An eddy current angular position sensor, motor assembly, and vehicle

Abstract

The utility model discloses an electric eddy current angle position sensor, motor assembly and vehicle belong to sensor technical field. The sensor includes casing, PCB circuit board and rotor, and the casing includes body and extension, is seted up with assembly hole on the body, and the positioning part is formed around the assembly hole, is provided with the mounting lug along the direction of the outer edge of the body, is seted up with the mounting hole on the mounting lug, and the limiting portion is formed around the mounting hole, the PCB circuit board is placed in the casing, and the PCB circuit board includes the board body, is seted up with the positioning hole and the winding coil around the positioning hole on the board body, and the electronic components of PCB circuit board are placed in the extension, and the wing plate corresponding with the mounting lug is provided with along the direction of the outer edge of the board body, and the limiting hole corresponding with the limiting portion is equipped on the wing plate, is formed with at least one diameter 0.2 5mm through -hole around the winding coil outside on the board body, so that the glue head can be inserted into the through -hole and the adhesive is injected into the gap between the board body and the casing, and the first encapsulation layer is formed after solidification.

Description

Technical Field

[0001] This utility model belongs to the field of sensor technology, and more specifically, relates to an eddy current angle position sensor, a motor assembly, and a vehicle. Background Technology

[0002] Eddy current angle position sensors are used in the motor control of new energy electric vehicles. The motor shaft and rotor are coaxially assembled. The circuit board detects the rotation angle of the rotor and transmits the detection signal to the MCU. The MCU calculates the angle value according to the algorithm, and the change of angle over time yields the motor speed. However, with the development of new energy electric vehicles, the input voltage of the motor must be increased accordingly. As an angle detection device, the eddy current sensor may face the challenge of high voltage. Therefore, it is necessary to improve the withstand voltage requirements of the eddy current angle sensor (eddy current angle sensors are low-voltage components that transmit electrical signals; the withstand voltage value is generally determined by the voltage of the electronic control terminal, usually 500V, but 800V platforms are now available).

[0003] Typical eddy current angle sensors are encapsulated with silicone or polyurethane. The insulation properties of these two materials are far lower than those of epoxy resin, which boasts an insulation strength of up to 30kV / mm. Simultaneously, epoxy resin exhibits excellent dielectric properties, with low dielectric constant and low dielectric loss factor, making it suitable for insulation in high-frequency eddy current products. During the potting process, the adhesive is dripped from above, relying on its own flow to fill the gap beneath the PCB circuit board. Because the gap between the PCB circuit board and the housing is less than 0.5mm (the PCB circuit board should be as close to the housing as possible to minimize the air gap between the PCB circuit board and the rotor; the air gap determines the signal strength and accuracy of the eddy current product), the adhesive easily traps air during its flow, forming bubbles. These bubbles may become trapped in the narrow space and are difficult to expel.

[0004] However, under high voltage conditions, the air in the bubble becomes a point of electric field concentration, causing the local electric field strength to exceed the breakdown field strength of air, resulting in partial discharge (PD). Partial discharge generates high-energy electrons, ions, ultraviolet rays, etc., which gradually erode the insulating material, leading to a decrease in insulation performance and potentially causing insulation breakdown, damaging the eddy current angle sensor; partial discharge is also an important cause of insulation failure in eddy current angle sensors.

[0005] To address the aforementioned issues, a search revealed Chinese patent CN107830797A, which discloses a large-range eddy current sensor for pipeline deformation detection. This sensor employs a method of simultaneously stirring and filling a groove with a prepared high-pressure resistant sealant to prevent air bubbles and completely cover the signal processing circuit components. The sealed sensor base is then cured at room temperature for at least 20 hours with the bottom surface facing upwards. However, while this method reduces air bubble formation, it does not significantly improve work efficiency. Summary of the Invention

[0006] 1. The problem to be solved To address the technical problem of poor insulation performance caused by air bubbles in the encapsulation layer of existing sensors, this invention provides an eddy current angle position sensor that reduces the number of air bubbles in the encapsulation layer, improves its insulation performance, and reduces the possibility of sensor breakdown and damage.

