A valve disc plate processing waste cleaning device

Abstract

The utility model relates to valve machining technical field, concretely is a kind of waste chip cleaning equipment for valve disc plate machining, including processing seat, chip guide plate and first baffle, the processing seat upper end outer wall one side screw connection has the chip removal cover, the chip removal cover outside lower end is provided with chip guide plate, the chip guide plate both sides outer wall are screw-connected with vibration motor, the chip removal cover and chip guide plate outer wall are welded with the fixed seat of rectangular array distribution, the chip guide plate outer wall is welded with the guide block of circular array distribution, the fixed seat between screw connection has guide rod, the chip guide plate inner wall one side is welded with first baffle, the first baffle lower end outer wall both sides are screw-connected with slide rail, the slide rail lower end is provided with second baffle, ensure the cleanness of chip removal cover inner wall, avoid the metal chip residual in chip removal cover inside, compared with static chip guide, more easily solve waste chip accumulation problem, the discharge completeness of metal chip is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of valve processing technology, specifically to a waste chip cleaning device for valve disc processing. Background Technology

[0002] The valve disc is the core opening and closing component of a butterfly valve. It is usually disc-shaped and installed on the valve stem inside the valve body. It controls the flow and cut-off of the medium in the pipeline by rotating around the valve stem. The processing of the valve disc is a systematic process that requires multiple precision processes from blank to finished product. It is mainly divided into blank pretreatment, reference surface processing, shape processing, sealing surface processing, hole system processing and surface treatment. Among them, hole system processing requires drilling holes in the disc using a drilling machine to ensure that the hole size meets the requirements. During the drilling process, metal chips are generated. Therefore, it is necessary to use waste chip cleaning equipment to collect and clean the generated metal chips. Existing drilling machines all use chip guide plates to guide metal chips and coolant, and use chip conveyors for auxiliary collection.

[0003] While existing cleaning equipment offers numerous advantages during use, it still suffers from the following problems: its cleaning of the chip guide plate is not thorough enough. As metal debris adheres to the inner wall of the chip guide plate due to the coolant, a significant amount of metal debris remains on the surface of the chip guide plate, affecting the completeness of metal debris collection. Utility Model Content

[0004] To address the problems in the existing technology, this utility model provides a waste chip cleaning device for valve disc processing.

[0005] The technical solution adopted by this utility model to solve its technical problem is a waste chip cleaning device for valve disc processing, including a processing base, a chip guide plate and a first baffle plate. A chip discharge hood is screwed to one side of the upper outer wall of the processing base. A chip guide plate is provided at the lower outer end of the chip discharge hood. Vibration motors are screwed to both outer walls of the chip guide plate. Fixed seats with a rectangular array are welded to the outer walls of the chip discharge hood and the chip guide plate. Guide blocks with a circular array are welded to the outer wall of the chip guide plate. Guide rods are screwed between the fixed seats. A first baffle plate is welded to one side of the inner wall of the chip guide plate. Slide rails are screwed to both sides of the lower outer wall of the first baffle plate. A second baffle plate is provided at the lower end of the slide rails.

[0006] By adopting the above technical solution, the chips generated during drilling of the workpiece fall into the chip removal hood and are guided by the inclined shape of the inner wall of the chip guide plate before sliding down to the matching chip conveyor for centralized collection. After processing, the operator controls the vibration motor through the matching controller. The vibration motor drives the chip guide plate to vibrate outside the chip removal hood, thereby assisting in the discharge of metal chips adhering to the inner wall of the chip guide plate, ensuring the cleanliness of the inner wall of the chip guide plate and avoiding the formation of metal chip residue inside the chip guide plate. Compared with static chip removal... The first and second baffles are designed to prevent the accumulation of waste chips and ensure the completeness of the discharge of metal chips. During vibration, the second baffle is tilted due to the inclined slide. With the help of the counterweight, the second baffle can slide in an inclined state through the slider and slide until it contacts the inner wall of the chip guide plate. Thus, the first and second baffles can block the upper part of the chip guide plate, preventing residual coolant and metal chips inside the chip guide plate from being ejected from the chip discharge cover due to vibration, thus ensuring the cleanliness of the vibration guidance.

