Silicon photonic chip-based optical engine and optical module

Abstract

The utility model discloses a light engine and light module based on silicon optical chip, this light engine includes: PCB board, light subassembly base plate is set up on the PCB board, light emission subassembly is set up on light subassembly base plate, and light emission subassembly includes the COC of setting in turn along the light path, emission end silicon optical chip and emission end optical fiber array unit, and COC is used to produce signal light, and signal light is coupled into the light -receiving waveguide of emission end silicon optical chip, and emission end optical fiber array unit is coupled with the light -emitting waveguide of emission end silicon optical chip, light receiving subassembly is set up on light subassembly base plate, and light receiving subassembly includes the receiving end optical fiber array unit and receiving end silicon optical chip of setting in turn along the light path, and receiving end optical fiber array unit is coupled with the light -receiving waveguide of receiving end silicon optical chip, connector is connected with emission end optical fiber array unit and receiving end optical fiber array unit. The utility model has reduced the quantity of use of optical element, has optimized the structural layout of light subassembly to effectively simplified the technological process of light subassembly.

Description

Technical Field

[0001] This utility model belongs to the field of optical communication technology, specifically relating to an optical engine and optical module based on a silicon photonic chip. Background Technology

[0002] With the development of telecommunications, big data, and cloud computing towards higher speeds and larger capacities, the demand for multi-channel parallel high-speed optical modules is growing rapidly. Currently, the widely used transmitter EML (Electro-Absorption Modulated Laser) parallel multi-channel scheme and the receiver discrete PD scheme occupy large space, have complex coupling processes, and high device power consumption. Utility Model Content

[0003] The purpose of this invention is to provide an optical engine and optical module based on silicon photonics chips to solve the problems of high material cost, large space occupation of optical components, and complicated packaging process of the transmitter EML parallel multi-channel scheme and the receiver discrete PD scheme.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: In a first aspect, this utility model provides a light engine based on a silicon photonics chip, the light engine comprising: PCB board; The optical component substrate is mounted on the PCB board; An optical emitting component is disposed on an optical component substrate. The optical emitting component includes a COC, an emitting silicon photonic chip, and an emitting fiber array unit arranged sequentially along the optical path. The COC is used to generate signal light, which is coupled into the input waveguide of the emitting silicon photonic chip. The emitting fiber array unit is coupled to the output waveguide of the emitting silicon photonic chip. An optical receiving component is disposed on an optical component substrate. The optical receiving component includes a receiving end fiber array unit and a receiving end silicon photonic chip arranged sequentially along the optical path, wherein the receiving end fiber array unit is coupled to the incident waveguide of the receiving end silicon photonic chip. Connectors are used to connect the transmitter fiber array unit and the receiver fiber array unit.

[0005] In some embodiments, the light emitting component further includes a first-stage lens and a second-stage lens, which are sequentially disposed in the optical path between the COC and the emitting silicon photonic chip to collimate and focus the signal light so that the signal light is coupled into the input waveguide of the emitting silicon photonic chip.

[0006] In some embodiments, the light emitting assembly further includes an isolator disposed between the first-stage lens and the second-stage lens for isolating reflected light.

[0007] In some embodiments, the light emitting assembly further includes a first emitting substrate and a second emitting substrate, both of which are disposed on the light assembly substrate. The COC, the first-stage lens, the isolator, and the second-stage lens are all mounted on the first emitting substrate, and the emitting silicon photonic chip is mounted on the second emitting substrate.

[0008] In some embodiments, the number of channels in the COC is single or multiple, and the number of channels is selected and set according to the optical port application of the transmitter silicon photonics chip.

[0009] In some embodiments, a prism is provided in front of the incident waveguide of the transmitting silicon photonics chip to adjust the incident angle of the signal light so that it matches the incident angle of the incident waveguide of the transmitting silicon photonics chip.