[0007] Another objective of this invention is to provide a motor assembly having the aforementioned eddy current angle position sensor.

[0008] Another objective of this invention is to provide a vehicle having an electric motor assembly.

[0009] 2. Technical Solution To solve the above problems, the technical solution adopted by this utility model is as follows: The first aspect of this utility model provides an eddy current angle position sensor, including a housing, a PCB circuit board and a rotor. The housing includes a body and an extension. The body has an assembly hole and a plurality of mounting ears are provided along the outer edge of the body. The mounting ears have mounting holes and a limiting part is formed around the mounting holes. The PCB circuit board is placed inside the housing. The PCB circuit board includes a board body, a positioning hole and a winding coil arranged around the positioning hole on the board body. The electronic components of the PCB circuit board are placed inside the extension. A wing plate corresponding to the mounting ear is arranged along the outer edge of the board body. The wing plate is provided with a limiting hole corresponding to the limiting part. At least one through-hole with a diameter of 0.2-5 mm is formed on the PCB circuit board and around the outer side of the winding coil. 0.2 mm is the minimum diameter of a commercially available dispensing head. Since the through-hole's impact on the PCB circuit board needs to be considered, the maximum diameter is 5 mm. Furthermore, the diameter of the through-hole is preferably 0.5-1 mm, allowing the dispensing head to be inserted into the through-hole and inject adhesive into the gap between the board and the housing. The adhesive spreads in the narrow gap, expelling air through the gap between the positioning hole and the assembly hole. After curing, it forms the first encapsulation layer, effectively preventing air bubbles from forming in the first encapsulation layer and ensuring a faster adhesive spreading speed, thereby effectively improving dispensing efficiency.

[0010] According to any embodiment of the first aspect of the present invention, the number of through holes is several, and they are arranged concentrically and at intervals with the winding coil.

[0011] According to any embodiment of the first aspect of the present invention, the through holes are provided near the connection between the wing plate and the plate body, and there are six of them, which are respectively provided on the outside of the winding coil.

[0012] According to any embodiment of the first aspect of the present invention, the through holes are provided near the connection between the wing plate and the plate body, and there are three of them, which are equally spaced on the outside of the winding coil.

[0013] According to any embodiment of the first aspect of the present invention, the connecting part has a recessed sharp angle facing the positioning hole, the angle of the recessed sharp angle is 100-150°, wherein the angle is 100°, 105°, 110°, 115°, 120°, 125°, 130°, 135°, 140°, 145°, 150°, the preferred angle is 120°, the obtuse angle of 100-150° can significantly reduce stress concentration and improve the strength of the connecting part under force.

[0014] According to any embodiment of the first aspect of the present invention, the cross-sectional shape of the through hole is circular, which can match the outer contour of the dispensing head.

[0015] According to any embodiment of the first aspect of the present invention, the central axis of the through hole is perpendicular to the surface of the plate.

[0016] According to any embodiment of the first aspect of the present invention, the central axis of the through hole is inclined at an angle of 1-5° to the surface of the plate.

[0017] According to any embodiment of the first aspect of the present invention, the limiting part is cylindrical, wherein the limiting part is capable of interference fit with the limiting hole.

[0018] According to any embodiment of the first aspect of the present invention, the end face A of the cylindrical limiting portion is flush with the end face B of the body.

[0019] According to any embodiment of the first aspect of the present invention, the limiting part is conical, and its conical head has a guiding function, so that the PCB circuit board can be installed in the body more accurately and achieve an interference fit.

[0020] According to any embodiment of the first aspect of the present invention, the end face C of the conical limiting portion is slightly lower than the end face D of the body.

[0021] According to any embodiment of the first aspect of the present invention, a second encapsulation layer is formed on the PCB circuit board by an adhesive.

