A semiconductor module calibration platform and system

Abstract

The utility model provides a kind of semiconductor module calibration platform and system, it includes: mounting plate;Fixing mechanism;Reflecting mirror, reflecting mirror forms the transmission path and reflection path of the output beam of the semiconductor module to be calibrated;Power detection unit is set on transmission path and light beam quality detection unit is set on reflection path.The utility model is equipped with fixing mechanism, reflecting mirror, power detection unit and light beam quality detection unit by mounting plate respectively, wherein, reflecting mirror is used to divide the output beam of the semiconductor module to be calibrated into transmission beam and reflection beam, so that the output power of the semiconductor module to be calibrated is detected by power detection unit respectively, while the output beam quality of the semiconductor module to be calibrated is detected by light beam quality detection unit, and then the synchronous, efficient detection of the core output parameter of light spot homogenization semiconductor module is realized.

Description

Technical Field

[0001] This utility model relates to the field of calibration technology, specifically to a semiconductor module calibration platform and system. Background Technology

[0002] As a core device with high-efficiency laser emission capabilities, the beam homogenization semiconductor module has been widely applied in many key fields such as industrial processing, medical aesthetics, lidar, precision measurement, and communications, thanks to its outstanding advantages such as high integration, excellent beam homogenization effect, and strong stability. It has become an important support for promoting technological upgrading and application expansion in related industries. In practical applications, the requirements for laser output characteristics vary significantly across different scenarios. Among these, laser power and beam quality are two core indicators that determine the module's application performance, and their precise and flexible adjustment capabilities directly affect the applicability and operational effectiveness of the beam homogenization semiconductor module.

[0003] Some modules employ a fixed power and fixed beam quality design, which can only meet the application requirements of a single specific scenario. When facing multiple operating conditions, it is necessary to replace modules or add additional adjustment devices to achieve parameter adaptation. This not only increases equipment costs and system complexity but also reduces operational flexibility and efficiency. To overcome these problems, some modules now have parameter adjustment functions, but their adjustment methods also have significant limitations: In power adjustment, simple current adjustment methods are often used, which easily leads to large fluctuations in laser output power, insufficient adjustment accuracy, and beam quality degradation when adjusting over a wide power range; In beam quality adjustment, existing technologies mostly rely on mechanical structures to adjust the relative positions of optical elements, resulting in slow response speeds and easy introduction of mechanical vibration and positioning errors during adjustment, making it difficult to guarantee beam quality stability. At the same time, the addition of mechanical structures also increases the module's size and failure rate.

[0004] Furthermore, in the actual operation of beam homogenization semiconductor modules, there is often a coupling relationship between laser power and beam quality. Existing adjustment techniques struggle to achieve decoupled control between the two, and adjusting one parameter can easily adversely affect the other, making it difficult for the module to simultaneously meet the application requirements of high power and high beam quality. As various fields continue to demand higher precision, efficiency, and reliability in laser applications, the shortcomings of existing beam homogenization semiconductor modules in terms of parameter adjustment accuracy, flexibility, stability, and the ability to coordinate the two have become major bottlenecks restricting their further expansion into new application scenarios.

[0005] Therefore, developing a technology that can achieve calibration after adjusting the laser power and beam quality of semiconductor modules has practical application value. Utility Model Content

[0006] Therefore, the technical problem to be solved by this utility model is to overcome the difficulty in calibrating the laser power and beam quality of semiconductor modules in the prior art, and to provide a semiconductor module calibration platform and system.

[0007] To address the aforementioned technical problems, this utility model provides a semiconductor module calibration platform, comprising: a mounting plate; a fixing mechanism disposed on the mounting plate, wherein the semiconductor module to be calibrated can be disposed on the fixing mechanism; a reflecting and transmitting mirror disposed on the mounting plate and located at the light source output end of the semiconductor module to be calibrated, thereby forming a transmission path and a reflection path for the output beam of the semiconductor module to be calibrated; a power detection unit and a beam quality detection unit disposed on the mounting plate, wherein the power detection unit is disposed on the transmission path and the beam quality detection unit is disposed on the reflection path.

[0008] In one embodiment of the present invention, the fixing mechanism includes a water-cooled tank, a water-cooled plate, and a cooling pipe. The cooling pipe is disposed in the water-cooled tank, and both ends of the cooling pipe are connected to an external water circulation device. The water-cooled plate is detachably connected to the water-cooled tank, and the semiconductor module to be calibrated is disposed on the water-cooled plate.

