A probe for testing a semiconductor chip package

Abstract

The utility model discloses a kind of probe for semiconductor chip packaging test, it is related to chip packaging technical field.The utility model includes: test bench, the upside of test bench is fixedly connected with placing plate;Multiple test components, test component includes stand, connecting plate and probe body;Among them, the upside of stand and the upside of connecting plate are equipped with rotating member, probe body is detachably fixed on the rotating member of connecting plate upside;Rotating member includes sleeve, fixed cylinder and drive rod, sleeve is sleeved and rotationally cooperated in the circumferential side of fixed cylinder, the opposite two inner sides of sleeve are all set with guide slot.The utility model is equipped with rotating member, using the cooperation of guide rod and limit slot, guide slot, only need to move drive rod to drive sleeve rotation, realize the quick adjustment of probe body test angle, simple and convenient operation, can adapt to the angle requirement of different semiconductor chip packaging test.

Description

Technical Field

[0001] This utility model belongs to the field of chip packaging technology, specifically, it relates to a probe for semiconductor chip packaging testing. Background Technology

[0002] In the semiconductor chip manufacturing process, packaging and testing is a crucial step in ensuring chip performance and quality. Its core is to use probes to make precise contact with chip pins or pads to test the electrical performance and functional integrity of the chip, ensuring that the chips meet design specifications and application requirements. As semiconductor technology rapidly develops towards higher integration, smaller size, and more pins, chip packaging forms are constantly iterating (such as BGA, CSP, QFP, etc.), which places higher demands on the adaptability, adjustment accuracy, and ease of operation of packaging and testing probes. Traditional probes often employ fixed mounting structures or single-dimensional adjustment designs, which can only adapt to chips with specific package forms and pin layouts. When faced with the testing requirements of chips with different sizes, pin pitches, or package angles, it is necessary to replace the entire probe assembly or adjust the overall posture of the test bench. This not only increases the equipment investment cost but also prolongs the test changeover time, making it difficult to meet the high-efficiency testing needs of multiple varieties and small batches of chips. In view of this, this utility model is proposed. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a probe for semiconductor chip packaging and testing, which solves the problems mentioned in the background art.

[0004] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by this utility model is as follows: A probe for semiconductor chip packaging testing, comprising: The test bench has a placement plate fixedly connected to its upper side. Multiple test components, including a column, a connecting plate, and a probe body; The upper side of the column and the upper side of the connecting plate are both equipped with rotating parts, and the probe body is detachably fixed on the rotating parts on the upper side of the connecting plate. The rotating component includes a sleeve, a fixed cylinder, and a drive rod. The sleeve is fitted and rotatably engages with the periphery of the fixed cylinder. Guide grooves are provided on both opposite inner sides of the sleeve. Limit grooves are provided on both opposite sides of the fixed cylinder. The drive rod is slidably engaged within the fixed cylinder. Guide rods are fixed on both opposite outer sides of the drive rod. The guide rods are slidably engaged within the limit grooves and guide grooves. Positioning elements are installed on both opposite outer sides of the drive rod, and the positioning elements engage with the fixed cylinder.

[0005] Optionally, multiple positioning grooves are provided on both inner sides of the fixed cylinder, and the positioning element cooperates with the positioning groove.

[0006] Optionally, the drive rod has grooves on both outer sides, and the positioning element includes a positioning rod that slides in the groove, with the positioning rod engaging with the positioning groove.

[0007] Optionally, a through groove is provided on the upper side of the drive rod, which is connected to two sliding grooves. The positioning component also includes a limiting rod, which is slidably fitted in the through groove and cooperates with the two positioning rods.

[0008] Optionally, one end of the limiting rod is chamfered, and the other end of the limiting rod is fixed with a limiting plate.

[0009] Optionally, a mounting block is fixed to one side of the sleeve of one of the rotating parts, a slot is provided on one side of the mounting block, and a threaded groove is provided on one side of the mounting block that communicates with the slot. A set screw is threaded in the threaded groove, and the probe body mates with the slot and the set screw.

[0010] Optionally, the slot opening has rounded corners.

[0011] Optionally, an arc-shaped pad is rotatably connected to the upper side of the set screw.

[0012] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art. Of course, any product implementing the present invention does not necessarily need to achieve all of the following advantages at the same time: 1. By setting a rotating component and utilizing the cooperation of the guide rod, the limiting groove, and the guide groove, the sleeve can be rotated simply by moving the drive rod, thereby achieving rapid adjustment of the probe body's testing angle. The operation is simple and convenient, and it can adapt to the angle requirements of different semiconductor chip packaging tests. 2. The inner side of the fixed cylinder is provided with multiple positioning grooves. With the help of positioning components, the position of the drive rod can be accurately positioned according to the required angle of the test, so as to realize the rapid and accurate adjustment of the probe body angle. At the same time, after the limit rod is inserted into the through groove, it can block the movement of the positioning rod, further locking the drive rod and preventing the sleeve from rotating due to accidental displacement of the drive rod during the test. This ensures that the probe always maintains a stable test posture and guarantees the test accuracy and reliability. 3. With the cooperation of the slots, threaded grooves and set screws on the mounting block, the probe body can be installed simply by inserting it into the slot and tightening the set screw. Disassembly is done by reversing the operation, which enables quick and easy removal and fixing of the probe body, making it convenient for probe replacement and maintenance. 4. The rounded corner design at the slot opening facilitates the insertion and installation of the probe body; the arc-shaped pad on the set screw increases the contact area with the probe body, improves clamping stability, avoids damage to the probe, and extends the probe's service life. 5. The configuration of multiple test components can meet the testing needs of multiple positions. Furthermore, through the multi-angle settings of the positioning slots and the combination of positioning components, the probe body can be quickly positioned and adjusted at multiple angles, making it suitable for semiconductor chip packaging testing scenarios of different types and specifications.