[0010] In some embodiments, the optical receiving component further includes a first receiving substrate and a second receiving substrate, both of which are disposed on the optical component substrate. The receiving fiber array unit is mounted on the second receiving substrate, and the receiving silicon photonic chip is mounted on the first receiving substrate.

[0011] In some embodiments, the coupling end face of the transmitting fiber array unit and the output waveguide of the transmitting silicon photonic chip, and the coupling end face of the receiving fiber array unit and the input waveguide of the receiving silicon photonic chip are both filled with refractive index matching liquid.

[0012] In some embodiments, the PCB board has slots, and the optical component substrate is bonded to the slots of the PCB board to accommodate the optical emitting component and the optical receiving component.

[0013] Secondly, this utility model provides an optical module based on a silicon photonics chip. The optical module includes an optical engine, an optical module base, an optical module cover, and an optical module pull ring, as described in any one of the first aspects. The optical module base and the optical module cover encapsulate the optical engine, and the optical module pull ring is used to unlock / lock the optical module.

[0014] In summary, compared with the prior art, the above-described technical solution conceived by this utility model can achieve the following beneficial effects: This invention provides an optical engine based on a silicon photonics chip. Both the optical emitting and receiving components of the optical engine adopt a silicon photonics chip-based packaging scheme, and the optical emitting and receiving components are set on the same optical component substrate. This reduces the number of optical components such as COC, lenses, and isolators, optimizes the structural layout of the optical component, and effectively simplifies the process flow of mounting and coupling of the optical component.

[0015] Furthermore, a prism is provided in front of the input waveguide of the transmitting silicon photonics chip to adjust the incident angle of the signal light, so that the incident angle of the signal light can match the incident angle of the input waveguide of the transmitting silicon photonics chip.

[0016] Furthermore, the number of channels in the COC can be selected as single-channel or multi-channel according to the actual optical port application of the transmitting silicon photonics chip; the isolator set between the first-stage lens and the second-stage lens can isolate reflected light and ensure the quality of the incident signal light; the coupling end face of the transmitting fiber array unit and the output waveguide of the transmitting silicon photonics chip, and the coupling end face of the receiving fiber array unit and the input waveguide of the receiving silicon photonics chip are filled with refractive index matching liquid, which can improve mode field matching and increase coupling efficiency. Attached Figure Description

[0017] Figure 1 A schematic diagram of a silicon photonics chip-based optical engine provided for an embodiment of this utility model; Figure 2 This is a schematic diagram from another angle of an embodiment of the present invention, showing an optical engine based on a silicon photonic chip. Figure 3 A schematic diagram of an optical component for an optical engine based on a silicon photonics chip, provided for an embodiment of this utility model; Figure 4 A schematic diagram of another optical component of an optical engine based on a silicon photonics chip, provided for an embodiment of this utility model; Figure 5 This is a schematic diagram of the packaging of an optical module based on a silicon photonics chip, provided for an embodiment of this utility model.

[0018] In the diagram: 10, optical engine; 20, optical module cover; 30, optical module base; 40, optical module pull ring; 100, PCB board; 110, connector; 120, optical component substrate; 200, optical transmitter assembly; 210, COC; 220, first-stage lens; 230, isolator; 240, second-stage lens; 250, transmitter silicon photonics chip; 260, transmitter fiber array unit; 270, transmitter first substrate; 280, transmitter second substrate; 290, prism; 300, optical receiver assembly; 310, receiver silicon photonics chip; 320, receiver fiber array unit; 330, receiver first substrate; 340, receiver second substrate. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments provided by this utility model without inventive effort are within the scope of protection of this utility model.

[0020] Obviously, the accompanying drawings described below are merely some examples or embodiments of this utility model. Those skilled in the art can apply this utility model to other similar scenarios without any creative effort. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this utility model, any changes to the design, manufacturing, or production methods based on the disclosed technical content are merely conventional technical means and should not be construed as insufficient disclosure of this utility model.

