IGBT lead frame stamping die

Abstract

The utility model relates to a kind of IGBT lead frame stamping die, belong to stamping die technical field, including upper die and lower die, the top of lower die is provided with forming cavity, the lower die top is provided with four groups respectively located in the placing mechanism of the four corner of forming cavity. This IGBT lead frame stamping die, by placing raw material plate in the placing groove on the top of four placing blocks, placing groove is positioned to raw material plate, avoid raw material plate, produce shaking before stamping, placing block is moved down and shrinks to first movable slot when stamping, raw material plate is placed in forming cavity, after stamping forming is completed, upper die and lower die separate after placing block loses external force and move upward under the action of first spring, hold up the lead frame after forming and separate from forming cavity, until moving to the top of lower die, it is convenient for personnel's to take, solve the phenomenon that raw material plate appears unstable position when placing die stamping in the existing die for lead frame, affect product stamping quality problem.

Description

Technical Field

[0001] This utility model relates to the field of stamping die technology, specifically to an IGBT lead frame stamping die. Background Technology

[0002] Insulated Gate Bipolar Transistors (IGBTs) combine the advantages of power transistors and electric field-effect transistors, possessing excellent characteristics and a wide range of applications. The IGBT leadframe is a metal structural component in transistor packaging, used to connect the internal circuitry of the chip to external wires for electrical connection, while also providing mechanical support and heat dissipation. As the chip carrier of integrated circuits, the leadframe is a key structural component that uses bonding materials (gold, aluminum, or copper wires) to achieve electrical connection between the internal circuit leads and external leads, forming an electrical circuit. It acts as a bridge connecting to external wires, and leadframes are required in the vast majority of semiconductor integrated circuits, making it an important basic material in the electronics and information industry.

[0003] In the production process of IGBT lead frames, stamping dies are required. A search revealed a patent document with publication number CN220612083U, which discloses a metal lead frame stamping die. This die includes an upper die base with a pressure plate installed at its bottom. Limiting rods are fixed at the four corners of the upper die base's bottom. A lower die base is located below the upper die base, and a metal lead frame forming cavity is opened at the top of the lower die base. A cleaning component is located on one side of the lower die base. Under the thrust of the hydraulic cylinder of the stamping press, the upper die base causes the limiting rods to insert into the inner side of the slide groove. Gas inside the airbag enters the inner side of the second air groove. This invention utilizes gas to blow out the metal debris after stamping the metal lead frame forming cavity. This can move the stamped lead frame parts, loosening the lead frame parts from the metal lead frame forming cavity, making it easier for workers to remove the lead frame from inside the metal lead frame forming cavity. During this process, workers do not need to manually clean the inside of the metal lead frame forming cavity, reducing their workload and improving their efficiency.

[0004] However, in this utility model, when the upper and lower dies are closed in preparation for the stamping operation, the air bladder blows air out through the first air groove, which blows the raw material plate placed in the forming cavity. Before the upper and lower dies are completely closed, the plate will detach from the forming cavity, causing the stamping position to deviate, which is a shortcoming. Therefore, an IGBT lead frame stamping die is proposed to solve the above-mentioned problems. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides an IGBT lead frame stamping die, which has the advantages of easy placement and removal of the lead frame and automatic cleaning of stamping waste. It solves the problem that existing die-casting dies for lead frames cause instability in the position of the raw material sheet during stamping, affecting the stamping quality of the product.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an IGBT lead frame stamping die, comprising an upper die and a lower die, wherein the top of the lower die has a forming cavity, and the top of the lower die is provided with four sets of placement mechanisms located at the four corners of the forming cavity, and the bottom of the upper die is fixedly installed with a stamping head; the placement mechanism includes a placement block, the top of the lower die has a first movable groove located at the corner of the forming cavity and communicating with it, the inner bottom wall of the first movable groove is fixedly installed with a guide rod, the placement block is slidably installed in the first movable groove, the bottom of the placement block has a second movable groove, the top of the guide rod is slidably installed in the second movable groove, a first spring located outside the guide rod is fixedly installed between the bottom of the placement block and the inner bottom wall of the first movable groove, and the top of the placement block has a placement groove.

[0007] Furthermore, the inner dimensions of the four placement slots are adapted to the inner dimensions of the molding cavity, and the depth of the first movable slot is greater than the height of the placement block.

