An optical module

Abstract

The present disclosure provides an optical module, a housing cover is combined on a circuit board, and a lens assembly, a first heat conduction assembly and a second heat conduction assembly are arranged between the circuit board and the housing. The lower surface of the circuit board is provided with a socket, the lens assembly comprises a lens support and a fiber support accommodating a fiber array, and the fiber support and the lens support are arranged along the height direction of the optical module. One end of the first heat conduction assembly is connected with the housing, and the other end of the first heat conduction assembly is connected with the optical matching chip, so that the heat of the optical matching chip is conducted to the housing through the first heat conduction assembly. One end of the second heat conduction assembly is connected with the housing, and the other end of the second heat conduction assembly is connected with the optical chip, so that the heat of the optical chip is conducted to the housing through the second heat conduction assembly. The present disclosure, the first heat conduction assembly can conduct the heat of the optical matching chip, the second heat conduction assembly can conduct the heat of the optical chip, and heat dissipation is realized.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing. Utility Model Content

[0003] This disclosure provides an optical module for heat dissipation.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] Circuit board;

[0006] A housing, covering the circuit board, and a space between the housing and the circuit board is provided:

[0007] Lens assembly;

[0008] First heat-conducting assembly;

[0009] Second heat-conducting assembly;

[0010] The circuit board has the following on its surface:

[0011] An optical matching chip is located on the upper surface of the circuit board and is electrically connected to the optical chip;

[0012] The socket, located on the lower surface of the circuit board, is connected to the switch;

[0013] The lens assembly includes:

[0014] A lens holder is located on the upper surface of the circuit board and covers the optical chip;

[0015] An optical fiber support is provided and connected to the lens support along the light input or light output direction of the optical chip.

[0016] The first thermally conductive assembly is connected at one end to the housing and at the other end to the optical matching chip;

[0017] The second heat-conducting assembly is connected to the housing at one end and to the optical chip at the other end.

[0018] The above technical solution has the following beneficial effects: This disclosure provides an optical module, including a circuit board and a housing. The housing covers the circuit board, and a lens assembly, a first heat-conducting assembly, and a second heat-conducting assembly can be disposed between the circuit board and the housing. An optical matching chip and a socket are disposed on the surface of the circuit board. The optical matching chip is located on the upper surface of the circuit board and is electrically connected to the optical chip so that the optical matching chip can receive the current signal from the optical chip. The socket is located on the lower surface of the circuit board and is connected to a switch to fix the optical module to the switch. Because the socket is located on the lower surface of the circuit board, heat inside the optical module cannot be dissipated to the bottom of the optical module; it can only be dissipated from the top of the optical module. The lens assembly includes a lens bracket and an optical fiber bracket. The optical fiber brackets are connected to the lens bracket and accommodate an optical fiber array. The lens bracket covers the upper surface of the circuit board and the optical chip, so that the lens bracket can be located in the optical output path of the optical chip, allowing the lens bracket to transmit the optical signal emitted by the optical chip to the optical fiber array, or allowing the lens bracket to transmit the optical signal emitted by the optical fiber array to the optical chip. The fiber optic bracket and lens bracket are positioned along the light input or output direction of the optical chip. This not only allows for the placement of multiple lens assemblies on the circuit board, enabling the optical module to support multi-channel optical signal transmission, but also reduces the encapsulation of the optical matching chip by the lens bracket. Furthermore, it ensures that the heat dissipation path of the fiber array in the lens assembly does not overlap with that of the optical module, thus meeting the heat dissipation requirements of the optical module. One end of the first heat-conducting assembly is connected to the housing, and the other end is connected to the optical matching chip, allowing heat from the optical matching chip to be conducted to the housing through the first heat-conducting assembly. One end of the second heat-conducting assembly is connected to the housing, and the other end is connected to the optical chip, allowing heat from the optical chip to be conducted to the housing through the second heat-conducting assembly. In this disclosure, the fiber optic bracket and the first lens bracket are arranged along the light input direction or light output direction of the optical chip. This not only facilitates the arrangement of multiple first lens assemblies on the circuit board, enabling the optical module to meet multi-channel optical signal transmission, but also ensures that the fiber optic array of the first lens assembly and the heat dissipation path of the optical module no longer overlap, thus meeting the heat dissipation requirements of the optical module. The first heat-conducting assembly can conduct heat away from the optical matching chip, and the second heat-conducting assembly can conduct heat away from the optical chip, achieving heat dissipation.

[0019] In some embodiments, an optical module is provided, wherein the front side of the optical chip and the front side of the optical matching chip both face away from the circuit board, the pads on the front side of the optical chip are wire-connected to the circuit board, the pads on the front side of the optical matching chip are wire-connected to the circuit board, and the pads on the front side of the optical chip are wire-connected to the pads on the front side of the optical matching chip.

[0020] The circuit board is formed as follows:

[0021] Third storage compartment;

[0022] The housing includes:

[0023] The first snap-fit ​​protrusion;

[0024] The second snap-fit ​​protrusion has a gap between it and the first snap-fit ​​protrusion to facilitate the placement of the lens assembly;

[0025] The first thermally conductive assembly includes:

[0026] The top of the first thermal pad is connected to the first snap-fit ​​protrusion.

[0027] The second heat sink has its top connected to the bottom of the first thermal pad and its bottom connected to the top of the optical matching chip.

[0028] The second thermally conductive assembly includes:

[0029] The top of the second thermal pad is connected to the bottom of the second snap-fit ​​protrusion;

[0030] The third heat sink is located in the third storage slot, with one end of its top connected to the optical chip and the other end connected to the bottom of the second thermal pad.