[0013] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0014] The accompanying drawings described below are merely some embodiments. Those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings: Figure 1 This is a schematic diagram of the test bench structure; Figure 2 This is a schematic diagram of the mounting block structure; Figure 3 This is a schematic diagram of the rotating component. Figure 4 This is a schematic diagram of the cross-sectional structure of the rotating component.

[0015] The attached diagram lists the components represented by each number as follows: Test bench 1, placement board 101; Test component 2, column 201, connecting plate 202, probe body 203; Rotating component 3, sleeve 301, fixed cylinder 302, drive rod 303, guide groove 304, limit groove 305, guide rod 306, positioning component 307, positioning groove 308, sliding groove 309, positioning rod 310, through groove 311, limit rod 312, limit plate 313, mounting block 314, slot 315, threaded groove 316, set screw 317.

[0016] It should be noted that these accompanying drawings and textual descriptions are not intended to limit the scope of the present invention in any way, but rather to illustrate the concept of the present invention to those skilled in the art by referring to specific embodiments. Detailed Implementation

[0017] The present invention will now be described in further detail with reference to the accompanying drawings.

[0018] Please see Figure 1-4 As shown, this embodiment provides a probe for semiconductor chip packaging testing, including: Test bench 1, with a placement plate 101 fixedly connected to the upper side of test bench 1; Multiple test components 2, each test component 2 including a column 201, a connecting plate 202 and a probe body 203; Among them, the upper side of the column 201 and the upper side of the connecting plate 202 are both equipped with rotating parts 3, and the probe body 203 is detachably fixed on the rotating parts 3 on the upper side of the connecting plate 202. The rotating component 3 includes a sleeve 301, a fixed cylinder 302, and a drive rod 303. The sleeve 301 is fitted and rotatably engaged around the fixed cylinder 302. Guide grooves 304 are provided on both inner sides of the sleeve 301. Limiting grooves 305 are provided on both sides of the fixed cylinder 302. The drive rod 303 is slidably engaged inside the fixed cylinder 302. Guide rods 306 are fixed on both outer sides of the drive rod 303. The guide rods 306 are slidably engaged in the limiting grooves 305 and the guide grooves 304. Positioning elements 307 are installed on both outer sides of the drive rod 303. The positioning elements 307 cooperate with the fixed cylinder 302.

[0019] Working principle: When it is necessary to perform packaging testing on semiconductor chips, first install the probe body 203 on the rotating part 3 on the upper side of the connecting plate 202, and then place the semiconductor chip to be tested on the placement plate 101. The packaging testing operation can then be carried out through the probe body 203. When it is necessary to adjust the test angle of the probe body 203, simply move the drive rod 303, which will then drive the guide rod 306 to move synchronously. Under the constraint of the limiting groove 305, the guide rod 306 moves along the trajectory of the limiting groove 305, and at the same time, through cooperation with the guide groove 304, drives the sleeve 301 to rotate relative to the fixed cylinder 302. This causes the connecting plate 202 or the probe body 203 to adjust its posture, thereby completing the adjustment of the test angle of the probe body 203. The positioning component 307 is designed to cooperate with the fixed cylinder 302 to lock the position of the drive rod 303, preventing the sleeve 301 from rotating due to accidental displacement of the drive rod 303 during the test, ensuring that the probe always maintains a stable test posture, and guaranteeing test accuracy and reliability.

[0020] In this embodiment, the fixed cylinder 302 has multiple positioning grooves 308 on its two inner sides, and the positioning member 307 cooperates with the positioning grooves 308. In this embodiment, the drive rod 303 has sliding grooves 309 on its two outer sides. The positioning member 307 includes a positioning rod 310, which is slidably fitted in the sliding groove 309 and cooperates with the positioning groove 308. In this embodiment, the drive rod 303 has a through groove 311 on its upper side, which is connected to the two sliding grooves 309. The positioning member 307 also includes a limiting rod 312, which is slidably fitted in the through groove 311 and cooperates with the two positioning rods 310. In this embodiment, one end of the limiting rod 312 is chamfered, and the other end of the limiting rod 312 is fixed with a limiting plate 313.

