A device for improving the heat dissipation efficiency of a wire-pipe condenser based on condensate evaporation

Abstract

The utility model provides a kind of silk pipe type condenser heat dissipation efficiency promotion device based on condensate evaporation, it is related to refrigeration equipment technical field, especially it is related to condenser heat dissipation technical field, for by condensate evaporation improves the heat exchange efficiency of silk pipe type condenser, including condensate collection component, condensate discharge component and overflow pipe, condensate collection component is set in the top of condenser body, condensate discharge component is set in the bottom of condenser body, including the lower water receiving box of top opening and the drain pipe being arranged in the one side of lower water receiving box, condenser support is arranged between lower water receiving box and condenser body, condensate collection component is connected with lower water receiving box by overflow pipe and is communicated.The utility model's technical scheme overcomes the problem of energy waste in prior art, that silk pipe type condenser only relies on air convection heat dissipation, does not utilize the condensate naturally generated in refrigeration cycle, causes.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment technology, and in particular to the field of condenser heat dissipation technology, specifically to a device for improving the heat dissipation efficiency of a wire tube condenser based on condensate evaporation. Background Technology

[0002] Currently, conventional wire-tube condensers rely solely on air convection for heat dissipation, failing to utilize the condensate naturally generated during the refrigeration cycle, resulting in energy waste. Chinese patent application CN116164467A discloses a commercial freezer that utilizes evaporative condensate to improve refrigeration performance. This invention adds a microchannel heat exchanger to the top of the freezer, positioned in front of the evaporator. The evaporator fan shroud includes a water storage tank and a drainage channel. Condensate is pumped into the microchannel heat exchanger for circulation. Hot air undergoes pre-cooling treatment via the microchannel heat exchanger before flowing to the evaporator for further cooling, delaying compressor operation time and extending compressor lifespan. The condensate, after heat exchange, is drained through a drain pipe to the condenser, which features a double-pipe or twin-pipe design. The circulating condensate removes heat from the condenser, improving its heat exchange rate. The water from the condenser is stored in a collection box at the bottom of the freezer and then pressurized by a pump at the bottom to a spray device for water cleaning, optimizing heat dissipation and improving refrigeration performance. However, this solution requires additional power components (such as pumps) and precision heat exchange components (such as microchannels), resulting in a complex structure, high cost, poor adaptability, and difficulty in matching the shape and spacing of wire tubes. It cannot achieve uniform, directional, and low-resistance flow of condensate on the surface of the wire tubes, thus failing to improve the heat dissipation efficiency of the condenser body.

[0003] Therefore, there is a need for a device that is simple in structure, low in cost, and capable of utilizing the evaporation of condensate to dissipate heat, in order to improve the heat dissipation efficiency of wire tube condensers. Summary of the Invention

[0004] The main purpose of this invention is to provide a device for improving the heat dissipation efficiency of a wire tube condenser based on condensate evaporation, so as to solve the problem that in the prior art, the condenser body only relies on air convection for heat dissipation and does not utilize the condensate naturally generated in the refrigeration cycle, resulting in energy waste.

[0005] To achieve the above objectives, this utility model provides a device for improving the heat dissipation efficiency of a wire-tube condenser based on condensate evaporation. The device comprises a condensate collection assembly, a condensate discharge assembly, and an overflow pipe. The condensate collection assembly is located at the top of the condenser body, and the condensate discharge assembly is located at the bottom of the condenser body. The condensate discharge assembly includes a lower water collection box with a top opening and a drain pipe located on one side of the lower water collection box. A condenser support is provided between the lower water collection box and the condenser body. The condensate collection assembly and the lower water collection box are connected via the overflow pipe.

[0006] Preferably, the condensate collection assembly includes an upper water receiving tray with several through holes at the bottom for guiding condensate flow. The upper water receiving tray is connected to the top of an overflow pipe via a connecting pipe, and the bottom of the overflow pipe is located in a water receiving box.

[0007] Preferably, the through holes of the upper water tray correspond one-to-one with the positions of the support wires of the condenser body.

[0008] Preferably, the diameter of the through hole is 1 mm larger than the diameter of the support wire.

[0009] Preferably, the support wire is embedded in the corresponding through hole.

[0010] Preferably, the condensate collection assembly includes an upper water receiving pan, an atomizing power assembly, and an atomizing nozzle. The atomizing power assembly is disposed inside the upper water receiving pan, and the atomizing nozzle is aimed at the surface of the condenser. The atomizing power assembly is connected to the upper water receiving pan to spray the atomized condensate onto the surface of the condenser.

