A push-pull force testing device for semiconductor wafer bumps

Abstract

The utility model discloses a kind of push-pull force testing devices for semiconductor wafer bump, including operation platform, the upper end of operation platform is fixedly connected with link frame, the upper end of operation platform is evenly provided with first sliding slot, and the fixedly connected with speed reducer of one first sliding slot side of operation platform is located, the output of speed reducer is fixedly connected with first bidirectional screw rod, the upper side of first bidirectional screw rod is threadedly connected with first sliding block, four are provided on first sliding block, second sliding slot is set in first sliding block and two by two opposite, the upper end of two first sliding blocks is fixedly connected with positive and negative motor, the output of positive and negative motor is fixedly connected with adjusting screw rod, the utility model is set by two second bidirectional screw rods of cross arrangement, so that four clamping seats can be relatively moved, cooperate with the clamping groove on clamping seat, carousel, rotary rod and pressure pad, the semiconductor wafer of different size can be limited, further, cooperate with the height adjustment of detection strip, improve the clamping adaptability of clamp.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer technology, and specifically to a push-pull force testing device for semiconductor wafer bumps. Background Technology

[0002] Semiconductor wafer bumps are tiny metal protrusion structures formed on the surface of a semiconductor wafer through a specific process. The bumps are usually made of metals such as gold, copper, and tin or other alloys, and can serve as a medium for connecting the wafer to external circuits. Common semiconductor wafer bumps require push-pull force testing devices during the inspection process.

[0003] Semiconductor wafer bump inspection requires cutting the bumped semiconductor wafer into samples suitable for testing, ensuring the bumps are intact, and then mounting the samples onto the sample stage of the inspection equipment. After positioning, the bumps are accurately aligned with the test probe, and the test parameters are set in the control system of the inspection equipment. Then, the test probe applies force to the bumps according to the set parameters, while the sensor measures the magnitude of the force, and the data acquisition system records it. After the inspection is completed, the collected data can be analyzed to calculate the push-pull force performance parameters of the bumps, thereby determining whether the bumps are qualified.

[0004] According to Chinese Patent Publication No. CN219065097, entitled "A Push-Pull Force Testing Device for Semiconductor Wafer Bumps," the device mainly includes a workbench. A rotating disk is rotatably connected to the center of the top of the workbench. A placement column is fixed to the center of the top of the rotating disk. Fastening mechanisms are symmetrically arranged on both sides of the placement column. First rod grooves are symmetrically formed on the top surface of the workbench at positions on both sides of the rotating disk. Second rod grooves are symmetrically formed at one end of the first rod grooves on the top of the workbench. A second threaded rod is rotatably connected inside the first rod groove. Threaded sleeves are threaded on both sides of the circumference. A connecting plate is fixed to the top of the threaded sleeve. A tensile tester is fixed on one side of the two connecting plates that are close to each other. A rotating rod is rotatably connected inside the second rod groove. One end of the rotating rod passes through the second rod groove and extends into the interior of the first rod groove at an adjacent position. The other end of the rotating rod passes through the second rod groove and extends to the outside of the worktable. A first bevel gear is fixedly sleeved on the other side of the outer circumference of the second threaded rod. A second bevel gear is fixedly sleeved on the outer circumference of the part of the rotating rod that extends into the interior of the second rod groove. The first bevel gear and the second bevel gear at an adjacent position are meshed.

[0005] The aforementioned patent uses a fastening mechanism to fix the two opposite positions of the semiconductor wafer bumps. The hook of the tensile tester passes through the pull ring, and by rotating one of the rotating rods, the two threaded sleeves synchronously drive the two tensile testers to move away from each other. This allows for simultaneous application of push and pull forces to both sides of the semiconductor wafer bumps for testing, facilitating accurate measurement data and aiding in the quality assessment of the semiconductor wafer bumps. This improves the device's practicality. Furthermore, by starting the motor, the meshing of the gear and the ring gear causes the rotating disk to rotate, allowing for precise adjustment of the semiconductor wafer bump angle after testing to facilitate testing at the other two opposite test positions. Extending the pin into the slot secures the rotating disk, further enhancing the device's ease of use.

