Optical module assembly and optical module

Abstract

The utility model discloses a kind of optical module assembly and optical module, optical module assembly includes tube shell component, it includes bottom plate, cofferdam, ceramic substrate and cover plate, the bottom of cofferdam is connected with bottom plate, cover plate cover is located on cofferdam, the connecting place of cofferdam and bottom plate is formed with installation port, ceramic substrate is embedded at installation port;The outer edge of ceramic substrate is formed with first solder pad;Pin, it is located at the outside of tube shell component, it includes first line segment, second line segment and third line segment connected in turn, first line segment is connected with first solder pad, third line segment is used to be connected with user mainboard, second line segment is coated with resin material. By coating with resin material on second line segment, resin material belongs to low dielectric constant material between air and ceramic, can reduce the dielectric constant difference between air and ceramic substrate, realize impedance continuity at pin, reduce signal reflection, realize high quality transmission of high-speed signal at pin.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to an optical module component and an optical module. Background Technology

[0002] With the advent of 5G new infrastructure base stations and the era of commercial satellite communications, the demand for higher speeds and greater bandwidth in communication equipment is constantly growing. Optical modules, as key components for data transmission, convert data into optical signals, which are then transmitted through optical fibers, thereby enabling fast and reliable data delivery.

[0003] Existing optical module products transmit signals by soldering pins to the user's motherboard on their outer surface. These pins are located on the outside of the packaged optical module and are exposed to air. During signal transmission, the surrounding dielectric layers change sequentially: ceramic and air, then air again, and finally to the user's motherboard and air. This change in the surrounding dielectric causes signal reflection along the transmission path, affecting the high-speed signal transmission quality of the optical module. Therefore, designing a technology to reduce signal reflection in the transmission path and achieve reliable high-speed signal transmission is the technical problem this invention aims to solve.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0005] To address the problems mentioned in the background art, this application provides an optical module assembly and an optical module, which reduces signal reflection in the transmission path and ensures reliable high-speed signal transmission. To achieve the above-mentioned objective, this utility model employs the following technical solution: In a first aspect of this application, an optical module assembly is provided, comprising: A casing component includes a base plate, a cofferdam, a ceramic substrate, and a cover plate. The bottom of the cofferdam is connected to the base plate, and the cover plate is placed on the cofferdam. An installation opening is formed at the connection between the cofferdam and the base plate. The ceramic substrate is embedded in the installation opening. The base plate, the cofferdam, the ceramic substrate, and the cover plate enclose a sealed installation space. A first solder pad is formed on the outer edge of the ceramic substrate. The pins, located on the outside of the housing component, include a first segment, a second segment, and a third segment connected in sequence. The first segment is connected to the first pad, the third segment is used to connect to the user motherboard, and the second segment is covered with resin material.

[0006] In some embodiments of this application, the resin material includes one or a combination of polyurethane resin, EVA resin, epoxy resin, polyimide resin, liquid crystal polymer and polytetrafluoroethylene.

[0007] In some embodiments of this application, a second pad is formed on the inner edge of the ceramic substrate, the second pad corresponding to the first pad, and a first lead is provided inside the ceramic substrate, the first pad and the second pad being connected through the first lead.

[0008] In some embodiments of this application, the optical module assembly further includes: A printed circuit board is disposed in the mounting space and fixed on the base plate, on which a third pad is formed, the third pad corresponding to the second pad, and the third pad and the second pad are connected by a plurality of second leads.

[0009] In some embodiments of this application, the second pad includes a first sub-pad segment and a second sub-pad segment connected to each other, the second sub-pad segment being closer to the third pad than the first sub-pad segment, and the width of the second sub-pad segment being greater than the width of the first sub-pad segment.

[0010] In some embodiments of this application, the second lead has an arc-shaped structure and bends toward the cover plate.

[0011] In some embodiments of this application, the first pad is located on the lower surface of the ceramic substrate, and the second pad is located on the upper surface of the ceramic substrate.