[0007] Specifically, a mounting platform is screwed to one side of the upper outer wall of the machining base, a drilling device is provided on the upper outer wall of the mounting platform, and a protective cover is screwed to the upper outer wall of the machining platform, with the protective cover located outside the drilling device.

[0008] By adopting the above technical solution, the protective cover encloses the drilling device, which can effectively block the splashing chips during the processing and protect the workers. The mounting platform is used to ensure that the drilling device is stable in position relative to the upper end of the processing seat. The drilling device can drill the workpiece, and the metal chips and coolant that fall off during drilling can fall into the chip discharge cover. Furthermore, due to the shielding of the mounting platform, metal chips are prevented from contacting the first shielding plate.

[0009] Specifically, the guide block has a through hole inside, and the guide rod is inside the through hole. Support springs are sleeved on both outer walls of the guide rod. The two support springs are distributed on the upper and lower sides of the guide block, and the upper and lower ends of the support springs are in contact with the outer walls of the guide block and the fixed seat, respectively.

[0010] By adopting the above technical solution, the cooperation between the guide block and the guide rod restricts the vibration direction of the chip guide plate and avoids lateral deviation; the support springs are distributed on both sides of the guide block, which can not only buffer the vibration impact and avoid rigid damage to the machining seat and chip hood, but also assist the chip guide plate to reset after the vibration stops, ensuring the stability of the chip removal trajectory.

[0011] Specifically, a sealing gasket is bonded and fixed to the upper end of the inner wall of the chip guide plate, and the sealing gasket is in contact with the outer wall of the chip discharge hood.

[0012] By adopting the above technical solution, the sealing gasket between the chip guide plate and the chip discharge hood can fill the gap and prevent small waste chips or coolant from leaking out from the connection.

[0013] Specifically, magnets are glued and fixed to both sides of the lower outer wall of the first shield, and the magnets are attracted to the upper surface of the second shield.

[0014] By adopting the above technical solution, the magnet attracts the second baffle plate, ensuring that the first baffle plate and the second baffle plate are tightly attached in the non-vibration state, and ensuring that the chip conveyor and the chip guide plate can be in a connected state. When the second baffle plate is affected by vibration, due to its tilt angle and the weight of the counterweight, it can be driven to slide in a tilted state, thereby blocking the chip conveyor and the chip guide plate.

[0015] Specifically, both sides of the upper outer wall of the second shield are screwed with sliders, and the slide rail has an inclined groove inside, in which the slider is slidably installed.

[0016] By adopting the above technical solution, the inclined groove in the slide rail cooperates with the slider to make the second baffle slide along the preset inclined direction when vibrating, which not only ensures that the chip removal channel is open when vibrating, but also avoids the misalignment of the second baffle caused by irregular sliding.

[0017] Specifically, counterweights are screwed to both sides of the upper outer wall of the second shield, and the counterweights are located outside the first shield.

[0018] By adopting the above technical solution, the counterweight uses gravity to assist the second baffle plate to slide out along the slide rail after the vibration stops. After the metal debris inside the chip removal plate is cleaned by vibration, the staff can manually push the second baffle plate to reset.

[0019] The beneficial effects of this utility model are: The present invention discloses a waste chip cleaning device for valve disc processing. Vibration helps to discharge metal chips adhering to the inner wall of the chip discharge hood, ensuring the cleanliness of the inner wall of the chip discharge hood and avoiding the generation of metal chip residue inside the chip discharge hood. Compared with static chip guiding, it is easier to solve the problem of waste chip accumulation and ensures the integrity of metal chip discharge.