[0006] Common semiconductor wafers vary in size and shape. When inspecting semiconductor wafer bumps, adjustments need to be made according to the actual situation. The clamping structure provided by the aforementioned patent has the problem of low clamping adaptability. It may not be able to effectively and stably fix wafers of different sizes and shapes, causing the sample to easily loosen during the inspection process. Moreover, when it is necessary to inspect the side of the semiconductor wafer bumps, the sample may shift due to the force caused by the unstable clamping, resulting in clamping instability. Utility Model Content

[0007] To address the shortcomings of existing technologies, this invention provides a push-pull force testing device for semiconductor wafer bumps, thereby improving the adaptability of the fixture and enhancing the clamping stability during semiconductor wafer bump testing.

[0008] The technical solution adopted by this utility model to solve the technical problem is: a push-pull force testing device for semiconductor wafer bumps, including an operating table, a connecting frame fixedly connected to the upper end of the operating table, and first sliding grooves opened on both sides of the upper end of the operating table. A reduction motor is fixedly connected to one side of one of the first sliding grooves on the operating table. A first bidirectional screw is fixedly connected to the output end of the reduction motor. First sliders are threadedly connected to both sides of the first bidirectional screw. Four first sliders are provided, and second sliding grooves are opened on the first sliders and are opposite to each other in pairs. Two of the first sliders are fixedly connected to the upper ends of a forward and reverse motor. The output ends of the forward and reverse motors are fixedly connected to... The system is connected to an adjusting screw, on which a second slider is threadedly connected. Support arms are fixedly connected to opposite sides of the two second sliders. Detection strips are provided on the bottom sides of the two support arms. Position sensors are fixedly connected to the upper ends of the support arms. A turntable is rotatably connected to the upper end of the operating platform via a rotating shaft. A cross-shaped groove is formed on the upper end of the turntable. Servo motors are fixedly connected to both sides of the cross-shaped groove on the turntable. A second bidirectional screw is fixedly connected to the output end of each servo motor. Clamping seats are threadedly connected to both sides of the second bidirectional screw. An electric push rod is fixedly connected within the connecting frame. An industrial camera is fixedly connected to the output end of the electric push rod.

[0009] As a preferred technical solution of this utility model, slots are provided on the four mutually spaced sides of the turntable, and a locking rod is inserted into one of the slots. The locking rod is threaded to the operating table. By setting the locking rod and the slots, the position of the detection strip can be adjusted.

[0010] As a preferred technical solution of this utility model, support rods are fixedly connected to the four mutually distant sides of the turntable. A sliding ball is rotatably embedded at the bottom end of the support rod, and the sliding ball contacts the operating table. By setting the support rods, the stability of the turntable rotation can be improved.

[0011] As a preferred technical solution of this utility model, an L-shaped plate is fixedly connected to one side of the bottom end of the support arm. A cavity is opened on the bottom side of the L-shaped plate. A sliding plate is slidably connected in the cavity. A connecting rod is fixedly connected to one end of the sliding plate. One end of the connecting rod is fixedly connected to the detection strip. A spring is sleeved on the connecting rod. By setting up the L-shaped plate, cavity, sliding plate, connecting rod and spring, a buffer structure can be provided, thereby shortening the equipment response time and facilitating the detection of the push and pull force of the wafer bump.

[0012] As a preferred technical solution of this utility model, the L-shaped plate has a hidden groove on the side near the detection strip. The hidden groove is consistent with the minimum distance of the spring contraction. A distance sensor is provided on one side of the detection strip. The distance sensor is fixedly connected to one side of the second slider. By setting the distance sensor, it is possible to quickly detect changes in the distance of the detection strip, thereby improving the detection accuracy.