[0022] According to any embodiment of the first aspect of the present invention, the first encapsulation layer and / or the second encapsulation layer are transparent.

[0023] According to any embodiment of the first aspect of the present invention, the first encapsulation layer and / or the second encapsulation layer are non-transparent.

[0024] The second aspect of this utility model provides a motor assembly of the eddy current angle position sensor of the first aspect, including the eddy current angle position sensor of the first aspect, wherein the eddy current angle position sensor is mounted on the motor shaft, and the rotor is fixed on the motor shaft and rotates therewith.

[0025] The third aspect of this utility model provides a vehicle having the motor assembly described in the second aspect above, which enables the vehicle to accurately detect rotation signals and ensure safe driving.

[0026] 3. Beneficial effects Compared with the prior art, the beneficial effects of this utility model are as follows: (1) The eddy current angle position sensor of this utility model forms several injection holes on the PCB circuit board. When the injection head is inserted into the through hole, the air below can be squeezed out through the gap between the positioning hole and the positioning part when the adhesive is injected into the PCB circuit board, which effectively prevents the formation of air bubbles and helps to improve the injection efficiency. (2) The eddy current angle position sensor of this utility model is encapsulated with epoxy resin to enhance insulation, durability and mechanical strength, and improve the reliability of the product. Attached Figure Description

[0027] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. However, it should be understood that these drawings are designed for illustrative purposes only and are not intended to limit the scope of this utility model. In addition, unless otherwise specified, these drawings are intended only to conceptually illustrate the structural construction described herein and are not necessarily drawn to scale.

[0028] Figure 1 This is a three-dimensional structural schematic diagram of the eddy current angle position sensor of Embodiment 1 of this utility model; Figure 2 This is a side view of the eddy current angle position sensor of Embodiment 1 of this utility model; Figure 3 This is a schematic diagram of the PCB circuit board structure of Embodiment 1 of this utility model; Figure 4 This is a three-dimensional structural diagram of the shell of Embodiment 1 of this utility model; Figure 5 This is a front view of the housing of Embodiment 1 of this utility model; Figure 6 for Figure 5 Sectional view along line AA; Figure 7 This is a schematic diagram of the PCB circuit board structure of Embodiment 2 of this utility model; Figure 8 This is a three-dimensional structural diagram of the shell of Embodiment 3 of this utility model; Figure 9 This is a front view of the casing of Embodiment 3 of this utility model; Figure 10 for Figure 9 A sectional view along line BB.

[0029] Explanation of reference numerals in the attached figures: 1. Housing; 11. Body; 111. End face B; 112. End face D; 12. Extension; 13. Assembly hole; 14. Positioning part; 15. Mounting ear; 16. Mounting hole; 17. Limiting part; 171. End face A; 172. End face C; 2. PCB circuit board; 21. Board body; 22. Winding coil; 23. Electronic components; 24. Positioning hole; 25. Wing plate; 26. Limiting hole; 27. Through hole; 28. Connecting part; 3. Rotor; 4. First encapsulation layer; 5. Second encapsulation layer; 6. Central axis. Detailed Implementation

[0030] The following detailed description of exemplary embodiments of the present invention refers to the accompanying drawings, which form part of the description, illustrating exemplary embodiments in which the present invention may be implemented. Although these exemplary embodiments have been described in sufficient detail to enable those skilled in the art to implement the present invention, it should be understood that other embodiments may be implemented and various changes may be made to the present invention without departing from the spirit and scope thereof. The more detailed description of embodiments of the present invention below is not intended to limit the scope of the claimed invention, but is merely illustrative and does not limit the description of the features and characteristics of the invention, in order to suggest the best mode for carrying out the invention and sufficient to enable those skilled in the art to implement it. Therefore, the scope of the present invention is defined only by the appended claims.

[0031] The following detailed description and exemplary embodiments of the present invention can be better understood in conjunction with the accompanying drawings, wherein the elements and features of the present invention are identified by reference numerals.