[0020] The present invention discloses a waste chip cleaning device for valve disc processing. The first and second baffle plates can block the upper part of the inside of the chip guide plate, preventing residual coolant and metal chips inside the chip guide plate from being ejected from the chip discharge cover due to vibration, thus ensuring the cleanliness of vibration guidance. Attached Figure Description

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Figure 1 This is a schematic diagram of the main structure of the processing base of this utility model; Figure 2 This is an enlarged schematic diagram of the processing base structure of this utility model; Figure 3 This is an enlarged schematic diagram of the chip removal hood structure of this utility model; Figure 4 This is a disassembly diagram of the chip hood structure of this utility model; Figure 5 This is a disassembly diagram of the first shielding plate structure of this utility model; Figure 6 For the present utility model Figure 4 Enlarged schematic diagram of structure A in the middle; Figure 7 For the present utility model Figure 5 Enlarged schematic diagram of the B-structure.

[0023] In the diagram: 1. Machining base; 11. Protective cover; 12. Drilling device; 13. Mounting platform; 14. Chip conveyor; 2. Chip guide plate; 21. Vibration motor; 22. Fixed base; 23. Guide rod; 24. Guide block; 25. Support spring; 26. Sealing gasket; 3. First baffle plate; 31. Slide rail; 32. Second baffle plate; 33. Magnet; 34. Counterweight; 35. Slider. Detailed Implementation

[0024] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0025] To save manpower and improve efficiency, as one embodiment of this utility model, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7As shown, the present invention discloses a waste chip cleaning device for valve disc processing, comprising a processing base 1, a chip guide plate 2, and a first baffle plate 3. A chip discharge hood 14 is screwed to one side of the upper outer wall of the processing base 1. A chip guide plate 2 is provided at the lower outer side of the chip discharge hood 14. Vibration motors 21 are screwed to both outer walls of the chip guide plate 2. Fixed seats 22 arranged in a rectangular array are welded to both the outer walls of the chip discharge hood 14 and the chip guide plate 2. Guide blocks 24 arranged in a circular array are welded to the outer wall of the chip guide plate 2. Guide rods 23 are screwed between the fixed seats 22. A first baffle plate 3 is welded to one side of the inner wall of the chip guide plate 2. Slide rails 31 are screwed to both sides of the lower outer wall of the first baffle plate 3. A second baffle plate 32 is provided at the lower end of the slide rails 31. The first baffle plate 3 is located at the lower end of the chip discharge hood 14, and when the chip guide plate 2 vibrates with the first baffle plate 3, the first baffle plate 3 will not contact the chip discharge hood 14.

[0026] During operation, the chips generated during drilling of the workpiece by the drilling device 12 fall into the chip removal hood 14. Guided by the inclined shape of the inner wall of the chip guide plate 2, they slide down to the accompanying chip conveyor for collection. After processing, the operator controls the vibration motor 21 via the accompanying controller. The vibration motor 21 drives the chip guide plate 2 to vibrate outside the chip removal hood 14, thereby assisting in the discharge of metal chips adhering to the inner wall of the chip guide plate 2. This ensures the cleanliness of the inner wall of the chip guide plate 2 and prevents metal chip residue from remaining inside the chip guide plate 2, which is easier to solve than static chip removal. To address the issue of waste chip accumulation, the integrity of metal chip discharge is ensured. During vibration, the second baffle plate 32 is tilted due to the inclined slide groove. With the assistance of the counterweight block 34, the second baffle plate 32 can slide in an inclined state through the slider 35 and the slide groove until the second baffle plate 32 contacts the inner wall of the chip guide plate 2. Thus, the first baffle plate 3 and the second baffle plate 32 can block the upper part of the inside of the chip guide plate 2, preventing residual coolant and metal chips inside the chip guide plate 2 from being ejected from the chip discharge cover 14 due to vibration, ensuring the cleanliness of the vibration guidance.

[0027] For workpiece machining, exemplarily, such as Figure 1 As shown, a mounting platform 13 is screwed to one side of the upper outer wall of the machining base 1. A drilling device 12 is provided on the upper outer wall of the mounting platform 13. A protective cover 11 is screwed to the upper outer wall of the machining platform. The protective cover 11 is located outside the drilling device 12.

