A target assembly for coating a curved substrate

CN224849092UActive Publication Date: 2026-10-13HEBEI LUX OPTICAL THIN FILM TECH CO LTD
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Patent Information

Application Number
CN202522459862.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-20
Publication Date
2026-10-13
Estimated Expiration
2035-11-20

AI Technical Summary

Technical Problem

[0003]例如,专利号为CN115261807A公布了一种六边形拼接组合靶材,通过调整拼接角度,使靶材表面趋近于曲面基材,但拼接靶材溅射区域不连续,六边形之间的拼接界面附近无法进行溅射,溅射区域不连续,镀膜有一定的缺陷

Benefits of technology

1)通过将靶筒、靶材材料和内部磁场的结构设计为球形或曲面,使得溅射源与曲面基材表面各点的距离保持一致,克服了传统平面或圆柱形靶材在曲面基材上镀膜时因距离差异导致的膜层厚度不均、附着力差的问题,显著提升了曲面工件上的镀膜质量与一致性。

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Abstract

The utility model relates to target material manufacturing technical field discloses a kind of target material assemblies for curved surface base material coating, comprising: target cylinder;Target material is set to the outside of target cylinder;Inner cylinder is set to the inside of target cylinder;Several magnetic steel blocks are set to the inner wall of inner cylinder.The target material assembly for curved surface base material coating of the utility model is suitable for curved surface base material coating, its special spherical structure can better match substrate surface, so that coating is more uniform.The utility model structures target cylinder, target material and internal magnetic field as spherical or curved surface, so that the distance of sputtering source and each point of curved surface substrate surface remains consistent;Overcome the problem of uneven film thickness and poor adhesion caused by distance difference when traditional plane or cylindrical target material is coated on curved surface substrate, significantly improve the coating quality and consistency on curved surface workpiece.
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Description

Technical Field

[0001] This utility model relates to the field of target manufacturing technology, and more specifically, to a target assembly for coating curved substrates. Background Technology

[0002] Magnetron sputtering is a widely used coating technology. It utilizes the glow discharge of plasma to generate ions that bombard a target. Target atoms are ejected from the target, migrate towards the substrate, and deposit on the substrate to form a coating. Currently used targets mainly include cylindrical rotating targets, rectangular planar targets, and circular targets. These types of targets are primarily used for coating planar substrates. However, using these targets to coat curved substrates results in uneven film layers and poor coating adhesion.

[0003] For example, patent number CN115261807A discloses a hexagonal splicing composite target material. By adjusting the splicing angle, the surface of the target material is made closer to the curved substrate. However, the splicing area of ​​the spliced ​​target material is discontinuous, and splicing cannot be performed near the splicing interface between the hexagons. The splicing area is discontinuous, and the coating has certain defects.

[0004] No effective solutions have yet been proposed to address the problems in the relevant technologies. Utility Model Content

[0005] In view of the problems in the related technologies, this utility model proposes a target assembly for coating curved substrates to overcome the above-mentioned technical problems existing in the existing related technologies.

[0006] Therefore, the specific technical solution adopted by this utility model is as follows: A target assembly for coating curved substrates includes: a target cylinder; target material disposed on the outside of the target cylinder; an inner cylinder disposed on the inside of the target cylinder; and a plurality of magnet blocks disposed on the inner wall of the inner cylinder.

[0007] Furthermore, to ensure that the spacing between the target material and the curved substrate remains consistent on the target tube surface, guaranteeing uniform deposition of sputtered atoms; seals and bearings reduce friction and vibration; the sealing surface is precisely fitted to the magnetron sputtering tip to form a vacuum seal, maintaining stability of the assembly during sputtering; the magnetic and electric fields work together to optimize plasma distribution; the main body of the target tube is spherical, with cylindrical ends; a seal is located at the bottom of the target tube, and a bearing that mates with the inner tube is located at the top of the seal; a sealing surface that mates with the inner tube is located at the top of the target tube, and the top of the sealing surface is connected to the magnetron sputtering tip; both the inner and outer parts of the target tube are spherical structures, and the target tube material is stainless steel.

[0008] Furthermore, in order to ensure that the target material acts synchronously with the target cylinder during sputtering, and to ensure that each area of ​​the curved substrate is bombarded with ions and that the target atoms are deposited uniformly, the target material is composed of two hemispherical structures that are fixedly connected to the target cylinder, and the target material is in contact with the target cylinder to form a curved surface.