[0032] Example 1 The eddy current sensor of this invention can be applied to vehicles traction-driven by a motor assembly. The motor assembly includes the aforementioned eddy current angle position sensor, which is mounted on the motor shaft. The rotor 3 is fixed to the motor shaft and rotates with it. This allows the vehicle to accurately detect the motor rotation signal through the motor assembly, ensuring safe vehicle operation.

[0033] like Figure 1 and Figure 2 As shown, the eddy current angle position sensor of this embodiment includes a housing 1, a PCB circuit board 2, and a rotor 3. The housing 1, PCB circuit board 2, and rotor 3 are coaxially arranged. The PCB circuit board 2 is placed inside the housing 1, and the rotor 3 is located outside the housing 1 with a gap between it and the housing 1. A first encapsulation layer 4 is formed between the housing 1 and the PCB circuit board 2 by an adhesive (e.g., epoxy resin or modified acrylic adhesive). A second encapsulation layer 5 is formed on top of the PCB circuit board 2 by an adhesive (e.g., epoxy resin or modified acrylic adhesive). Both the first encapsulation layer 4 and the second encapsulation layer 5 serve to provide electrical insulation and prevent moisture penetration.

[0034] After complete curing, the adhesive has good mechanical properties, including high tensile strength, shear strength and compressive strength. These mechanical properties enable the first encapsulation layer 4 and the second encapsulation layer 5 to effectively absorb and disperse energy when subjected to vibration, reducing the impact of vibration on the adhered shell 1.

[0035] Depending on the type of adhesive used, the first encapsulation layer 4 and / or the second encapsulation layer 5 can be transparent, or they can be opaque. For example, in this embodiment, the first encapsulation layer 4 and the second encapsulation layer 5 are opaque.

[0036] Combination Figure 1 , Figures 4 to 6 As shown, the housing 1 includes a body 11 and an extension 12. The body 11 and the extension 12 are integrally formed, which makes the entire housing 1 have high strength. The body 11 has a mounting hole 13 along the center that can pass through the motor shaft. The diameter of the mounting hole 13 is slightly larger than the diameter of the motor shaft. The body 11 does not contact the motor shaft, thereby avoiding friction. A positioning part 14 is formed around the mounting hole 13. Three mounting ears 15 are provided along the outer edge direction (circumferential outer edge) of the body 11. The three mounting ears 15 are evenly distributed on the body 11. The mounting ears 15 have mounting holes 16, which can be used to fix the sensor.

[0037] like Figure 1 and Figure 3 As shown, the PCB circuit board 2 includes a board body 21, on which a positioning hole 24 is provided and a winding coil 22 is arranged around the positioning hole 24. The electronic components 23 (chips) of the PCB circuit board 2 are placed in the extension portion 12. A wing plate 25 corresponding to the mounting ear 15 is provided along the outer edge of the board body 21. The wing plate 25 is provided with a limiting hole 26 corresponding to the limiting portion 17.

[0038] To ensure the accuracy of rotation signal detection, limiting parts 17 are formed around the mounting hole 16. These limiting parts 17 can accurately position the winding coil 22 and the mounting hole 13, so that the center of the winding coil 22 and the mounting hole 13 coincide as much as possible. After the motor shaft passes through the mounting hole 13, the winding coil 22 can detect the change of the secondary magnetic field generated by the eddy current induction of the rotor 3.

[0039] like Figure 3 As shown, the through holes 27 are located near the connection part 28 between the wing plate 25 and the plate body 21, and there are six of them, which are respectively located on the outside of the winding coil 22, with a diameter of 0.5mm.

