Electroplating fixture for silver plating electronic components

Abstract

The utility model relates to electroplating fixture technical field and disclose a kind of electronic components silver plating electroplating fixture, including first clamping plate, the positive surface of first clamping plate is fixedly installed with fixed seat, this electronic components silver plating electroplating fixture, the fixture is reliably clamped by multiple structures cooperation, while avoiding damage component, when rotating second clamping plate around fixed seat and approaching first clamping plate, the thread cooperation of ball screw and self-locking nut can accurately adjust interval, cooperate self-locking characteristic locking position, prevent clamping loose, spring is compressed in clamping, can buffer impact force, avoid excessive clamping damage component, first conductive rubber pad and second conductive rubber pad not only guarantee current conduction, but also can enhance the friction force of component and prevent skidding, and rubber material can flexibly protect component surface, furthermore, fixed bolt is further reinforced first clamping plate by installation groove, overall structure ensures clamping firm, provides stable environment for silver plating.

Description

Technical Field

[0001] This utility model relates to the field of electroplating fixture technology, specifically to an electroplating fixture for silver plating of electronic components. Background Technology

[0002] In the field of electronic component manufacturing, silver plating is a key step in improving the conductivity, oxidation resistance, and signal transmission performance of components. As the core tool for fixing components and conducting current during the silver plating process, the performance of electroplating fixtures directly determines the quality of silver plating and production efficiency.

[0003] Existing electroplating fixtures mostly use ordinary bolts or snap-fit ​​structures to adjust the clamping distance, lacking precise distance control and self-locking function. During the adjustment process, the fit between the bolts and the clamping plates is low, making it impossible to achieve millimeter-level spacing adaptation according to the component size. This results in clamping that is too loose or too tight, and there is no self-locking characteristic. During the electroplating process, the fixture is affected by external forces such as the impact of silver plating solution and equipment vibration, which can easily cause the clamping position to shift or loosen, resulting in poor contact between the component and the electrode. This leads to uneven silver plating layer thickness and localized incomplete plating, which seriously affects the electrical performance of the component. In view of this, an electroplating fixture for silver plating of electronic components is proposed. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides an electroplating fixture for silver plating of electronic components, which solves the problem of insufficient clamping force in electroplating fixtures.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the present invention provides the following technical solution: an electroplating fixture for silver plating of electronic components, comprising a first clamping plate, wherein a fixing seat is fixedly mounted on the front surface of the first clamping plate;

[0008] The first clamping plate is provided with a fixing mechanism, which includes an installation groove, fixing bolts, a first conductive rubber pad, a second clamping plate, a second conductive rubber pad, and a pin positioning ring.

[0009] The mounting groove is formed on the front surface of the first clamping plate, and the fixing bolt is threaded onto the inner surface of the first clamping plate and penetrates into the inner wall of the mounting groove.

[0010] The first conductive rubber pad is fixedly sleeved on the outer surface of the first clamping plate.

[0011] Preferably, the second clamping plate is rotatably connected to the inner surface of the fixed base, and the second conductive rubber pad is fixedly sleeved on the outer surface of the second clamping plate.

[0012] Preferably, the two pin positioning rings are fixedly installed on the opposite sides of the first conductive rubber pad and the second conductive rubber pad, and the pin positioning rings are arranged in a circular shape.

[0013] Preferably, the fixing mechanism further includes a spring and a self-locking nut, the spring being rotatably connected to the rear surface of the second clamping plate, and the self-locking nut being fixedly installed at the rear end of the spring.

[0014] Preferably, the fixing mechanism further includes a ball screw, which is threaded onto the inner surface of the self-locking nut and fixedly installed on the front surface of the first clamping plate.

[0015] Preferably, the pin positioning ring is configured with a U-shaped opening.

[0016] Preferably, the pin positioning ring is hollowed out, with three fan-shaped hollow holes evenly distributed on the ring body.

