A high-precision assembly device for wafer metrology equipment

Abstract

The utility model discloses a high accuracy assembly device for wafer measurement equipment belongs to semiconductor detection equipment field, a high accuracy assembly device for wafer measurement equipment, including assembly mechanism, the inner end right side rear of assembly mechanism is installed with transfer mechanism, the inner end right side front of assembly mechanism is provided with loading mechanism, the transfer mechanism includes motor box, the upper end of motor box is connected with the pivot, the upper end fixed connection of pivot has motorized telescopic handle, the upper end fixed connection of motorized telescopic handle has controller, the front end fixed connection of controller has electric push rod, the front end fixed connection of electric push rod has monitor, the front end both sides fixed connection of monitor has support arm, the upper end of support arm is provided with protective pad, this high accuracy assembly device for wafer measurement equipment sets up support arm and corresponding sliding slot, makes the device more convenient when taking material and carrying out assembly work.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing equipment, and in particular to a high-precision assembly device for wafer measurement equipment. Background Technology

[0002] Against the backdrop of the semiconductor industry's continuous breakthroughs towards advanced processes of 5nm and below, wafer metrology equipment, as core equipment for monitoring chip manufacturing process precision and ensuring product yield, needs to achieve measurement accuracy at the nanometer or even sub-nanometer level. This performance is highly dependent on the assembly precision of the internal components. Currently, traditional wafer metrology equipment assembly methods have significant limitations: manual assembly is greatly affected by the operator's experience, making it difficult to consistently achieve assembly consistency at the micrometer level and below, and is also inefficient. At the same time, under the mass production demands of the semiconductor industry, existing assembly solutions struggle to balance high precision and high cycle efficiency, further restricting the large-scale application of wafer metrology equipment. Therefore, developing high-precision assembly devices adapted to wafer metrology equipment has become a key industry requirement. Existing high-precision assembly devices for wafer measurement equipment generally face problems such as insufficient positioning accuracy and lack of assembly force control accuracy. They not only fail to meet the ultra-precision requirements of advanced processes, but may also cause hidden damage to fragile precision components due to micro-stress and micro-collisions during the assembly process, resulting in decreased equipment measurement stability and shortened calibration cycle. Therefore, we propose a high-precision assembly device for wafer measurement equipment. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a high-precision assembly device for wafer measurement equipment. By setting a support arm and a corresponding slide, the device is more convenient when picking up materials and performing assembly work, and the predetermined movement trajectory makes it less likely to damage the wafer.

[0004] The above-mentioned technical objective of this utility model is achieved through the following technical solution: A high-precision assembly device for wafer measurement equipment includes an assembly mechanism, a transfer mechanism is installed at the rear right side of the inner end of the assembly mechanism, and a loading mechanism is provided at the front right side of the inner end of the assembly mechanism. The transfer mechanism includes a motor housing, with a rotating shaft connected to the upper end of the motor housing. An electric telescopic rod is fixedly connected to the upper end of the rotating shaft, and a controller is fixedly connected to the upper end of the electric telescopic rod. An electric push rod is fixedly connected to the front end of the controller, and a monitor is fixedly connected to the front end of the electric push rod. Support arms are fixedly connected to both sides of the front end of the monitor, and protective pads are provided at the upper ends of the support arms. By setting support arms and corresponding sliding grooves, the device is more convenient when picking up materials and performing assembly work, and the predetermined movement trajectory makes it less likely to damage the wafer, thus improving the convenience and protection performance of the device during use.

[0005] Furthermore, the assembly mechanism includes an outer casing, with support legs fixedly installed at the four lower corners of the outer casing, a door movably installed on the front side of the outer casing, an assembly platform provided on the inner left side of the outer casing, grooves provided on the upper left and right sides of the assembly platform, an assembly slot provided in the middle of the upper end of the assembly platform, and an assembly box fixedly connected to the upper left side of the assembly platform. The grooves facilitate material loading into the device, improving the ease of use of the device.

[0006] Furthermore, the loading mechanism includes a loading box, an inner end of which is provided with a loading groove, and a support plate is fixedly connected to the inner side of the loading groove. A sliding groove is provided on the upper inner side of the support plate. By setting the support plate for mounting wafer workpieces, multiple support plates can be set to simultaneously mount multiple wafer workpieces for testing, thereby improving the testing efficiency of the device during use.

[0007] Furthermore, the loading box is movably installed on the front inner end of the outer box. By setting the loading box to be movably installed on the front inner end of the outer box, the loading box is easy to install and load materials, and it is also easy to replenish materials, which improves the convenience of using the device.

[0008] Furthermore, the motor housing is fixedly installed on the rear inner side of the outer housing.

[0009] Furthermore, the support arm is adapted to both the slide and the groove.

[0010] Furthermore, the controller can rotate with the rotating shaft. Before rotation, the controller is aligned with the direction of the loading box, and after rotation, the controller is aligned with the direction of the assembly slot.