[0040] In this embodiment, Figure 4 and Figure 5In the above-mentioned limiting part 17 is cylindrical, wherein the limiting part 17 can be interference-fitted with the limiting hole 26, which can ensure the accurate positioning of the PCB circuit board 2, and also reduce the gap between the PCB circuit board 2 and the limiting part 17, thereby facilitating the extension of adhesive to the positioning hole 24 and the positioning part 14, and venting air from the gap between the positioning hole 24 and the positioning part 14, thus preventing the formation of air bubbles in the encapsulation layer.

[0041] like Figure 6 As shown, the end face A171 of the cylindrical limiting part 17 is flush with the end face B111 of the body 11. There is no height difference between the end face A171 and the end face B111. They are continuous and flush, so that the limiting part 17 will not protrude, so as not to hinder the movement or assembly of other components. At the same time, the surface of the second encapsulation layer 5 is smooth and the appearance is beautiful.

[0042] Combination Figure 3 As shown, the sensor is constantly in a vibrating environment. Under prolonged vibration, cracks may form at the contact surface between the outer shell and the adhesive, posing a risk of short circuits to the internal electronic components. Therefore, the connecting part 28 has a recessed sharp corner facing the positioning hole 24, which actively draws in the adhesive using capillary force, facilitating air expulsion and filling the entire gap, significantly increasing the effective contact area between the adhesive and the shell 1. At the same time, it also guides the adhesive, ensuring that critical areas are fully filled, allowing the adhesive to better extend and penetrate in the connecting part 28 and form a stronger and more reliable bond.

[0043] Furthermore, the angle of the recessed corner is 120°. This obtuse angle can significantly reduce stress concentration and improve the strength of the connection 28 under stress. The term "recessed" means that the corner is recessed inward, forming part of a groove, rather than a protruding edge.

[0044] In this embodiment, as Figure 3 The cross-sectional shape of the through hole 27 is circular, which can match the outer contour of the dispensing head. The above design allows the dispensing head to fit tightly with the circular through hole 27. When the adhesive is injected into the through hole 27, there is no gap between the two, so there will be no problem of glue overflow.

[0045] The positional relationship between the aforementioned through hole 27 and the plate 21 in the longitudinal direction is such that the central axis 6 of the through hole 27 is set perpendicular to the surface of the plate 21. This design allows the dispensing head to fit tightly with the end face of the through hole 27 without gaps, thereby avoiding glue overflow. This not only helps to improve the efficiency of dispensing, but also makes it difficult to set the second encapsulation layer 5 after the glue overflows and cures.

[0046] In addition, the central axis 6 of the through hole 27 can be inclined at an angle of 1-5° to the surface of the plate 21, such as 1°, 2°, 3°, 4° and 5°, so that the through hole 27 is inclined and the adhesive injected by the dispensing head enters the gap between the PCB circuit board 2 and the body 11 at a certain angle, which is conducive to the smooth spread of the adhesive.

[0047] Three pairs (six) of injection holes are formed on the PCB circuit board. The injection head is inserted into the injection hole, which allows the air in the gap between the positioning hole 24 and the positioning part 14 to be discharged when the adhesive is injected into the PCB circuit board, effectively preventing the formation of air bubbles and improving the injection efficiency.

[0048] The significant difference between the bubbles (dielectric constant ≈ 1) and the encapsulation layer (the dielectric constant of the epoxy resin in this embodiment is typically 3-4) leads to distorted electric field distribution, disordered eddy current magnetic field, and sensitivity drift of 5%~15%. Furthermore, under thermal expansion coefficient (CTE) mismatch (epoxy resin CTE ≈ 60 ppm / ℃ vs. copper 17 ppm / ℃), the bubbles become the starting point for delamination, and the delamination area can expand to 5 times the initial bubble size during vibration testing. In high-voltage applications (e.g., above 500V), bubble ionization causes partial discharge, and the insulation resistance increases from 10... 12 Ω drops sharply to 10 6 Ω, leading to insulation failure.

