Optical device

Abstract

The application provides an optical device. The optical device comprises a shell, a transmitting assembly and a receiving assembly; the transmitting assembly comprises a plurality of transmitting chips and a light collecting part, each transmitting chip is used for emitting a first light beam of different wavelength, the light collecting part is used for receiving the first light beams of different wavelength, making the first light beams into parallel light state, and then combining the plurality of first light beams to form a transmitting light; the receiving assembly comprises a plurality of receiving chips and a light splitting part, the light splitting part is used for receiving the incident light, the light splitting part is used for separating the incident light into a plurality of second light beams, and then making the second light beams into parallel light state, and each receiving chip is used for receiving one second light beam in parallel light state. The application integrates the transmitting assembly and the receiving assembly in one shell, optimizes the structure of the optical device, reduces the number of parts that need to be assembled, facilitates the user to assemble, reduces the difficulty of assembly, reduces the overall size of the optical device, and can provide more available space for other parts.

Description

Technical Field

[0001] This application belongs to the field of optical communication technology, specifically involving optical devices. Background Technology

[0002] In the field of optical communication, multiple optical transmitters and multiple optical receivers are usually assembled on an integrated component. Then, multiple filters in the integrated component are used to combine multiple beams into one emitted beam and separate one incident beam into multiple beams. This results in high assembly difficulty, large beam power loss, the need for multiple components, and high manufacturing cost. Utility Model Content

[0003] In view of this, this application provides an optical device, the optical device comprising: The shell has a receiving space; A transmitting assembly, disposed within the receiving space, includes multiple transmitting chips and a light collecting unit. Each transmitting chip emits a first beam of different wavelengths, and the light collecting unit receives the first beams of different wavelengths, parallelizes them, and then combines the multiple first beams to form emitted light. A receiving component is disposed within the receiving space. The receiving component includes a plurality of receiving chips and a beam splitter. The beam splitter is used to receive incident light. The incident light is formed by combining a plurality of second beams of different wavelengths. The beam splitter is used to separate the incident light into the plurality of second beams and then make the second beams parallel. Each receiving chip is used to receive one second beam that is parallel.

[0004] The optical device provided in this application optimizes the structure of the optical device by integrating the transmitting and receiving components into a single housing, reduces the number of parts that need to be assembled, facilitates user assembly, lowers the assembly difficulty, and reduces the overall size of the optical device, thus providing more usable space for other components.

[0005] Furthermore, the transmitting and receiving components of this application utilize a light-collecting section to combine multiple beams into emitted light and a light-splitting section to divide an incident light into multiple beams, eliminating the need for at least one filter and lens in related technologies, reducing manufacturing costs, reducing beam power loss, and improving the transmission performance of optical devices.

[0006] The light-collecting part includes a first photon part and a second photon part. The first photon part is closer to the emitting chip than the second photon part. The first photon part is provided with at least one first lens. The first lens is used to receive the first light beam emitted by the emitting chip and make the first light beam parallel. The second photon part is used to combine multiple first light beams that are parallel to form the emitted light.

[0007] The second photonic unit includes a first sub-incident light unit, a first sub-reflective light unit, and a second sub-incident light unit. The first sub-incident light unit is disposed between one of the emitting chips and the first sub-reflective light unit, and the second sub-incident light unit corresponds to another emitting chip. The plurality of first beams include first sub-beams and second sub-beams with different wavelengths. In this process, a first sub-beam in a parallel light state is incident on the first sub-incident light part, which receives the first sub-beam and causes it to be incident on the first sub-reflecting part. The first sub-reflecting part then reflects the first sub-beam to the second sub-incident light part. A second sub-beam in a parallel light state is incident on the second sub-incident light part, which receives the second sub-beam, thereby causing the second sub-beam to merge with the first sub-beam.

[0008] The beam splitting section includes a first beam splitter and a second beam splitter. The first beam splitter is closer to the receiving chip than the second beam splitter. The first beam splitter is provided with at least one second lens. The second lens is used to receive the second beam emitted by the second beam splitter and make the second beam parallel. The second beam splitter is used to split the incident light into the plurality of second beams.

