Vacuum atomization electroplating device for copper-coated steel wire

Abstract

The utility model discloses a copper clad steel wire vacuum atomization electroplating device, it includes the chassis, the upper end fixedly connected with the electroplating cylinder of chassis, the inner surface of electroplating cylinder is provided with the shower nozzle, the upper end fixedly connected with the solution tank of chassis, the output of solution tank is connected with the shower nozzle, the output of solution tank is provided with ultrasonic atomizer, the inside of electroplating cylinder is provided with slide rail, the slide rail slidingly connected with the moving frame, the one side fixedly connected with the sealed door of moving frame, the both sides fixedly connected with material box and the material receiving box of moving frame, the upper end fixedly connected with vacuum pump of electroplating cylinder. Through above -mentioned structure, through equipping vacuum pump and sealed door structure, can make the inside of electroplating cylinder form stable vacuum environment, can avoid the solution after atomization and oxygen, impurity in air contact, reduce atomization particle oxidation or the risk of pollution, simultaneously, let the copper ion after atomization more evenly spread to the copper clad steel wire surface.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, specifically a vacuum atomization electroplating device for copper-clad steel wire. Background Technology

[0002] Steel wire is a slender metal product made from high-quality steel through processes such as rolling and drawing. Electroplating of steel wire forms a uniform and dense metal coating on its surface, which not only effectively isolates the steel wire from contact with air, moisture and corrosive media, providing excellent corrosion protection and extending its service life, but also improves the surface hardness and wear resistance of the steel wire, enhances its electrical and thermal conductivity, and makes the steel wire appear brighter and cleaner.

[0003] However, existing electroplating equipment typically involves immersing steel in a solution for electroplating. However, when the electroplating solution comes into contact with oxygen and dust in the air, it is prone to oxidation reactions that generate impurities. Alternatively, air bubbles may mix into the solution, leading to problems such as pinholes, oxidation spots, and weak adhesion in the plating layer. Utility Model Content

[0004] This utility model provides a vacuum atomization electroplating device for copper-clad steel wire. By equipping it with a vacuum pump and a sealed door structure, a stable vacuum environment can be formed inside the electroplating cylinder, which can prevent the atomized solution from coming into contact with oxygen and impurities in the air, reducing the risk of oxidation or contamination of atomized particles. At the same time, it allows the atomized copper ions to diffuse more evenly to the surface of the copper-clad steel wire.

[0005] To achieve the above objectives, a vacuum atomization electroplating device for copper-clad steel wire is provided, comprising a base frame, an electroplating cylinder fixedly connected to the upper end of the base frame, a nozzle provided on the inner surface of the electroplating cylinder, a solution tank fixedly connected to the upper end of the base frame, an output end of the solution tank connected to the nozzle, an ultrasonic atomizer provided at the output end of the solution tank, a slide rail provided inside the electroplating cylinder, a movable frame slidably connected to the slide rail, a sealing door fixedly connected to one side of the movable frame, a material box and a receiving box fixedly connected to both sides of the movable frame respectively, a discharge port provided on the opposite side of the material box and the receiving box, and a vacuum pump fixedly connected to the upper end of the electroplating cylinder. The electroplating drum is designed for easy electroplating of wires; the nozzle is designed for easy spraying of the electroplating solution; the solution tank is designed for easy storage of the electroplating solution; the ultrasonic atomizer is designed for easy atomization of the electroplating solution; the slide rail is designed for easy guidance of the moving frame; the moving frame is designed for easy movement; the sealing door is designed for easy sealing of the electroplating drum; the receiving box and material box are designed for easy placement of materials; the discharge port is designed for easy passage of wires into the electroplating area; and the vacuum pump is designed for easy extraction of air from the electroplating drum.

[0006] According to the aforementioned vacuum atomization electroplating device for copper-clad steel wire, a material roller is fixedly connected inside the material box, and a receiving roller is rotatably connected inside the receiving box. Guide rollers are provided on the side of both the material box and the receiving box near the outlet. The material roller and receiving roller facilitate material placement, and the guide rollers facilitate guiding the wire so that it passes through the electroplating area in a straight line.

[0007] According to the aforementioned vacuum atomization electroplating device for copper-clad steel wire, a first motor is fixedly connected to one side of the receiving box, and the output end of the first motor is fixedly connected to the receiving roller. The first motor is provided to facilitate driving the receiving roller to rotate.

[0008] According to the aforementioned vacuum atomization electroplating device for copper-clad steel wire, a screw is rotatably connected to the upper end of the base frame, and a guide rod is fixedly connected to the upper end of the base frame. The screw is provided to facilitate the movement of the connecting frame, and the guide rod is provided to facilitate the restriction of the movement trajectory of the connecting frame.