[0012] In some embodiments of this application, the base plate, the cofferdam, and the cover plate are all made of metal materials.

[0013] In some embodiments of this application, the ceramic substrate comprises a plurality of ceramic sheets pressed and sintered together.

[0014] In a second aspect, the present invention provides an optical module, including an optical module component as described in any one of the embodiments of the first aspect above.

[0015] Compared with the prior art, the advantages and positive effects of this utility model are as follows: The optical module assembly includes a housing component and pins. The housing component includes a base plate, a dam, a ceramic substrate, and a cover plate. A mounting port is formed at the connection between the dam and the base plate. The ceramic substrate is embedded in the mounting port. A first pad is formed on the outer edge of the ceramic substrate. The pins include a first line segment, a second line segment, and a third line segment. The first line segment is connected to the first pad, and the third line segment is connected to the user's motherboard. By coating the second line segment with resin material, which is a low dielectric constant material between air and ceramic, the difference in dielectric constant between air and ceramic substrates can be reduced, impedance continuity at the pins can be achieved, signal reflection can be reduced, and high-speed signal transmission at the pins can be realized.

[0016] Other features and advantages of this utility model will become clearer after reading the detailed embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 One of the structural schematic diagrams of an embodiment of the optical module assembly provided by this utility model; Figure 2 An exploded view of the optical module assembly provided by this utility model; Figure 3 A second schematic diagram of the structure of an embodiment of the optical module assembly provided by this utility model; Figure 4 for Figure 3 Cross-sectional view along direction AA; Figure 5 for Figure 3 Enlarged view of region B in the middle; Figure 6 One of the structural schematic diagrams of the ceramic substrate for the optical module assembly provided by this utility model; Figure 7 The second schematic diagram shows the structure of the ceramic substrate for the optical module assembly provided by this utility model.

[0019] Figure label: 1. Pipe shell component; 11. Base plate; 12. Cofferdam; 13. Ceramic substrate; 131. First pad; 132. Second pad; 1321. First sub-pad segment; 1322. Second sub-pad segment; 14. Cover plate; 15. Mounting port; 2. Pin; 21. First line segment; 22. Second line segment; 23. Third line segment; 24. Resin material; 3. Printed circuit board; 31. Third pad; 32. Second lead. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0023] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0026] As a core component in fiber optic transmission, the optical module's specifications determine the overall transmission performance. The optical module serves as the transmission medium between switches and devices, primarily converting electrical signals into optical signals. Its basic structure consists of two parts: an optical transmitting component and its driving circuit, and an optical receiving component and its receiving circuit.

[0027] Generally, an optical module contains two channels: a transmit channel and a receive channel.

[0028] The structure and working principle of the launch channel are as follows: The optical module's transmission channel consists of an electrical signal input interface, an impedance matching circuit, a laser driver circuit, and a laser assembly. Its working principle is as follows: the electrical signal is input through the transmission channel's electrical interface circuit and impedance matching circuit to achieve electrical signal coupling. Then, it passes through the laser driver circuit in the transmission channel for modulation, completing signal modulation and driving. Finally, the signal is sent to the laser, converting the electrical signal into an optical signal, which is then transmitted through optical fiber.

[0029] The structure and working principle of the receiving channel are as follows: The optical module receiving channel consists of a photodetector assembly (composed of a photodetector diode and a transimpedance amplifier), a limiting amplifier circuit, and an electrical signal output interface circuit.

[0030] Its working principle is that the photodetector diode converts the collected light signal into an electrical signal in a proportional manner. The transimpedance amplifier converts this electrical signal into a voltage signal and amplifies the converted voltage signal to the required amplitude. The limiting amplifier circuit then completes the signal amplification and shaping, improves the signal-to-noise ratio, and reduces the bit error rate. Finally, the signal is transmitted to the electrical interface circuit through the impedance matching circuit to complete the signal output.