[0021] In this utility model, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this utility model. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this utility model may be combined with other embodiments without conflict.

[0022] Unless otherwise defined, the technical or scientific terms used in this utility model shall have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "a," "an," "a kind," "the," and similar words used in this utility model do not indicate quantity limitation and may indicate singular or plural. The terms "comprising," "including," "having," and any variations thereof used in this utility model are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms "connected," "linked," "coupled," and similar words used in this utility model are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "A plurality" used in this utility model refers to two or more. The "and / or" operator describes the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship. The terms "first," "second," and "third" used in this utility model are merely to distinguish similar objects and do not represent a specific ordering of the objects.

[0023] This invention provides an optical engine and optical module based on silicon photonics chips. It adopts an all-silicon photonics chip optical component packaging scheme, which optimizes the structural layout of the optical component, simplifies the process flow of the optical component, and uses the same optical component substrate for both receiving and emitting components. The consistency of the same process flow is high, making manufacturing more convenient.

[0024] like Figure 1 , Figure 2 and Figure 5 As shown, the optical module based on silicon photonics chip provided in this embodiment of the present invention includes an optical engine 10, an optical module cover 20, an optical module base 30, and an optical module pull ring 40. The optical engine 10 is a core functional component, which is encapsulated and fixed to the optical module base 30 via the optical module cover 20. The optical module pull ring 40 is disposed at the end of the optical module and is used for unlocking / locking the optical module.

[0025] like Figure 1 and Figure 2As shown, the core structure of the optical engine 10 includes a PCB board 100, an optical component substrate 120, an optical emitting component 200, an optical receiving component 300, and a connector 110. The PCB board 100 has a slot, within which the optical component substrate 120 is bonded to accommodate the optical emitting component 200 and the optical receiving component 300. The connector 110 is located at the end of the PCB board 100 and connects to the optical emitting component 200 and the optical receiving component 300 for external transmission of optical signals.

[0026] In some embodiments, the optical emitting component 200 is used to generate and output a modulated optical signal, such as Figure 3 As shown, it includes a photoelectric core (COC) 210, a first-stage lens 220, an isolator 230, a second-stage lens 240, a transmitting silicon photonic chip 250, a transmitting fiber array unit 260, a transmitting first substrate 270, and a transmitting second substrate 280. The transmitting first substrate 270 and the transmitting second substrate 280 are bonded to the optical component substrate 120 to house other components of the optical emitting component 200. The COC 210, the first-stage lens 220, the isolator 230, and the second-stage lens 240 are sequentially mounted on a predetermined optical path track of the transmitting first substrate 270; the transmitting silicon photonic chip 250 is mounted on the transmitting second substrate 280, with its input waveguide aligned with the output direction of the second-stage lens 240.

[0027] In this embodiment, the COC (Chip on Carrier, mainly including a pad and a laser) is used to generate signal light. The first-stage lens 220 (mainly used for collimating the signal light) and the second-stage lens 240 (mainly used for focusing the collimated signal light) are used to collimate and focus the signal light, so that the signal light is coupled into the input waveguide of the transmitting silicon photonic chip 250. The isolator 230 is disposed between the two stages of lenses in the optical path to isolate reflected light. The signal light is emitted from the output waveguide of the transmitting silicon photonic chip 250 and directly coupled to the transmitting fiber array unit 260. A refractive index matching fluid can be added at the end face to improve mode field matching and increase coupling efficiency.

[0028] In this embodiment, the signal light generated by COC 210 is collimated by the first-stage lens 220, focused by the isolator 230 and the second-stage lens 240, and then incident on the input waveguide of the transmitting silicon photonic chip 250. After being modulated by the transmitting silicon photonic chip 250, the signal light is emitted from the output waveguide of the transmitting silicon photonic chip 250 and finally transmitted to the connector 110 through the transmitting fiber array unit 260.