[0008] Furthermore, four rectangular connecting rods are fixedly installed on the top of the upper die, and a top die located outside the stamping head is slidably installed on the outside of the four connecting rods. The top of the top die has four third movable grooves corresponding to the connecting rods respectively. The connecting rods are located in the third movable grooves and a second spring is fixedly installed at their bottom.

[0009] Furthermore, the thickness of the stamping head is greater than the thickness of the top die, and the bottom position of the stamping head does not exceed the bottom of the top die.

[0010] Furthermore, the inner bottom wall of the forming cavity is provided with a stamping hole corresponding to the stamping head, and the bottom of the lower die is provided with a blanking groove communicating with the stamping hole.

[0011] Furthermore, two chip removal grooves communicating with the material discharge groove are provided on the bottom wall of the inner side of the molding cavity, and the two chip removal grooves are respectively located at the left and right ends of the inner side of the molding cavity.

[0012] Furthermore, a fourth movable groove is provided on the inner left wall of the molding cavity, and an electric telescopic rod with its output end facing right is fixedly installed on the inner left wall of the fourth movable groove. A cleaning brush plate is fixedly connected to the right end of the output end of the electric telescopic rod.

[0013] Furthermore, the bottom of the cleaning plate is evenly provided with bristles, which are in contact with the inner bottom wall of the molding cavity.

[0014] Compared with the prior art, this utility model provides an IGBT lead frame stamping die, which has the following advantages: 1. When it is necessary to clean the residual debris in the forming cavity of the IGBT lead frame stamping die, the electric telescopic rod is activated. The output end of the electric telescopic rod extends and drives the cleaning brush plate to move to the right. Under the action of the brush bristles, the residual debris on the bottom wall of the forming cavity is cleaned to avoid the residual debris in the forming cavity from affecting the stamping quality.

[0015] 2. This IGBT lead frame stamping die, by placing the raw material plate in the placement slots on top of four placement blocks, positions the raw material plate. The upper die moves downward, first causing the top die to contact the placement block, pushing the placement block downward and retracting into the first movable slot until the raw material plate is placed in the forming cavity. At this time, after the top die contacts the lower die, the upper die drives the stamping head to continue moving downward to stamp the raw material plate. After stamping is completed, the upper die and lower die separate. After the four placement blocks lose external force, they move upward under the action of the first spring, lifting the formed lead frame and detaching it from the forming cavity until it moves to the top of the lower die, making it easy for personnel to pick up. This solves the problem that existing molds used for lead frames cause the raw material plate to be unstable in position during stamping, affecting the stamping quality of the product. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a cross-sectional view of the lower mold structure of this utility model; Figure 3 This utility model Figure 2 A magnified structural diagram of structure A is shown below; Figure 4 This is a front cross-sectional view of the structure of this utility model; Figure 5 This utility model Figure 4 A magnified structural diagram of B is shown.

[0017] In the diagram: 1. Upper mold; 2. Lower mold; 3. Molding cavity; 4. Placement mechanism; 41. Placement block; 42. First movable groove; 43. Guide rod; 44. Second movable groove; 45. First spring; 46. Placement groove; 5. Punch head; 6. Connecting rod; 7. Top mold; 8. Third movable groove; 9. Second spring; 10. Punch hole; 11. Blanking groove; 12. Fourth movable groove; 13. Electric telescopic rod; 14. Cleaning brush plate; 15. Brush bristles; 16. Chip removal groove. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0019] Please see Figures 1 to 5 This embodiment of an IGBT lead frame stamping die includes an upper die 1 and a lower die 2. The top of the upper die 1 is fixed to a stamping drive mechanism. The top of the lower die 2 has a forming cavity 3. A stamping head 5 is fixedly installed at the bottom of the upper die 1, and the stamping head 5 corresponds to the forming cavity 3. Four rectangularly distributed connecting rods 6 are fixedly installed at the top of the upper die 1. A top die 7 located outside the stamping head 5 is slidably installed on the outside of the four connecting rods 6. The top of the top die 7 has four third movable slots 8, each corresponding to one of the connecting rods 6. A second spring 9 is fixedly installed in the moving groove 8 at its bottom. When the upper mold 1 contacts the top mold 7, in order to facilitate the insertion of the stamping head 5 into the forming cavity 3 to complete the stamping operation, the thickness of the stamping head 5 is greater than the thickness of the top mold 7, and when the stamping head 5 is static, its bottom position does not exceed the bottom of the top mold 7. During the stamping operation, the upper mold 1 moves downward, driving the top mold 7 to move downward at the same time. After the top mold 7 contacts the lower mold 2, the stamping head 5 continues to move downward into the forming cavity 3 to stamp the raw material plate. This can buffer the stamping head 5 and improve the service life of the mold.