[0009] Furthermore, in order to generate a uniform and directional magnetic field, optimize the electron motion path, significantly improve plasma density and sputtering efficiency, reduce magnetic field dead zones, and ensure uniform sputtering across the entire target surface, the inner cylinder is spherical in shape with cylindrical ends; both the inner and outer sides of the inner cylinder are spherical structures, with several magnetic steel blocks distributed on the curved surface of the inner sphere.

[0010] Furthermore, in order to effectively reduce the target temperature, prevent the target material from melting, deforming or degrading due to overheating, extend the service life of the target assembly, maintain stable sputtering conditions, and ensure consistent coating quality, a gap exists between the target barrel and the inner barrel, which can accommodate the flow of cooling water.

[0011] The beneficial effects of this utility model are as follows: 1) By designing the target cylinder, target material, and internal magnetic field into spherical or curved surfaces, the distance between the sputtering source and each point on the surface of the curved substrate is kept consistent. This overcomes the problem of uneven film thickness and poor adhesion caused by distance differences when coating on curved substrates with traditional planar or cylindrical targets, and significantly improves the coating quality and consistency on curved workpieces.

[0012] 2) The target material adopts two hemispherical structures and is closely attached to the target cylinder to form a complete and continuous curved sputtering source, which effectively avoids the sputtering dead zone and film defects that exist in spliced ​​targets; the sealing design of the top and bottom and the reliable connection with the magnetron sputtering end ensure the sealing of the vacuum environment and the structural stability of the entire component during the sputtering process.

[0013] 3) Magnet blocks are uniformly arranged on the spherical curved surface of the inner wall of the inner cylinder, generating a magnetic field that is highly matched with the curved surface of the target material. The magnetic field layout can most effectively constrain the trajectory of electrons, greatly increase the plasma density, and thus improve the sputtering rate and efficiency. In addition, the gap reserved between the target cylinder and the inner cylinder forms a cooling water channel, which can remove a large amount of heat generated by sputtering in time, prevent the target material from overheating and being damaged, and ensure long-term, stable, high-performance coating operation. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of a target assembly for coating curved substrates according to an embodiment of the present utility model; Figure 2 This is a schematic diagram illustrating the working principle of magnetron sputtering in a target assembly for coating curved substrates according to an embodiment of the present invention. Figure 3 This is a coating pattern of a target assembly for coating a curved substrate sputtered onto a curved substrate according to an embodiment of the present invention. Figure 4 This is a coating diagram of a cylindrical target sputtered onto a curved substrate in a target assembly for coating a curved substrate according to an embodiment of the present invention. Figure 5 This is a coating pattern of a planar target sputtered onto a curved substrate in a target assembly for coating a curved substrate according to an embodiment of the present invention.

[0016] In the picture: 1. Target barrel; 2. Target material; 3. Inner cylinder; 4. Magnet block; 5. Seal; 6. Bearing; 7. Sealing surface; 8. Magnetron sputtering tip. Detailed Implementation

[0017] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the drawings are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0018] According to an embodiment of the present invention, a target assembly for coating curved substrates is provided.

[0019] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments, such as... Figure 1-5 As shown, the target assembly for coating curved substrates according to an embodiment of the present invention includes: a target cylinder 1; a target material 2 disposed on the outside of the target cylinder 1; an inner cylinder 3 disposed on the inside of the target cylinder 1; and a plurality of magnetic steel blocks 4 disposed on the inner wall of the inner cylinder 3.

[0020] like Figure 1 As shown, not only is the structure of the target assembly for coating curved substrates displayed, but also the arrangement of the magnet blocks after the inner cylinder 3 is unfolded. In the figure, N represents the North Pole and S represents the South Pole, with the North and South Poles alternating.

[0021] By employing the aforementioned technical solutions, this invention designs the target cylinder 1, target material 2, and internal magnetic field as spherical or curved surfaces, ensuring consistent distances between the sputtering source and all points on the curved substrate surface. This overcomes the problems of uneven film thickness and poor adhesion caused by distance differences when coating curved substrates with traditional planar or cylindrical targets, significantly improving the coating quality and consistency on curved workpieces. The target material 2 employs two hemispherical structures that are tightly fitted to the target cylinder 1, forming a complete and continuous curved sputtering source, effectively avoiding sputtering dead zones and film defects present in spliced ​​targets. The top and bottom sealing surfaces 7, sealing elements 5, and reliable connection to the magnetron sputtering end 8, coupled with bearings 6, ensure the sealing of the vacuum environment and the structural stability of the entire assembly during the sputtering process. Magnets 4 are uniformly arranged on the spherical curved surface of the inner wall of the inner cylinder 3, generating a magnetic field highly matched to the curved surface of the target material. This magnetic field layout can most effectively constrain the trajectory of electrons, significantly increase plasma density, and thus improve sputtering rate and efficiency. In addition, the gap between the target cylinder 1 and the inner cylinder 3 forms a cooling water channel, which can promptly remove the large amount of heat generated by sputtering, prevent the target material from overheating and being damaged, and ensure long-term, stable, high-performance coating operation.