[0011] Furthermore, the number of the protective pads is four, and the four protective pads are fixedly installed in pairs on the upper end of the support arm.

[0012] In summary, this utility model has the following beneficial effects: 1. By setting up support arms and corresponding slides, the device is more convenient to pick up materials and perform assembly work. The predetermined movement trajectory makes it less likely to damage the wafer, which improves the convenience and protection performance of the device. The grooves make it easier to load materials into the device, which also improves the convenience of the device. 2. By setting up support plates for mounting wafer workpieces, multiple support plates can simultaneously mount multiple wafer workpieces for testing, improving the testing efficiency of the device. By setting up a loading box that is movable and installed on the front inner end of the outer casing, the loading box is easy to install and load, and it is also easy to replenish materials, improving the convenience of the device. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure in this embodiment; Figure 2 This is a three-dimensional structural diagram of the assembly mechanism in this embodiment; Figure 3 This is a partial three-dimensional structural diagram of the assembly mechanism in this embodiment; Figure 4 This is a three-dimensional structural diagram of the transfer mechanism in this embodiment; Figure 5 This is a three-dimensional structural diagram of the loading mechanism in this embodiment.

[0014] In the diagram, 1. Assembly mechanism; 101. Outer casing; 102. Support leg; 103. Box door; 104. Assembly table; 105. Groove; 106. Assembly slot; 107. Assembly box; 2. Transfer mechanism; 201. Motor box; 202. Rotating shaft; 203. Electric telescopic rod; 204. Controller; 205. Electric push rod; 206. Monitor; 207. Support arm; 208. Protective pad; 3. Loading mechanism; 301. Loading box; 302. Loading slot; 303. Support plate; 304. Slide. Detailed Implementation

[0015] The present invention will be further described in detail below with reference to the accompanying drawings.

[0016] Identical parts are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific part, respectively.

[0017] Reference Figure 1-4As shown, a high-precision assembly device for wafer measurement equipment is provided in a preferred embodiment of the present invention, including an assembly mechanism 1, a transfer mechanism 2 installed at the rear right side of the inner end of the assembly mechanism 1, and a loading mechanism 3 provided at the front right side of the inner end of the assembly mechanism 1. The transfer mechanism 2 includes a motor housing 201. A rotating shaft 202 is connected to the upper end of the motor housing 201. An electric telescopic rod 203 is fixedly connected to the upper end of the rotating shaft 202. A controller 204 is fixedly connected to the upper end of the electric telescopic rod 203. An electric push rod 205 is fixedly connected to the front end of the controller 204. A monitor 206 is fixedly connected to the front end of the electric push rod 205. Support arms 207 are fixedly connected to both sides of the front end of the monitor 206. A protective pad 208 is provided at the upper end of the support arms 207. The motor housing 201 is fixedly installed on the inner rear side of the outer housing 101. The support arms 207 are compatible with both the slide groove 304 and the groove 105. The protective pad 208... There are four pads 208, which are fixedly installed in pairs on the upper end of the support arm 207. By setting the pads 208, the support arm 207 is prevented from directly contacting the wafer surface, which improves the convenience of using the device. The controller 204 can rotate with the rotating shaft 202. Before rotating, the controller 204 is aligned with the direction of the loading box 301. After rotating, the controller 204 is aligned with the direction of the assembly slot 106. By setting the support arm 207 and the corresponding slide 304, the device is more convenient to pick up materials and perform assembly work. Moreover, the predetermined movement trajectory makes it less likely for the wafer to be damaged, which improves the convenience and protection performance of the device.

[0018] Reference Figure 1-3 As shown, the assembly mechanism 1 includes an outer box 101. Support legs 102 are fixedly installed at the four corners of the lower end of the outer box 101. A box door 103 is movably installed on the front side of the outer box 101. An assembly platform 104 is provided on the left side of the inner end of the outer box 101. Grooves 105 are provided on the left and right sides of the upper end of the assembly platform 104. An assembly groove 106 is provided in the middle of the upper end of the assembly platform 104. An assembly box 107 is fixedly connected to the left side of the upper end of the assembly platform 104. The grooves 105 facilitate the loading of materials into the device, improving the convenience of using the device.

[0019] Reference Figure 1-5 As shown, the loading mechanism 3 includes a loading box 301, with a loading groove 302 at the inner end of the loading box 301. A support plate 303 is fixedly connected to the inner side of the loading groove 302. A sliding groove 304 is provided on the inner side of the upper end of the support plate 303. The support plate 303 is used to carry wafer workpieces. Multiple support plates 303 can carry multiple wafer workpieces for testing at the same time, which improves the testing efficiency of the device.

[0020] Reference Figure 2-5As shown, the loading box 301 is movably installed on the front inner end of the outer box 101. By setting the loading box 301 to be movably installed on the front inner end of the outer box 101, the loading box 301 is easy to install and load materials, and it is also easy to replenish materials, which improves the convenience of using the device.