[0011] Preferably, the upper water tray is connected to the condenser body via a snap-fit.

[0012] Preferably, the upper water tray is made of sheet metal or injection molded material.

[0013] Preferably, a connecting pipe is provided between the upper water receiving pan and the overflow pipe. The connecting pipe is inclined, and one end of the connecting pipe is located on the side of the upper water receiving pan. This is used to connect the upper water receiving pan to the top of the overflow pipe, so that the condensate in the upper water receiving pan that is higher than the connecting pipe can be discharged through the overflow pipe.

[0014] Preferably, the condensate collection assembly includes a condensate adsorption layer disposed on the top of the condenser body. The condensate adsorption layer is made of capillary material. An overflow prevention shell is sleeved on the outside of the condensate adsorption layer. A connecting pipe is provided on the side of the overflow prevention shell, and the connecting pipe connects the condensate adsorption layer and the overflow pipe.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention improves the heat dissipation efficiency of the condenser body and reduces the energy consumption of the refrigeration system by setting a heat dissipation component on the condenser body and applying condensed water to the condenser body through the heat dissipation component. It utilizes the synergistic effect of condensed water evaporation heat dissipation and air convection heat dissipation to improve the heat dissipation efficiency of the condenser body. This invention achieves uniform distribution of condensate in the condenser body by directional opening at the bottom of the upper water tray or by using an atomizing nozzle, while avoiding turbulent flow of condensate and reducing or preventing corrosion of other electronic components by condensate. This utility model heat dissipation component includes an upper water receiving pan, an overflow pipe, and a connecting pipe. By directionally opening a through hole at the bottom of the upper water receiving pan, gravity is used to achieve directional flow of condensate. The structure is simple, no additional power facilities are required, no additional debugging of precision parts is required during installation, and the cost is low, but the adaptation cost is high. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] In the attached diagram: Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of this utility model.

[0018] Figure 2 for Figure 1 Front view.

[0019] Figure 3 This is a top view of the water receiving tray in Example 1.

[0020] The reference numerals in the above figures are as follows: 1. Condenser body; 2. Lower water box; 3. Condenser bracket; 4. Condensate collection assembly; 41. Upper water tray; 42. Connecting pipe; 43. Overflow pipe; 44. Through hole; 5. Drain pipe. Detailed Implementation

[0021] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0022] Example 1 like Figure 1 , Figure 2 and Figure 3The device described is a heat dissipation efficiency improvement device for a wire-tube condenser based on condensate evaporation. It is characterized by comprising a condensate collection assembly 4, a condensate discharge assembly, and an overflow pipe 43. The condensate collection assembly 4 is located at the top of the condenser body 1, and the condensate discharge assembly is located at the bottom of the condenser body 1. The condensate discharge assembly includes a lower water collection box 2 with a top opening and a drain pipe 5 located on one side of the lower water collection box 2. A condenser support 3 is provided between the lower water collection box 2 and the condenser body 1. The condensate collection assembly 4 and the lower water collection box 2 are connected by the overflow pipe 43. The condensate collection assembly 4 includes an upper water collection tray 41. The bottom of the upper water collection tray 41 has several through holes 44 for condensate flow. The upper water collection tray 41 is connected to the top of the overflow pipe 43 via a connecting pipe 42. The bottom of the overflow pipe 43 is located in the lower water collection box 2. The through holes 44 of the upper water tray 41 correspond one-to-one with the positions of the support wires of the condenser body 1. The support wires of the condenser body 1 are embedded in the through holes 44, and the condensate flows out from the through holes 44 and flows into the condenser body 1 along the support wires. The bottom of the upper water tray 41 has directional openings that precisely match the support wires, ensuring uniform distribution of condensate and preventing corrosion of electronic components. The modular design allows for flexible adaptation to condenser bodies 1 of different specifications. Only the layout and size of the openings in the lower water box 2 need to be adjusted to apply it to scenarios such as household freezers and small refrigeration units, solving the problem of narrow compatibility in existing complex solutions and facilitating rapid industry promotion and replication.

[0023] Specifically, a connecting pipe 42 is provided between the upper water receiving pan 41 and the overflow pipe 43. The connecting pipe 42 is inclined and one end of the connecting pipe 42 is located on the side of the upper water receiving pan 41. It is used to connect the upper water receiving pan 41 and the top of the overflow pipe 43, so that the condensate in the upper water receiving pan 41 with the water level higher than the part of the connecting pipe 42 can be discharged through the overflow pipe 43.