[0029] In other embodiments, the angle at which the signal light in the optical emitting component 200 enters the incident waveguide of the emitting silicon photonic chip 250 can be adjusted according to the structural design. A prism 290 with a refraction angle matching the incident angle of the incident light signal can be placed in front of the incident waveguide of the emitting silicon photonic chip 250; preferably, a deflection prism, such as... Figure 4 As shown, the incident angle of the signal light is adjusted to match the incident angle of the incident waveguide of the silicon photonics chip 250 at the transmitting end.

[0030] In this embodiment, the signal light generated by COC 210 is collimated by the first-stage lens 220, focused by the isolator 230, focused by the second-stage lens 240, and its angle is adjusted by the prism 290 before being incident on the input waveguide of the transmitting silicon photonic chip 250. After being modulated by the transmitting silicon photonic chip 250, the signal light is emitted from the output waveguide of the transmitting silicon photonic chip 250 and finally transmitted to the connector 110 through the transmitting fiber array unit 260.

[0031] It should be noted that the number of channels of COC 210 can be selected as single-channel or multi-channel according to the actual optical port application of the silicon photonics chip. Figure 3 and Figure 4 This is a schematic diagram of a multi-channel parallel optical engine and optical module provided in an embodiment of this utility model.

[0032] In some embodiments, the light receiving component 300 is used to receive external optical signals and convert them into electrical signals, such as... Figure 3 and Figure 4 As shown, it includes a receiving fiber optic array unit 320, a receiving silicon photonic chip 310, a first receiving substrate 330, and a second receiving substrate 340. The first and second receiving substrates 330 and 340 are bonded to the optical component substrate 120. The receiving fiber optic array unit 320 is mounted on the second receiving substrate 340, and its input end is connected to a connector 110. The receiving silicon photonic chip 310 is mounted on the first receiving substrate 330, and its input waveguide is aligned with the output end face of the receiving fiber optic array unit 320. The received signal light is directly coupled from the receiving fiber optic array unit 320 into the input waveguide of the receiving silicon photonic chip 310. A refractive index matching fluid can be added at the end face to improve mode field matching and increase coupling efficiency. The receiving silicon photonic chip 310 can integrate components such as a PD (Power Distribution Detector) and a TIA (Transimpedance Amplifier).

[0033] In this embodiment, the external optical signal is transmitted to the receiving end fiber optic array unit 320 via connector 110, and the optical signal is distributed to the input waveguide of the receiving end silicon photonic chip 310 through the fiber optic array.

[0034] In this invention, the optical component substrate 120 is generally made of metal. The portion of the optical component substrate 120 that houses the light emitting component 200 is bonded to the first emitting substrate 270 and the second emitting substrate 280. The portion of the optical component substrate 120 that houses the light receiving component 300 is bonded to the first receiving substrate 330 and the second receiving substrate 340. Four substrates are mounted on the optical component substrate 120 for mounting various optical components. These substrates are generally made of ceramic and are used to support and elevate the optical components, ensuring consistent optical path and optical axis height, and also to assist in heat dissipation.

[0035] In summary, this utility model provides an optical engine and optical module based on a silicon photonics chip. The optical module includes an optical engine, an optical module cover, an optical module base, and an optical module pull ring. The optical engine includes a PCB board, an optical component substrate, an optical emitting component, an optical receiving component, and a connector. The optical emitting component may include components such as a first transmitting substrate, a second transmitting substrate, a COC (Chip-on-Chip), a first-stage lens, an isolator, a second-stage lens, a transmitting silicon photonics chip, a prism, and a transmitting fiber optic array unit. The optical receiving component may include components such as a first receiving substrate, a second receiving substrate, a receiving fiber optic array unit, and a receiving silicon photonics chip.

[0036] This invention employs a silicon photonics chip-based packaging scheme in both the optical emitting and receiving components, and places the emitting and receiving components on the same optical component substrate, reducing the number of optical components such as COC, lenses, and isolators, optimizing the structural layout of the optical component, and thus effectively simplifying the process flow of mounting and coupling of the optical component; in addition, a prism is mounted at the light-incident waveguide of the silicon photonics chip at the emitting end, which can adapt to different light-incident angles.