[0009] In one embodiment of the present invention, the semiconductor module calibration platform further includes a fixture, through which the semiconductor module to be calibrated is connected to the fixing mechanism.

[0010] In one embodiment of the present invention, the fixture includes a support portion and a guide portion. The support portion is detachably connected to the fixing mechanism. The semiconductor module to be calibrated is disposed on the support portion. The guide portion is disposed at one end of the support portion and has a guide groove inside. The light source emitting end of the semiconductor module to be calibrated is located in the guide groove.

[0011] In one embodiment of the present invention, the guide portion is provided with an emission hole, which is located at one end of the guide groove near the reflecting mirror.

[0012] In one embodiment of the present invention, the guide portion is higher than the support portion in the height direction of the fixture to form an abutment surface that can mutually limit the positioning of the semiconductor module to be calibrated.

[0013] In one embodiment of this utility model, the mounting plate is provided with a plurality of adjustment holes, and the fixing mechanism, the reflecting and transmitting mirror, the power detection unit and the beam quality detection unit are detachably connected to the mounting plate by connectors.

[0014] In one embodiment of the present invention, the semiconductor module calibration platform further includes a control mechanism, and the power detection unit and the beam quality detection unit are respectively connected to the control mechanism.

[0015] In one embodiment of this utility model, the power detection unit is configured as a laser power meter, and the beam quality detection unit is configured as a beam quality analyzer.

[0016] This invention also provides a semiconductor module calibration system, which includes the aforementioned semiconductor module calibration platform.

[0017] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art: The semiconductor module calibration platform and system described in this utility model assembles a fixing mechanism, a reflecting and transmitting mirror, a power detection unit, and a beam quality detection unit via a mounting plate. The fixing mechanism can support the semiconductor module to be calibrated, and the reflecting and transmitting mirror is used to divide the output beam of the semiconductor module to be calibrated into a transmitted beam and a reflected beam. The output power of the semiconductor module to be calibrated is detected by the power detection unit, and the output beam quality of the semiconductor module to be calibrated is detected by the beam quality detection unit. This enables synchronous and efficient detection of the core output parameters of the beam homogenization semiconductor module.

[0018] This integrated calibration structure design eliminates the cumbersome process of building separate power detection and beam quality detection systems in traditional testing. It not only significantly reduces the space occupied by the detection equipment and lowers the detection cost, but also effectively avoids the detection error caused by multiple module clamping through synchronous split detection of the same beam, thus improving the consistency and accuracy of parameter detection.

[0019] Crucially, this calibration platform provides real-time and reliable feedback for parameter adjustment of the beam homogenization semiconductor module. The non-destructive beam splitting design achieved through the reflecting and transmitting mirrors ensures accurate detection without interfering with the module's normal output characteristics, allowing the detection data to accurately reflect the module's actual operating status. Based on this, operators can optimize the module's adjustment parameters according to the real-time detection results from the power detection unit and beam quality detection unit, achieving precise matching and decoupled control of laser power and beam quality. This effectively solves the problems of low parameter adjustment accuracy and poor stability in existing technologies, providing strong technical support for the adaptable application of the beam homogenization semiconductor module in various scenarios. Attached Figure Description

[0020] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0021] Figure 1 This is a three-dimensional structural diagram of the semiconductor module calibration platform in a preferred embodiment of the present invention; Figure 2 yes Figure 1 Top view of the semiconductor module calibration platform shown; Figure 3 yes Figure 1 Enlarged structural diagram at point A in the middle.

[0022] Explanation of reference numerals in the accompanying drawings: 100, mounting plate; 110, adjustment hole; 200, fixing mechanism; 210, water cooling tank; 220, water cooling plate; 300, fixture; 310, support part; 311, connector; 320, guide part; 321, guide groove; 322, emission hole; 400, reflecting and transmitting mirror; 500, power detection unit; 600, beam quality detection unit; 700, semiconductor module to be calibrated. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0024] Example 1: See Figures 1 to 3 As shown, this embodiment provides a semiconductor module calibration platform, which includes: a mounting plate 100; a fixing mechanism 200 disposed on the mounting plate 100, wherein a semiconductor module 700 to be calibrated can be disposed on the fixing mechanism 200; a reflecting and transmitting mirror 400 disposed on the mounting plate 100 and located at the light source output end of the semiconductor module 700 to form a transmission path and a reflection path for the output beam of the semiconductor module to be calibrated; a power detection unit 500 and a beam quality detection unit 600 disposed on the mounting plate 100, wherein the power detection unit 500 is disposed on the transmission path and the beam quality detection unit 600 is disposed on the reflection path.