[0031] In the first aspect, combining Figures 1 to 7 As shown, this embodiment of the present disclosure provides an optical module assembly, which includes a housing component 1 and pins 2.

[0032] Combination Figure 2 As shown, the casing component 1 includes a base plate 11, a cofferdam 12, a ceramic substrate 13, and a cover plate 14. The cofferdam 12 has a frame-shaped structure with a hollow center. The bottom of the cofferdam 12 is connected to the base plate 11. The cover plate 14 is placed on the cofferdam 12. A first opening groove is formed below the cofferdam 12. A second opening groove is formed on the base plate 11 at a position corresponding to the first opening groove. The first opening groove and the second opening groove are connected to form an installation port 15. That is, the installation port 15 is located at the connection between the cofferdam 12 and the base plate 11. The ceramic substrate 13 is embedded in the installation port 15.

[0033] The base plate 11, the cofferdam 12, the ceramic substrate 13 and the cover plate 14 enclose a sealed installation space; a plurality of first pads 131 are formed on the outer edge of the ceramic substrate 13.

[0034] Pin 2 is located on the outside of housing component 1. Pin 2 includes a first line segment 21, a second line segment 22 and a third line segment 23 connected in sequence. The first line segment 21 is connected to the first pad 131, and the third line segment 23 is used to be soldered to the user motherboard. In order to reduce the difference in dielectric constant between the reference media at pin 2, the second line segment 22 is covered with resin material 24. The dielectric constant of resin material 24 is between that of air and ceramic, and resin material 24 has insulation and good thermal stability, which can ensure electrical insulation between each pin 2.

[0035] Specifically, the first segment 21, the second segment 22, and the third segment 23 are integrally formed structures.

[0036] Specifically, the optical module assembly includes a housing component 1 and pins 2. The housing component 1 includes a base plate 11, a dam 12, a ceramic substrate 13, and a cover plate 14. A mounting port 15 is formed at the connection between the dam 12 and the base plate. The ceramic substrate 13 is embedded in the mounting port 15. A first pad 131 is formed on the outer edge of the ceramic substrate 13. The pins 2 include a first line segment 21, a second line segment 22, and a third line segment 23. The first line segment 21 is connected to the first pad 131, and the third line segment 23 is connected to the user motherboard. By coating the second line segment 22 with resin material 24, which is a low dielectric constant material between air and ceramic, the difference in dielectric constant between air and the ceramic substrate 13 can be reduced, achieving impedance continuity at the pins 2, reducing signal reflection, and realizing high-quality transmission of high-speed signals at the pins 2.

[0037] In some embodiments of this application, the resin material 24 includes one or a combination of polyurethane resin, EVA resin, epoxy resin, polyimide resin, liquid crystal polymer and polytetrafluoroethylene.

[0038] Specifically, the dielectric constant of resin material 24 is typically around 2 to 4, while the dielectric constant of air is close to 1, and the dielectric constant of ceramic is 6 to 10. That is, the dielectric constant of resin material 24 is between that of air and ceramic. Furthermore, resin material 24 is fluid when heated, which allows it to wrap the second line segment 22. At the same time, resin material 24 has low hardness, so it will not deform the pin 2 structure, and it is also insulating, which can ensure the insulation between each pin 2.

[0039] Specifically, by coating the second line segment 22 with resin material 24, the difference in dielectric constant between air and ceramic medium can be reduced, achieving impedance continuity at pin 2, which is beneficial for achieving high-quality transmission of high-speed signals at pin 2.

[0040] For example, S-parameter simulation is performed on whether the second line segment 22 is covered with resin material 24. When there is no dielectric filling between the output pin 2 and the test printed circuit board (it is an air cavity), the highest frequency corresponding to S11: -15dB is 8.6GHz; when there is dielectric filling between the output pin 2 and the test printed circuit board with a dielectric constant of 4, the highest frequency corresponding to S11: -15dB is 18.5GHz.