[0049] The eddy current sensor obtained in this embodiment is tested, and the testing method includes: 1) X-ray inspection: Using X-rays to observe the distribution of bubbles inside the encapsulation layer; 2) Ultrasonic testing: Use an ultrasonic testing instrument to detect air bubbles in the encapsulation layer; 3) Partial discharge detection: Use a partial discharge detection system to monitor the discharge status of the sensor under high voltage environment and evaluate the insulation performance; 4) Withstand voltage test: Perform a withstand voltage test to check whether the sensor in this embodiment can withstand high voltage without breakdown.

[0050] Upon testing, the encapsulation layer of the eddy current sensor in this embodiment has a small number of bubbles, which are not visible to the naked eye, and the electrical insulation is good.

[0051] Theoretical calculation: Relative permittivity of epoxy resin It is usually between 3.5 and 4.5, and 4.0 can be used as the calculated value.

[0052] relative permittivity of air The value is 1.

[0053] The air breakdown field strength is approximately 3 kV / mm under standard atmospheric pressure.

[0054] The effect of bubbles: When an electric field passes through the interface of two materials with different dielectric constants, the electric field strength changes abruptly. According to Gauss's law and electromagnetic boundary conditions, in the direction perpendicular to the interface...

[0055] Therefore, the electric field strength inside the bubble is approximately four times that in the surrounding epoxy resin.

[0056] When the electric field strength inside the bubble reaches 3kV / mm, the electric field strength around the epoxy resin is 0.75kV / mm. That is, when the withstand voltage around the product reaches 750V / mm, the bubble inside the product will be broken down.

[0057] When there are no air bubbles in the product, the product's withstand voltage value is the epoxy resin withstand voltage value. The breakdown field strength of epoxy resin is affected by factors such as air pressure, humidity, internal defects, purity, and electrode shape, and its value is usually 15-30kV.

[0058] This product has passed the 1000VAC, 60s withstand voltage test. The leakage current is ≤0.1mA, and the upper limit is 1mA. The withstand voltage test is qualified.

[0059] Example 2 This embodiment has a basically the same structure as Embodiment 1, the difference being that, as Figure 7 As shown, there are three through holes 27, which are equally spaced and located on the outside of the winding coil 22 near the connection 28 between the wing plate 25 and the plate body 21. In use, adhesive is injected into all three through holes 27 simultaneously, which improves the injection efficiency compared to a single through hole 27. Therefore, while improving injection efficiency, the adhesive can spread more evenly and quickly in all directions, expelling air from the gaps. The cured first encapsulation layer 4 contains almost no air bubbles, ensuring the sensor's insulation performance.

[0060] In this embodiment, the cross-sectional shape of the through hole 27 is circular, which can match the outer contour of the dispensing head. The above design allows the dispensing head to fit tightly with the circular through hole 27. When the adhesive is injected into the through hole 27, there is no gap between the two, thus avoiding the problem of glue overflow.

[0061] Example 3 This embodiment has a basically the same structure as Embodiment 1, the difference being that, as Figures 8 to 10 As shown, the limiting part 17 is conical, and its conical head has a guiding function, so that the PCB circuit board 2 can be installed in the body 11 with relatively accurate precision and achieve interference fit; at the same time, the conical head has an inclined surface, which can provide an extension surface for the adhesive to overflow from below the board 21, so that the adhesive overflows more smoothly.

[0062] exist Figure 10 In this design, the end face C172 of the conical limiting portion 17 is slightly lower than the end face D112 of the body 11. The height difference between the end face C172 and the end face D112 prevents the limiting portion 17 from protruding, thus avoiding obstruction of the movement or assembly of other components. At the same time, the second encapsulation layer 5 formed by adhesive covers the end face C172 of the limiting portion 17. The surface of the second encapsulation layer 5 is smooth and aesthetically pleasing.