[0031] The above technical solution has the following beneficial effects: Both the front side of the optical chip and the front side of the optical matching chip face away from the circuit board. The pads on the front side of the optical chip are wire-connected to the circuit board, the pads on the front side of the optical matching chip are wire-connected to the circuit board, and the pads on the front side of the optical chip and the pads on the front side of the optical matching chip are wire-connected, thus achieving electrical connection between the optical chip and the optical matching chip. The circuit board forms a third storage slot. The housing includes a first snap-fit ​​protrusion and a second snap-fit ​​protrusion, with a gap between them to facilitate the placement of the lens assembly. The first thermally conductive assembly includes a first thermally conductive pad and a second heat sink. The top of the first thermally conductive pad is connected to the first snap-fit ​​protrusion, the bottom of the first thermally conductive pad is connected to the top of the second heat sink, and the bottom of the second heat sink is connected to the top of the optical matching chip, so that the heat from the optical matching chip is sequentially conducted to the outside of the optical module through the second heat sink, the first thermally conductive pad, and the first snap-fit ​​protrusion. The second thermally conductive assembly includes a third heat sink and a second thermal pad. The top of the second thermal pad is connected to the bottom of the second snap-fit ​​protrusion. One end of the top of the third heat sink is connected to the top of the optical chip, and the other end of the top of the third heat sink is connected to the bottom of the second thermal pad. This allows the heat from the optical chip to be conducted to the outside of the optical module sequentially through the third heat sink, the second thermal pad, and the second snap-fit ​​protrusion. The third heat sink is located within the third mounting slot, ensuring that the top of the third heat sink is flush with the upper surface of the circuit board. This allows the third heat sink to effectively conduct the heat generated by the optical chip while preventing interference to other components inside the optical module due to height differences.

[0032] In some embodiments, an optical module is provided, wherein the front side of the optical chip and the front side of the optical matching chip both face away from the circuit board, the pads on the front side of the optical chip are wire-connected to the circuit board, the pads on the front side of the optical matching chip are wire-connected to the circuit board, and the pads on the front side of the optical chip are wire-connected to the pads on the front side of the optical matching chip.

[0033] The circuit board is formed as follows:

[0034] Third storage compartment;

[0035] The housing includes:

[0036] The first snap-fit ​​protrusion;

[0037] The second snap-fit ​​protrusion has a gap between it and the first snap-fit ​​protrusion to facilitate the placement of the lens assembly;

[0038] The first thermally conductive assembly includes:

[0039] The first thermal pad has its top connected to the first snap-fit ​​protrusion and its bottom connected to the top of the optical matching chip;

[0040] The second thermally conductive assembly includes:

[0041] The top of the second thermal pad is connected to the bottom of the second snap-fit ​​protrusion;

[0042] The third heat sink is located in the third storage slot, with one end of its top connected to the optical chip and the other end connected to the bottom of the second thermal pad.

[0043] The above technical solution has the following beneficial effects: Both the front side of the optical chip and the front side of the optical matching chip face away from the circuit board. The pads on the front side of the optical chip are wire-connected to the circuit board, and the pads on the front side of the optical matching chip are also wire-connected to the circuit board. Furthermore, the pads on the front side of the optical chip and the pads on the front side of the optical matching chip are wire-connected to achieve electrical connection between the optical chip and the optical matching chip. The circuit board forms a third storage slot. The housing includes a first snap-fit ​​protrusion and a second snap-fit ​​protrusion, with a gap between them to facilitate the placement of the lens assembly. The first thermally conductive assembly includes a first thermally conductive pad. The top of the first thermally conductive pad is connected to the first snap-fit ​​protrusion, and the bottom of the first thermally conductive pad is connected to the top of the optical matching chip, so that the heat from the optical matching chip is sequentially conducted to the outside of the optical module through the first thermally conductive pad and the first snap-fit ​​protrusion. The second thermally conductive assembly includes a third heat sink and a second thermal pad. The top of the second thermal pad is connected to the bottom of the second snap-fit ​​protrusion. One end of the top of the third heat sink is connected to the top of the optical chip, and the other end of the top of the third heat sink is connected to the bottom of the second thermal pad. This allows the heat from the optical chip to be conducted to the outside of the optical module sequentially through the third heat sink, the second thermal pad, and the second snap-fit ​​protrusion. The third heat sink is located within the third mounting slot, ensuring that the top of the third heat sink is flush with the upper surface of the circuit board. This allows the third heat sink to effectively conduct the heat generated by the optical chip while preventing interference to other components inside the optical module due to height differences.

[0044] In some embodiments, an optical module is provided, wherein the second heat sink includes:

[0045] The top of the first heat dissipation substrate is connected to the first thermal pad.

[0046] The second heat dissipation substrate has its top connected to the bottom of the first heat dissipation substrate and its bottom connected to the top of the optical matching chip.

[0047] The third heat dissipation substrate has its top connected to the bottom side of the first heat dissipation substrate and its bottom connected to the upper surface of the circuit board;

[0048] The fourth heat dissipation substrate is connected at the top to the other side of the bottom of the first heat dissipation substrate, and at the bottom to the upper surface of the circuit board.

[0049] The length of the second heat dissipation substrate is smaller than the length of the optical matching chip, and the width of the second heat dissipation substrate is smaller than the width of the optical matching chip; the length of the second heat dissipation substrate is smaller than the length of the first heat dissipation substrate, and the width of the second heat dissipation substrate is smaller than the width of the first heat dissipation substrate.