[0025] The semiconductor module calibration platform and system described in this utility model assembles a fixing mechanism 200, a reflecting and transmitting mirror 400, a power detection unit 500, and a beam quality detection unit 600 via a mounting plate 100. The fixing mechanism 200 can support the semiconductor module 700 to be calibrated. The reflecting and transmitting mirror 400 is used to divide the output beam of the semiconductor module 700 to be calibrated into a transmitted beam and a reflected beam. The power detection unit 500 detects the output power of the semiconductor module 700 to be calibrated, and the beam quality detection unit 600 detects the output beam quality of the semiconductor module 700 to be calibrated, thereby achieving synchronous and efficient detection of the core output parameters of the beam homogenization semiconductor module.

[0026] This integrated calibration structure design eliminates the cumbersome process of building separate power detection and beam quality detection systems in traditional testing. It not only significantly reduces the space occupied by the detection equipment and lowers the detection cost, but also effectively avoids the detection error caused by multiple module clamping through synchronous split detection of the same beam, thus improving the consistency and accuracy of parameter detection.

[0027] Most importantly, this calibration platform provides real-time and reliable feedback for parameter adjustment of the beam homogenization semiconductor module. The non-destructive beam splitting design implemented by the reflecting and transmitting mirror 400 ensures detection accuracy without interfering with the module's normal output characteristics, allowing the detection data to accurately reflect the module's actual operating status. Based on this, operators can optimize the module's adjustment parameters according to the real-time detection results from the power detection unit 500 and the beam quality detection unit 600, achieving precise matching and decoupled control of laser power and beam quality. This effectively solves the problems of low parameter adjustment accuracy and poor stability in existing technologies, providing strong technical support for the adaptable application of the beam homogenization semiconductor module in various scenarios.

[0028] In this embodiment, the mounting plate 100 serves as the fundamental support and integration carrier of the entire calibration platform. Its core function is to provide a stable and high-precision mounting reference for all functional components within the platform. On one hand, the mounting plate 100 enables the precise assembly of the fixing mechanism 200, the reflecting and transmitting mirror 400, the power detection unit 500, and the beam quality detection unit 600, ensuring that the relative positions of each component meet the optical path design requirements for optical detection and avoiding optical path deviations and detection errors caused by component misalignment. On the other hand, the integrated structure of the mounting plate 100 ensures the mechanical stability of the entire platform, reduces the interference of external vibrations and environmental deformation on the detection system, and provides reliable physical support for the accurate detection of laser parameters.

[0029] Furthermore, in this embodiment, the mounting plate 100 is provided with multiple adjustment holes 110. The fixing mechanism 200, the reflecting and transmitting mirror 400, the power detection unit 500, and the beam quality detection unit 600 are detachably connected to the mounting plate 100 via connectors 311. The mounting plate 100 serves as the basic support and integrated carrier of the entire calibration platform. The multiple adjustment holes 110 on its surface, in conjunction with the connectors 311, enable the detachable assembly of the fixing mechanism 200, the reflecting and transmitting mirror 400, the power detection unit 500, and the beam quality detection unit 600. This design combines installation flexibility, position adjustability, and ease of maintenance. In this embodiment, the multiple adjustment holes 110 are arranged in an array on the surface of the mounting plate 100. In different embodiments, the specific location and number of adjustment holes 110 can be adaptively adjusted according to actual usage requirements; this utility model does not impose specific limitations in this regard.

[0030] Furthermore, the detachable connection structure with the adjustment hole 110 allows for the adaptation of different specifications of the semiconductor modules 700 to be calibrated and the detection components. When the module model or the accuracy level of the detection unit is changed, adaptation can be achieved simply by disassembling and reassembling the components and readjusting their installation positions on the adjustment hole 110, without replacing the entire platform. This significantly improves the platform's versatility and reduces operating costs. In addition, the detachable structure allows for independent disassembly and assembly of each component. When malfunctions occur, such as wear of the reflecting mirror 400 or sensor failure of the power detection unit 500, repair or replacement can be completed quickly. Moreover, if the component position shifts during long-term use, it can be recalibrated through the adjustment hole 110, ensuring the platform's ease of maintenance and long-term detection stability. This provides reliable physical support and structural protection for the accurate detection of laser parameters. In this embodiment, the fixing mechanism 200 is the positioning and installation connection component for the semiconductor module 700 to be calibrated. Its core function is to ensure the fixed position and stable attitude of the module to be calibrated during the detection process. First, the fixing mechanism 200 can quickly install and position the module according to the shape and interface specifications of the semiconductor module to be calibrated, ensuring that the light source output end of the module is precisely aligned with the incident surface of the reflector 400, and ensuring that the optical path of the output beam conforms to the preset design. Second, it can be adapted to different models of semiconductor modules, improving the versatility of the calibration platform and reducing the equipment replacement cost for testing multiple models of modules.