[0063] The present invention and its embodiments have been described above illustratively. This description is not restrictive, and the figures shown are only one embodiment of the present invention; the actual structure is not limited to this. Therefore, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. An eddy current angle position sensor, characterized in that, The device includes a housing (1), a PCB circuit board (2) and a rotor (3). The PCB circuit board (2) is placed inside the housing (1). The PCB circuit board (2) includes a board body (21). The board body (21) has a positioning hole (24) and a winding coil (22) arranged around the positioning hole (24). At least one through hole (27) with a diameter of 0.2-5 mm is formed on the plate (21) and around the outside of the winding coil (22), so that the glue injection head can be inserted into the through hole (27) and inject the adhesive into the gap between the plate (21) and the shell (1), and after curing, a first encapsulation layer (4) is formed.

2. The eddy current angle position sensor according to claim 1, characterized in that, The number of through holes (27) is several, and they are arranged concentrically and at intervals with the winding coil (22).

3. The eddy current angle position sensor according to claim 2, characterized in that, The housing (1) includes a body (11) and an extension (12). The body (11) has an assembly hole (13) and a positioning part (14) is formed around the assembly hole (13). A plurality of mounting ears (15) are provided along the outer edge of the body (11). The mounting ears (15) have mounting holes (16) and a limiting part (17) is formed around the mounting holes (16). The electronic components (23) of the PCB circuit board (2) are placed inside the extension (12), and a wing plate (25) corresponding to the mounting ear (15) is provided along the outer edge of the board body (21). The wing plate (25) is provided with a limiting hole (26) corresponding to the limiting part (17).

4. The eddy current angle position sensor according to claim 3, characterized in that, The through holes (27) are located near the connection part (28) between the wing plate (25) and the plate body (21), and there are six of them, which are respectively located on the outside of the winding coil (22).

5. The eddy current angle position sensor according to claim 3, characterized in that, The through holes (27) are provided near the connection part (28) between the wing plate (25) and the plate body (21), and there are three of them, which are equally spaced on the outside of the winding coil (22).

6. The eddy current angle position sensor according to claim 4 or 5, characterized in that, The connecting part (28) has a recessed sharp corner facing the positioning hole (24), and the angle of the recessed sharp corner is 100-150°.

7. The eddy current angle position sensor according to claim 6, characterized in that, The cross-sectional shape of the through hole (27) is circular, which can match the outer contour of the dispensing head.

8. The eddy current angle position sensor according to claim 6, characterized in that, The central axis (6) of the through hole (27) is perpendicular to the surface of the plate (21).

9. The eddy current angle position sensor according to claim 6, characterized in that, The central axis (6) of the through hole (27) is inclined at an angle of 1-5° to the surface of the plate (21).

10. The eddy current angle position sensor according to claim 3, characterized in that, The limiting part (17) is cylindrical, wherein the limiting part (17) can be interference-fitted with the limiting hole (26).

11. The eddy current angle position sensor according to claim 10, characterized in that, The end face A (171) of the limiting part (17) is flush with the end face B (111) of the body (11).

12. The eddy current angle position sensor according to claim 3, characterized in that, The limiting part (17) is conical, which allows the PCB circuit board (2) to be installed in the body (11) with relatively high precision and achieves an interference fit.

13. The eddy current angle position sensor according to claim 12, characterized in that, The end face C (172) of the limiting part (17) is slightly lower than the end face D (112) of the body (11).

14. The eddy current angle position sensor according to claim 13, characterized in that, A second encapsulation layer (5) is formed on the PCB circuit board (2) by an adhesive.

15. The eddy current angle position sensor according to claim 14, characterized in that, The first encapsulation layer (4) and / or the second encapsulation layer (5) are transparent.

16. The eddy current angle position sensor according to claim 14, characterized in that, The first encapsulation layer (4) and / or the second encapsulation layer (5) are non-transparent.

17. A motor assembly, characterized in that, The electric eddy current angle position sensor according to any one of claims 1-16 is mounted on the motor shaft, wherein the rotor (3) is fixed on the motor shaft and rotates therewith.

18. A vehicle, characterized in that, The motor assembly includes the eddy current angle position sensor as described in claim 17.

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