[0024] The lower water box 2 contains the condensate that has not evaporated from the condenser and the condensate that overflows from the upper water tray 41. Excess condensate is discharged through the drain pipe 5 to prevent excessive condensate accumulation, which could lead to condensate leakage and damage to the equipment.

[0025] Specifically, the condenser body 1 is pretreated by spraying a silica solution to improve the hydrophilicity of the support wire surface, reduce water droplet accumulation caused by uneven water flow, and avoid water curtain obstruction. Without spraying the condenser body 1 with silica solution, if the water volume in the upper water tray 41 is low, water blockage may occur in the water support wires and openings due to the surface tension of the water, preventing condensate from flowing smoothly down the wires. Therefore, spraying silica solution onto the material surface reduces the surface tension of the water, achieving uniform wetting.

[0026] Specifically, the diameter of the through hole 44 is 1 mm larger than the diameter of the support wire.

[0027] Specifically, the upper water tray 41 is connected to the condenser body 1 via a snap fastener.

[0028] Specifically, the upper water tray 41 is made of sheet metal or injection molded material.

[0029] The specific working state of the heat dissipation efficiency improvement device for a wire-tube condenser based on condensate evaporation in Embodiment 1 of this utility model is as follows: During installation, align the openings of the upper water tray 41 with the top of the condenser support wires and insert them. Use clips to install the upper water tray 41 onto the condenser. Connect the upper water tray 41 and the overflow pipe 43 through the pipe 42. Then install the condenser bracket 3 and the lower water box 2 onto the condenser. Place the bottom of the overflow pipe 43 into the lower water box 2. Finally, place the drain pipe 5.

[0030] When moisture in the air inside the chamber condenses upon cooling, the condensate or defrost water collects and flows out along the inside of the chamber. First, due to gravity, it flows into the upper water collection tray 41. The openings in the upper water collection tray 41 correspond one-to-one with the positions of the support wires at the top of the condenser. The opening size is 1.0 mm larger than the diameter of the support wires, ensuring that the condensate flows down the wires under gravity. To ensure that the water flows continuously rather than as droplets, and to prevent the formation of a water film in the pores due to surface tension, a silica solution is sprayed onto the surface of the condenser support wires and the inside of the upper water collection tray 41 beforehand to form a hydrophilic layer. Condensate flows down the wire along the opening and gap, forming a water film. Under the action of the condenser fan, it evaporates and absorbs heat, lowering the temperature and assisting in heat dissipation. If there is too much water and it cannot be completely evaporated, the excess water will drip into the lower water collection box 2 after flowing to the bottom of the support wire. If the water volume in the upper water collection pan 41 is large and exceeds the overflow height, the excess water will also overflow along the overflow pipe 43 to the lower water collection box 2, and then be discharged through the drain pipe 5.

[0031] Example 2 Unlike Embodiment 1, Embodiment 2 omits the directional flow structure of the upper water receiving pan 4141 and instead uses an atomizing nozzle to atomize the condensate and spray it directly onto the condenser surface. The condensate collection assembly 4 of Embodiment 2 includes an upper water receiving pan 41, an atomizing power assembly, and an atomizing nozzle. The atomizing power assembly is located within the upper water receiving pan 41, and the atomizing nozzle is aimed at the condenser surface. The atomizing power assembly is connected to the upper water receiving pan 41 to spray the atomized condensate onto the condenser surface.

[0032] Specifically, the upper water tray 41 is connected to the condenser body 1 via a snap fastener.

[0033] Specifically, the upper water tray 41 is made of sheet metal or injection molded material.

[0034] Specifically, a connecting pipe 42 is provided between the upper water receiving pan 41 and the overflow pipe 43. The connecting pipe 42 is inclined and one end of the connecting pipe 42 is located on the side of the upper water receiving pan 41. It is used to connect the upper water receiving pan 41 and the top of the overflow pipe 43, so that the condensate in the upper water receiving pan 41 with the water level higher than the part of the connecting pipe 42 can be discharged through the overflow pipe 43.

[0035] Specifically, a dilute silica solution is sprayed onto the surface of the support filaments to enhance their hydrophilicity, reducing water droplet aggregation caused by uneven water flow and preventing water curtains from obstructing the wind. The atomized micro-droplets increase the contact area with the fins, accelerating evaporation and heat absorption; by controlling the nozzle layout and atomization volume, a water film-like heat dissipation enhancement effect is achieved. An additional atomization power source (such as a micro-water pump or ultrasonic generator) is required, slightly increasing structural complexity, but providing greater adaptability to fin spacing and covering various fin types.