[0022] It should be noted that magnetron sputtering technology has been developed for many years and is a relatively mature technology that is widely used in many fields such as optics, semiconductors, and microfabrication.

[0023] like Figure 2 As shown, the working principle and process of magnetron sputtering can be simply described as follows: 1. Under vacuum system conditions, discharge gas is introduced, generally argon; 2. Under the action of an electric field, argon gas is ionized to generate argon ions; 3. Argon ions bombard the target material (coating material), and target atoms are ejected from the target material; 4. Target atoms migrate to the substrate and are deposited on the substrate to form a coating.

[0024] Magnetron sputtering uses a target as the cathode and places a magnet of a specific structure below it. Under the influence of voltage, argon atoms are ionized into argon ions and electrons, creating a glow discharge phenomenon in the plasma. As electrons fly towards the substrate, they are subjected to a combination of Lorentz force and electrostatic force, causing them to drift and deflect—a phenomenon known as electron pendulum motion. This motion significantly increases the electron's trajectory, greatly increasing the probability of collisions with argon particles and generating more ions and electrons. After multiple collisions, the electrons' kinetic energy decreases, eventually depositing on the anode and substrate. Positive ions, under the influence of the electric field, collide with the target, causing target atoms to escape from the target surface due to momentum transfer. These atoms then deposit on the substrate, forming a thin film. Compared to other sputtering deposition techniques, magnetron sputtering, with the addition of a magnetic field, greatly increases the probability of electrons colliding with argon atoms, resulting in a significantly higher plasma density on the target surface. Therefore, magnetron sputtering has a higher film formation efficiency.

[0025] In one embodiment, the target cylinder 1 has a spherical body and cylindrical ends. A sealing element 5 is provided at the bottom of the target cylinder 1, and a bearing 6 that mates with the inner cylinder 3 is provided at the top of the sealing element 5. A sealing surface 7 that mates with the inner cylinder 3 is provided at the top of the target cylinder 1, and the top of the sealing surface 7 is connected to the magnetron sputtering head 8. The target cylinder 1 has a spherical structure both inside and out, and is made of stainless steel. This ensures that the distance between the target material 2 and the curved substrate remains consistent on the surface of the target cylinder 1, guaranteeing uniform deposition of sputtered atoms. The sealing element 5 and bearing 6 reduce friction and vibration. The sealing surface 7 is precisely fitted to the magnetron sputtering head 8 to form a vacuum seal. During sputtering, the assembly remains stable, and the magnetic and electric fields work together to optimize plasma distribution.

[0026] Furthermore, the stainless steel target cylinder 1 possesses high strength and corrosion resistance, capable of withstanding the high temperatures and ion bombardment during sputtering. The inner and outer spherical structures ensure a close fit with the external target material 2 and the inner cylinder 3, forming a stable load-bearing and accommodating space, while also providing a uniform channel foundation for cooling water circulation.

[0027] In one embodiment, the target material 2 is composed of two hemispherical structures and is fixedly connected to the target cylinder 1. The target material 2 is attached to the target cylinder 1 to form a curved surface. Thus, during sputtering, the target material 2 acts synchronously with the target cylinder 1, ensuring that each area of ​​the curved substrate is bombarded with ions and that the target atoms are deposited uniformly.

[0028] In one embodiment, for the inner cylinder 3 and the magnet blocks 4, the main body of the inner cylinder 3 is spherical and the two ends are cylindrical; the inner cylinder 3 has a spherical structure both inside and outside, and several magnet blocks 4 are distributed on the curved surface of the inner sphere, thereby generating a uniform and directional magnetic field, optimizing the electron motion path, greatly improving the plasma density and sputtering efficiency, while reducing the magnetic field dead angle and ensuring uniform sputtering of the entire target surface.

[0029] In one embodiment, there is a gap between the target cylinder 1 and the inner cylinder 3, which can accommodate the flow of cooling water, thereby effectively reducing the target material temperature, preventing the target material from melting, deforming or degrading due to overheating, extending the service life of the target material assembly, maintaining stable sputtering conditions, and ensuring consistent coating quality.

