A triangular solder strip and a tin removal device thereof

CN224849100UActive Publication Date: 2026-10-13TRINA SOLAR CO LTD
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Patent Information

Application Number
CN202522347651.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-05
Publication Date
2026-10-13
Estimated Expiration
2035-11-05

AI Technical Summary

Technical Problem

[0004]本实用新型的目的在于,提供一种三角形焊带除锡装置,解决三角形焊带选择性除锡的问题

Benefits of technology

[0014]本实用新型还提供了一种采用上述的三角形焊带除锡装置制得的三角形焊带结构,包括截面为三角形的焊带基材,所述焊带基材具有一个背光面和两个受光面;

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Abstract

The utility model discloses a kind of triangular welding strip and tin removing device, including cutting component and base, the cutting component has inverted V-shaped cutout structure, two cutting surfaces of the inverted V-shaped cutout structure are used to remove the tin layer of the light-receiving surface of triangular welding strip;The inverted V-shaped cutout structure and the upper surface of the base form triangular channel allowing the triangular welding strip to pass, the upper surface of the base is used to support the back light surface of triangular welding strip to keep its tin layer.The utility model is simple in structure, tin layer of light-receiving surface of welding strip can be selectively removed, while keeping back light surface tin layer unaffected, keeping the triangular structure of welding strip, reducing light reflection loss, improve the light absorption efficiency.
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Description

Technical Field

[0001] This utility model relates to the field of photovoltaic module manufacturing technology, and in particular to a triangular solder strip and its desoldering device. Background Technology

[0002] Current triangular solder strips employ a three-layer structure: copper in the middle, silver on the outermost layer, and tin on the very outside. However, during the soldering process, the outer tin layer melts and adheres to the outside of the solder strip, causing the overall cross-section of the solder strip to change from a triangle to an ellipse, increasing light reflection loss. Since silver's light absorption rate is only 60% that of tin, directly exposing the silver layer to the outside is crucial for improving photoelectric conversion efficiency.

[0003] Therefore, there is a need for a device capable of selectively removing the tin layer from the surface of triangular solder strips in order to maintain their triangular structure and improve photoelectric conversion efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a desoldering device for triangular solder strips, thereby solving the problem of selective desoldering of triangular solder strips.

[0005] To solve the above-mentioned technical problems, this utility model provides a triangular solder strip desoldering device, including a cutting component and a base; The upper surface of the base is used to support the back of the triangular welding strip; The cutting component has an inverted V-shaped cut structure, and the two cutting surfaces of the inverted V-shaped cut structure are used to remove the tin layer from the light-receiving surface of the triangular solder strip; the inverted V-shaped cut structure and the upper surface of the base form a triangular channel that allows the triangular solder strip to pass through.

[0006] Optionally, the cutting component includes two blades, with the ends of the two blades connected away from the base to form the inverted V-shaped cut structure.

[0007] Optionally, the two blades are arranged in a mirror image.

[0008] Optionally, the cutting component further includes a cutter arm, with one cutter arm connected to the side of each blade away from the triangular channel.

[0009] Optionally, it also includes a retaining ring, with each of the two blade arms having a first through hole at the end away from the blade, allowing the retaining ring to pass through, and the base having a second through hole, allowing the retaining ring to pass through.

[0010] Optionally, the fixing ring includes a ring body and a first limiting part; The first limiting part is detachably connected to the ring body.

[0011] Optionally, the first limiting part includes an internal thread, and the ring body is provided with an external thread that mates with the internal thread.

[0012] Optionally, a fixing connector is also included, one end of which is connected to the base for fixing the triangular solder strip desoldering device to an external device.

[0013] Optionally, the fixing connector includes two connectors disposed opposite to each other and a fixing plate that connects the two connectors respectively, wherein one of the connectors is connected to the base.

