Anti-glue-overflow pre-pressing sealing ring for packaging module

Abstract

The utility model relates to electronic packaging equipment accessory technical field, concretely, it relates to the anti -overflowing glue pre -pressing sealing ring of packaging module, including the packaging lower mould and the locating collar of installing on the upper surface of packaging lower mould, is provided with the elastic support base body sealing ring on the packaging lower mould, the elastic support base body sealing ring is encased in the outside of locating collar, the top surface of elastic support base body sealing ring is fixedly installed with annular sealing boss at the position close to inside part, is provided with the arc sealing surface on the upper surface of annular sealing boss, the top surface of elastic support base body sealing ring is fixedly installed with the glue ring of blocking at the position close to outside, still is provided with the glue overflow groove on the top surface of elastic support base body sealing ring, and the glue overflow groove is located between annular sealing boss and the glue ring of blocking. The utility model has good anti -overflowing glue protection effect, and it is beneficial to the smooth operation of packaging operation.

Description

Technical Field

[0001] This utility model relates to the technical field of electronic packaging equipment accessories, specifically to an anti-overflow adhesive pre-compression sealing ring for packaging modules. Background Technology

[0002] Against the backdrop of the rapid development of the electronic information industry, the demand for high-precision packaging products such as semiconductor chips, LED display modules, and automotive electronic sensors has exploded. The packaging quality directly determines the performance and reliability of terminal devices. As a core step, the pre-compression process of the packaging module uses the combined effect of 5-30kPa pressure and 80-200℃ temperature to promote the curing of adhesives such as epoxy and silicone, achieving a tight fit between the internal components of the module, such as chips, substrates, and pins. In this process, the sealing ring is a key sealing component of the pre-compression mold, which must simultaneously perform the dual functions of "preventing adhesive overflow" and "adapting to pre-compression deformation". It must prevent the adhesive flowing under heat from overflowing from the sealing gap, avoiding contamination of the module pins and causing short circuit risks, and it must also adapt to the 0.1-0.3mm micro-bumps or irregular structures that may exist on the surface of the packaging module to ensure that there are no local gaps on the sealing surface that could lead to adhesive penetration.

[0003] Existing sealing rings mostly employ a "single-plane seal" or "simple raised seal" structure, lacking a systematic anti-overflow system and failing to effectively address the thermal flow characteristics of adhesives. On one hand, traditional planar sealing rings rely solely on the adhesion between the sealing surface and the module's base to block the adhesive. When the adhesive viscosity drops to 500-1000 cP at a pre-compression temperature of 120-180℃, its flowability significantly increases. If the pre-compression fluctuates by ±2 kPa, the adhesive easily overflows from the tiny gaps in the sealing surface. On the other hand, some sealing rings with simple raised sections have a raised height of only 0.2-0.3 mm and lack subsequent containment structures. A small amount of adhesive, after passing over the raised section, directly diffuses into the mold or non-sealed areas of the module, failing to meet the sealing requirements of high-precision modules. Therefore, we propose an anti-overflow adhesive pre-compression sealing ring for encapsulation modules. Utility Model Content

[0004] The purpose of this invention is to provide an anti-overflow adhesive pre-compression sealing ring for packaging modules, so as to solve the defects mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: The pre-compression sealing ring for preventing adhesive overflow in the packaging module includes a lower packaging mold and a positioning collar mounted on the upper surface of the lower packaging mold. An elastic support base sealing ring is provided on the lower packaging mold, and the elastic support base sealing ring is fitted outside the positioning collar. An annular sealing boss is fixedly installed on the top surface of the elastic support base sealing ring near its inner side. An arc-shaped sealing surface is provided on the upper surface of the annular sealing boss. An adhesive-blocking ring is fixedly installed on the top surface of the elastic support base sealing ring near its outer side. An adhesive overflow groove is also provided on the top surface of the elastic support base sealing ring, located between the annular sealing boss and the adhesive-blocking ring.

[0006] Preferably, the sealing ring of the elastic support base is internally embedded with a plurality of miniature stainless steel springs, the miniature stainless steel springs having a diameter between 0.3 and 0.5 mm and a length between 2 and 3 mm; This feature ensures that the substrate can elastically deform under pre-stress, adapting to the 0.1~0.3mm micro-bumps on the module surface.

[0007] Preferably, an annular positioning flange is fixedly installed on the outer annular side of the elastic support base sealing ring, and an annular positioning groove is provided on the upper surface of the annular positioning flange, which is adapted to the annular protrusion of the pre-compression mold. This setting serves as a positioning feature, preventing deviation during the pre-compression process.