[0030] To facilitate understanding of the above-mentioned technical solutions of this utility model, the working principle or operation method of this utility model in actual process will be described in detail below.

[0031] In practical applications, the target assembly, as one of the main components of magnetron sputtering, works on the principle of magnetron sputtering. The target cylinder 1 carries the target material 2, and the inner cylinder 3 carries the magnet 4 to form a magnetic field; for example... Figure 3-5 As shown, during sputtering deposition, the target assembly can be uniformly deposited on the curved substrate. However, the distance from the sputtering surface of commonly used cylindrical and planar targets to the surface of the curved substrate is different, resulting in different numbers and energies of sputtered ions reaching the substrate surface. This causes uneven deposition, inconsistent film quality, and poor film properties. Under the influence of an applied voltage, argon atoms are ionized into argon ions and electrons, resulting in the glow discharge phenomenon of plasma. Electrons, under the combined influence of the magnetic and electric fields, drift and deflect, significantly increasing their trajectory. This increases the probability of collisions with argon particles during their motion, generating more ions and electrons. The ions then collide with the target material under the influence of the electric field. Due to momentum transfer, target atoms escape from the target surface and deposit onto the substrate, ultimately forming a thin film.

[0032] In summary, by utilizing the above-mentioned technical solution of this utility model, the present utility model designs the target cylinder 1, target material 2, and internal magnetic field into spherical or curved surfaces, so that the distance between the sputtering source and each point on the surface of the curved substrate remains consistent; it overcomes the problem of uneven film thickness and poor adhesion caused by distance differences when traditional planar or cylindrical targets are coated on curved substrates, and significantly improves the coating quality and consistency on curved workpieces. The target material 2 adopts two hemispherical structures and is tightly fitted with the target cylinder 1 to form a complete and continuous curved sputtering source, effectively avoiding the sputtering dead zone and film defects present in spliced ​​targets. The top and bottom sealing surfaces 7, sealing elements 5, and reliable connection with the magnetron sputtering end 8, and the cooperation through bearings 6, ensure the sealing of the vacuum environment and the structural stability of the entire assembly during the sputtering process. Magnets 4 are uniformly arranged on the spherical curved surface of the inner wall of the inner cylinder 3, generating a magnetic field that is highly matched with the curved surface of the target material. The magnetic field layout can most effectively constrain the trajectory of electrons, greatly increase the plasma density, and thus improve the sputtering rate and efficiency. In addition, the gap reserved between the target cylinder 1 and the inner cylinder 3 forms a cooling water channel, which can remove the large amount of heat generated by sputtering in time, prevent the target material from overheating and being damaged, and ensure long-term, stable, high-performance coating operation.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A target assembly for coating curved substrates, characterized in that, include: Target tube (1); The target material (2) is disposed on the outside of the target cylinder (1); The inner cylinder (3) is disposed inside the target cylinder (1); Several magnetic steel blocks (4) are disposed on the inner wall of the inner cylinder (3).

2. The target assembly for coating curved substrates according to claim 1, characterized in that, The main body of the target tube (1) is spherical, and the two ends are cylindrical; The bottom end of the target cylinder (1) is provided with a sealing element (5), and the top end of the sealing element (5) is provided with a bearing (6) that cooperates with the inner cylinder (3). The top end of the target cylinder (1) is provided with a sealing surface (7) that cooperates with the inner cylinder (3), and the top end of the sealing surface (7) is connected to the magnetron sputtering end (8).

3. The target assembly for coating curved substrates according to claim 2, characterized in that, The target cylinder (1) has a spherical structure both inside and outside, and the target cylinder (1) is made of stainless steel.

4. The target assembly for coating curved substrates according to claim 1, characterized in that, The target material (2) is composed of two hemispherical structures, which are fixedly connected to the target cylinder (1), and the target material (2) is attached to the target cylinder (1) to form a curved surface.

5. The target assembly for coating curved substrates according to claim 1, characterized in that, The main body of the inner cylinder (3) is spherical, and the two ends are cylindrical; the inner and outer sides of the main body of the inner cylinder (3) are both spherical structures, and several of the magnetic steel blocks (4) are distributed on the curved surface of the inner sphere.

6. The target assembly for coating curved substrates according to claim 5, characterized in that, There is a gap between the target cylinder (1) and the inner cylinder (3), which can accommodate the flow of cooling water.

Citation Information

Patent Citations

  • Target material capable of realizing uniform coating on curved-surface base material and preparation method of target material

    CN115261807A