[0020] In this embodiment, the top of the lower mold 2 is provided with four sets of placement mechanisms 4 located at the four corners of the molding cavity 3. Each placement mechanism 4 includes a placement block 41. The top of the lower mold 2 has a first movable groove 42 located at and communicating with the corner of the molding cavity 3. A guide rod 43 is fixedly installed on the inner bottom wall of the first movable groove 42. The placement block 41 is slidably installed in the first movable groove 42. A second movable groove 44 is opened at the bottom of the placement block 41. The top of the guide rod 43 is slidably installed in the second movable groove 44. A first spring located outside the guide rod 43 is fixedly installed between the bottom of the placement block 41 and the inner bottom wall of the first movable groove 42. Spring 45, the top of the placement block 41 is provided with placement grooves 46, the inner dimensions of the four placement grooves 46 are adapted to the inner dimensions of the forming cavity 3. In order to facilitate the placement block 41 to fully retract into the first movable groove 42, the depth of the first movable groove 42 is greater than the height of the placement block 41. The raw material plate can be positioned and placed through the placement grooves 46 on the top of the four placement blocks 41 to ensure that it will not shake before the stamping operation. After the stamping is completed, after the top mold 7 separates from the lower mold 2, the placement block 41 moves upward under the action of the first spring 45 to separate the stamped lead frame from the forming cavity 3 for easy handling by personnel.

[0021] It should be noted that when the top mold 7 contacts the lower mold 2 first and then pushes the placement block 41 to retract into the first movable groove 42, the position of the bottom wall of the inner side of the placement groove 46 should be lower than the position of the bottom wall of the inner side of the molding cavity 3, so that the raw material plate can be placed in contact with the bottom wall of the inner side of the molding cavity 3.

[0022] In this embodiment, the inner bottom wall of the forming cavity 3 is provided with a punching hole 10 corresponding to the punching head 5, and the bottom of the lower die 2 is provided with a material discharge groove 11 communicating with the punching hole 10. The punching head 5 cooperates with the punching hole 10 to punch the raw material plate, and the waste material after punching is collected through the punching hole 10 and the material discharge groove 11.

[0023] In this embodiment, a fourth movable groove 12 is provided on the inner left wall of the molding cavity 3. An electric telescopic rod 13 with its output end facing right is fixedly installed on the inner left wall of the fourth movable groove 12. A cleaning brush plate 14 is fixedly connected to the right end of the output end of the electric telescopic rod 13. Brush bristles 15 are evenly arranged at the bottom of the cleaning brush plate 14. The brush bristles 15 contact the inner bottom wall of the molding cavity 3. The arrangement of the brush bristles 15 improves the cleaning effect. When it is necessary to clean the residual waste in the molding cavity 3, the electric telescopic rod 13 is activated. The output end of the electric telescopic rod 13 extends and drives the cleaning brush plate 14 to move to the right. Under the action of the brush bristles 15, the residual waste in the inner bottom wall of the molding cavity 3 is cleaned, so as to avoid the residual waste in the molding cavity 3 from affecting the stamping quality.

[0024] The bottom wall of the molding cavity 3 has two chip discharge grooves 16 connected to the material discharge groove 11. The two chip discharge grooves 16 are located at the left and right ends of the molding cavity 3, respectively. When the cleaning brush plate 14 moves left and right in the molding cavity 3, it can push the waste chips to the chip discharge grooves 16 at both ends for discharge. The discharged waste chips are collected and recycled through the material discharge groove 11.