[0009] The second beam splitter includes a first sub-emitting beam, a second sub-reflecting beam, and a second sub-emitting beam. The first sub-emitting beam corresponds to one of the receiving chips, and the second sub-emitting beam is disposed between another receiving chip and the second sub-reflecting beam. The plurality of second beams include a third sub-beam and a fourth sub-beam with different wavelengths. The incident light is directed to the first sub-emitting part, which transmits the third sub-beam and reflects the fourth sub-beam to the second sub-reflecting part, thereby separating the third sub-beam from the fourth sub-beam; the second sub-reflecting part reflects the fourth sub-beam to the second sub-emitting part, which transmits the fourth sub-beam.

[0010] The beam splitter further includes a beam focusing section, which is located between the first beam splitter and the receiving chip. The beam focusing section is used to receive and focus a second beam of light in a parallel light state, and also to direct the focused second beam of light onto the receiving chip.

[0011] The housing also has a port communicating with the containment space, and the optical device further includes an optical fiber inserted into the port. The optical fiber is used to receive the emitted light emitted by the emitting component and to emit the incident light.

[0012] The optical device further includes a first filter and a second filter. The first filter is disposed between the optical fiber and the light collecting part, and the second filter corresponds to the beam splitting part. The first filter is used to transmit the emitted light and also to reflect the incident light emitted from the optical fiber to the second filter. The second filter is used to reflect the incident light to the beam splitting part.

[0013] The housing also includes a connecting platform, part of which is located outside the receiving space and the other part is located inside the receiving space. The connecting platform located inside the receiving space has a first protrusion and a second protrusion. The height of the first protrusion matches the height of the plurality of transmitting chips, and the plurality of transmitting chips are connected to the first protrusion through a first conductive line. The height of the second protrusion matches the height of the plurality of receiving chips, and the plurality of receiving chips are connected to the second protrusion through a second conductive line.

[0014] The height of the first boss is greater than the height of the second boss. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0016] Figure 1 This is a schematic diagram of the structure of an optical device provided in one embodiment of this application.

[0017] Figure 2 This is a schematic diagram of the optical device provided in one embodiment of this application from another perspective.

[0018] Figure 3 This is a schematic diagram of the structure of the transmitting component and the receiving component provided in one embodiment of this application.

[0019] Figure 4 This is a schematic diagram of the optical path of the transmitting component provided in one embodiment of this application.

[0020] Figure 5 This is a schematic diagram of the optical path of a receiving component provided in one embodiment of this application.

[0021] Figure 6 A partial optical path diagram of a receiving component provided in one embodiment of this application.

[0022] Figure 7 This is a schematic diagram of the optical path of an optical device provided in one embodiment of this application.

[0023] Figure 8 This is a schematic diagram of the structure of the connection platform provided in one embodiment of this application.

[0024] Figure 9 This is a partial structural schematic diagram of an optical device provided in one embodiment of this application.

[0025] Labeling: Optical device 1, housing 10, receiving space 11, port 12, connecting platform 13, first boss 131, second boss 132, third boss 133, emitting assembly 20, emitting chip 21, light collecting part 22, first photon collecting part 221, first lens 2211, second photon collecting part 222, first sub-light input part 2221, first sub-reflector part 2222, second sub-light input part 2223, receiving assembly 30, receiving chip 31, beam splitter 32, first beam splitter part 321, second lens 3211, second beam splitter part 322, first sub-light output part 3221, second sub-reflector part 3222, second sub-light output part 3223, focusing part 323, optical fiber 40, first filter 51, second filter 52. Detailed Implementation

[0026] Before introducing the technical solution of this application, let's go over the technical issues in related technologies in detail.

[0027] 50G PON is the next-generation PON standard after 10G PON. It supports 50Gbps uplink and downlink speeds per wavelength, with a bandwidth five times that of 10GPON. It can coexist with 10G PON and is compatible with existing network infrastructure. It's important to note that 50G PON is a fiber optic communication-based technology; the "50G" in its name indicates its superior data transmission speed of 50Gbps (Gigabits per second), representing the next generation of PON (Passive Optical Network) technology.

[0028] A 50G COMBO PON OLT optical device typically consists of three transmitters and three receivers, sharing a single optical fiber for transmitting and receiving optical signals. The transmitter can also be understood as an optical chip. The three transmitters, three receivers, and one optical fiber are assembled onto a single integrated unit, and filters and lenses on this unit are used to modify the propagation paths of different wavelengths of light.

[0029] However, optical devices using the aforementioned technologies require assembling multiple components onto an integrated unit, resulting in high assembly difficulty, significant beam power loss, and high manufacturing costs.