[0050] The above technical solution has the following beneficial effects: The second heat sink includes a first heat sink substrate, a second heat sink substrate, a third heat sink substrate, and a fourth heat sink substrate. The top of the first heat sink substrate is connected to a first thermal pad, the top of the second heat sink substrate is connected to the bottom of the first heat sink substrate, and the bottom of the second heat sink substrate is connected to the top of the optical matching chip, so that the heat of the optical matching chip is conducted sequentially through the second heat sink substrate, the first heat sink substrate, and the first thermal pad to the first snap-fit ​​protrusion. The top of the third heat sink substrate is connected to one side of the bottom of the first heat sink substrate, and the top of the fourth heat sink substrate is connected to the other side of the bottom of the first heat sink substrate. The bottoms of both the third and fourth heat sink substrates are connected to the upper surface of the circuit board, which can guide the stress point to the circuit board, avoiding direct stress on the optical matching chip, thereby protecting the optical matching chip. The length of the second heat sink substrate is smaller than the length of the optical matching chip, and the width of the second heat sink substrate is smaller than the width of the optical matching chip, so that the edge of the optical matching chip can be exposed, which facilitates the setting of pads on the edge of the optical matching chip, and thus facilitates wire bonding between the optical matching chip and other devices. The length of the first heat dissipation substrate is greater than that of the second heat dissipation substrate, and the width of the first heat dissipation substrate is greater than that of the second heat dissipation substrate. This not only increases the contact area between the first heat dissipation component and the first thermal pad, improving the thermal conductivity, but also provides space for the gold wire.

[0051] In some embodiments, an optical module is provided in which the length dimension of the first thermal pad is smaller than the length dimension of the optical matching chip, and the width dimension of the first thermal pad is smaller than the width dimension of the optical matching chip, so that the first thermal pad is far away from the edge of the optical matching chip.

[0052] The above technical solution has the following beneficial effects: the length of the first thermal pad is smaller than the length of the optical matching chip, and the width of the first thermal pad is smaller than the width of the optical matching chip, so that the edge of the optical matching chip can be exposed, which facilitates the setting of pads on the edge of the optical matching chip, and thus facilitates wire bonding connection between the optical matching chip and other devices.

[0053] In some embodiments, an optical module is provided, wherein the front of the optical chip faces away from the circuit board, the front of the optical matching chip faces the circuit board, the pads on the front of the optical chip are wire-connected to the circuit board, the solder balls on the front of the optical matching chip are directly connected to the circuit board, a high-frequency signal line is formed on the upper surface of the circuit board, one end of the high-frequency signal line is wire-connected to the pads on the front of the optical chip, and the other end of the high-frequency signal line is directly connected to the solder balls on the front of the optical matching chip;

[0054] The circuit board is formed as follows:

[0055] Third storage compartment;

[0056] The housing includes:

[0057] The first snap-fit ​​protrusion;

[0058] The second snap-fit ​​protrusion has a gap between it and the first snap-fit ​​protrusion to facilitate the placement of the lens assembly;

[0059] The first thermally conductive assembly includes:

[0060] The first thermal pad has its top connected to the first snap-fit ​​protrusion and its bottom connected to the top of the optical matching chip;

[0061] The second thermally conductive assembly includes:

[0062] The top of the second thermal pad is connected to the bottom of the second snap-fit ​​protrusion;

[0063] The third heat sink is located in the third storage slot, with one top end connected to the bottom of the optical chip and the other top end connected to the bottom of the second thermal pad.

[0064] The above technical solution has the following beneficial effects: the front of the optical chip faces away from the circuit board, the front of the optical matching chip faces the circuit board, the pads on the front of the optical chip are wire-connected to the circuit board, and the solder balls on the front of the optical matching chip are directly connected to the circuit board. A high-frequency signal line is formed on the upper surface of the circuit board. One end of the high-frequency signal line is wire-connected to the pads on the front of the optical chip, and the high-frequency signal line is directly connected to the solder balls on the front of the optical matching chip, so that the optical chip and the optical matching chip are electrically connected. The circuit board forms a second storage slot. The housing includes a first snap-fit ​​protrusion and a second snap-fit ​​protrusion, with a gap between the first snap-fit ​​protrusion and the second snap-fit ​​protrusion to facilitate the placement of the first lens assembly. The first thermally conductive assembly includes a first thermally conductive pad. The top of the first thermally conductive pad is connected to the first snap-fit ​​protrusion, and the bottom of the first thermally conductive pad is connected to the top of the optical matching chip, so that the heat of the optical matching chip is conducted to the outside of the optical module in sequence through the first thermally conductive pad and the first snap-fit ​​protrusion. The second thermally conductive assembly includes a third heat sink and a second thermally conductive pad. The top of the second thermally conductive pad is connected to the bottom of the second snap-fit ​​protrusion. One end of the top of the third heat sink is connected to the top of the optical chip, and the other end of the top of the third heat sink is connected to the bottom of the second thermally conductive pad. This allows the heat from the optical chip to be conducted to the outside of the optical module sequentially through the third heat sink, the second thermally conductive pad, and the second snap-fit ​​protrusion. The third heat sink is located within the second mounting slot, ensuring that the top of the third heat sink is flush with the upper surface of the circuit board. This allows the third heat sink to effectively conduct the heat generated by the optical chip while preventing interference to other components inside the optical module due to height differences.

[0065] In some embodiments, an optical module is provided, wherein the front side of the optical chip and the front side of the optical matching chip face the circuit board, the solder balls on the front side of the optical chip are directly connected to the circuit board, the solder balls on the front side of the optical matching chip are directly connected to the circuit board, a high-frequency signal line is formed on the upper surface of the circuit board, one end of the high-frequency signal line is directly connected to the solder ball on the front side of the optical chip, and the other end of the high-frequency signal line is directly connected to the solder ball on the front side of the optical matching chip.

[0066] The housing includes:

[0067] The first snap-fit ​​protrusion;

[0068] The second snap-fit ​​protrusion has a gap between it and the first snap-fit ​​protrusion to facilitate the placement of the first lens assembly;

[0069] The first thermally conductive assembly includes:

[0070] The first thermal pad has its top connected to the first snap-fit ​​protrusion and its bottom connected to the top of the optical matching chip;

[0071] The second thermally conductive assembly includes:

[0072] The top of the second thermal pad is connected to the bottom of the second snap-fit ​​protrusion;

[0073] The first thermal via is located inside the circuit board, and its top is connected to the bottom of the optical chip;

[0074] The second thermal via is located inside the circuit board, and its top is connected to the bottom of the second thermal pad;

[0075] The fourth heat sink is located in the middle layer of the circuit board, with one top end connected to the bottom of the first heat-conducting via and the other top end connected to the bottom of the second heat-conducting via.