[0037] It should be noted that, depending on the implementation needs, the various steps / components described in this utility model can be broken down into more steps / components, or two or more steps / components or parts of the operation of steps / components can be combined into new steps / components to achieve the purpose of this utility model.

[0038] Those skilled in the art will readily understand that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A light engine based on a silicon photonics chip, characterized in that, The light engine includes: PCB board; The optical component substrate is mounted on the PCB board; An optical emitting component is disposed on an optical component substrate. The optical emitting component includes a COC, an emitting silicon photonic chip, and an emitting fiber array unit arranged sequentially along the optical path. The COC is used to generate signal light, which is coupled into the input waveguide of the emitting silicon photonic chip. The emitting fiber array unit is coupled to the output waveguide of the emitting silicon photonic chip. An optical receiving component is disposed on an optical component substrate. The optical receiving component includes a receiving end fiber array unit and a receiving end silicon photonic chip arranged sequentially along the optical path, wherein the receiving end fiber array unit is coupled to the incident waveguide of the receiving end silicon photonic chip. Connectors are used to connect the transmitter fiber array unit and the receiver fiber array unit.

2. The optical engine based on a silicon photonic chip according to claim 1, characterized in that, The optical emitting component also includes a first-stage lens and a second-stage lens, which are sequentially arranged in the optical path between the COC and the emitting silicon photonic chip to collimate and focus the signal light so that the signal light is coupled into the input waveguide of the emitting silicon photonic chip.

3. The optical engine based on a silicon photonic chip according to claim 2, characterized in that, The light emitting assembly also includes an isolator, which is positioned between the first-stage lens and the second-stage lens.

4. The optical engine based on a silicon photonic chip according to claim 3, characterized in that, The optical emitting assembly also includes a first emitting substrate and a second emitting substrate, both of which are disposed on the optical component substrate. The COC, the first-stage lens, the isolator, and the second-stage lens are all mounted on the first emitting substrate, and the emitting silicon photonic chip is mounted on the second emitting substrate.

5. The optical engine based on a silicon photonic chip according to any one of claims 1 to 4, characterized in that, The number of channels in a COC can be single or multiple, and the number of channels is selected and set according to the optical port application of the silicon photonics chip at the transmitter.

6. The optical engine based on a silicon photonic chip according to any one of claims 1 to 4, characterized in that, A prism is placed in front of the input waveguide of the transmitting silicon photonics chip to adjust the incident angle of the signal light so that it matches the incident angle of the input waveguide of the transmitting silicon photonics chip.

7. The optical engine based on a silicon photonic chip according to claim 1, characterized in that, The optical receiving component also includes a first receiving substrate and a second receiving substrate, both of which are disposed on the optical component substrate. The receiving fiber array unit is mounted on the second receiving substrate, and the receiving silicon photonic chip is mounted on the first receiving substrate.

8. The optical engine based on a silicon photonic chip according to claim 1, characterized in that, The coupling end faces of the transmitting fiber array unit and the output waveguide of the transmitting silicon photonic chip, and the coupling end faces of the receiving fiber array unit and the input waveguide of the receiving silicon photonic chip are all filled with refractive index matching liquid.

9. The optical engine based on a silicon photonic chip according to claim 1, characterized in that, The PCB board has slots, and the optical component substrate is bonded to the slots of the PCB board to accommodate the optical emitting component and the optical receiving component.

10. An optical module based on a silicon photonics chip, characterized in that, The optical module includes an optical engine, an optical module base, an optical module cover, and an optical module pull ring, as described in any one of claims 1 to 9; wherein the optical module base and the optical module cover encapsulate the optical engine, and the optical module pull ring is used to unlock / lock the optical module.

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