[0030] In view of this, to solve the above problems, please refer to the following: Figures 1-5This embodiment provides an optical device 1, which includes a housing 10, an emitting component 20, and a receiving component 30. The housing 10 has a receiving space 11. The emitting component 20 is disposed within the receiving space 11 and includes a plurality of emitting chips 21 and a light-collecting part 22. Each emitting chip 21 is used to emit a first light beam of a different wavelength, and the light-collecting part 22 is used to receive the first light beams of different wavelengths and make the first light beams parallel, and then combine the plurality of first light beams to form emitted light. The receiving component 30 is disposed within the receiving space 11 and includes a plurality of receiving chips 31 and a beam splitter 32. The beam splitter 32 is used to receive incident light, which is formed by combining a plurality of second light beams of different wavelengths. The beam splitter 32 is used to separate the incident light into the plurality of second light beams and then make the second light beams parallel, and each receiving chip 31 is used to receive one second light beam that is parallel.

[0031] The optical device 1 provided in this embodiment can be used in optical communication systems including optical network terminals, optical network units, or optical distribution networks.

[0032] The housing 10 is used to fix and protect the components of the optical device 1. The housing 10 has a receiving space 11, within which both the transmitting assembly 20 and the receiving assembly 30 are housed. The housing 10 also has a port 12 and a connecting platform 13. The port 12 is used to accommodate the optical fiber 40, and the connecting platform 13 is used to achieve electrical connection with other devices. The connection method between the transmitting assembly 20 and the housing 10 can be adhesive bonding, snap-fit ​​connection, threaded connection, etc., and this embodiment is not limited in this regard. The connection method between the receiving assembly 30 and the housing 10 can be adhesive bonding, snap-fit ​​connection, threaded connection, etc., and this embodiment is not limited in this regard.

[0033] The emitting component 20 is used to emit emitted light, which is formed by combining multiple first beams of different wavelengths. The emitting component 20 includes multiple emitting chips 21 and a light-collecting part 22. The emitting chips 21 are used to emit the first beam. The number of emitting chips 21 can be at least two, specifically, for example, two, three, four, five, or six, etc. Optionally, the emitting chip 21 is a laser emitter, and further optionally, the emitting chip 21 can be an infrared emitter or an ultraviolet emitter, etc. Each emitting chip 21 is capable of emitting a first beam of different wavelengths. Optionally, multiple emitting chips 21 are arranged side by side.

[0034] The light-collecting section 22 is used to receive and reflect, and / or receive and transmit, and / or receive and filter the first light beam emitted by the emitting chip 21, so as to change the propagation direction of the first light beam and combine multiple first light beams to form emitted light. The optical path from the emitting chip 21 through the light-collecting section 22 is as follows: Figure 4As shown in L1. The emitted light can also be directed to a component that receives the light source signal, such as optical fiber 40, a passive network, an active network, etc. Optionally, the light-collecting part 22 includes multiple glass slides that can reflect and / or transmit light. The number of glass slides is 2-10. The specific structure of the light-collecting part 22 will be described in detail below.

[0035] The receiving component 30 is used to receive a second light beam, which is formed by separating incident light and combining multiple second light beams of different wavelengths. The receiving component 30 includes multiple receiving chips 31 and a beam splitter 32. The receiving chips 31 are used to receive the second light beam. The number of receiving chips 31 can be at least two, specifically, for example, two, three, four, five, or six. Optionally, the number of transmitting chips 21 is equal to the number of receiving chips 31, or the number of transmitting chips 21 is not equal to the number of receiving chips 31. The receiving chips 31 are capable of receiving light and converting it into current. Each receiving chip 31 is capable of receiving a second light beam of different wavelengths. Optionally, multiple receiving chips 31 are arranged side-by-side. The optical path from the beam splitter 32 through the receiving chips 31 is as follows... Figure 5 As shown in L2.

[0036] The optical device 1 provided in this embodiment optimizes the structure of the optical device 1 by integrating the transmitting component 20 and the receiving component 30 into a housing 10, reducing the number of parts that need to be assembled, making it easier for users to assemble, reducing the assembly difficulty, and shrinking the overall size of the optical device 1, which can provide more usable space for other parts.

[0037] Furthermore, in this embodiment, the transmitting component 20 and the receiving component 30 combine multiple beams to form emitted light using the light collecting part 22 and split one incident light into multiple beams using the light splitting part 32, thus eliminating at least one filter and lens in the related art, reducing manufacturing costs, reducing beam power loss, and improving the transmission performance of the optical device 1.