[0009] According to the aforementioned vacuum atomization electroplating device for copper-clad steel wire, a connecting frame is fixedly connected to the outside of the sealing door. The connecting frame is threadedly connected to a screw and slidably connected to a guide rod. The connecting frame is provided to facilitate the connection of the sealing door.

[0010] According to the aforementioned vacuum atomization electroplating device for copper-clad steel wire, a second motor is fixedly connected to one end of the base frame, and the output end of the second motor is fixedly connected to a screw. The second motor is provided to facilitate driving the screw to rotate.

[0011] According to the aforementioned vacuum atomization electroplating device for copper-clad steel wire, the nozzles are circumferentially distributed on the inner surface of the electroplating cylinder around the central axis of the electroplating cylinder.

[0012] According to the aforementioned vacuum atomization electroplating device for copper-clad steel wire, a drain tank is provided at the bottom of the electroplating cylinder, and a filter screen is provided above the drain tank. The drain tank is provided for convenient storage of waste liquid, and the filter screen is provided to prevent larger impurities from falling into the drain tank.

[0013] The beneficial effects of this utility model are as follows: by equipping it with a vacuum pump and a sealed door structure, a stable vacuum environment can be formed inside the electroplating tank, which can prevent the atomized solution from coming into contact with oxygen and impurities in the air, reducing the risk of oxidation or contamination of the atomized particles. At the same time, it allows the atomized copper ions to diffuse more evenly to the surface of the copper-clad steel wire.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments; Figure 1 This is a first structural schematic diagram of a vacuum atomization electroplating device for copper-clad steel wire according to the present invention; Figure 2 This is a schematic diagram of the second structure of a vacuum atomization electroplating device for copper-clad steel wire according to the present invention; Figure 3 This is a schematic diagram of the internal structure of the electroplating cylinder of a vacuum atomization electroplating device for copper-clad steel wire according to this utility model; Figure 4 This is an internal cross-sectional view of the electroplating cylinder of a vacuum atomization electroplating device for copper-clad steel wire according to this utility model.

[0016] Legend: 1. Base frame; 2. Electroplating cylinder; 3. Nozzle; 4. Solution tank; 5. Ultrasonic atomizer; 6. Slide rail; 7. Moving frame; 8. Sealed door; 9. Material box; 10. Receiving box; 11. Discharge port; 12. Vacuum pump; 13. Material roller; 14. Receiving roller; 15. Guide roller; 16. First motor; 17. Screw; 18. Guide rod; 19. Connecting frame; 20. Second motor; 21. Drainage tank; 22. Filter screen. Detailed Implementation

[0017] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0018] Reference Figures 1 to 4 This utility model discloses a vacuum atomization electroplating device for copper-clad steel wire, comprising a base frame 1, an electroplating cylinder 2 fixedly connected to the upper end of the base frame 1, a nozzle 3 provided on the inner surface of the electroplating cylinder 2, a solution tank 4 fixedly connected to the upper end of the base frame 1, a corrosion-resistant centrifugal pump installed at the bottom of the solution tank 4, an ultrasonic atomizer 5 provided at the output end of the solution tank 4, a slide rail 6 provided inside the electroplating cylinder 2, a movable frame 7 slidably connected to the slide rail 6, a sealing door 8 fixedly connected to one side of the movable frame 7, a material box 9 and a receiving box 10 fixedly connected to both sides of the movable frame 7 respectively, an outlet 11 provided on the opposite side of the material box 9 and the receiving box 10, and a vacuum pump 12 fixedly connected to the upper end of the electroplating cylinder 2.

[0019] Material box 9 is fixedly connected to material roller 13, and receiving box 10 is rotatably connected to receiving roller 14. Material box 9 and receiving box 10 are provided with guide roller 15 on the side near the discharge port 11. A first motor 16 is fixedly connected to one side of receiving box 10, and the output end of the first motor 16 is fixedly connected to receiving roller 14.

[0020] A screw 17 is rotatably connected to the upper end of the base frame 1, and a guide rod 18 is fixedly connected to the upper end of the base frame 1. A connecting frame 19 is fixedly connected to the outer side of the sealing door 8. The connecting frame 19 is threadedly connected to the screw 17, and the connecting frame 19 is slidably connected to the guide rod 18 to ensure that the connecting frame 19 moves only in a straight line, so as to avoid misalignment between the sealing door 8 and the flange interface of the electroplating cylinder 2, which would lead to sealing failure.

[0021] A second motor 20 is fixedly connected to one end of the base frame 1. The output end of the second motor 20 is fixedly connected to the screw 17. The nozzles 3 are distributed circumferentially on the inner surface of the electroplating cylinder 2 around the central axis of the electroplating cylinder 2. A drain trough 21 is provided at the bottom of the inside of the electroplating cylinder 2. A filter screen 22 is provided above the drain trough 21.