[0076] The above technical solution has the following beneficial effects: Both the front of the optical chip and the front of the optical matching chip face the circuit board. A high-frequency signal line is formed on the upper surface of the circuit board. One end of the high-frequency signal line is connected to the solder ball on the front of the optical chip, and the other end is connected to the solder ball on the front of the optical matching chip, thus achieving electrical connection between the optical chip and the optical matching chip. The circuit board forms a second storage slot. The housing includes a first snap-fit ​​protrusion and a second snap-fit ​​protrusion, with a gap between them to facilitate the placement of the first lens assembly. The first thermally conductive assembly includes a first thermally conductive pad. The top of the first thermally conductive pad is connected to the first snap-fit ​​protrusion, and the bottom of the first thermally conductive pad is connected to the top of the optical matching chip, so that the heat from the optical matching chip is sequentially conducted to the outside of the optical module through the first thermally conductive pad and the first snap-fit ​​protrusion. The second thermally conductive assembly includes a first thermally conductive via, a fourth heat sink, a second thermally conductive via, and a second thermally conductive pad. The first and second thermally conductive vias are located inside the circuit board, and the fourth heat sink is located in the middle layer of the circuit board. The top of the first thermally conductive via is connected to the solder ball on the front side of the optical chip, the bottom of the first thermally conductive via is connected to one end of the fourth heat sink, the other end of the fourth heat sink is connected to the bottom of the second thermally conductive via, the top of the second thermally conductive via is connected to the bottom of the second thermally conductive pad, and the top of the second thermally conductive pad is connected to a second snap-fit ​​protrusion, so that the heat of the optical chip is conducted to the outside of the optical module in sequence through the first thermally conductive via, the fourth heat sink, the second thermally conductive via, the second thermally conductive pad, and the second snap-fit ​​protrusion.

[0077] In some embodiments, an optical module is provided, wherein the front side of the optical chip and the front side of the optical matching chip face the circuit board, the solder balls on the front side of the optical chip are directly connected to the pads on the back side of the optical matching chip, and the solder balls on the front side of the optical matching chip are directly connected to the circuit board.

[0078] The housing includes:

[0079] The first snap-fit ​​protrusion;

[0080] The first thermally conductive assembly includes:

[0081] The first thermal pad has its top connected to the first snap-fit ​​protrusion and its bottom connected to the top of the optical matching chip;

[0082] The second thermally conductive assembly includes:

[0083] The optical matching chip;

[0084] The first heat-conducting assembly.

[0085] The above technical solution has the following beneficial effects: the front side of the optical chip and the front side of the optical matching chip face the circuit board; the solder balls on the front side of the optical chip are directly connected to the solder pads on the back side of the optical matching chip; and the solder balls on the front side of the optical matching chip are directly connected to the circuit board, thereby electrically connecting the optical chip and the optical matching chip. The housing includes a first snap-fit ​​protrusion. The first thermally conductive assembly includes a first thermally conductive pad; the top of the first thermally conductive pad is connected to the first snap-fit ​​protrusion, and the bottom of the first thermally conductive pad is connected to the top of the optical matching chip, so that the heat from the optical matching chip is sequentially conducted to the outside of the optical module through the first thermally conductive pad and the first snap-fit ​​protrusion. The second thermally conductive assembly includes the optical matching chip and the first thermally conductive assembly, so that the heat from the optical chip is sequentially conducted to the outside of the optical module through the optical matching chip, the first thermally conductive pad, and the first snap-fit ​​protrusion.

[0086] In some embodiments, an optical module is provided in which the length of the second storage slot is greater than or equal to the length of the third heat sink, the width of the second storage slot is greater than or equal to the width of the third heat sink, and the depth of the second storage slot is equal to the thickness of the third heat sink.

[0087] The above technical solution has the following beneficial effects: the length of the second storage slot is greater than or equal to the length of the third heat sink, and the width of the second storage slot is greater than or equal to the width of the third heat sink, so that the second storage slot can accommodate the third heat sink. The depth of the second storage slot is equal to the thickness of the third heat sink, so that the top of the third heat sink is flush with the upper surface of the circuit board. This allows the third heat sink to not only effectively conduct the heat generated by the optical chip, but also avoid interference to other components inside the optical module due to height differences.

[0088] In some embodiments, an optical module is provided, the housing comprising:

[0089] Cover plate;

[0090] Two first side plates, the top of which are connected to the two sides of the cover plate, and the first bottom plate is connected to the upper surface of the circuit board;

[0091] The second side plate is connected to one end of the cover plate at its top, forming an opening; the fiber array extends outward from the optical module through the opening.

[0092] The third side plate is connected to the other end of the cover plate at the top and to the upper surface of the circuit board at the bottom, with the bottom protruding outward to form a limiting protrusion; the limiting protrusion is connected to one end face of the circuit board.

[0093] The base plate is connected to the second bottom of the first side plate on both sides, one end is connected to the second side plate, and the other end has a gap with the third side plate to facilitate the placement of the circuit board; the other end of the base plate is connected to the other end face of the circuit board.