[0038] Please refer to this as well. Figures 1-4 In one embodiment, the light-collecting part 22 includes a first light-collecting part 221 and a second light-collecting part 222. The first light-collecting part 221 is closer to the emitting chip 21 than the second light-collecting part 222. The first light-collecting part 221 is provided with at least one first lens 2211. The first lens 2211 is used to receive the first light beam emitted by the emitting chip 21 and make the first light beam parallel. The second light-collecting part 222 is used to combine multiple first light beams that are parallel to form the emitted light.

[0039] The first photon collector 221 is used to make the first beam parallel, so as to provide a basis for the subsequent beam combining of the first beam by the second photon collector 222, and reduce the difficulty of combining multiple first beams into emitted light. The first photon collector 221 is provided with at least one first lens 2211, which is disposed corresponding to the emitting chip 21. Optionally, the number of first lenses 2211 is equal to the number of emitting chips 21. Optionally, multiple first lenses 2211 are arranged side by side. Optionally, the arrangement direction of the multiple first lenses 2211 is the same as the arrangement direction of the emitting chips 21.

[0040] The second photonics unit 222 is located on the side of the first photonics unit 221 away from the emitting chip 21. Specifically, the emitting chip 21 emits a first beam of light, which becomes parallel after passing through the first photonics unit 221. Then, the parallel first beam of light is combined with the second photonics unit 222 to form emitted light.

[0041] In summary, this embodiment optimizes the structure by setting up a first photonic unit 221 and a second photonic unit 222, omitting at least one filter and lens sheet from related technologies, reducing manufacturing costs, reducing beam power loss, and improving the transmission performance of the optical device 1.

[0042] Please refer to this as well. Figures 1-4 In one embodiment, the second photon collection unit 222 includes a first sub-light-incident unit 2221, a first sub-reflector unit 2222, and a second sub-light-incident unit 2223. The first sub-light-incident unit 2221 is disposed between one of the emitting chips 21 and the first sub-reflector unit 2222, and the second sub-light-incident unit 2223 corresponds to another emitting chip 21. The plurality of first beams include first sub-beams and second sub-beams with different wavelengths.

[0043] In this process, a first sub-beam in a parallel light state is incident on the first sub-incident light section 2221, which receives the first sub-beam and directs it to the first sub-reflector section 2222. The first sub-reflector section 2222 then reflects the first sub-beam to the second sub-incident light section 2223. A second sub-beam in a parallel light state is incident on the second sub-incident light section 2223, which receives the second sub-beam, thereby combining the second sub-beam with the first sub-beam.

[0044] The first sub-light-entry section 2221 is used to receive and transmit a first sub-beam, and also to direct the first sub-beam to a first sub-reflector section 2222. The first sub-reflector section 2222 is used to reflect the first sub-beam to a second sub-light-entry section 2223. The second sub-light-entry section 2223 is used to receive and transmit a second sub-beam, and also to receive and reflect the first sub-beam. Furthermore, the second sub-light-entry section 2223 is used to combine the first and second sub-beams to form emitted light.

[0045] Optionally, the first sub-light-incident section 2221 and the first sub-reflector section 2222 are arranged parallel to each other, and the second sub-light-incident section 2223 and the first sub-reflector section 2222 are arranged parallel to each other. Optionally, the plurality of emitting chips 21 include a first emitting sub-chip for emitting a first sub-beam and a second emitting sub-chip for emitting a second sub-beam. A first lens 2211 corresponds to the first emitting sub-chip, and a second emitting sub-chip corresponds to the second emitting sub-chip. One first lens 2211 is located between the first emitting sub-chip and the first sub-light-incident section 2221, and another first lens 2211 is located between the second emitting sub-chip and the second sub-light-incident section 2223. The first sub-reflector section 2222 is located on the side of the first sub-light-incident section 2221 away from the first lens 2211.

[0046] It should be noted that in this embodiment, the first sub-incident beam 2221, the first sub-reflector 2222, and the second sub-incident beam 2223 are used to combine two sub-beams to form emitted light. Similarly, by further increasing the number of sub-incident beams and sub-reflectors, more sub-beams can be combined to form emitted light.