[0041] S11 is the reflection coefficient, a core parameter measuring the port's reflection characteristics and directly reflecting the system's impedance matching state. When the S11 value is -15dB, higher frequency signals can be transmitted with dielectric filling. Therefore, filling the air segment at pin 2 with low-dielectric material can significantly reduce signal reflection at pin 2 and improve signal integrity.

[0042] In some embodiments of this application, a second pad 132 is formed on the inner edge of the ceramic substrate 13, the second pad 132 corresponds to the first pad 131, and a first lead (not shown in the figure) is provided inside the ceramic substrate 13. The first pad 131 and the second pad 132 are connected by the first lead.

[0043] Specifically, by setting a first lead inside the ceramic substrate 13, one end of the first lead is connected to the second pad 132, and the other end of the first lead is connected to the first pad 131. In this way, the first pad 131, the first lead, and the second pad 132 are connected in sequence, which facilitates the hermetic encapsulation of the optical module, isolates environmental interference such as humidity and dust, and supports the efficient conversion of electrical signals and optical signals.

[0044] Meanwhile, ceramics possess ultra-precision machining capabilities, high wear resistance, high thermal conductivity, and a low coefficient of expansion, resulting in lower loss of optical signals during transmission.

[0045] In some embodiments of this application, combined with Figure 3 and Figure 4 As shown, the optical module assembly also includes a printed circuit board 3.

[0046] The printed circuit board 3 is disposed in the mounting space and fixed on the base plate 11. A third pad 31 is formed on the printed circuit board 3. The third pad 31 corresponds to the second pad 132. The third pad 31 and the second pad 132 are connected by multiple second leads 32.

[0047] Specifically, the ceramic substrate 13 and the printed circuit board 3 are relatively fixed in position. A third pad 31 is provided on the printed circuit board 3, and the third pad 31 corresponds to the position of the second pad 132. The third pad 31 and the second pad 132 are connected by multiple second leads 32. By increasing the number of second leads 32, the equivalent inductance of multiple second leads 32 is greatly reduced, the interconnection electromagnetic characteristics are significantly improved, and the transmission performance of multiple second leads 32 is better than that of a single lead.

[0048] For example, in combination Figure 5 Due to the limited space for gold bonding wires, each third pad 31 and the corresponding second pad 132 are connected by two second leads 32.

[0049] In some embodiments of this application, the second pad 132 includes a first sub-pad segment 1321 and a second sub-pad segment 1322 connected to each other. The second sub-pad segment 1322 is closer to the third pad 31 than the first sub-pad segment 1321, and the width of the second sub-pad segment 1322 is greater than the width of the first sub-pad segment 1321.

[0050] Specifically, by setting the width of the second sub-pad segment 1322 to be greater than the width of the first sub-pad segment 1321, the inductive effect brought by the second lead 32 can be offset, which is beneficial to improving the transmission performance to a certain extent.

[0051] For example, the second pad 132 has a wing-shaped structure or a T-shaped structure.

[0052] In some embodiments of this application, the second lead 32 has an arc-shaped structure and bends toward the cover plate 14.

[0053] Specifically, by setting the second lead 32 to an arc-shaped structure, an elastic connection can be provided between the second pad 132 and the third pad 31, which acts as a buffer to prevent the second lead 32 from breaking.

[0054] For example, the length of the second lead 32 is 0.5~0.8mm and the arch height is 0.15~0.19mm.

[0055] In some embodiments of this application, combined with Figure 6 and Figure 7 The first pad 131 is located on the lower surface of the ceramic substrate 13, and the second pad 132 is located on the upper surface of the ceramic substrate 13.

[0056] Specifically, by setting the first pad 131 on the lower surface of the ceramic substrate 13 and the second pad 132 on the upper surface of the ceramic substrate 13, it is convenient to connect the first pad 131 to the pin 2 and to connect the second pad 132 to the third pad 31.