[0031] Furthermore, the fixing mechanism 200 in this embodiment includes a water-cooled tank 210, a water-cooled plate 220, and cooling pipes. The cooling pipes are disposed in the water-cooled tank 210, and both ends of the cooling pipes are connected to external water circulation equipment. The water-cooled plate 220 is detachably connected to the water-cooled tank 210, and the semiconductor module 700 to be calibrated is disposed on the water-cooled plate 220. The cooling pipes are the core heat dissipation components of this mechanism. They are arranged inside the water-cooled tank 210, and both ends are connected to external water circulation equipment, forming a continuous low-temperature cooling water circulation path. When the semiconductor module 700 to be calibrated is activated and generates heat during the testing process, the heat is gradually conducted to the water-cooled plate 220, and then transferred to the cooling pipes through the contact surface between the water-cooled plate 220 and the water-cooled tank 210. Finally, the flowing cooling water conducts the heat to the external equipment. This structure can effectively suppress the temperature rise of the module due to continuous operation, avoid problems such as laser power attenuation and beam quality degradation caused by high temperature, ensure the stability of the module output parameters during the detection stage, and prevent the module from being damaged due to overheating.

[0032] The water-cooled plate 220 can be quickly replaced with the corresponding specification based on the external dimensions and installation reference of different models of semiconductor modules 700 to be calibrated, meeting the load-bearing requirements of multiple types of modules and improving the versatility of the fixing mechanism 200. On the other hand, the tight fit between the water-cooled plate 220 and the water-cooling tank 210 provides an efficient heat conduction path, ensuring that the heat generated by the module can be quickly transferred to the cooling pipes for heat dissipation. The internal cavity of the water-cooling tank 210 can neatly arrange the cooling pipes, avoiding the impact of messy pipes on the overall optical path layout of the platform, while isolating external collisions, wear and other interference, preventing pipe leakage, and ensuring the stability of the water-cooling system. In addition, the cooperation between the water-cooling tank 210 and the water-cooled plate 220 forms a centralized heat dissipation area, reducing the diffusion of module heat to the mounting plate 100 and other detection components, avoiding the adverse effects of temperature fluctuations on the performance of precision components such as the power detection unit 500 and the beam quality detection unit 600, and ensuring that the detection accuracy of the entire calibration platform is not affected by ambient temperature rise.

[0033] The semiconductor module calibration platform in this embodiment further includes a fixture 300, through which the semiconductor module 700 to be calibrated is connected to the fixing mechanism 200. Further, the fixture 300 includes a support portion 310 and a guide portion 320. The support portion 310 is detachably connected to the fixing mechanism 200. The semiconductor module 700 to be calibrated is disposed on the support portion 310. The guide portion 320 is disposed at one end of the support portion 310 and has a guide groove 321 inside. The light source emitting end of the semiconductor module 700 to be calibrated is located in the guide groove 321 and emits laser light through an emission hole 322.

[0034] The support unit 310 serves as the basic connection and support component of the fixture 300. It is detachably connected to the fixing mechanism 200. The support unit 310 can be replaced with a corresponding one according to the size and specifications of different models of semiconductor modules 700 to be calibrated. This not only improves the compatibility of the entire calibration platform with modules of multiple specifications, but also allows the module to be stably supported on the water-cooling plate 220 of the fixing mechanism 200 through precise docking, indirectly ensuring the temperature control effect during the operation of the module. At the same time, the flat support surface of the support unit 310 can ensure the overall stability of the module and prevent the module from shaking or shifting. The guide section 320 is located at one end of the support section 310. The guide groove 321 inside the guide section can limit and guide the light source emitting end of the module. On the one hand, the cavity of the guide groove 321 is adapted to the shape of the light source emitting end of the module, which can limit the radial displacement of the light source emitting end and further enhance the installation stability of the module. On the other hand, the guide groove 321 has a precise coaxiality design, which can force and standardize the initial optical path of the module's laser output, ensuring that the laser beam can be accurately incident on the preset area of ​​the reflective transmission mirror 400, avoiding optical path deviation caused by the attitude deviation of the module's light source emitting end. This lays the optical path foundation for the accurate detection of the subsequent power detection unit 500 and beam quality detection unit 600, and greatly improves the detection consistency and reliability of the entire calibration platform.