[0008] Preferably, the height of the annular sealing boss is between 0.5 and 1 mm, and the radius of curvature of the arc-shaped sealing surface is between 0.2 and 0.3 mm. This feature facilitates the fit between the curved sealing surface and the surface of the packaging module, preventing adhesive flow.

[0009] Preferably, an ultra-thin silicone layer is provided on the surface of the arc-shaped sealing surface, and the thickness of the ultra-thin silicone layer is between 0.1 and 0.2 mm; This feature utilizes the deformation of an ultra-thin silicone layer to wrap around the micro-bumps on the module surface, improving the sealing effect.

[0010] Preferably, a peelable release liner is provided in the overflow tank, and the thickness of the peelable release liner is between 25 and 50 μm; This setting ensures that any spilled adhesive adheres only to the surface of the release liner, allowing for easy cleaning by simply peeling off the release liner.

[0011] Preferably, the adhesive blocking ring has multiple micro protrusions on its side near the adhesive overflow groove, and the height of the micro protrusions is between 0.05 and 0.1 mm. This feature prevents the adhesive from adhering and curing inside the adhesive barrier ring. During cleaning, a soft brush can be used to quickly remove any residual adhesive from the gap, preventing blockage.

[0012] Preferably, a side reinforcing ring is fixedly installed between the outer side of the annular sealing boss and the top surface of the elastic support base sealing ring. The bottom end of the side reinforcing ring extends to the inner groove of the overflow groove, and the outer side of the side reinforcing ring is a downward inclined surface set at 60°~80°.

[0013] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model sets up an annular sealing boss on the top surface of the elastic support base sealing ring, an outer adhesive blocking ring, and an overflow groove between the two. The annular sealing boss first blocks the flow of adhesive, and a small amount of overflowing adhesive is contained by the overflow groove. The adhesive blocking ring further intercepts the diffusion of adhesive, forming a three-level anti-overflow system of "blocking-containing-intercepting". This replaces the traditional single sealing structure and achieves effective isolation of adhesive, thereby avoiding adhesive contamination of module pins and reducing the risk of short circuit.

[0014] 2. This utility model sets up a miniature stainless steel spring inside the sealing ring of the elastic support base, combined with an ultra-thin silicone layer on the arc-shaped sealing surface. The miniature stainless steel spring causes the base to deform elastically under pre-pressure, and the ultra-thin silicone layer can wrap the micro-protrusions on the module surface. At the same time, the annular positioning groove of the annular positioning flange matches the mold protrusion to prevent displacement, replacing the traditional rigid sealing structure, realizing the tight fit between the sealing ring and the surface of the irregular module, achieving the effect of adapting to pre-pressure deformation and eliminating local sealing gaps.

[0015] 3. This utility model features a peelable release liner in the overflow groove and micro protrusions on the side of the adhesive blocking ring. The overflowing adhesive adheres to the surface of the peelable release liner, which can be directly peeled off during cleaning. The micro protrusions prevent the adhesive from directly adhering to and solidifying on the inside of the adhesive blocking ring, thus avoiding blockage. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This utility model Figure 1 Enlarged view of point A in the middle; Figure 3 This utility model Figure 2 Enlarged view of point B in the middle; The meanings of the labels in the diagram are as follows: 1. Encapsulation lower mold; 10. Positioning collar; 2. Elastic support base sealing ring; 20. Miniature stainless steel spring; 21. Annular positioning flange; 211. Annular positioning groove; 22. Annular sealing boss; 221. Arc-shaped sealing surface; 23. Ultra-thin silicone layer; 24. Overflow groove; 241. Peelable release membrane; 25. Adhesive-blocking ring; 251. Miniature protrusion; 26. Side reinforcement ring. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figures 1-3 This utility model provides a technical solution: an anti-overflow adhesive pre-compression sealing ring for a packaging module, including a lower packaging mold 1 and a positioning collar 10 mounted on the upper surface of the lower packaging mold 1. An elastic support base sealing ring 2 is provided on the lower packaging mold 1. The elastic support base sealing ring 2 is sleeved on the outside of the positioning collar 10. The positioning collar 10 provides an installation positioning reference for the elastic support base sealing ring 2, avoiding radial displacement of the sealing ring during the pre-compression process and ensuring precise alignment between the sealing structure and the packaging module.