[0036] Example 3 Unlike Example 1, the condensate collection assembly 4 in Example 3 includes a condensate adsorption layer disposed on the top of the condenser body 1, which is made of capillary material.

[0037] Preferably, an overflow prevention shell is fitted onto the outer side of the condensate adsorption layer, and a pipe 42 is provided on the side of the overflow prevention shell, through which the condensate adsorption layer and the overflow pipe 43 are connected.

[0038] Utilizing the capillary effect, condensate is continuously adsorbed and transported to the fin surface to form a thin water film. Driven by the capillary force of the material, it requires no mechanical openings. It consumes no power and is suitable for irregular fin layouts. However, the capillary wick is prone to clogging, requiring regular maintenance, and the heat dissipation efficiency is limited by the material's water absorption / evaporation rate.

[0039] Of course, the above description is not intended to limit the present utility model, and the present utility model is not limited to the examples given above. Any changes, modifications, additions or substitutions made by those skilled in the art within the scope of the present utility model should also fall within the protection scope of the present utility model.

Claims

1. A device for improving the heat dissipation efficiency of a wire-tube condenser based on condensate evaporation, characterized in that, It includes a condensate collection assembly, a condensate discharge assembly, and an overflow pipe. The condensate collection assembly is located at the top of the condenser body, and the condensate discharge assembly is located at the bottom of the condenser body. It includes a lower water collection box with a top opening and a drain pipe located on one side of the lower water collection box. A condenser support is provided between the lower water collection box and the condenser body. The condensate collection assembly and the lower water collection box are connected by an overflow pipe.

2. The device for improving the heat dissipation efficiency of a wire-tube condenser based on condensate evaporation according to claim 1, characterized in that, The condensate collection assembly includes an upper water receiving tray with several through holes at the bottom for guiding condensate flow. The upper water receiving tray is connected to the top of the overflow pipe via a connecting pipe, and the bottom of the overflow pipe is located in the water receiving box.

3. The device for improving the heat dissipation efficiency of a wire-tube condenser based on condensate evaporation according to claim 2, characterized in that, The through holes of the upper water tray correspond one-to-one with the positions of the support wires of the condenser body.

4. The heat dissipation efficiency improvement device for a wire-tube condenser based on condensate evaporation according to claim 3, characterized in that, The diameter of the through hole is 1 mm larger than the diameter of the support wire.

5. The heat dissipation efficiency improvement device for a wire-tube condenser based on condensate evaporation according to claim 4, characterized in that, The support wire is embedded in the corresponding through hole.

6. The device for improving the heat dissipation efficiency of a wire-tube condenser based on condensate evaporation according to claim 1, characterized in that, The condensate collection assembly includes an upper water receiving pan, an atomizing power assembly, and an atomizing nozzle. The atomizing power assembly is located inside the upper water receiving pan, and the atomizing nozzle is aimed at the surface of the condenser. The atomizing power assembly is connected to the upper water receiving pan to spray the atomized condensate onto the surface of the condenser.

7. A device for improving the heat dissipation efficiency of a wire-tube condenser based on condensate evaporation, as described in claim 2 or 6, characterized in that, The upper water tray is connected to the condenser body via a clip.

8. A device for improving the heat dissipation efficiency of a wire-tube condenser based on condensate evaporation, as described in claim 2 or 6, characterized in that, The upper water tray is made of sheet metal or injection molded material.

9. A device for improving the heat dissipation efficiency of a wire-tube condenser based on condensate evaporation, as described in claim 2 or 6, characterized in that, A connecting pipe is installed between the upper water receiving pan and the overflow pipe. The connecting pipe is inclined, and one end of the connecting pipe is located on the side of the upper water receiving pan. It is used to connect the upper water receiving pan to the top of the overflow pipe and discharge the condensate in the upper water receiving pan that is higher than the connecting pipe through the overflow pipe.

10. The device for improving the heat dissipation efficiency of a wire-tube condenser based on condensate evaporation according to claim 1, characterized in that, The condensate collection assembly includes a condensate adsorption layer located on top of the condenser body. The condensate adsorption layer is made of capillary material. An overflow prevention shell is fitted around the outside of the condensate adsorption layer. A connecting pipe is provided on the side of the overflow prevention shell, which connects the condensate adsorption layer to the overflow pipe.

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