[0014] This utility model also provides a triangular solder strip structure made using the above-mentioned triangular solder strip desoldering device, including a solder strip substrate with a triangular cross section, wherein the solder strip substrate has a backlight surface and two light-receiving surfaces; The middle layer of the solder strip substrate is a copper core, and the outer layer surrounding the middle layer is silver. The backlight surface is provided with a backlight protective layer, which is a tin-plated layer, and the material of the two light-receiving surfaces is silver. Compared with the prior art, the triangular solder ribbon and its detinning device provided by this utility model adopt a simple and reliable combination structure of cutting components and base, which is easy to manufacture and maintain; the inverted V-shaped cut structure of the cutting component forms a stable triangular channel, which can selectively remove the tin layer on the light-receiving surface of the solder ribbon while keeping the tin layer on the backlight surface unaffected; through continuous contact between the cutting surface and the solder ribbon, a continuous and stable detinning process is achieved; it can solve the problem that the solder ribbon cross-section becomes elliptical due to the melting of the tin layer during soldering, maintain the triangular structure of the solder ribbon, reduce light reflection loss, and allow the silver layer to be directly exposed on the light-receiving surface, thereby improving the light absorption efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the triangular solder strip desoldering device in an embodiment of this utility model; Figure 2 This is a schematic diagram of the working process of the triangular solder strip desoldering device in this embodiment of the present invention; Figure 3 This is a schematic diagram of the cross-section of the triangular welding strip in an embodiment of this utility model.

[0016] In the diagram: 1. Base; 2. Cutting component; 21. Blade; 22. Blade arm; 3. Fixing ring; 4. Fixing connector; 5. Triangular welding strip; 51. Middle layer; 52. Outer layer; 53. Backlight protective layer. Detailed Implementation

[0017] The present invention will now be described with reference to the accompanying drawings, which illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art can modify the present invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the present invention.

[0018] The serial numbers assigned to components in this document, such as "first," "second," etc., are merely for distinguishing the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). In the description of this utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0020] The present invention will be described in more detail below by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0021] This embodiment of the invention provides a triangular solder strip desoldering device. Please refer to [link / reference]. Figure 1 - Figure 2 The device includes a cutting component 2 and a base 1. The cutting component 2 has an inverted V-shaped cut structure, and the two cutting surfaces of the inverted V-shaped cut structure are used to remove the tin layer on the light-receiving surface of the triangular solder strip 5. The upper surface of the base 1 is used to support the back surface of the triangular solder strip 5. A triangular channel is formed between the inverted V-shaped cut structure and the upper surface of the base 1 to allow the triangular solder strip 5 to pass through.

[0022] The triangular solder strip 5 has a copper center, a silver outer layer, and a tin outermost layer, forming a three-layered structure. However, during soldering, the outermost tin layer melts, causing the molten tin to adhere to the outside of the solder strip. This results in an elliptical cross-section for the solder strip, rather than a triangular structure. This increases the reflection of light onto the solder strip. Since silver absorbs only 60% of the light compared to tin, it is crucial that the silver is exposed.

[0023] Using the triangular solder strip desoldering device provided in this embodiment, the triangular solder strip 5 is first placed on the base 1, ensuring that the back surface of the triangular solder strip 5 is in contact with the base 1; the device is then activated, allowing the triangular solder strip 5 to pass through the triangular channel; the two cutting surfaces of the inverted V-shaped cut structure scrape away the solder layer on the two light-receiving surfaces of the triangular solder strip 5, while keeping the solder layer on the back surface unaffected. After the desoldering process is completed, the cross-section of the triangular solder strip 5 is triangular, with the silver layer on the light-receiving surface exposed, while the solder layer on the back surface remains unaffected.

[0024] In one specific example, the cutting component 2 includes two blades 21, with the ends of the two blades 21 connected away from the base 1 to form the inverted V-shaped cut structure. The two blades 21 are arranged in a mirror image, with their cutting surfaces facing each other.

[0025] In this embodiment, when the triangular solder ribbon 5 passes through the triangular channel, the two blades 21 constituting the inverted V-shaped cut structure contact the two light-receiving surfaces of the triangular solder ribbon 5 respectively. As the solder ribbon moves as a whole, the light-receiving surfaces of the triangular solder ribbon 5 maintain continuous contact with the blades 21, achieving the effect of removing the tin plating layer from the two light-receiving surfaces and exposing the silver layer. The base 1 supports the backlighting surface of the triangular solder ribbon 5, so the tin layer on the backlighting surface is not affected by the cutting component 2.

[0026] In another specific example, the cutting component 2 can also be an integral structure or be formed by bending a metal sheet. The bent sheet is bent along the center line to form an inverted V-shaped structure. The two bent surfaces constitute the two cutting surfaces of the inverted V-shaped cut structure. The bending angle matches the cross-sectional angle of the triangular welding strip 5 to ensure that the two cutting surfaces can effectively contact the light-receiving surface of the triangular welding strip 5.