[0035] Specifically, the guide portion 320 is higher than the support portion 310 in the height direction of the fixture 300, forming a contact surface that can mutually limit the positioning of the semiconductor module 700 to be calibrated. This contact surface enables multi-dimensional positioning of the module, enhances the initial calibration accuracy of the optical path, and improves the convenience and consistency of clamping: on the one hand, the support portion 310 completes the horizontal plane bearing positioning of the module, while the contact surface can limit the module from the vertical direction and axial direction, so that its sidewall or end face is tightly attached to the contact surface, restricting the tilting and axial displacement of the module in the height direction, eliminating the attitude deviation of the module due to vibration and other factors during the detection process, and ensuring the coaxiality stability of the light source emitting end and the guide groove 321; on the other hand, the precise contact of the contact surface can further fix the attitude of the light source emitting end in the guide groove 321, avoid its angular tilt or radial sway, ensure that the initial optical path of the laser beam matches the preset direction of the guide groove 321, and accurately enters the designated area of ​​the reflecting and transmitting mirror 400, reducing the optical path deviation of subsequent power and beam quality detection.

[0036] In this embodiment, the reflector-transmitter mirror 400 is the core optical path distribution component of the platform and a key component for achieving synchronous detection of power and beam quality. Its core function is to non-destructively split the laser beam output from the semiconductor module, constructing independent and non-interfering transmission and reflection detection paths. Specifically, the reflector-transmitter mirror 400 can split the incident laser into two beams according to a preset ratio: one beam is transmitted along the original optical path and used to transmit to the power detection unit 500; the other beam is reflected at a fixed angle and used to transmit to the beam quality detection unit 600. The core value of this optical path design lies in achieving synchronous detection of two parameters of the same laser beam. This avoids the cumbersome process of repeatedly clamping the module to detect power and beam quality separately in traditional detection, and eliminates the positioning errors caused by multiple clamping, ensuring the consistency and correlation of the two parameter detection data. At the same time, its non-destructive splitting characteristic can minimize the interference with the original characteristics of the laser beam, ensuring that the detection data can truly reflect the actual output state of the module, providing a reliable basis for subsequent parameter adjustment. Specifically, in this embodiment, the reflector 400 is configured as a beam splitter with 1% reflection and 99% transmission. The power detection unit 500 needs to acquire the true power data of the laser output from the module; therefore, allocating a high-percentage (99%) transmitted beam to this unit maximizes the accuracy of power detection and avoids detection errors caused by an excessively low beam splitting percentage. Meanwhile, the beam quality detection unit 600 has low energy requirements for the incident beam; a 1% reflected beam is sufficient for its acquisition and analysis of parameters such as beam shape and divergence angle, without consuming excessive laser energy. This achieves effective beam quality detection without significantly impacting the core power detection.

[0037] In this embodiment, the power detection unit 500 is a precise monitoring component for laser output power. Its core function is to collect, process, and provide feedback on the power data of the laser beam along the transmission path. It is preferably a laser power meter. The beam quality detection unit 600 is a comprehensive analysis component for laser beam characteristics. It is preferably a beam quality analyzer.

[0038] Furthermore, the semiconductor module calibration platform in this embodiment also includes a control mechanism, with the power detection unit 500 and the beam quality detection unit 600 respectively connected to the control mechanism. The control mechanism of the semiconductor module calibration platform in this embodiment is electrically connected to the laser power meter and the beam quality analyzer, serving as the platform's data processing and command center. It enables intelligent control of the detection process: it can simultaneously collect and integrate real-time power data from the power meter and characteristic parameters such as beam uniformity and M² factor from the beam quality analyzer, complete data calibration conversion through built-in algorithms, and simultaneously visualize and automatically archive the data, forming a traceable calibration ledger, supporting single-module parameter trend analysis and multi-module performance comparison.

[0039] Example 2: This example provides a semiconductor module calibration system, which includes the semiconductor module calibration platform described in Example 1.