[0025] The working principle of the above embodiments is as follows: The raw material plate is placed in the placement groove 46 on the top of the four placement blocks 41. The placement groove 46 positions the raw material plate. The upper mold 1 moves downward, first driving the top mold 7 to contact the placement block 41, pushing the placement block 41 to move downward and retract into the first movable groove 42 until the raw material plate is placed in the forming cavity 3. At this time, after the top mold 7 contacts the lower mold 2, the upper mold 1 drives the stamping head 5 to continue to move downward to stamp the raw material plate. After the stamping is completed, the upper mold 1 and the lower mold 2 separate. After the four placement blocks 41 lose external force, they move upward under the action of the first spring 45, lifting the formed lead frame to detach from the forming cavity 3 until it moves to the top of the lower mold 2 for easy handling. The stamping waste falls into the material discharge groove 11 through the stamping hole 10 for collection. When it is necessary to clean the residual debris in the forming cavity 3, the electric telescopic rod 13 is activated. The output end of the electric telescopic rod 13 extends and drives the cleaning brush plate 14 to move to the right. Under the action of the brush bristles 15, the residual debris on the inner bottom wall of the forming cavity 3 is cleaned to avoid the residual debris in the forming cavity 3 from affecting the stamping quality.

[0026] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods, and any method that achieves the desired beneficial effect can be implemented. Furthermore, all electrical components in this embodiment are electrically connected to the main controller and power supply. The main controller can be a conventional, known device such as a computer that performs control functions. Those skilled in the art can control the electrical components through simple programming, and the existing disclosed power connection technologies are common knowledge in the field. Therefore, this embodiment will not elaborate further on their specific structural composition and working principles.

[0027] It should be noted that the orientations or positional relationships indicated herein are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the purpose of facilitating the description of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

Claims

1. A stamping die for an IGBT lead frame, characterized in that: It includes an upper mold (1) and a lower mold (2). The lower mold (2) has a forming cavity (3) at its top. The lower mold (2) has four sets of placement mechanisms (4) located at the four corners of the forming cavity (3) at its top. The upper mold (1) has a stamping head (5) fixedly installed at its bottom. The placement mechanism (4) includes a placement block (41). The top of the lower mold (2) is provided with a first movable groove (42) located at the corner of the molding cavity (3) and communicating with it. A guide rod (43) is fixedly installed on the inner bottom wall of the first movable groove (42). The placement block (41) is slidably installed in the first movable groove (42). A second movable groove (44) is provided at the bottom of the placement block (41). The top of the guide rod (43) is slidably installed in the second movable groove (44). A first spring (45) located outside the guide rod (43) is fixedly installed between the bottom of the placement block (41) and the inner bottom wall of the first movable groove (42). A placement groove (46) is provided at the top of the placement block (41).

2. The IGBT lead frame stamping die according to claim 1, characterized in that: The inner dimensions of the four placement slots (46) are adapted to the inner dimensions of the molding cavity (3), and the depth of the first movable slot (42) is greater than the height of the placement block (41).

3. The IGBT lead frame stamping die according to claim 1, characterized in that: The top of the upper die (1) is fixedly installed with four rectangular connecting rods (6), and the top die (7) located outside the stamping head (5) is slidably installed on the outside of the four connecting rods (6). The top of the top die (7) is provided with four third movable grooves (8) corresponding to the connecting rods (6). The connecting rods (6) are located in the third movable grooves (8) and a second spring (9) is fixedly installed at their bottom.

4. The IGBT lead frame stamping die according to claim 3, characterized in that: The thickness of the stamping head (5) is greater than the thickness of the top die (7), and the bottom position of the stamping head (5) does not exceed the bottom of the top die (7).

5. The IGBT lead frame stamping die according to claim 1, characterized in that: The inner bottom wall of the forming cavity (3) is provided with a punching hole (10) corresponding to the punching head (5), and the bottom of the lower die (2) is provided with a blanking groove (11) communicating with the punching hole (10).

6. The IGBT lead frame stamping die according to claim 5, characterized in that: The bottom wall of the molding cavity (3) has two chip removal grooves (16) that communicate with the material discharge groove (11). The two chip removal grooves (16) are located at the left and right ends of the inner side of the molding cavity (3).

7. The IGBT lead frame stamping die according to claim 1, characterized in that: The inner left wall of the molding cavity (3) is provided with a fourth movable groove (12), and an electric telescopic rod (13) with its output end facing right is fixedly installed on the inner left wall of the fourth movable groove (12). A cleaning brush plate (14) is fixedly connected to the right end of the output end of the electric telescopic rod (13).

8. The IGBT lead frame stamping die according to claim 7, characterized in that: The bottom of the cleaning plate (14) is evenly provided with bristles (15), and the bristles (15) are in contact with the inner bottom wall of the molding cavity (3).

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