[0013] This utility model has the following advantages: by setting two intersecting second bidirectional screws, the four clamping seats can move relative to each other. With the clamping grooves, turntables, rotating rods and pressure pads on the clamping seats, semiconductor wafers of different sizes can be limited. Furthermore, with the height adjustment of the detection strip, the clamping adaptability of the fixture is improved. Attached Figure Description

[0014] Figure 1 This is a three-dimensional sectional view of a push-pull force testing device for semiconductor wafer bumps according to a preferred embodiment of the present invention.

[0015] Figure 2 This is a front view schematic diagram of a push-pull force testing device for semiconductor wafer bumps according to a preferred embodiment of the present invention;

[0016] Figure 3 This is a side cross-sectional view of the L-shaped plate of a semiconductor wafer bump push-pull force testing device according to a preferred embodiment of the present invention.

[0017] Explanation of reference numerals in the attached drawings: 1. Operating table; 2. Connecting frame; 3. First bidirectional screw; 4. First slider; 5. Adjusting screw; 6. Second slider; 7. Support arm; 8. L-shaped plate; 9. Position sensor; 10. Rotating shaft; 11. Turntable; 12. Second bidirectional screw; 13. Clamping seat; 14. Electric push rod; 15. Industrial camera; 16. Slot; 17. Clamping rod; 18. Support rod; 19. Cavity; 20. Slide plate; 21. Connecting rod; 22. Spring; 23. Hidden groove; 24. Distance sensor; 25. Detection strip. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings.

[0019] Please refer to the following: Figure 1-3The device shown is a push-pull force testing device for semiconductor wafer bumps, including an operating table 1. A connecting frame 2 is fixedly connected to the upper end of the operating table 1. First grooves are formed on both sides of the upper end of the operating table 1 (a first auxiliary rod is fixedly connected in the other groove, through which two first sliders 4 are movably inserted and cooperate with a first bidirectional screw 3, allowing the opposing first sliders 4 to move relative to each other, thereby changing the position of the detection strip 25). A reduction motor is fixedly connected to one side of one of the first grooves on the operating table 1. The output end of the reduction motor is fixedly connected to the first bidirectional screw 3. First sliders 4 are threadedly connected to both sides of the first bidirectional screw 3. Four first sliders 4 are provided, each with a second groove formed in pairs (a second auxiliary rod can be fixedly connected in the other two second grooves, through which a second slider 6 is movably inserted, allowing the height of the second slider 6 and the detection strip 25 to move, thereby improving adaptability). A forward and reverse motor is fixedly connected to the upper end of two of the first sliders 4. An adjusting screw 5 is fixedly connected to the output end of the forward and reverse motor. A second slider 6 is threadedly connected to the adjusting screw 5. Support arms 7 are fixedly connected to opposite sides of the two sliders 6. Detection strips 25 are provided on the bottom sides of the two support arms 7. Position sensors 9 are fixedly connected to the upper ends of the support arms 7. A turntable 11 is rotatably connected to the upper end of the operating table 1 via a rotating shaft 10. A cross groove is formed on the upper end of the turntable 11. Servo motors are fixedly connected to both sides of the cross groove on the turntable 11. A second bidirectional screw 12 is fixedly connected to the output end of each servo motor. A single servo motor can control one second bidirectional screw 12, causing the two clamping seats 13 on the second bidirectional screw 12 to move relative to each other. Two servo motors separately control the movement of the opposing clamping seats 13, which can accommodate the positioning of semiconductor wafers with different aspect ratios. The second bidirectional screw 12 has clamping seats 13 threadedly connected to both sides. Each clamping seat 13 has a clamping groove. A rotating rod is threadedly connected to the upper side of the clamping seat 13 within the clamping groove. A pressure pad is rotatably connected to the bottom end of the rotating rod. An electric push rod 14 is fixedly connected inside the connecting frame 2. An industrial camera 15 is fixedly connected to the output end of the electric push rod 14. The industrial camera 15 is connected in series with a controller via wires. The controller is located on one side of the operating table 1. Figure 1 (At the center position), the controller is connected in series with the forward and reverse motors, servo motors, geared motors and industrial camera 15 via wires. The industrial camera 15 is equipped with a spectral analysis function, which can perform preliminary analysis of the material composition of the wafer bumps and provide more information for quality control. The electric push rod 14 drives the industrial camera 15 to move and approach the semiconductor wafer, which can improve the observation effect.