[0017] (III) Beneficial Effects

[0018] Compared with the prior art, this utility model provides an electroplating fixture for silver plating of electronic components, which has the following beneficial effects:

[0019] 1. This electroplating fixture for silver plating electronic components achieves reliable clamping through multi-structure collaboration while avoiding damage to the components. When the second clamping plate rotates around the fixed base and approaches the first clamping plate, the threaded engagement of the ball screw and the self-locking nut allows for precise adjustment of the spacing. Combined with the self-locking characteristic, the position is locked to prevent loosening. The spring is compressed during clamping, which can buffer the impact force and avoid over-clamping and damage to the components. The first and second conductive rubber pads not only ensure current conduction but also enhance the friction with the components to prevent slippage. The rubber material can also flexibly protect the surface of the components. In addition, the fixing bolts further reinforce the first clamping plate through the mounting groove. The overall structure ensures stable clamping and provides a stable environment for silver plating.

[0020] 2. This electroplating fixture for silver plating electronic components features different shapes of pin positioning rings, effectively improving plating quality and operational efficiency. Two pin positioning rings are installed on the opposite sides of the first and second conductive rubber pads. The U-shaped opening facilitates quick placement of component pins, while the circular structure accurately positions the pins to prevent misalignment. Its hollow design, with three evenly spaced fan-shaped holes, ensures the silver plating solution fully contacts the pins, guaranteeing uniform plating. Simultaneously, the rotating structure of the second clamping plate around the fixed base, combined with the adjustment of the ball screw and self-locking nut, allows operators to easily open and close the fixture, quickly placing and removing components. The overall structure improves pin positioning accuracy, simplifies the operation process, and ensures optimal silver plating results. Attached Figure Description

[0021] Figure 1This is a schematic diagram of the structure of an electroplating fixture for silver plating of electronic components according to the present invention;

[0022] Figure 2 This is a schematic diagram of the ball screw structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the first clamping plate structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the pin positioning ring structure of this utility model.

[0025] In the diagram: 1. First clamping plate; 2. Mounting groove; 3. Fixing bolt; 4. First conductive rubber pad; 5. Fixing seat; 6. Ball screw; 7. Self-locking nut; 8. Spring; 9. Second clamping plate; 10. Second conductive rubber pad; 11. Pin positioning ring. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figure 1-4 This utility model provides a new technical solution: an electroplating fixture for silver plating of electronic components, including a first clamping plate 1: serving as the main load-bearing base of the entire electroplating fixture and the mounting base for other components. A fixing seat 5 is fixedly installed on its front surface, and an installation groove 2 is also provided. A first conductive rubber pad 4 is sleeved on the outer surface to provide stable support for the entire fixture. At the same time, it provides installation positions for other components through its own structure, ensuring the stability of the overall structure of the fixture.

[0028] Mounting groove 2: It is formed on the front surface of the first clamping plate 1, providing a through channel for the fixing bolt 3, so that the fixing bolt 3 can penetrate and act on the relevant parts, and assist the fixing bolt 3 in tightening the parts during the fixing process, ensuring the normal operation of the fixing mechanism.

[0029] Fixing bolt 3: It is threaded on the inner surface of the first clamping plate 1 and penetrates into the inner wall of the mounting groove 2. Its position in the first clamping plate 1 can be adjusted by rotation, thereby applying pressure to the components in the mounting groove 2 or related connected components, playing a fixing role and ensuring the stability of the component connection.

[0030] First conductive rubber pad 4: It is fixedly sleeved on the outer surface of the first clamping plate 1. It is conductive and can conduct current during electroplating. Because the rubber material has a certain elasticity, it can play a buffering role when clamping electronic components to avoid damaging the components, while also enhancing the tightness of the clamping.

[0031] Fixed base 5: It is fixedly installed on the front surface of the first clamping plate 1 and is the hub connecting the first clamping plate 1 and the second clamping plate 9. It provides a rotation support point for the second clamping plate 9, so that the second clamping plate 9 can rotate flexibly, realize the opening and closing of the clamp, and facilitate the placement and removal of components.

[0032] Ball screw 6: It is threaded onto the inner surface of the self-locking nut 7 and fixedly installed on the front surface of the first clamping plate 1. Through its cooperation with the self-locking nut 7, it converts rotational motion into linear motion and adjusts the distance between the second clamping plate 9 and the first clamping plate 1, thereby controlling the clamping force.

[0033] Self-locking nut 7: It is fixedly installed at the rear end of the spring 8 and threadedly connected to the ball screw 6. When the ball screw 6 rotates, it can move accordingly. At the same time, it uses its own self-locking characteristics to fix itself after being adjusted to a suitable position, preventing changes in clamping force due to external force.