[0094] The above technical solution has the following beneficial effects: The housing includes a cover plate, two first side plates, a second side plate, a third side plate, and a bottom plate. The two sides of the cover plate are connected to the tops of the two first side plates, one end of the cover plate is connected to the top of the second side plate, and the other end of the cover plate is connected to the top of the third side plate. The two sides of the bottom plate are respectively connected to the second bottom of the first side plates, one end of the bottom plate is connected to the second side plate, and there is a gap between the third side plate and the other end of the bottom plate to facilitate the placement of the circuit board. The second side plate forms an opening through which the fiber optic array extends outward from the optical module. The bottom of the third side plate is connected to the upper surface of the circuit board, and the first bottom of the first side plate is connected to the upper surface of the circuit board, so that the housing covers the circuit board. The bottom of the third side plate protrudes outward to form a limiting protrusion, which is connected to one end face of the circuit board. The bottom plate is connected to the other end face of the circuit board to define the position of the circuit board within the housing. Attached Figure Description

[0095] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0096] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments;

[0097] Figure 2 This is a partial structural diagram of a switch according to some embodiments;

[0098] Figure 3 The structure of a first optical module according to some embodiments Figure 1 ;

[0099] Figure 4 The structure of a first optical module according to some embodiments Figure 2 ;

[0100] Figure 5 An exploded view of a first type of optical module provided according to some embodiments;

[0101] Figure 6a A partial structure of a first type of optical module provided according to some embodiments Figure 1 ;

[0102] Figure 6b Partial breakdown of a first type of optical module provided according to some embodiments Figure 1 ;

[0103] Figure 6c Partial breakdown of a first type of optical module provided according to some embodiments Figure 2 ;

[0104] Figure 7 The wiring diagram is shown for the fiber array of a first type of optical module according to some embodiments;

[0105] Figure 8 This is a partial structural diagram of a second type of optical module provided according to some embodiments;

[0106] Figure 9 The wiring diagram of the fiber array for a second type of optical module provided according to some embodiments;

[0107] Figure 10 An exploded view of a first lens assembly is provided according to some embodiments;

[0108] Figure 11a This is a structural diagram of a first lens holder according to some embodiments;

[0109] Figure 11b This is a cross-sectional view of a first lens holder provided according to some embodiments;

[0110] Figure 12a Another structure of a first lens holder according to some embodiments. Figure 1 ;

[0111] Figure 12b Another structure of a first lens holder according to some embodiments. Figure 2 ;

[0112] Figure 12c This is a cross-sectional view of another first lens holder provided according to some embodiments;

[0113] Figure 13a This is a structural diagram of a fiber optic bracket according to some embodiments;

[0114] Figure 13b This is a cross-sectional view of an optical fiber support according to some embodiments;

[0115] Figure 14 This is a structural diagram of a first lens assembly provided according to some embodiments;

[0116] Figure 15 A partial cross-sectional view of a first type of optical module provided according to some embodiments. Figure 1 ;

[0117] Figure 16 This is a structural diagram of a housing according to some embodiments;

[0118] Figure 17a This is a partial cross-sectional schematic diagram of a third type of optical module provided according to some embodiments;

[0119] Figure 17b This is a cross-sectional schematic diagram of a third type of optical module provided according to some embodiments;

[0120] Figure 17c This is a cross-sectional schematic diagram of a fourth type of optical module provided according to some embodiments;

[0121] Figure 17d This is a partial structural diagram of a third type of optical module provided according to some embodiments;

[0122] Figure 17e This is a heat dissipation distribution diagram of a third type of optical module provided according to some embodiments;

[0123] Figure 18a This is a partial cross-sectional schematic diagram of a fifth optical module provided according to some embodiments;

[0124] Figure 18b This is a cross-sectional schematic diagram of a fifth optical module provided according to some embodiments;

[0125] Figure 18c This is a cross-sectional schematic diagram of a sixth optical module provided according to some embodiments;

[0126] Figure 18d This is a partial structural schematic diagram of a fifth optical module provided according to some embodiments;

[0127] Figure 19a This is a partial cross-sectional schematic diagram of a seventh optical module provided according to some embodiments;

[0128] Figure 19b This is a cross-sectional schematic diagram of a seventh optical module provided according to some embodiments;

[0129] Figure 19c This is a partial structural schematic diagram of a seventh optical module provided according to some embodiments;

[0130] Figure 19d This is a heat dissipation distribution diagram of a seventh type of optical module provided according to some embodiments;

[0131] Figure 20a This is a partial structural diagram of a ninth optical module provided according to some embodiments;

[0132] Figure 20b This is a partial exploded view of a ninth optical module provided according to some embodiments;

[0133] Figure 21 An exploded view of a second lens assembly provided according to some embodiments;

[0134] Figure 22a This is a structural diagram of a second lens holder according to some embodiments;

[0135] Figure 22b This is a structural diagram of another second lens holder provided according to some embodiments;

[0136] Figure 22c This is a cross-sectional view of a second lens holder provided according to some embodiments;

[0137] Figure 23a This is another structure of a second lens holder according to some embodiments. Figure 1 ;

[0138] Figure 23b This is another structure of a second lens holder according to some embodiments. Figure 2 ;

[0139] Figure 24a This is a structural diagram of another fiber optic bracket provided according to some embodiments;

[0140] Figure 24b This is a cross-sectional view of another fiber optic bracket provided according to some embodiments;

[0141] Figure 25 A cross-sectional view of a second lens assembly provided according to some embodiments;

[0142] Figure 26 This is a partial cross-sectional view of a ninth optical module provided according to some embodiments;

[0143] Figure 27a This is a partial cross-sectional schematic diagram of a tenth optical module provided according to some embodiments;

[0144] Figure 27b A cross-sectional view of a tenth optical module provided according to some embodiments;

[0145] Figure 27c This is a partial structural schematic diagram of a tenth optical module provided according to some embodiments;

[0146] Figure 27d This is a heat dissipation distribution diagram of a tenth type of optical module provided according to some embodiments;

[0147] Figure 28a This is a partial cross-sectional schematic diagram of an eleventh optical module provided according to some embodiments;

[0148] Figure 28b This is a cross-sectional view of an eleventh optical module provided according to some embodiments;

[0149] Figure 28c This is a heat dissipation distribution diagram of an eleventh optical module provided according to some embodiments. Detailed Implementation

[0150] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0151] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0152] In optical communication technology, information is loaded onto light to generate optical signals, which are then used to transmit information between information processing devices. Connections are established between these devices via optical transmission equipment. Optical power loss is minimal during transmission through this equipment, allowing for long-distance transmission with relatively low power loss. Light boasts extremely high transmission speeds, and the cost of optical transmission equipment, such as fiber optic cables, is lower than that of electrical transmission equipment like copper wires. Using optical signals to transmit information offers advantages such as long-distance transmission, high speed, and low cost.