[0022] Working principle: In use, the second motor 20 is started to drive the screw 17 to rotate, which in turn moves the connecting frame 19 along the guide rod 18 away from the electroplating cylinder 2, causing the sealing door 8 and the moving frame 7 to slide out synchronously, placing the steel wire on the material roller 13. Then, one end of the wire is pulled and passed sequentially around the guide roller 15 at the outlet of the material box 9, the internal space of the electroplating cylinder 2, and the guide roller 15 at the inlet of the receiving box 10, and finally fixed on the receiving roller 14. Then, the second motor 20 is started to reverse, and the screw 17 drives the connecting frame 19 and the sealing door 8 to move towards the electroplating cylinder 2 until the sealing door 8 and the interface of the electroplating cylinder 2 are completely fitted. Then, the vacuum pump 12 is started to extract the air in the electroplating cylinder 2 until the inside reaches a vacuum. The electroplating solution in the solution tank 4 is transported to the ultra-high pressure system by a centrifugal pump. The sonic atomizer 5 atomizes the material into droplets, which are then transported through a pipe to the circumferential nozzle 3 inside the electroplating cylinder 2. The droplets are evenly sprayed into the cylinder space from multiple directions, forming a stable atomized atmosphere. Then, the first motor 16 is started to drive the receiving roller 14 to rotate, which slowly releases the wire to be electroplated from the material roller 13. Guided by the guide roller 15, the wire moves in a straight line through the atomized atmosphere zone inside the electroplating cylinder 2. During this process, the atomized copper ion droplets are evenly attached to the surface of the wire and are rapidly deposited in a vacuum environment to form a dense and uniform copper plating layer. The atomized solution droplets that are not attached to the surface of the wire will drip into the drain tank 21 at the bottom of the electroplating cylinder 2 due to gravity. Once electroplating is complete, the sealing door 8 can be opened, and the electroplated wire can be taken out from the receiving roller 14.

[0023] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A vacuum atomization electroplating device for copper-clad steel wire, characterized in that, The device includes a base frame (1), an electroplating cylinder (2) fixedly connected to the upper end of the base frame (1), a nozzle (3) provided on the inner surface of the electroplating cylinder (2), a solution tank (4) fixedly connected to the upper end of the base frame (1), the output end of the solution tank (4) connected to the nozzle (3), an ultrasonic atomizer (5) provided at the output end of the solution tank (4), a slide rail (6) provided inside the electroplating cylinder (2), a movable frame (7) slidably connected to the slide rail (6), a sealing door (8) fixedly connected to one side of the movable frame (7), a material box (9) and a receiving box (10) fixedly connected to the two sides of the movable frame (7), a discharge port (11) provided on the opposite side of the material box (9) and the receiving box (10), and a vacuum pump (12) fixedly connected to the upper end of the electroplating cylinder (2).

2. The vacuum atomization electroplating device for copper-clad steel wire according to claim 1, characterized in that, The material box (9) is fixedly connected to the inside of the material roller (13), and the receiving box (10) is rotatably connected to the inside of the material roller (14). The material box (9) and the receiving box (10) are provided with guide rollers (15) on the side near the discharge port (11).

3. The vacuum atomization electroplating device for copper-clad steel wire according to claim 2, characterized in that, A first motor (16) is fixedly connected to one side of the receiving box (10), and the output end of the first motor (16) is fixedly connected to the receiving roller (14).

4. The vacuum atomization electroplating device for copper-clad steel wire according to claim 1, characterized in that, The upper end of the base frame (1) is rotatably connected to a screw (17), and the upper end of the base frame (1) is fixedly connected to a guide rod (18).

5. The vacuum atomization electroplating apparatus for copper-clad steel wire according to claim 4, characterized in that, A connecting frame (19) is fixedly connected to the outside of the sealing door (8). The connecting frame (19) is threadedly connected to the screw (17), and the connecting frame (19) is slidably connected to the guide rod (18).

6. The vacuum atomization electroplating apparatus for copper-clad steel wire according to claim 5, characterized in that, One end of the base frame (1) is fixedly connected to a second motor (20), and the output end of the second motor (20) is fixedly connected to a screw (17).

7. The vacuum atomization electroplating apparatus for copper-clad steel wire according to claim 1, characterized in that, The nozzles (3) are distributed circumferentially on the inner surface of the electroplating cylinder (2) around the central axis of the electroplating cylinder (2).

8. The vacuum atomization electroplating device for copper-clad steel wire according to claim 1, characterized in that, The electroplating cylinder (2) has a drain trough (21) at its bottom, and a filter screen (22) is provided above the drain trough (21).

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