[0034] Spring 8: Rotatably connected to the rear surface of the second clamping plate 9, and connected to the self-locking nut 7 at the rear end. It is elastic and can buffer the impact force during clamping. At the same time, it provides elastic support when adjusting the clamping force, making the clamping more gentle and avoiding excessive clamping that could damage the components.

[0035] The second clamping plate 9 is rotatably connected to the inner surface of the fixed base 5 and cooperates with the first clamping plate 1 to form a clamping structure. The outer surface of the clamping plate 9 is fitted with a second conductive rubber pad 10. By rotating itself, the clamping plate 9 can adjust its relative position with the first clamping plate 1 to clamp or release the components.

[0036] The second conductive rubber pad 10 is fixedly sleeved on the outer surface of the second clamping plate 9. Its function is similar to that of the first conductive rubber pad 4. It ensures the current conduction during electroplating, protects the components during clamping, and enhances the friction between the components to prevent slippage.

[0037] Pin positioning rings 11: There are two of them, which are fixedly installed on the opposite side of the first conductive rubber pad 4 and the second conductive rubber pad 10. They are circular with U-shaped openings and hollowed-out shapes. Three fan-shaped hollow holes are evenly opened on the ring body, which can accurately position the pins of electronic components. The U-shaped opening makes it easy to insert the pins. The hollow design does not affect the contact of the electroplating solution and ensures the silver plating effect of the pins.

[0038] An electroplating fixture for silver plating of electronic components, initially, the second clamping plate 9 maintains a certain opening angle with the first clamping plate 1 via the fixing seat 5, the spring 8 is in a natural or slightly compressed state, and the self-locking nut 7 and the ball screw 6 are in a relatively loose threaded engagement state. When it is necessary to fix the electronic components, the second clamping plate 9 is rotated to move closer to the first clamping plate 1. At this time, the second clamping plate 9 drives the spring 8 and the self-locking nut 7 to move synchronously. The self-locking nut 7 moves towards the first clamping plate 1 along the threaded trajectory of the ball screw 6, and the spring 8 is gradually compressed, storing elastic potential energy. As the second clamping plate 9 rotates, the first conductive rubber pad 4 and the second... As the conductive rubber pad 10 gradually approaches, the pin positioning ring 11 on the opposite side of the two will wrap and position the component pins. The hollow structure ensures that the pins are in full contact with the silver plating solution. When the clamping force reaches the required level, the current position is fixed by the thread self-locking characteristics of the ball screw 6 and the self-locking nut 7. At the same time, the fixing bolt 3 can be further tightened. The mounting groove 2 helps to reinforce the first clamping plate 1 to prevent the clamping from loosening. After the silver plating is completed, the cooperation between the ball screw 6 and the self-locking nut 7 is adjusted in the opposite direction. The spring 8 releases the elastic potential energy, which drives the second clamping plate 9 to rotate in the opposite direction around the fixing seat 5 and separate from the first clamping plate 1, thus completing the removal of the component.

[0039] Example 1: Application of Circular Pin Positioning Rings in Mass Silver Plating of Micro-connector Pins

[0040] like Figure 2 In the mass production of silver plating for miniature connectors (pin diameter 0.3mm, pitch 0.5mm) for mobile phone charging interfaces, the annular pin positioning ring 11 installed on the opposite sides of the first and second conductive rubber pads plays a precise positioning role. This positioning ring is made of corrosion-resistant polytetrafluoroethylene, and the error between the inner ring diameter and the connector pin diameter is controlled within ±0.01mm. When the operator places the connector into the fixture, the annular structure can simultaneously wrap all the pins, ensuring that each pin is in the central axis position of the fixture. During the silver plating process, the first and second conductive rubber pads form a stable current loop through the annular positioning ring, avoiding uneven current distribution due to pin offset. After testing, it was found that after using this positioning ring, the silver plating layer thickness deviation of the connector pins decreased from ±0.8μm to ±0.2μm, and the missed plating rate decreased from 3.2% to 0.1%. Moreover, in mass production, the silver plating operation of 120 products per hour can be completed, improving efficiency by 40%.