[0153] Information processing equipment typically includes switches, servers, optical network units (ONUs), optical distribution networks (ODNs), optical line terminals (OLTs), gateways, routers, mobile phones, computers, tablets, televisions, etc.; optical transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can recognize and process electrical signals, while optical transmission equipment can transmit optical signals. Therefore, an optical module is needed between the optical transmission equipment and the information processing equipment to perform the conversion between optical and electrical signals.

[0154] In some embodiments, the optical signal input and / or optical signal output of the optical module are connected to an optical fiber, and the electrical signal input and / or electrical signal output of the optical module are connected to a switch; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the switch; a second electrical signal from the switch is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0155] Information processing equipment connected to optical modules is also known as the host computer for optical modules. In access network transmission scenarios, the host computer for optical modules is usually an ONU, ODN, or OLT; in data center transmission scenarios, the host computer for optical modules is usually a Switch or Server.

[0156] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments. For example... Figure 1 As shown, switch 100 has multiple optical module interfaces. Multiple optical modules are inserted into the switch through these interfaces, establishing electrical signal communication between the optical modules and the switch. Optical fiber 101 is connected to the optical modules, establishing optical signal communication between the optical fiber and the optical modules. One end of optical fiber 101 is connected to the optical module, and the other end of optical fiber 101 (…) Figure 1 (not shown) connects to another optical module ( Figure 1 (Not shown in the image), another optical module accesses the server ( Figure 1 (not shown in the image) or another switch ( Figure 1 (Not shown in the image).

[0157] In some embodiments, the optical fiber 101 and the optical module 200 are detachably connected; in other embodiments, the optical fiber 101 and the optical module 200 are non-detachably connected.

[0158] The switch 100 is configured to provide data electrical signals to the optical module 200, or receive data electrical signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0159] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0160] Figure 2 This is a partial structural diagram of a switch according to some embodiments. To clearly show the connection relationship between the optical module 200 and the switch 100, Figure 2 Only the structure of the switch 100 related to the optical module 200 is shown. (Example) Figure 2 As shown, in some embodiments, the switch 100 further includes a PCB circuit board 102 disposed in the receiving cavity, and a cage 103 disposed on the surface of the PCB circuit board 102; the optical module 200 is inserted into the cage 103 and fixed by the cage 103.

[0161] In some embodiments, a heat sink 104 is provided on the cage 103 to dissipate heat for the optical module; in some embodiments, the heat sink 104 has protruding structures such as fins to increase the heat dissipation area.

[0162] In some embodiments, an electrical connector is provided inside the cage 103, which is configured to access the electrical interface of the optical module 200.

[0163] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the cage 103 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 103 and then diffused through the heat sink 104.

[0164] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 103, thereby establishing an electrical signal connection between the optical module 200 and the switch 100.

[0165] In some embodiments, the optical interface of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0166] Figure 3 The structure of a first optical module according to some embodiments Figure 1 . Figure 4 The structure of a first optical module according to some embodiments Figure 2 . Figure 5 This is an exploded view of a first type of optical module provided according to some embodiments. For example... Figure 3, Figure 4 and Figure 5 As shown, in some embodiments, the optical module 200 includes a housing 201 and a circuit board 300. The housing 201 covers the circuit board 300, forming an opening 2131, which is an optical interface.

[0167] In some embodiments, the housing 201 is made of a metallic material, which facilitates electromagnetic shielding and heat dissipation.

[0168] The assembly method of combining the housing 201 with the circuit board 300 facilitates the installation of lens assemblies and other components between the circuit board 300 and the housing 201. The housing 201 and the circuit board can encapsulate and protect the aforementioned devices.

[0169] In some embodiments, the housing 201 includes a cover plate 2011, two first side plates 2012, a second side plate 2013, a bottom plate 2014, and a third side plate 2015. The two first side plates 2012 may be located on both sides of the cover plate 2011, and the second side plates 2013 and the third side plates 2015 may be located at both ends of the cover plate 2011. The bottoms of the first side plates 2012 and the second side plates 2013 are connected to the bottom plate 2014, and the bottom plate 2014 is not connected to the third side plate 2015. The tops of the first side plates 2012, the second side plates 2013, and the third side plates 2015 are all connected to the cover plate 2011, and the bottoms of the first side plates 2012 and the third side plates 2015 cover the circuit board 300.

[0170] like Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments, the circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0171] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the switch 100.

[0172] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0173] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0174] In some implementations, the gold fingers are located on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers are set on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is large.

[0175] In some implementations, the gold fingers of the circuit board extend from the electrical interface and are inserted into the electrical connector of the switch 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0176] In some embodiments, the optical module may include a lens assembly. The lens assembly may be a first lens assembly or a second lens assembly. The lens assembly may include a lens holder. The lens holder 410 may include a collimating lens array and a focusing lens array. The collimating lens array can collimate the received optical signal, and the focusing lens array may be located in the output optical path of the collimating lens array so that the focusing lens array can receive the collimated optical signal from the collimating lens array.

[0177] In some embodiments, the lens holder 410 may be disposed on the upper surface of the circuit board 300. For example... Figure 5 As shown.

[0178] In some embodiments, the circuit board 300 forms a through-hole for placing objects, and the lens holder 410 is snapped into the through-hole for placing objects, or a portion of the lens holder 410 is placed into the through-hole for placing objects, and another portion is snapped into the lower surface of the circuit board 300.

[0179] In some embodiments, the lens holder 410 may be C-shaped, that is, the lens holder 410 may be a first lens holder. For example... Figure 5 As shown.

[0180] In some embodiments, the lens holder 410 may also be H-shaped, that is, the lens holder 410 may be a second lens holder.