[0057] In some embodiments of this application, the base plate 11, the cofferdam 12, and the cover plate 14 are all made of metal materials.

[0058] Specifically, the base plate 11, the cofferdam 12, and the cover plate 14 are all made of metal materials, which are inexpensive, have mature and convenient processing technology, high mechanical strength, and can protect the internal optical and electronic components from external influences.

[0059] In some embodiments of this application, the ceramic substrate 13 includes a plurality of ceramic sheets that are pressed and sintered together.

[0060] Specifically, ceramic materials have good stability and resistance to high and low temperatures, which can meet the requirements for high-quality and reliable signal transmission in extreme high and low temperature environments, vacuum environments, etc.

[0061] Specifically, a signal hole is provided in the ceramic layer between the first pad 131 and the second pad 132. The signal hole includes a first signal hole and a second signal hole. The first signal hole is located directly above the first pad 131, and the second signal hole is located directly below the second pad 132. One end of the first lead is soldered to the first pad 131, and the other end of the first lead passes through the first signal hole and through the ceramic layer, and finally passes through the second signal hole and is soldered to the second pad 132.

[0062] Specifically, in the embodiments disclosed herein, the connection between the leads and the pads is achieved using a gold wire bonding process.

[0063] In a second aspect, embodiments of this disclosure provide an optical module comprising an optical module component as described in any of the embodiments of the first aspect above. Since the optical module component comprising any of the embodiments of the first aspect above possesses all of its beneficial effects, further details are omitted here.

[0064] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0065] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An optical module assembly, characterized in that, include: A casing component includes a base plate, a cofferdam, a ceramic substrate, and a cover plate. The bottom of the cofferdam is connected to the base plate, and the cover plate is placed on the cofferdam. An installation opening is formed at the connection between the cofferdam and the base plate. The ceramic substrate is embedded in the installation opening. The base plate, the cofferdam, the ceramic substrate, and the cover plate enclose a sealed installation space. A first solder pad is formed on the outer edge of the ceramic substrate. The pins, located on the outside of the housing component, include a first segment, a second segment, and a third segment connected in sequence. The first segment is connected to the first pad, the third segment is used to connect to the user motherboard, and the second segment is covered with resin material.

2. The optical module assembly according to claim 1, characterized in that, The resin material includes one of polyurethane resin, EVA resin, epoxy resin, polyimide resin, liquid crystal polymer, and polytetrafluoroethylene.

3. The optical module assembly according to claim 1, characterized in that, A second pad is formed on the inner edge of the ceramic substrate, the second pad corresponding to the first pad, and a first lead is provided inside the ceramic substrate, the first pad and the second pad being connected through the first lead.

4. The optical module assembly according to claim 3, characterized in that, The optical module assembly also includes: A printed circuit board is disposed in the mounting space and fixed on the base plate, on which a third pad is formed, the third pad corresponding to the second pad, and the third pad and the second pad are connected by a plurality of second leads.

5. The optical module assembly according to claim 4, characterized in that, The second pad includes a first sub-pad segment and a second sub-pad segment connected to each other. The second sub-pad segment is closer to the third pad than the first sub-pad segment, and the width of the second sub-pad segment is greater than the width of the first sub-pad segment.

6. The optical module assembly according to claim 4, characterized in that, The second lead has an arc-shaped structure and bends toward the cover plate.

7. The optical module assembly according to claim 3, characterized in that, The first pad is located on the lower surface of the ceramic substrate, and the second pad is located on the upper surface of the ceramic substrate.

8. The optical module assembly according to claim 1, characterized in that, The base plate, the cofferdam, and the cover plate are all made of metal materials.

9. The optical module assembly according to claim 1, characterized in that, The ceramic substrate comprises multiple ceramic sheets that are pressed and sintered together.

10. An optical module, characterized in that, Includes the optical module assembly as described in any one of claims 1 to 9 above.

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