[0028] When in use, the protective cover 11 covers the drilling device 12, which can effectively block the flying debris during the processing and protect the workers. The mounting platform 13 is used to ensure that the drilling device 12 is stable on the upper end of the processing seat 1. The drilling device 12 can drill the workpiece, and the metal chips and coolant that fall off during drilling can fall into the chip discharge cover 14. Due to the shielding of the mounting platform 13, the metal chips are prevented from contacting the first shielding plate 3.

[0029] To maintain the vibration position, for example, such as Figure 6 As shown, the guide block 24 has a through hole inside, and the guide rod 23 is inside the through hole. Support springs 25 are sleeved on both sides of the outer wall of the guide rod 23. The two support springs 25 are distributed on the upper and lower sides of the guide block 24, and the upper and lower ends of the support springs 25 are in contact with the outer walls of the guide block 24 and the fixed seat 22, respectively.

[0030] During use, the cooperation between the guide block 24 and the guide rod 23 restricts the vibration direction of the chip guide plate 2 and avoids lateral deviation; the support springs 25 are distributed on both sides of the guide block 24, which can not only buffer the vibration impact and avoid rigid damage to the machining seat 1 and the chip discharge cover 14, but also assist the chip guide plate 2 to reset after the vibration stops, ensuring the stability of the chip discharge trajectory.

[0031] For sealing purposes, exemplarily, such as Figure 6 As shown, a sealing gasket 26 is bonded and fixed to the upper end of the inner wall of the chip guide plate 2, and the sealing gasket 26 is in contact with the outer wall of the chip discharge cover 14.

[0032] During use, the sealing gasket 26 between the chip guide plate 2 and the chip discharge cover 14 can fill the gap and prevent small waste chips or coolant from leaking out from the connection.

[0033] To maintain the usage location, for example, such as Figure 5 As shown, magnets 33 are glued and fixed to both sides of the lower outer wall of the first shielding plate 3, and the magnets 33 are attracted to the upper surface of the second shielding plate 32.

[0034] When in use, the magnet 33 attracts the second baffle plate 32, ensuring that the first baffle plate 3 and the second baffle plate 32 are tightly attached in the non-vibration state, ensuring that the chip discharge cover 14 and the chip guide plate 2 can be in a connected state. When the second baffle plate 32 is affected by vibration, due to its tilt angle and the weight guidance of the counterweight block 34, the second baffle plate 32 can be driven to slide in a tilted state, thereby blocking the chip discharge cover 14 and the chip guide plate 2.

[0035] To control the movement trajectory, for example, such as Figure 5 As shown, sliders 35 are screwed to both sides of the upper outer wall of the second baffle plate 32. The slide rail 31 has an inclined groove inside, and the sliders 35 are slidably installed inside the groove.

[0036] In use, the inclined groove in the slide rail 31 cooperates with the slider 35 to make the second baffle 32 slide along the preset inclined direction when vibrating, which not only ensures that the chip removal channel is open when vibrating, but also avoids the misalignment of the second baffle 32 caused by irregular sliding.

[0037] To assist movement, for example, such as Figure 5 As shown, counterweights 34 are screwed to both sides of the upper outer wall of the second baffle plate 32, and the counterweights 34 are located outside the first baffle plate 3.

[0038] During use, the counterweight 34 uses gravity to assist the second baffle 32 in sliding out along the slide rail 31 after the vibration stops. After the metal debris inside the chip removal plate is cleaned by vibration, the staff can manually push the second baffle 32 to reset.

