11 is pushed upward so that it fits against the upper side of the inner wall of the slide groove 14. This allows the limiting ring 12 to fit against the inside of the upper limiting groove 15. At this point, the elastic element 10 is no longer restricted, allowing it to reset and move. This pushes the mounting piece 8 inward, allowing the mounting piece 8 to push the locking block 4 into the slot 3, thus ensuring the nozzle 5 is stably installed. Conversely, it can be easily disassembled and replaced, reducing labor costs and improving efficiency, resulting in better economic efficiency.

[0024] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change. Secondly: The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other. Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor wafer single-wafer cleaning device, characterized in that, Includes a body (1), with a mounting bracket (6) fixedly connected inside the body (1). Two connecting pipes (2) are fixedly connected to the bottom end of the mounting bracket (6). Two slots (3) are opened on the outside of the connecting pipes (2). A locking block (4) is locked inside the slots (3). A nozzle (5) is slidably connected to the outside of the locking block (4). The nozzle (5) is sleeved on the outside of the connecting pipes (2).

2. The semiconductor wafer single-wafer cleaning apparatus according to claim 1, characterized in that, The nozzle (5) has two mounting slots (7) inside. The end of the locking block (4) away from the slot (3) is fixedly connected to a mounting piece (8). The end of the mounting piece (8) away from the locking block (4) is fixedly connected to a pull rope (9). The other end of the pull rope (9) is fixedly connected to a pull ring (11). An elastic element (10) is sleeved on the outside of the pull rope (9).

3. The semiconductor wafer single-wafer cleaning apparatus according to claim 2, characterized in that, The inner side of the pull ring (11) is fixedly connected to a limiting ring (12), and the inner side of the limiting ring (12) is provided with multiple slots (13). The outer side of the nozzle (5) is provided with a sliding groove (14), and the inner side of the sliding groove (14) is provided with two limiting grooves (15). The inner wall of the limiting groove (15) is fixedly connected with multiple inserts (16).

4. The semiconductor wafer single-wafer cleaning apparatus according to claim 2, characterized in that, The card block (4) is slidably connected inside the mounting groove (7), the mounting piece (8) is slidably connected inside the mounting groove (7), and the pull rope (9) is slidably connected inside the mounting groove (7).

5. The semiconductor wafer single-wafer cleaning apparatus according to claim 2, characterized in that, One end of the elastic element (10) is fixedly connected to the inner wall of the mounting groove (7), and the other end of the elastic element (10) is fixedly connected to the mounting plate (8).

6. The semiconductor wafer single-wafer cleaning apparatus according to claim 3, characterized in that, The pull ring (11) is slidably connected inside the slide groove (14), and the limiting ring (12) is slidably connected inside the slide groove (14).

7. The semiconductor wafer single-wafer cleaning apparatus according to claim 3, characterized in that, The limiting ring (12) fits into the inside of the limiting groove (15), and the insert (16) is inserted into the inside of the slot (13).

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