[0020] The turntable 11 has four slots 16 on its four sides that are far apart from each other. A locking rod 17 is inserted into one of the slots 16. The locking rod 17 is threaded to the operating table 1. By setting the locking rod 17 and the slots 16, the turntable 11 can be stably limited after its position is adjusted, so as to ensure the accuracy of the detection.

[0021] Among them, the turntable 11 is fixedly connected to the four sides that are far apart from each other. The bottom end of the support rod 18 is rotatably embedded with a slider. The surface of the slider is coated with a layer of polytetrafluoroethylene. The slider contacts the operating table 1. By setting the support rod 18 and the slider, the turntable 11 can be supported and the shaking of the turntable 11 can be reduced.

[0022] The support arm 7 has an L-shaped plate 8 fixedly connected to one side of its bottom end. The L-shaped plate 8 has a cavity 19 on its inner bottom side. A slide plate 20 is slidably connected to the cavity 19. A connecting rod 21 is fixedly connected to one end of the slide plate 20. One end of the connecting rod 21 is fixedly connected to the detection strip 25. A spring 22 is sleeved on the connecting rod 21. The spring 22 is regularly inspected and replaced to ensure that its elastic performance meets the testing requirements. A mark can be set on the spring 22 to record its usage and replacement time for easy maintenance and management. The detection strip 25 and the hidden groove 23 are fixedly connected to both ends of the spring 22, respectively. By setting a movable detection strip 25, a fast-response structure can be formed. When the spring 22 is squeezed or stretched, the position of the detection strip 25 will change, making it easy to identify the force displacement of the bumps on the wafer.

[0023] The L-shaped plate 8 has a hidden groove 23 on the side near the detection strip 25. The hidden groove 23 is consistent with the minimum distance of the spring 22 when it is contracted. A distance sensor 24 is provided on one side of the detection strip 25. The distance sensor 24 is connected to the controller in series with a wire. The distance sensor 24 is fixedly connected to one side of the second slider 6. By setting the hidden groove 23, the detection strip 25 will abut against the L-shaped plate 8 when the spring 22 is fully contracted, which is convenient for performing thrust detection. The distance sensor 24 provides distance signal monitoring. When the position of the detection strip 25 changes, it will send an electrical signal through the distance sensor 24 and transfer it to the controller, thereby achieving the instantaneous signal monitoring when the protrusion moves under the push and pull force, which is convenient for monitoring.

[0024] The output ends of the first bidirectional screw 3, the second bidirectional screw 12, the adjusting screw 5, and the electric push rod 14 can all be equipped with detachable transparent plastic dust covers to reduce the movement of the first slider 4, the second slider 6, and the clamping seat 13 caused by dust contact with the screws.

[0025] Among them, the geared motor, forward and reverse motor, servo motor and electric actuator 14 are common devices in this field and can be purchased and used from the market as needed.

[0026] Working principle: First, the semiconductor wafer is placed on the turntable 11, and the second bidirectional screw 12 is rotated by two servo motors, causing the corresponding clamping seat 13 to move. At this time, the clamping groove contacts the wafer, and the rotating rod and pressure pad cooperate with the clamping groove to limit the wafer, so that the wafer bump is on the side away from the turntable 11. Then, according to the actual situation, the reduction motor is started, so that the detection strip 25 contacts the wafer bump to be detected, and the turntable 11 is limited by the clamping groove 16 by the clamping rod 17. Further, the electric push rod 14 extends, so that the industrial camera 15 can be brought closer to observe and provide a basis for the controller's adjustment. When bump thrust detection is required, the detection strip 25 abuts against one end of the L-shaped plate 8, and the spring 22 is fully retracted into the hidden groove 23 (required). Note that only one detection strip 25 abuts against the wafer bump to be tested (i.e., the wafer bump to be tested is not located at the center point of the turntable 11). When further bump pull testing is required, the adjusting screw 5 can be used to drive the second slider 6 to move upward, so that the detection strip 25 corresponds to the other side of the bump. At this time, the spring 22 is fully extended, and the slide plate 20 abuts against the side of the cavity 19 near the detection plate 25. When the bump is pulled and disengaged, the spring 22 is not stretched and will retract normally, causing the position of the detection plate 25 to move. At this time, the distance sensor 24 monitors the distance signal and transmits it to the controller. Then, the controller controls the reduction motor to stop the rotation of the first bidirectional screw 3 according to the transmitted signal, so that the first slider 4 stops moving, thereby improving the fast control and response capability.