[0039] When the device is in its initial state, the second baffle plate 32 is engaged with the inclined groove of the slide rail 31 through the slider 35, and is tightly attached to the first baffle plate 3 under the attraction of the magnet 33, ensuring that the chip discharge cover 14 and the chip guide plate 2 are connected; the chip guide plate 2 is sleeved on the guide rod 23 through the guide block 24, and the support spring 25 is in a natural extension and contraction state. Workers drill holes in the workpiece using the drilling device 12. The metal chips and coolant produced during the process fall into the chip removal hood 14 under the action of gravity. They are then guided by the inclined structure of the inner wall of the chip guide plate 2 and naturally slide down to the matching chip removal machine for centralized collection. After drilling is completed, the operator starts the vibration motor 21 through the controller. The vibration motor 21 drives the chip guide plate 2 to vibrate along the direction of the guide rod 23. During the vibration, the residual metal chips attached to the inner wall of the chip guide plate 2 are detached from the surface under the action of vibration and slide down to the chip conveyor with the vibration. The impact force generated by the vibration causes the second baffle plate 32 to overcome the attraction force of the magnet 33. With the assistance of the counterweight 34, it slides along the inclined groove of the slide rail 31 through the slider 35 until the second baffle plate 32 contacts the inner wall of the chip guide plate 2. At this time, the first baffle plate 3 and the second baffle plate 32 form a closed baffle structure to prevent the residual coolant and debris in the chip guide plate 2 from splashing out of the chip discharge cover 14 due to vibration. After the vibration chip removal is completed, the vibration motor 21 is turned off, and the staff manually pushes the second baffle 32 to slide along the inclined slide. The slider 35 drives the second baffle 32 to rise until it re-adhere to the magnet 33 at the lower end of the first baffle 3, restoring the unobstructed state of the chip removal channel.

[0040] It should be noted that this utility model is a waste chip cleaning device for valve disc processing. All components in this utility model are known to those skilled in the art, and their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0041] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A waste chip cleaning device for valve disc processing, characterized in that, The assembly includes a machining base (1), a chip guide plate (2), and a first baffle plate (3). A chip removal cover (14) is screwed to one side of the upper outer wall of the machining base (1). A chip guide plate (2) is provided at the lower outer side of the chip removal cover (14). A vibration motor (21) is screwed to both sides of the outer wall of the chip guide plate (2). A rectangular array of fixed seats (22) is welded to the outer wall of both the chip removal cover (14) and the chip guide plate (2). A circular array of guide blocks (24) is welded to the outer wall of the chip guide plate (2). A guide rod (23) is screwed between the fixed seats (22). A first baffle plate (3) is welded to one side of the inner wall of the chip guide plate (2). A slide rail (31) is screwed to both sides of the lower outer wall of the first baffle plate (3). A second baffle plate (32) is provided at the lower end of the slide rail (31).

2. The waste chip cleaning equipment for valve disc processing according to claim 1, characterized in that, The upper outer wall of the processing base (1) is screwed to a mounting platform (13), and the upper outer wall of the mounting platform (13) is provided with a drilling device (12). The upper outer wall of the processing base is screwed to a protective cover (11), and the protective cover (11) is located outside the drilling device (12).

3. The waste chip cleaning equipment for valve disc processing according to claim 1, characterized in that, The guide block (24) has a through hole inside, and the guide rod (23) is inside the through hole. Support springs (25) are sleeved on both sides of the outer wall of the guide rod (23). The two support springs (25) are distributed on the upper and lower sides of the guide block (24), and the upper and lower ends of the support springs (25) are in contact with the outer wall of the guide block (24) and the fixing seat (22), respectively.

4. The waste chip cleaning equipment for valve disc processing according to claim 1, characterized in that, A sealing gasket (26) is bonded and fixed to the upper end of the inner wall of the chip guide plate (2), and the sealing gasket (26) is in contact with the outer wall of the chip discharge cover (14).

5. The waste chip cleaning equipment for valve disc processing according to claim 1, characterized in that, Magnets (33) are glued and fixed on both sides of the lower outer wall of the first shielding plate (3), and the magnets (33) are attracted to the upper surface of the second shielding plate (32).

6. The waste chip cleaning equipment for valve disc processing according to claim 1, characterized in that, The upper outer wall of the second shield (32) is screwed with sliders (35) on both sides. The slide rail (31) has an inclined groove inside, and the slider (35) is slidably installed inside the groove.

7. The waste chip cleaning equipment for valve disc processing according to claim 1, characterized in that, The upper outer wall of the second shield (32) is screwed with counterweights (34) on both sides, and the counterweights (34) are located outside the first shield (3).

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