[0021] By using the positioning element 307, the position of the drive rod 303 can be initially positioned through the cooperation of the positioning rod 310 and the positioning groove 308. Furthermore, the positioning groove 308 can be opened according to the angle required for semiconductor chip packaging testing. When the positioning rod 310 cooperates with the positioning groove 308, the angle of the probe body 203 can be adjusted quickly and accurately. The combination of multiple positioning grooves 308 on two positioning elements 307 can also achieve the effect of multi-angle rapid positioning adjustment, making it convenient for staff to quickly adjust the angle of the probe body 203 according to the packaging testing requirements. After the angle of the probe body 203 is adjusted, the operator can insert the limiting rod 312 into the through groove 311 to block the two positioning rods 310, so that the two positioning rods 310 cannot move, thereby restricting the position of the drive rod 303 and preventing the drive rod 303 from moving.

[0022] In this embodiment, a mounting block 314 is fixed to one side of the sleeve 301 of one of the rotating parts 3. A slot 315 is provided on one side of the mounting block 314, and a threaded groove 316 communicating with the slot 315 is provided on one side of the mounting block 314. A set screw 317 is threadedly engaged in the threaded groove 316. The probe body 203 is engaged with the slot 315 and the set screw 317. The opening of the slot 315 in this embodiment is provided with a rounded corner. An arc-shaped pad is rotatably connected to the upper side of the set screw 317 in this embodiment.

[0023] When installing the probe body 203, insert one end of the probe body 203 into the slot 315, and then screw the set screw 317 into the threaded groove 316. At this time, the set screw 317 will clamp the probe body 203 with the help of the arc-shaped pad, thus successfully completing the fixing operation of the probe body 203. When it is necessary to disassemble the probe body 203, follow the reverse operation method of installation, rotate the set screw 317 so that the set screw 317 no longer exerts a squeezing and fixing effect on the probe body 203, and then you can pull the probe body 203 to remove it.

[0024] It should be noted that all electrical devices involved in this application can be powered by batteries or external power sources.

[0025] This utility model is not limited to the above-described embodiments. Anyone should know that structural changes made under the guidance of this utility model, and any technical solutions that are the same as or similar to this utility model, fall within the protection scope of this utility model. Technical aspects, shapes, and structures not described in detail in this utility model are all publicly known technologies.

Claims

1. A probe for semiconductor chip packaging testing, characterized in that, include: Test bench (1), with a placement plate (101) fixedly connected to the upper side of the test bench (1). Multiple test components (2), each test component (2) includes a column (201), a connecting plate (202), and a probe body (203); Among them, the upper side of the column (201) and the upper side of the connecting plate (202) are both equipped with rotating parts (3), and the probe body (203) is detachably fixed on the rotating parts (3) on the upper side of the connecting plate (202); The rotating component (3) includes a sleeve (301), a fixed cylinder (302), and a drive rod (303). The sleeve (301) is fitted and rotatably fitted around the fixed cylinder (302). Guide grooves (304) are provided on both inner sides of the sleeve (301). Limiting grooves (305) are provided on both sides of the fixed cylinder (302). The drive rod (303) is slidably fitted inside the fixed cylinder (302). Guide rods (306) are fixed on both outer sides of the drive rod (303). Guide rods (306) are slidably fitted inside the limiting grooves (305) and the guide grooves (304). Positioning components (307) are installed on both outer sides of the drive rod (303). The positioning components (307) cooperate with the fixed cylinder (302).

2. The probe for semiconductor chip packaging testing according to claim 1, characterized in that, Multiple positioning grooves (308) are provided on both inner sides of the fixed cylinder (302), and the positioning element (307) cooperates with the positioning grooves (308).

3. The probe for semiconductor chip packaging testing according to claim 2, characterized in that, The drive rod (303) has two grooves (309) on its opposite outer sides. The positioning member (307) includes a positioning rod (310), which slides in the groove (309) and cooperates with the positioning groove (308).

4. A probe for semiconductor chip packaging testing according to claim 3, characterized in that, The drive rod (303) has a through groove (311) on its upper side. The through groove (311) is connected to two sliding grooves (309). The positioning member (307) also includes a limiting rod (312). The limiting rod (312) is slidably fitted in the through groove (311) and cooperates with the two positioning rods (310).

5. A probe for semiconductor chip packaging testing according to claim 4, characterized in that, One end of the limiting rod (312) is chamfered, and the other end of the limiting rod (312) is fixed with a limiting plate (313).

6. A probe for semiconductor chip packaging testing according to claim 1, characterized in that, One of the rotating parts (3) has a mounting block (314) fixed on one side of the sleeve (301). A slot (315) is provided on one side of the mounting block (314). A threaded groove (316) communicating with the slot (315) is provided on one side of the mounting block (314). A set screw (317) is threaded in the threaded groove (316). The probe body (203) is engaged with the slot (315) and the set screw (317).

7. A probe for semiconductor chip packaging testing according to claim 6, characterized in that, The opening of the slot (315) has rounded corners.

8. A probe for semiconductor chip packaging testing according to claim 7, characterized in that, An arc-shaped pad is rotatably connected to the upper side of the set screw (317).

Images