[0027] The above are merely preferred embodiments of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

[0028] All other parts of this utility model that are not described in detail belong to the prior art, and therefore will not be described in detail here.

[0029] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A push-pull force testing device for semiconductor wafer bumps, comprising an operating table (1), characterized in that, The upper end of the operating table (1) is fixedly connected to a connecting frame (2). The upper end of the operating table (1) is provided with first sliding grooves on both sides. The operating table (1) is fixedly connected to a reduction motor on one side of one of the first sliding grooves. The output end of the reduction motor is fixedly connected to a first bidirectional screw (3). The first bidirectional screw (3) is threadedly connected to both sides of the first bidirectional screw (3). There are four first sliding blocks (4). The first sliding blocks (4) are provided with second sliding grooves and are opposite to each other in pairs. The upper ends of two of the first sliding blocks (4) are fixedly connected to a forward and reverse motor. The output end of the forward and reverse motor is fixedly connected to an adjusting screw (5). The adjusting screw (5) is threadedly connected to a second sliding block (6). The two second sliding blocks (6) are threadedly connected to each other. On opposite sides, a support arm (7) is fixedly connected. A detection strip (25) is provided on the bottom side of the two support arms (7). A position sensor (9) is fixedly connected to the upper end of the support arm (7). A turntable (11) is rotatably connected to the upper end of the operating table (1) via a rotating shaft (10). A cross groove is provided on the upper end of the turntable (11). Servo motors are fixedly connected to both sides of the turntable (11) located in the cross groove. A second bidirectional screw (12) is fixedly connected to the output end of the servo motor. A clamping seat (13) is threaded on both sides of the second bidirectional screw (12). An electric push rod (14) is fixedly connected inside the connecting frame (2). An industrial camera (15) is fixedly connected to the output end of the electric push rod (14).

2. The push-pull force testing device for semiconductor wafer bumps as described in claim 1, characterized in that, The turntable (11) has slots (16) on its four mutually spaced sides, and a lever (17) is inserted into one of the slots (16). The lever (17) is threadedly connected to the operating table (1).

3. The push-pull force testing device for semiconductor wafer bumps as described in claim 2, characterized in that, Support rods (18) are fixedly connected to the four mutually distant sides of the turntable (11). A slider is rotatably embedded at the bottom of the support rod (18), and the slider is in contact with the operating table (1).

4. The push-pull force testing device for semiconductor wafer bumps as described in claim 1, characterized in that, An L-shaped plate (8) is fixedly connected to one side of the bottom end of the support arm (7). A cavity (19) is opened on the bottom side of the L-shaped plate (8). A sliding plate (20) is slidably connected in the cavity (19). A connecting rod (21) is fixedly connected to one end of the sliding plate (20). One end of the connecting rod (21) is fixedly connected to the detection strip (25). A spring (22) is sleeved on the connecting rod (21).

5. The push-pull force testing device for semiconductor wafer bumps as described in claim 4, characterized in that, The L-shaped plate (8) has a hidden groove (23) on the side near the detection strip (25). The hidden groove (23) is consistent with the minimum distance of the spring (22) when it contracts. A distance sensor (24) is provided on one side of the detection strip (25). The distance sensor (24) is fixedly connected to one side of the second slider (6).

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