[0021] Specific implementation process: Place the wafer workpieces to be assembled one by one onto the support plate 303. Since the upper inner side of the support plate 303 has a groove 304 that matches the support arm 207, and a single loading box 301 can simultaneously carry multiple wafers through multiple support plates 303, push the loading box 301 with the completed wafer loading into the front side of the inner end of the outer box 101 to complete the positioning and installation of the loading box 301. This movable design facilitates subsequent wafer replenishment and improves the ease of operation of the device. Close the box door 103 at the front of the outer box 101, turn on the device power, and put all mechanisms into standby mode. At this time, the initial direction of the controller 204 is consistent with that of the loading box 301, preparing for subsequent material handling and alignment. Start the motor box 201, which drives the lower connected rotating shaft 202 for fine adjustment. At the same time, the electric telescopic rod 203 extends and retracts according to the height of the support plate 303 inside the loading box 301, adjusting the height of the support arm 207 so that the support arm 207 and the groove 304 of the support plate 303 are at the same level. The controller 204 issues a command to extend the electric push rod 205 at its front end forward. Since the support arm 207 is fixed to both sides of the front end of the monitor 206, the extension of the electric push rod 205 will cause the monitor 206 and the support arm 207 to move forward synchronously until the support arm 207 is fully inserted into the groove 304 of the support plate 303. After the support arm 207 is inserted into the groove 304, the bottom surface of the wafer is stably placed on the protective pad 208 at the upper end of the support arm 207; simultaneously, the monitor 206... The contact status between the wafer and the support arm 207 is monitored in real time to ensure that the wafer is placed stably and without deviation. If a positional deviation occurs, the electric push rod 205 is finely adjusted by the controller 204 to ensure the picking accuracy. The motor box 201 drives the rotating shaft 202 to rotate so that the height of the support arm 207 matches the height of the groove 105 of the assembly table 104, ensuring that the wafer will not collide with the outer box 101 or other parts of the assembly table 104 during the transfer process, thus completing the loading work. The assembly box 107 then performs subsequent work.

[0022] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-precision assembly device for wafer measurement equipment, characterized in that: It includes an assembly mechanism (1), a transfer mechanism (2) is installed at the rear right side of the inner end of the assembly mechanism (1), and a loading mechanism (3) is provided at the front right side of the inner end of the assembly mechanism (1). The transfer mechanism (2) includes a motor housing (201), with a rotating shaft (202) connected to the upper end of the motor housing (201). An electric telescopic rod (203) is fixedly connected to the upper end of the rotating shaft (202). A controller (204) is fixedly connected to the upper end of the electric telescopic rod (203). An electric push rod (205) is fixedly connected to the front end of the controller (204). A monitor (206) is fixedly connected to the front end of the electric push rod (205). Support arms (207) are fixedly connected to both sides of the front end of the monitor (206). A pad (208) is provided at the upper end of the support arm (207).

2. The high-precision assembly device for wafer measurement equipment according to claim 1, characterized in that: The assembly mechanism (1) includes an outer box (101), with support legs (102) fixedly installed at the four corners of the lower end of the outer box (101), and a box door (103) movably installed on the front side of the outer box (101). An assembly platform (104) is provided on the left side of the inner end of the outer box (101), and grooves (105) are provided on the left and right sides of the upper end of the assembly platform (104). An assembly slot (106) is provided in the middle of the upper end of the assembly platform (104), and an assembly box (107) is fixedly connected to the left side of the upper end of the assembly platform (104).

3. A high-precision assembly device for wafer measurement equipment according to claim 2, characterized in that: The loading mechanism (3) includes a loading box (301), the inner end of the loading box (301) is provided with a loading groove (302), the inner side of the loading groove (302) is fixedly connected with a support plate (303), and the upper inner side of the support plate (303) is provided with a sliding groove (304).

4. A high-precision assembly device for wafer measurement equipment according to claim 3, characterized in that: The loading box (301) is movably installed on the front side of the inner end of the outer box (101).

5. A high-precision assembly device for wafer measurement equipment according to claim 2, characterized in that: The motor housing (201) is fixedly installed on the inner rear side of the outer housing (101).

6. A high-precision assembly device for wafer measurement equipment according to claim 3, characterized in that: The support arm (207) is adapted to both the slide (304) and the groove (105).

7. A high-precision assembly device for wafer measurement equipment according to claim 3, characterized in that: The controller (204) can rotate with the rotating shaft (202). Before rotation, the controller (204) is aligned with the direction of the loading box (301). After rotation, the controller (204) is aligned with the direction of the assembly slot (106).

8. A high-precision assembly device for wafer measurement equipment according to claim 1, characterized in that: The number of the pads (208) is four, and the four pads (208) are fixedly installed in pairs on the upper end of the support arm (207).

Images