[0047] Optionally, the light-collecting part 22 further includes a first fixing member, which includes a first inner sidewall and a second inner sidewall disposed opposite to each other. The first inner sidewall is closer to the first light-collecting sub-part 221 than the second inner sidewall. Both the first inner sidewall and the second inner sidewall are inclined. The first sub-light-incident part 2221 and the second sub-light-incident part 2223 are fixed to the first inner sidewall, and the first sub-reflective part 2222 is fixed to the second inner sidewall.

[0048] In summary, this embodiment optimizes the structure, reduces the overall size of the optical device 1, simplifies the optical path, reduces beam power loss, and improves the transmission performance of the optical device 1 by setting a second photon unit 222 composed of a first sub-light-incident unit 2221, a first sub-reflector unit 2222, and a second sub-light-incident unit 2223.

[0049] Please refer to this as well. Figures 1-5In one embodiment, the beam splitter 32 includes a first beam splitter 321 and a second beam splitter 322. The first beam splitter 321 is closer to the receiving chip 31 than the second beam splitter 322. The first beam splitter 321 is provided with at least one second lens 3211. The second lens 3211 is used to receive the second beam emitted from the second beam splitter 322 and make the second beam parallel. The second beam splitter 322 is used to split the incident light into the plurality of second beams.

[0050] The first photonics splitter 321 is used to parallelize the second beam, providing a basis for the subsequent receiving chip 31 to receive more of the second beam and reducing beam power loss. The first photonics splitter 321 includes at least one second lens 3211, which is positioned directly opposite the receiving chip 31. Optionally, the number of second lenses 3211 is equal to the number of receiving chips 31. Optionally, multiple second lenses 3211 are arranged side-by-side. Optionally, the arrangement direction of the multiple second lenses 3211 is the same as the arrangement direction of the receiving chips 31.

[0051] The second photonics splitter 322 is located on the side of the first photonics splitter 321 away from the receiving chip 31. Specifically, the incident light is split into multiple second beams after passing through the second photonics splitter 322. The second beams are paralleled by the first photonics splitter 321 and then the paralleled second beams are directed to the receiving chip 31.

[0052] In summary, this embodiment optimizes the structure by setting up a first photonics unit 321 and a second photonics unit 322, omitting at least one filter and lens sheet from related technologies, reducing manufacturing costs, reducing beam power loss, and improving the transmission performance of the optical device 1.

[0053] Please refer to this as well. Figures 1-5 In one embodiment, the second photonics splitter 322 includes a first sub-light emitting section 3221, a second sub-reflector 3222, and a second sub-light emitting section 3223. The first sub-light emitting section 3221 corresponds to one of the receiving chips 31, and the second sub-light emitting section 3223 is disposed between another receiving chip 31 and the second sub-reflector 3222. The plurality of second beams include a third sub-beam and a fourth sub-beam with different wavelengths.

[0054] The incident light is directed to the first sub-light emitting section 3221, which transmits the third sub-beam and reflects the fourth sub-beam to the second sub-reflecting section 3222, thereby separating the third sub-beam from the fourth sub-beam. The second sub-reflecting section 3222 reflects the fourth sub-beam to the second sub-light emitting section 3223, which transmits the fourth sub-beam.

[0055] The first sub-beam emitter 3221 is used to receive and transmit the third sub-beam. The first sub-beam emitter 3221 is also used to direct the fourth sub-beam to the second sub-reflector 3222, thereby separating the third sub-beam from the fourth sub-beam. The second sub-reflector 3222 is used to reflect the fourth sub-beam to the second sub-beam emitter 3223. The second sub-beam emitter 3223 is used to receive and transmit the fourth sub-beam.

[0056] Optionally, the first sub-light-emitting section 3221 and the second sub-reflecting section 3222 are arranged in parallel, and the second sub-light-emitting section 3223 and the second sub-reflecting section 3222 are arranged in parallel. Optionally, the plurality of receiving chips 31 include a first receiving sub-chip for receiving a third sub-beam and a second receiving sub-chip for receiving a fourth sub-beam. The second lens 3211 corresponds to the first receiving sub-chip, and the second lens 3211 corresponds to the second receiving chip. One second lens 3211 is located between the first receiving sub-chip and the first sub-light-emitting section 3221, and the other second lens 3211 is located between the second receiving chip and the second sub-light-emitting section 3223. The second sub-reflecting section 3222 is located on the side of the second sub-light-emitting section 3223 away from the second lens 3211.