[0027] Furthermore, the cutting component 2 also includes two cutting arms 22, with each cutting blade 21 connected to the cutting arm 22 on the side away from the triangular channel.

[0028] Furthermore, it also includes a retaining ring 3, with a first through hole at the end of each of the two blade arms 22 away from the blade 21, allowing the retaining ring 3 to pass through, and a second through hole at the base 1, allowing the retaining ring 3 to pass through.

[0029] The retaining ring 3 secures the cutter arm 22 to the base 1 via the first and second through holes, ensuring the stability and precise positioning of the cutting component 2 during operation and preventing the cutter arm 22 from accidentally moving or falling off, thus improving operational safety. The first and second through holes allow for quick installation and removal of the retaining ring 3, facilitating the installation, adjustment, and maintenance of the cutting component 2.

[0030] In this embodiment, the cutting component 2 is placed on the base 1, the position and angle of the blade arm 22 are adjusted to form the triangular channel, and the fixing ring 3 passes through the first through hole of the two blade arms 22 and the second through hole on the base 1 to complete the fixing.

[0031] Please continue to refer to this. Figure 1 The fixing ring 3 includes a ring body and a first limiting part; the first limiting part is detachably connected to the ring body.

[0032] Furthermore, the first limiting part includes an internal thread, and the ring body is provided with an external thread that mates with the internal thread, making the threaded connection convenient for installation, adjustment and maintenance.

[0033] In one specific example, the ring body is a cylindrical structure, and its outer diameter is adapted to the inner diameter of the first through hole and the second through hole to ensure positioning accuracy during installation. One end of the ring body is provided with an external thread, and the other end is provided with a limiting flange, the diameter of which is larger than the inner diameter of the first through hole. The first limiting part is a threaded sleeve, and its interior is provided with an internal thread that mates with the external thread of the ring body.

[0034] The installation method of the retaining ring 3 is as follows: First, insert the ring body through the second through hole of the base 1, so that the limiting flange abuts against one side of the base 1; then, pass the ring body sequentially through the first through holes at the ends of the two cutter arms 22, at which point the external threaded end of the ring body extends out of the outermost first through hole; finally, screw the first limiting part threaded sleeve onto the external threaded end of the ring body and tighten it to an appropriate force. Through the bidirectional limiting action of the limiting flange and the first limiting part, reliable fixation of the cutter arm 22 and the base 1 is achieved. When adjustment or maintenance is required, the entire fixing structure can be quickly disassembled simply by removing the first limiting part.

[0035] Furthermore, it also includes a fixing connector 4, one end of which is connected to the base 1, for fixing the triangular solder strip desoldering device to an external device.

[0036] In one specific example, the fixed connector 4 includes two connectors arranged opposite to each other and a fixing plate that connects the two connectors respectively, wherein one of the connectors is connected to the base 1.

[0037] Furthermore, one of the fixing connectors 4 is connected to the side of the base 1 by bolts or welding.

[0038] The fixing connector 4 is used for docking with other external equipment, allowing the entire device to be securely installed on the production line. The fixing connector 4 provides flexibility and wider applicability for the triangular solder strip desoldering device.

[0039] In this embodiment, the triangular solder ribbon 5 is stretched from the coil state through a triangular channel. The inverted V-shaped cut structure continuously removes tin from the light-receiving surface of the solder ribbon. The treated solder ribbon can be directly used in subsequent cell welding processes. The entire process is highly automated, significantly improving production efficiency. The tin removal device provided in this embodiment has a simple structure, is easy to manufacture and maintain. The cross-section of the solder ribbon after tin removal is triangular, which effectively avoids the elliptical cross-section caused by the melting of the tin layer, thereby reducing light reflection loss and improving the photoelectric conversion efficiency of the photovoltaic module. Since the silver layer is exposed, the light absorption rate of the solder ribbon is further enhanced.

[0040] Example 2 This embodiment provides a triangular solder strip structure 5. Please refer to [reference needed]. Figure 3 The solder ribbon substrate has a triangular cross-section and has one backlighting surface and two light-receiving surfaces. The middle layer 51 of the solder ribbon substrate is a copper core, and the outer layer 52 surrounding the middle layer 51 is made of silver. The backlighting surface is provided with a backlighting surface protective layer 53, which is a tin-plated layer. The two light-receiving surfaces are made of silver.