[0019] In this embodiment, an annular sealing boss 22 is fixedly installed on the top surface of the elastic support base sealing ring 2 near the inner side. An arc-shaped sealing surface 221 is provided on the upper surface of the annular sealing boss 22. The height of the annular sealing boss 22 is between 0.5 and 1 mm, and the radius of curvature of the arc-shaped sealing surface 221 is between 0.2 and 0.3 mm. The arc-shaped sealing surface 221 can form a tight fit with the surface of the packaging module. The fit is such that after the packaging module is pressed down, the top surface of the annular sealing boss 22 can better fit on the surface of the packaging module, effectively blocking the flow of adhesive and reducing the risk of adhesive overflowing from the gap of the sealing surface.

[0020] Specifically, a blocking ring 25 is fixedly installed on the top surface of the elastic support base sealing ring 2 near the outer side. An overflow groove 24 is also provided on the top surface of the elastic support base sealing ring 2. The overflow groove 24 is located between the annular sealing boss 22 and the blocking ring 25. A small amount of adhesive that crosses the annular sealing boss 22 can be contained by the overflow groove 24. The blocking ring 25 further intercepts the adhesive from spreading to the outside, forming double protection to prevent the adhesive from contaminating the pre-pressing mold or the non-sealed area of ​​the module.

[0021] Furthermore, multiple miniature stainless steel springs 20 are embedded inside the elastic support base sealing ring 2. The diameter of the miniature stainless steel springs 20 is between 0.3 and 0.5 mm, and the length is between 2 and 3 mm. The miniature stainless steel springs 20 can enhance the elastic deformation capability of the base, so that the sealing ring can adapt to the deformation of the module surface shape under the action of 5 to 30 kPa pre-pressure, accurately fit the micro protrusions of 0.1 to 0.3 mm on the module surface, and eliminate local sealing gaps.

[0022] like Figure 2As shown, an annular positioning flange 21 is fixedly installed on the outer annular side of the elastic support base sealing ring 2. An annular positioning groove 211 is provided on the upper surface of the annular positioning flange 211. The annular positioning groove 211 is adapted to engage with the annular protrusion of the pre-compression mold to provide positioning for the sealing ring, prevent the sealing ring from shifting due to vibration or pressure fluctuation during the pre-compression process, and ensure the stability of the sealing position.

[0023] like Figure 2 As shown, an ultra-thin silicone layer 23 is provided on the surface of the arc-shaped sealing surface 221. The thickness of the ultra-thin silicone layer 23 is between 0.1 and 0.2 mm. The ultra-thin silicone layer 23 has excellent flexibility and deformation ability, which can tightly wrap the micro-protrusions and micro-depressions on the module surface, further fill the micro gaps on the sealing surface, and improve the fit of the sealing surface and the anti-overflow effect of adhesive.

[0024] like Figure 3 As shown, a peelable release liner 241 is provided in the overflow liner 24. The thickness of the peelable release liner 241 is between 25 and 50 μm. The overflowing adhesive only adheres to the surface of the peelable release liner 241. During cleaning, there is no need to repeatedly wipe the overflow liner 24. The release liner can be peeled off directly to complete the cleaning, simplifying the cleaning process and reducing the cleaning wear of the sealing ring.

[0025] In addition, multiple micro protrusions 251 are provided on the side of the adhesive blocking ring 25 near the adhesive overflow groove 24. The height of the micro protrusions 251 is between 0.05 and 0.1 mm. The micro protrusions 251 can form a small gap inside the adhesive blocking ring 25 to prevent the adhesive from tightly adhering to the side of the adhesive blocking ring 25 and solidifying. When cleaning, the residual adhesive can be quickly removed with a soft brush to avoid gap blockage and affecting the subsequent sealing effect.

[0026] It is worth noting that a side reinforcing ring 26 is fixedly installed between the outer surface of the annular sealing boss 22 and the top surface of the elastic support base sealing ring 2. The bottom end of the side reinforcing ring 26 extends to the inner groove of the overflow groove 24. The outer surface of the side reinforcing ring 26 is a downward inclined surface set at 60°~80°. The side reinforcing ring 26 can enhance the structural strength of the annular sealing boss 22 and prevent it from deforming or breaking under long-term pre-pressure. At the same time, the inclined outer surface can guide the overflowing glue to flow into the overflow groove 24, avoiding the accumulation of glue at the root of the annular sealing boss 22.

[0027] The annular sealing boss 22 can be made of fluororubber and carbon fiber composite material, which ensures elasticity and improves the resistance to deformation. The permanent deformation after pre-compression is ≤0.02mm. The surface of the ultra-thin silicone layer 23 is provided with a micron-level honeycomb structure, which can wrap the micro-protrusions on the module surface through the deformation of the honeycomb structure and eliminate local fitting gaps. The substrate of the elastic support base sealing ring 2 can be doped with 10%~15% of high-temperature resistant additives, such as nano-sized silica, to improve the high-temperature resistance of the substrate. At the same time, the additives can enhance the tear resistance of the substrate and prevent cracking during the pre-compression process.