[0057] It should be noted that this embodiment utilizes the first sub-light emitting section 3221, the second sub-reflecting section 3222, and the second sub-light emitting section 3223 to separate the incident light into two second beams. Similarly, by further increasing the number of sub-light emitting sections and sub-reflecting sections, it is possible to separate the incident light into more second beams.

[0058] Optionally, the beam splitter 32 further includes a second fixing member, which includes a third inner sidewall and a fourth inner sidewall disposed opposite to each other. The third inner sidewall is closer to the first beam splitter 321 than the fourth inner sidewall. Both the third inner sidewall and the fourth inner sidewall are inclined. The first sub-light emitting part 3221 and the second sub-light emitting part 3223 are fixed to the third inner sidewall, and the second sub-reflecting part 3222 is fixed to the fourth inner sidewall.

[0059] In summary, this embodiment, by setting a second beam splitter 322 composed of a first sub-light-emitting section 3221, a second sub-reflecting section 3222, and a second sub-light-emitting section 3223, divides an incident light into a third sub-beam and a fourth sub-beam, optimizes the structure, reduces the overall size of the optical device 1, simplifies the optical path, reduces beam power loss, and improves the transmission performance of the optical device 1.

[0060] Please refer to this as well. Figures 1-6 In one embodiment, the beam splitter 32 further includes a beam focusing section 323, which is disposed between the first beam splitter 321 and the receiving chip 31. The beam focusing section 323 is used to receive and focus a second beam in a parallel light state, and also to direct the focused second beam onto the receiving chip 31.

[0061] The focusing section 323 is used to concentrate dispersed light rays. For example, the focusing section 323 can be a convex lens, a concave lens, etc. The focusing section 323 is disposed corresponding to the first photon splitter section 321 and corresponding to the receiving chip 31. Optionally, the focusing section 323 is tilted; more preferably, the tilt angle of the focusing section 323 is 45°. The optical path of the second beam in the focusing section 323 is as follows... Figure 6 As shown in L2.

[0062] In summary, this embodiment improves the intensity of the light source signal, reduces beam power loss, and enhances the transmission performance of the optical device 1 by providing a focusing part 323 to concentrate the emitted light.

[0063] Please refer to this as well. Figures 1-7 In one embodiment, the housing 10 further has a port 12 communicating with the receiving space 11, and the optical device 1 further includes an optical fiber 40 inserted into the port 12. The optical fiber 40 is used to receive the emitted light emitted by the transmitting component 20 and to emit the incident light.

[0064] Part of the optical fiber 40 is disposed within port 12. The connection method between the optical fiber 40 and the housing 10 can be adhesive bonding, snap-fit, etc., and this embodiment is not limited in this regard. After the housing 10 and the optical fiber 40 are coupled, the optical device 1 can transmit light source signals with other devices to realize light source signal exchange. Optionally, the optical fiber 40 is disposed corresponding to the light collecting part 22. Optionally, the optical fiber 40 is disposed corresponding to the light splitting part 32.

[0065] Specifically, the transmitting chip 21 emits multiple first beams, which are then collected by the light collecting unit 22 to form emitted light. The emitted light is then directed to the optical fiber 40, which receives the emitted light. Furthermore, the optical fiber 40 emits incident light, which is then received by the beam splitter 32 and divided into multiple second beams. The receiving chip 31 receives the second beams.

[0066] In summary, this embodiment achieves the reception of transmitted optical signals and the transmission of incident optical signals by setting optical fiber 40, thereby simplifying the optical communication process and greatly reducing assembly and material costs.

[0067] Please refer to this as well. Figures 1-7 In one embodiment, the optical device 1 further includes a first filter 51 and a second filter 52. The first filter 51 is disposed between the optical fiber 40 and the light collecting part 22, and the second filter 52 corresponds to the beam splitting part 32. The first filter 51 is used to transmit the emitted light and also to reflect the incident light emitted from the optical fiber 40 to the second filter 52. The second filter 52 is used to reflect the incident light to the beam splitting part 32.

[0068] The first filter 51 is used to receive and transmit emitted light, and the first filter is also used to receive and reflect incident light to the second filter. The second filter is used to receive and reflect incident light to the beam splitter 32 of the receiving assembly 30. Optionally, the first filter 51 and the second filter 52 are inclined; further optionally, the first filter 51 and the second filter 52 have the same inclination angle; even more optionally, the inclination angle between the first filter 51 and the second filter 52 is 22.5°.