[0041] Because silver absorbs only 60% of the light compared to tin, it is crucial that silver is exposed. The intermediate layer 51 of the solder ribbon substrate is a copper core. Copper has excellent conductivity and is the main component for current conduction in the solder ribbon. The thickness and purity of the copper core will affect the electrical performance of the solder ribbon. The intermediate layer 51 of the solder ribbon substrate is surrounded by silver material. Silver has excellent conductivity and oxidation resistance, which can improve the long-term stability and current transmission efficiency of the solder ribbon. The silver layer can also reflect light, reduce light loss, and improve the efficiency of photovoltaic modules. A layer of tin is plated on the back surface of the solder ribbon substrate, which helps the solder ribbon form good solder joints with the cells or other metal surfaces during the soldering process. The material of the two light-receiving surfaces is silver. The silver layer helps reflect light and reduces light absorption, thereby reducing the heat loss of photovoltaic modules. The combination of the copper core and the silver outer layer 52 provides excellent conductivity.

[0042] The structure of the triangular solder strip 5 provided in this embodiment can be obtained by the desoldering device provided in Embodiment 1, or by other processing and manufacturing methods or devices.

[0043] In summary, this invention provides a desoldering device and structure for triangular solder ribbons. The device employs a combination of a cutting component with an inverted V-shaped cut and a base, selectively removing the tin layer from the light-receiving side of the solder ribbon while protecting the tin plating on the backside. The cutting component uses a mirror-shaped double-blade structure, and is stably and reliably installed and fixed via a blade arm and retaining ring, facilitating maintenance and adjustment. After processing by the desoldering device, the triangular solder ribbon retains only the tin plating on the backside for soldering, while the two light-receiving sides expose the silver layer. This avoids the elliptical deformation problem caused by tin melting during soldering in traditional solder ribbons, maintaining an ideal triangular cross-section and significantly reducing light reflection loss. This desoldering device is simple and reliable, providing a new technical approach to improving the efficiency of photovoltaic modules by enhancing the optical and electrical performance of the solder ribbon.

[0044] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A triangular solder strip desoldering device, characterized in that, Includes cutting components and a base; The upper surface of the base is used to support the back of the triangular welding strip; The cutting component has an inverted V-shaped cut structure, and the two cutting surfaces of the inverted V-shaped cut structure are used to remove the tin layer from the light-receiving surface of the triangular solder strip; a triangular channel is formed between the inverted V-shaped cut structure and the upper surface of the base to allow the triangular solder strip to pass through.

2. The triangular solder strip desoldering device as described in claim 1, characterized in that, The cutting component includes two blades, with the ends of the two blades away from the base connected to form the inverted V-shaped cut structure.

3. The triangular solder strip desoldering device as described in claim 2, characterized in that, The two blades are arranged in a mirror image.

4. The triangular solder strip desoldering device as described in claim 3, characterized in that, The cutting component also includes a cutter arm, with each of the blades connected to a cutter arm on the side away from the triangular channel.

5. The triangular solder strip desoldering device as described in claim 4, characterized in that, It also includes a retaining ring, and the ends of the two blade arms away from the blade are respectively provided with a first through hole that allows the retaining ring to pass through, and the base is provided with a second through hole that allows the retaining ring to pass through.

6. The triangular solder strip desoldering device as described in claim 5, characterized in that, The fixing ring includes a ring body and a first limiting part; The first limiting part is detachably connected to the ring body.

7. The triangular solder strip desoldering device as described in claim 6, characterized in that, The first limiting part includes an internal thread, and the ring body is provided with an external thread that mates with the internal thread.

8. The triangular solder strip desoldering device as described in claim 1, characterized in that, It also includes a fixing connector, one end of which is connected to the base for fixing the triangular solder strip desoldering device to an external device.

9. The triangular solder strip desoldering device as described in claim 8, characterized in that, The fixed connector includes two connectors arranged opposite each other and a fixing plate that connects the two connectors respectively, wherein one of the connectors is connected to the base.

10. A triangular solder strip structure manufactured using the triangular solder strip desoldering device as described in any one of claims 1 to 9, characterized in that, The substrate includes a solder strip with a triangular cross-section, the solder strip having one backlight surface and two light-receiving surfaces; The middle layer of the solder strip substrate is a copper core, and the outer layer surrounding the middle layer is silver. The backlight surface is provided with a backlight surface protective layer, which is a tin-plated layer, and the material of the two light-receiving surfaces is silver.