[0040] In summary, the semiconductor module calibration platform and system described in this utility model assembles the fixing mechanism 200, the reflecting and transmitting mirror 400, the power detection unit 500, and the beam quality detection unit 600 via the mounting plate 100. The fixing mechanism 200 can support the semiconductor module 700 to be calibrated. The reflecting and transmitting mirror 400 is used to divide the output beam of the semiconductor module 700 to be calibrated into a transmitted beam and a reflected beam. The power detection unit 500 detects the output power of the semiconductor module 700 to be calibrated, and the beam quality detection unit 600 detects the output beam quality of the semiconductor module 700 to be calibrated, thereby achieving synchronous and efficient detection of the core output parameters of the beam homogenization semiconductor module.

[0041] This integrated calibration structure design eliminates the cumbersome process of building separate power detection and beam quality detection systems in traditional testing. It not only significantly reduces the space occupied by the detection equipment and lowers the detection cost, but also effectively avoids the detection error caused by multiple module clamping through synchronous split detection of the same beam, thus improving the consistency and accuracy of parameter detection.

[0042] Most importantly, this calibration platform provides real-time and reliable feedback for parameter adjustment of the beam homogenization semiconductor module. The non-destructive beam splitting design implemented by the reflecting and transmitting mirror 400 ensures detection accuracy without interfering with the module's normal output characteristics, allowing the detection data to accurately reflect the module's actual operating status. Based on this, operators can optimize the module's adjustment parameters according to the real-time detection results from the power detection unit 500 and the beam quality detection unit 600, achieving precise matching and decoupled control of laser power and beam quality. This effectively solves the problems of low parameter adjustment accuracy and poor stability in existing technologies, providing strong technical support for the adaptable application of the beam homogenization semiconductor module in various scenarios.

[0043] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this utility model.

Claims

1. A semiconductor module calibration platform, characterized in that: include: Mounting plate; A fixing mechanism is provided on the mounting plate, and the semiconductor module to be calibrated can be placed on the fixing mechanism; A reflective transmission mirror is disposed on the mounting plate and located at the light source output end of the semiconductor module to be calibrated, so as to form the transmission path and reflection path of the output beam of the semiconductor module to be calibrated. A power detection unit and a beam quality detection unit are respectively disposed on the mounting plate, wherein the power detection unit is disposed on the transmission path and the beam quality detection unit is disposed on the reflection path.

2. The semiconductor module calibration platform according to claim 1, characterized in that: The fixing mechanism includes a water-cooled tank, a water-cooled plate, and a cooling pipe. The cooling pipe is disposed in the water-cooled tank, and both ends of the cooling pipe are connected to an external water circulation device. The water-cooled plate is detachably connected to the water-cooled tank, and the semiconductor module to be calibrated is disposed on the water-cooled plate.

3. The semiconductor module calibration platform according to claim 1, characterized in that: The semiconductor module calibration platform also includes a fixture, through which the semiconductor module to be calibrated is connected to the fixing mechanism.

4. The semiconductor module calibration platform according to claim 3, characterized in that: The fixture includes a support portion and a guide portion. The support portion is detachably connected to the fixing mechanism. The semiconductor module to be calibrated is disposed on the support portion. The guide portion is disposed at one end of the support portion and has a guide groove inside. The light source emitting end of the semiconductor module to be calibrated is located in the guide groove.

5. The semiconductor module calibration platform according to claim 4, characterized in that: The guide section is provided with an emission hole, which is located at one end of the guide groove near the reflective transmission mirror.

6. The semiconductor module calibration platform according to claim 4, characterized in that: The guide portion is higher than the support portion in the height direction of the fixture to form an abutment surface that can mutually limit the positioning of the semiconductor module to be calibrated.

7. The semiconductor module calibration platform according to claim 1, characterized in that: The mounting plate is provided with multiple adjustment holes, and the fixing mechanism, the reflecting and transmitting mirror, the power detection unit and the beam quality detection unit are detachably connected to the mounting plate through connectors.

8. The semiconductor module calibration platform according to claim 1, characterized in that: The semiconductor module calibration platform also includes a control mechanism, and the power detection unit and the beam quality detection unit are respectively connected to the control mechanism.

9. The semiconductor module calibration platform according to claim 1, characterized in that: The power detection unit is configured as a laser power meter, and the beam quality detection unit is configured as a beam quality analyzer.

10. A semiconductor module calibration system, characterized in that: The semiconductor module calibration platform includes any one of claims 1 to 9.

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