[0069] Specifically, the emitted light passes through the first filter and is incident on the optical fiber 40, where the optical fiber 40 receives the emitted light. Furthermore, the incident light is emitted from the optical fiber 40, and after being reflected by the first filter and the second filter in sequence, the incident light is incident on the beam splitter 32.

[0070] In summary, this embodiment achieves the coordination between the optical fiber 40 and the transmitting component 20 and the receiving component 30 by setting the first filter and the second filter, optimizes the structure, reduces the overall size of the optical device 1, simplifies the optical path, reduces beam power loss, and improves the transmission performance of the optical device 1.

[0071] Please refer to this as well. Figures 1-9 In one embodiment, the housing 10 is further provided with a connecting platform 13. Part of the connecting platform 13 is located outside the receiving space 11, and another part is located inside the receiving space 11. The connecting platform 13 located inside the receiving space 11 is provided with a first protrusion 131 and a second protrusion 132. The height of the first protrusion 131 matches the height of the plurality of transmitting chips 21. The plurality of transmitting chips 21 are connected to the first protrusion 131 through a first conductive line. The height of the second protrusion 132 matches the height of the plurality of receiving chips 31. The plurality of receiving chips 31 are connected to the second protrusion 132 through a second conductive line.

[0072] The connecting platform 13 is conductive, and its material is conductive; in other words, the connecting platform 13 is a conductive component. For example, the material of the connecting platform 13 is conductive ceramic. The connecting platform 13 penetrates the receiving space 11. The connecting platform 13 located outside the receiving space 11 is equipped with a circuit board for connecting other electrical components; the connecting platform 13 located inside the receiving space 11 is used to connect the transmitting assembly 20, the receiving assembly 30, and the detection assembly, etc. The detection assembly includes a temperature detection component, a beam detection component, etc.

[0073] In this configuration, the transmitting chip 21 of the transmitting assembly 20 is directly electrically connected to the connecting station 13 via a first conductive line; or, the transmitting chip 21 of the transmitting assembly 20 is indirectly electrically connected to the connecting station 13 via the first conductive line and other conductive devices. The receiving chip 31 of the receiving assembly 30 is directly electrically connected to the connecting station 13 via a second conductive line; or, the receiving chip 31 of the receiving assembly 30 is indirectly electrically connected to the connecting station 13 via the second conductive line and other conductive devices. The detection assembly is directly electrically connected to the connecting station 13 via a third conductive line; or, the detection assembly is indirectly electrically connected to the connecting station 13 via other conductive devices.

[0074] In related technologies, since the transmitting component 20 and the receiving component 30 are simultaneously arranged inside the housing 10, there is a height difference between the connecting platform 13 and the transmitting chip 21 and the receiving chip 31. This makes it easy for the conductive wires to be too long and have many bends when setting them, which can lead to the conductive wires being prone to breakage and affecting the use of the optical device 1.

[0075] Therefore, this embodiment provides a first protrusion 131 and a second protrusion 132 on the connecting platform 13, so that the first protrusion 131 matches the height of the transmitting chip 21 and the second protrusion 132 matches the height of the receiving chip 31, thereby shortening the length of the first conductive line and the second conductive line, reducing the probability of damage to the first conductive line and the second conductive line, and improving the reliability of the optical device 1.

[0076] In one embodiment, the height of the first protrusion 131 is greater than the height of the second protrusion 132. Optionally, the height of the first protrusion 131 is equal to the height of the transmitting chip 21, and the height of the second protrusion 132 is equal to the height of the receiving chip 31.

[0077] Optionally, the optical device 1 further includes a detection component disposed within the receiving space 11. The connecting platform 13 located within the receiving space 11 is also provided with a third protrusion 133, the height of which matches the height of the detection component. Further optionally, the height of the third protrusion 133 is greater than the height of the first protrusion 131.

[0078] In summary, this embodiment provides a first protrusion 131 and a second protrusion 132 on the connecting platform 13, so that the height of the connecting platform 13 matches the transmitting chip 21 and the receiving chip 31, thereby shortening the length of the first conductive line and the second conductive line, reducing the probability of damage to the first conductive line and the second conductive line, and improving the reliability of the optical device 1.

[0079] Unless otherwise stated or in case of conflict, the terms or phrases used in this application shall have the following meanings: In this application, terms such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0080] In this application, "one or more" refers to any one, any two, or any two or more of the listed items. "Several" refers to any two or more.