[0181] The lens holder 410 can be integrally molded from polymer material using an injection molding process. Specifically, the material used to make the lens holder 410 includes materials with good light transmittance such as PEI (Polyetherimide) plastic (Ultem series). Since all beam propagation elements in the lens holder 410 are formed from the same polymer material in a single piece, the number of molding dies can be greatly reduced, thus lowering manufacturing costs and complexity.

[0182] In some embodiments, the lens assembly may include an optical fiber support 420. The optical fiber support 420 may be disposed on the upper surface of the circuit board 300. The optical fiber support 420 is correspondingly disposed with the lens support 410. The optical fiber support 420 may be connected to the lens support 410 to fix the optical fiber support 420 to the lens support 410. An optical fiber array 500 is accommodated inside the optical fiber support 420. One end of the optical fiber array 500 establishes an optical connection with the lens support 410 through the optical fiber support 420, and the other end of the optical fiber array 500 establishes an optical connection with an optical fiber adapter. The first lens support and the optical fiber support 420 may form a first lens assembly, and the second lens support and the optical fiber support 420 may form a second lens assembly.

[0183] A fiber optic array can consist of multiple optical fibers. It transmits light from the lens holder to the fiber optic adapter, enabling the emission of optical signals, and transmits light from the fiber optic adapter to the lens holder, enabling the reception of optical signals from outside the optical module. The fiber optic array and lens holder have a well-designed optical coupling structure. Multiple beams from the lens holder are converged and incident on the multiple fibers of the fiber optic array, utilizing the optical structure of the lens holder to achieve optical connection with the optical transmitting chip; similarly, multiple beams from the fiber optic array are incident on the lens holder, utilizing the optical structure of the lens holder to achieve optical connection with the optical receiving chip.

[0184] In some embodiments, the fiber optic array may include a sub-fiber optic array. For example, the fiber optic array may include a first sub-fiber optic array.

[0185] In some embodiments, the fiber optic array may include multiple sub-fiber optic arrays. For example, the fiber optic array may include a first sub-fiber optic array and a second sub-fiber optic array, arranged side-by-side. The fiber optic array may include a first sub-fiber optic array, a second sub-fiber optic array, a third sub-fiber optic array, and a fourth sub-fiber optic array.

[0186] In some embodiments, the optical module 200 is detachably connected to the optical fiber 101. The optical fiber 101 and the optical fiber array 500 are different optical fibers, and they can be optically connected through an optical fiber adapter. That is, the optical fiber 101 is connected to or disconnected from the optical module 200 by inserting or removing it from the optical interface.

[0187] In some embodiments, the optical module 200 is fixedly connected to the optical fiber 101. The optical fiber 101 can be an active optical fiber or a pigtail. The optical fiber 101 enters the optical module 200 through an optical interface and is fixed to the optical fiber support 420 inside the optical module 200. Among them, the optical fiber that does not enter the optical module 200 is the optical fiber 101, and the optical fiber that enters the optical module 200 is the optical fiber array 500.

[0188] In some embodiments, a socket 202 is provided on the lower surface of the circuit board 300. The socket 202 can be connected to the cage 103 on the switch 100 to fix the optical module 200 to the switch 100.

[0189] A socket 202 is provided on the lower surface of the circuit board 300. Heat inside the optical module 200 cannot be dissipated to the bottom of the optical module 200, but can only be dissipated from the top of the optical module 200. Therefore, the optical module 200 is required to meet both multi-channel optical path transmission and heat dissipation requirements.

[0190] In some embodiments, the fiber optic bracket 420 and the lens bracket 410 can be arranged along the height direction of the optical module 200. This not only facilitates the arrangement of multiple lens assemblies on the circuit board 300, enabling the optical module 200 to meet the requirements of multi-channel optical signal transmission, but also ensures that the fiber optic array of the lens assembly and the heat dissipation path of the optical module no longer overlap, thus meeting the heat dissipation requirements of the optical module 200.

[0191] In some embodiments, the optical module 200 further includes a first heat sink 600. The first heat sink 600 may be located between the circuit board 300 and the housing 201, so that the first heat sink 600 can conduct heat from inside the optical module to the outside of the optical module. One end of the first heat sink 600 may be located between the circuit board 300 and the housing 201, so that heat from the circuit board 300 is conducted through the first heat sink 600 to the housing 201, and then from the housing 201 to the outside of the optical module 200.

[0192] Figure 6a A partial structure of a first type of optical module provided according to some embodiments Figure 1 . Figure 6b Partial breakdown of a first type of optical module provided according to some embodiments Figure 1 . Figure 6c Partial breakdown of a first type of optical module provided according to some embodiments Figure 2 .like Figure 6a , Figure 6band Figure 6c As shown, in some embodiments, the first lens assembly 400 may include a first lens bracket 410a and an optical fiber bracket 420, wherein the optical fiber bracket 420 and the first lens bracket 410a may be arranged along the height direction of the optical module.

[0193] In some embodiments, the optical module 200 includes an optical chip 310. The optical chip 310 may be a laser chip or an optical receiver chip. The laser chip can emit optical signals. The optical receiver chip can receive optical signals and convert them into electrical signals.

[0194] In some embodiments, the optical chip 310 may be located on the upper surface of the circuit board 300. The first lens holder 410a may be disposed on the optical chip 310 so that the first lens holder 410a can transmit the optical signal emitted by the optical chip 310 to the fiber array 500, or can transmit the optical signal emitted by the fiber array 500 to the optical chip 310.

[0195] In some embodiments, the optical chip 310 may be located on the upper surface of the circuit board 300, and the first lens holder 410a may be located above the optical chip 310, so that the first lens holder 410a may be located on the light output path of the optical chip 310, or the optical chip 310 may be located on the light output path of the first lens holder 410a.