[0028] When using the anti-overflow glue pre-compression sealing ring of the packaging module of this utility model, the elastic support base sealing ring 2 is sleeved on the outside of the positioning collar 10 of the lower packaging mold 1, so that the annular positioning groove 211 of the annular positioning flange 21 is adapted and engaged with the annular protrusion of the pre-compression mold to complete the positioning. A peelable release film 241 is laid in the glue overflow groove 24 for later use. Place the encapsulation module above the elastic support base sealing ring 2, start the pre-pressing device, and when the module is pressed down, the annular sealing boss 22 with the arc-shaped sealing surface 221 and the ultra-thin silicone layer 23 fits the module surface. The internal micro stainless steel spring 20 helps the base deform to adapt to the micro protrusions. Even if a small amount of glue overflows, the glue overflow will be contained by the glue overflow groove 24 and the glue blocking ring 25 will intercept the outward expansion. After pre-pressing is completed, remove the module and peel off the peelable release membrane 241 in the overflow groove 24. If there is residual adhesive inside the adhesive blocking ring 25, clean the adhesive between the micro protrusions 251 with a soft brush. After checking that there is no adhesive buildup on the side reinforcing ring 26, it can proceed to the next round of use.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An anti-overflow adhesive pre-compression sealing ring for a packaging module, comprising a lower packaging mold (1) and a positioning collar (10) mounted on the upper surface of the lower packaging mold (1), characterized in that: The lower mold (1) of the encapsulation is provided with an elastic support base sealing ring (2), which is sleeved on the outside of the positioning collar (10). An annular sealing boss (22) is fixedly installed on the top surface of the elastic support base sealing ring (2) near the inner side. An arc-shaped sealing surface (221) is provided on the upper surface of the annular sealing boss (22). A glue-blocking ring (25) is fixedly installed on the top surface of the elastic support base sealing ring (2) near the outer side. An overflow groove (24) is also provided on the top surface of the elastic support base sealing ring (2). The overflow groove (24) is located between the annular sealing boss (22) and the glue-blocking ring (25).

2. The anti-overflow adhesive pre-compression sealing ring for the packaging module according to claim 1, characterized in that: The elastic support base sealing ring (2) is internally embedded with multiple miniature stainless steel springs (20), the miniature stainless steel springs (20) having a diameter between 0.3 and 0.5 mm and a length between 2 and 3 mm.

3. The pre-compression sealing ring for the packaging module according to claim 1, characterized in that: An annular positioning flange (21) is fixedly installed on the outer annular side of the elastic support base sealing ring (2). An annular positioning groove (211) is provided on the upper surface of the annular positioning flange (21). The annular positioning groove (211) is adapted to the annular protrusion of the pre-pressing mold.

4. The anti-overflow adhesive pre-compression sealing ring of the packaging module according to claim 1, characterized in that: The height of the annular sealing boss (22) is between 0.5 and 1 mm, and the radius of curvature of the arc-shaped sealing surface (221) is between 0.2 and 0.3 mm.

5. The anti-overflow adhesive pre-compression sealing ring for the packaging module according to claim 1, characterized in that: An ultra-thin silicone layer (23) is provided on the surface of the arc-shaped sealing surface (221), and the thickness of the ultra-thin silicone layer (23) is between 0.1 and 0.2 mm.

6. The anti-overflow adhesive pre-compression sealing ring for the packaging module according to claim 1, characterized in that: The overflow groove (24) is provided with a peelable release membrane (241), the thickness of which is between 25 and 50 μm.

7. The pre-compression sealing ring for the packaging module according to claim 1, characterized in that: The adhesive-blocking ring (25) has multiple micro protrusions (251) on its side near the adhesive overflow groove (24), and the height of the micro protrusions (251) is between 0.05 and 0.1 mm.

8. The anti-overflow adhesive pre-compression sealing ring of the packaging module according to claim 1, characterized in that: A side reinforcement ring (26) is fixedly installed between the outer side of the annular sealing boss (22) and the top surface of the elastic support base sealing ring (2). The bottom end of the side reinforcement ring (26) extends to the inner groove of the overflow groove (24). The outer side of the side reinforcement ring (26) is a sloped surface that is inclined downward at 60°~80°.

Images