[0081] In this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0082] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0083] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0084] The above description represents some embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. An optical device, characterized in that, The optical device includes: The shell has a receiving space; A transmitting assembly, disposed within the receiving space, includes multiple transmitting chips and a light collecting unit. Each transmitting chip emits a first beam of different wavelengths, and the light collecting unit receives the first beams of different wavelengths, parallelizes them, and then combines the multiple first beams to form emitted light. A receiving component is disposed within the receiving space. The receiving component includes a plurality of receiving chips and a beam splitter. The beam splitter is used to receive incident light. The incident light is formed by combining a plurality of second beams of different wavelengths. The beam splitter is used to separate the incident light into the plurality of second beams and then make the second beams parallel. Each receiving chip is used to receive one second beam that is parallel.

2. The optical device as described in claim 1, characterized in that, The light-collecting part includes a first photon part and a second photon part. The first photon part is closer to the emitting chip than the second photon part. The first photon part is provided with at least one first lens. The first lens is used to receive the first light beam emitted by the emitting chip and make the first light beam parallel. The second photon part is used to combine multiple first light beams that are parallel to form the emitted light.

3. The optical device as described in claim 2, characterized in that, The second photonic unit includes a first sub-incident light unit, a first sub-reflective light unit, and a second sub-incident light unit. The first sub-incident light unit is disposed between one of the emitting chips and the first sub-reflective light unit, and the second sub-incident light unit corresponds to another emitting chip. The plurality of first beams include first sub-beams and second sub-beams with different wavelengths. In this process, a first sub-beam in a parallel light state is incident on the first sub-incident light part, which receives the first sub-beam and causes it to be incident on the first sub-reflecting part. The first sub-reflecting part then reflects the first sub-beam to the second sub-incident light part. A second sub-beam in a parallel light state is incident on the second sub-incident light part, which receives the second sub-beam, thereby causing the second sub-beam to merge with the first sub-beam.

4. The optical device as described in claim 1, characterized in that, The beam splitter includes a first beam splitter and a second beam splitter. The first beam splitter is closer to the receiving chip than the second beam splitter. The first beam splitter is provided with at least one second lens. The second lens is used to receive the second beam emitted by the second beam splitter and make the second beam parallel. The second beam splitter is used to split the incident light into the plurality of second beams.

5. The optical device as described in claim 4, characterized in that, The second beam splitter includes a first sub-light emitting section, a second sub-reflecting section, and a second sub-light emitting section. The first sub-light emitting section corresponds to one of the receiving chips, and the second sub-light emitting section is disposed between another receiving chip and the second sub-reflecting section. The plurality of second beams include a third sub-beam and a fourth sub-beam with different wavelengths. The incident light is directed to the first sub-emitting part, which transmits the third sub-beam and reflects the fourth sub-beam to the second sub-reflecting part, thereby separating the third sub-beam from the fourth sub-beam; the second sub-reflecting part reflects the fourth sub-beam to the second sub-emitting part, which transmits the fourth sub-beam.

6. The optical device as described in claim 4, characterized in that, The beam splitter also includes a beam focusing section, which is located between the first beam splitter and the receiving chip. The beam focusing section is used to receive and focus a second beam in a parallel light state, and also to direct the focused second beam onto the receiving chip.

7. The optical device as described in claim 1, characterized in that, The housing also has a port communicating with the containment space, and the optical device further includes an optical fiber inserted into the port, the optical fiber being used to receive the emitted light emitted by the emitting component, and the optical fiber being used to emit the incident light.

8. The optical device as described in claim 7, characterized in that, The optical device further includes a first filter and a second filter. The first filter is disposed between the optical fiber and the light collecting part, and the second filter corresponds to the beam splitting part. The first filter is used to transmit the emitted light and also to reflect the incident light emitted from the optical fiber to the second filter. The second filter is used to reflect the incident light to the beam splitting part.

9. The optical device as described in claim 1, characterized in that, The housing is also provided with a connecting platform, part of which is located outside the receiving space and the other part is located inside the receiving space. The connecting platform located inside the receiving space is provided with a first protrusion and a second protrusion. The height of the first protrusion matches the height of the plurality of transmitting chips. The plurality of transmitting chips are connected to the first protrusion through a first conductive line. The height of the second protrusion matches the height of the plurality of receiving chips. The plurality of receiving chips are connected to the second protrusion through a second conductive line.

10. The optical device as described in claim 9, characterized in that, The height of the first boss is greater than the height of the second boss.

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