[0041] Example 2: Application of U-shaped open pin positioning ring in silver plating of irregularly shaped component pins

[0042] like Figure 3In the silver plating of irregularly shaped sensors (L-shaped pins with irregular spacing) in the automotive electronics field, the U-shaped pin positioning ring 11 solves the problem of traditional circular positioning rings being unable to be quickly picked up and put down. The positioning ring has an opening angle of 30° and the opening edge is rounded (radius 0.2mm) to avoid scratching the pins. During operation, the operator does not need to fully open the second clamping plate. He only needs to insert the sensor pin directly into the positioning ring along the U-shaped opening. The position is fixed by the elastic clamping force of the first and second conductive rubber pads. In the silver plating solution circulation impact test, the U-shaped opening, together with the buffering effect of the spring 8, keeps the pin displacement within 0.03mm, which is far lower than the displacement limit of 0.1mm of the traditional clamp. In addition, for components that need to be re-plated, the target pin can be taken out separately through the U-shaped opening for processing without disassembling the entire clamp. The re-plating time is shortened from 20 minutes to 5 minutes.

[0043] Example 3: Application of hollow pin positioning rings in silver plating of high-precision chip pins

[0044] like Figure 4 In the silver plating process of 5G communication high-precision chips (24 pins, 1.2mm in length per pin), the hollow pin positioning ring 11 with three fan-shaped hollow holes evenly distributed on its ring body achieves dual protection of silver plating uniformity and positioning stability. The hollow area of ​​the positioning ring accounts for 45% of the total area of ​​the ring body, and the distance between the edge of the fan-shaped hole and the pin is maintained at 0.15mm. This avoids blocking the flow path of the silver plating liquid and can form multi-point support for the pin through the remaining structure of the ring body. During the silver plating process, the silver plating liquid circulates rapidly through the fan-shaped hollow holes, which increases the silver plating liquid renewal rate on the pin surface by 60%. This effectively solves the problem of excessively thick silver plating layer at the root of the pin caused by traditional solid positioning rings. At the same time, in the high-temperature silver plating environment (60℃), the hollow structure accelerates heat dissipation, keeping the temperature rise at the contact point between the pin and the positioning ring below 5℃, avoiding pin deformation caused by high temperature. After silver plating, the pass rate of conductivity test of chip pins increases from 92% to 99.5%.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silver plating fixture for electronic components, comprising a first clamping plate (1), characterized in that: A fixing seat (5) is fixedly installed on the front surface of the first clamping plate (1); The first clamping plate (1) is provided with a fixing mechanism, which includes a mounting groove (2), a fixing bolt (3), a first conductive rubber pad (4), a second clamping plate (9), a second conductive rubber pad (10), and a pin positioning ring (11). Among them, the mounting groove (2) is opened on the front surface of the first clamping plate (1), the fixing bolt (3) is threaded on the inner surface of the first clamping plate (1), and the fixing bolt (3) penetrates into the inner wall of the mounting groove (2); The first conductive rubber pad (4) is fixedly sleeved on the outer surface of the first clamping plate (1).

2. The electroplating fixture for silver plating of electronic components according to claim 1, characterized in that: The second clamp (9) is rotatably connected to the inner surface of the fixed seat (5), and the second conductive rubber pad (10) is fixedly sleeved on the outer surface of the second clamp (9).

3. The electroplating fixture for silver plating of electronic components according to claim 1, characterized in that: The two pin positioning rings (11) are fixedly installed on the opposite sides of the first conductive rubber pad (4) and the second conductive rubber pad (10), and the pin positioning rings (11) are arranged in a circular shape.

4. The electroplating fixture for silver plating of electronic components according to claim 1, characterized in that: The fixing mechanism also includes a spring (8) and a self-locking nut (7). The spring (8) is rotatably connected to the rear surface of the second clamping plate (9), and the self-locking nut (7) is fixedly installed at the rear end of the spring (8).

5. The electroplating fixture for silver plating of electronic components according to claim 1, characterized in that: The fixing mechanism also includes a ball screw (6), which is threaded onto the inner surface of the self-locking nut (7) and is fixedly installed on the front surface of the first clamping plate (1).

6. The electroplating fixture for silver plating of electronic components according to claim 1, characterized in that: The pin positioning ring (11) is U-shaped with an opening.

7. The electroplating fixture for silver plating of electronic components according to claim 1, characterized in that: The pin positioning ring (11) is hollowed out, with three fan-shaped hollow holes evenly opened on the ring body.

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