[0196] In some embodiments, the optical chip 310 may be located at the through-hole. The optical chip 310 may be located at the through-hole, and the first lens holder 410a may be located below the optical chip 310, so that the first lens holder 410a may be located in the light output path of the optical chip 310, or the optical chip 310 may be located in the light output path of the first lens holder 410a.

[0197] In some embodiments, the optical chip 310 is a laser chip, which may integrate an array of light-emitting regions. The array includes multiple light-emitting surfaces, which may be arranged side-by-side along the width of the circuit board 300. The light-emitting regions emit light signals, enabling the optical chip 310 to emit a line of light signals. For example, the first light-emitting region array includes eight light-emitting surfaces arranged side-by-side along the width of the circuit board 300.

[0198] In some embodiments, the optical chip 310 is a laser chip, which may integrate multiple light-emitting area arrays. Each light-emitting area array includes multiple light-emitting areas, which may be arranged side-by-side along the width of the circuit board 300. The light-emitting areas emit light signals, enabling the optical chip 310 to emit multiple lines of light signals. For example, the laser chip integrates two light-emitting area arrays, or the laser chip integrates four light-emitting area arrays.

[0199] In some embodiments, the optical chip 310 is an optical receiver chip, which may integrate a photosensitive surface array. The photosensitive surface array includes multiple photosensitive surfaces, which may be arranged side-by-side along the width direction of the circuit board 300. The photosensitive surfaces receive optical signals, enabling the optical chip 310 to receive a row of optical signals. For example, the first photosensitive surface array includes eight photosensitive surfaces arranged side-by-side along the width direction of the circuit board 300.

[0200] In some embodiments, the optical chip 310 is an optical receiver chip, which may integrate multiple photosensitive surface arrays. Each photosensitive surface array includes multiple photosensitive surfaces, which may be arranged side-by-side along the width of the circuit board 300. The photosensitive surfaces receive optical signals, enabling the optical chip 310 to receive multiple rows of optical signals. For example, the optical receiver chip may integrate two photosensitive surface arrays, or it may integrate four photosensitive surface arrays.

[0201] In some embodiments, the optical chip 310 may be a chip packaged using a wire bonding packaging process, that is, the back side of the optical chip 310 faces the circuit board 300, the front side of the optical chip 310 faces away from the circuit board 300, and the pads on the front side of the optical chip 310 are connected to the pads on the circuit board 300 by gold wires.

[0202] In some embodiments, the optical chip 310 can be a chip packaged using a flip-chip packaging process, that is, the front side of the optical chip 310 faces the circuit board 300, the back side of the optical chip 310 faces away from the circuit board 300, the pads on the front side of the optical chip 310 protrude outward to form solder balls, and the solder balls are directly soldered to the pads of the circuit board 300.

[0203] In some embodiments, an optical matching chip 320 may be disposed on the upper surface of the circuit board 300. The optical matching chip 320 may be electrically connected to the optical chip 310. The optical matching chip 320 may be a laser driver chip or a TIA chip. The laser driver chip is electrically connected to the laser chip so that the laser driver chip can provide a driving signal to the laser chip, causing the laser chip to emit an optical signal under the action of the driving signal. The TIA chip is electrically connected to the optical receiver chip so that the TIA chip can receive the current signal from the optical receiver chip and convert the current signal into a voltage signal.

[0204] In some embodiments, the fiber optic bracket 420 and the first lens bracket 410a can be arranged along the light input or output direction of the optical chip 310, that is, the fiber optic bracket 420 and the first lens bracket 410a can be arranged along the height direction of the optical module. This arrangement not only facilitates the placement of multiple lens assemblies on the circuit board 300, enabling the optical module 200 to support multi-channel optical signal transmission, but also reduces the encapsulation of the optical matching chip 320 by the first lens bracket 410a, ensuring that the fiber array of the first lens assembly does not overlap with the heat dissipation path of the optical module, thus meeting the heat dissipation requirements of the optical module 200. Similarly, the fiber optic bracket 420 and the second lens bracket can be arranged along the light input or output direction of the optical chip 310, that is, the fiber optic bracket 420 and the second lens bracket can be arranged along the height direction of the optical module.

[0205] In some embodiments, the optical matching chip 320 may be a chip packaged using wire bonding packaging technology, that is, the back side of the optical matching chip 320 faces the circuit board 300, the front side of the optical matching chip 320 faces away from the circuit board 300, and the pads on the front side of the optical matching chip 320 are connected to the pads on the circuit board 300 by gold wires.

[0206] In some embodiments, the optical matching chip 320 can be a chip packaged using a flip-chip packaging process, that is, the front side of the optical matching chip 320 faces the circuit board 300, the back side of the optical matching chip 320 faces away from the circuit board 300, the positive electrode pads of the optical matching chip 320 protrude outward to form solder balls, and the solder balls are directly soldered to the pads of the circuit board 300.

[0207] In some embodiments, the optical chip 310 and the optical matching chip 320 can be arranged in a flat configuration.

[0208] In some embodiments, the front side of the optical chip 310 and the front side of the optical matching chip 320 both face away from the circuit board 300, while the back side of the optical chip 310 and the back side of the optical matching chip 320 both face the circuit board 300. The pads on the front side of the optical chip 310 are wire-connected to the circuit board 300, the pads on the front side of the optical matching chip 320 are wire-connected to the circuit board 300, and the pads on the front side of the optical chip 310 are wire-connected to the pads on the front side of the optical matching chip 320.

[0209] In some embodiments, the front side of the optical chip 310 and the front side of the optical matching chip 320 both face away from the upper surface of the circuit board 300, and the back side of the optical chip 310 and the back side of the optical matching chip 320 both face the upper surface of the circuit board 300. The pads on the front side of the optical matching chip 320 are connected to the pads on the circuit board 300 by gold wires, the pads on the front side of the optical chip 310 are connected to the pads on the circuit board 300 by gold wires, and the pads on the front side of the optical chip 310 are connected to the pads on the front side of the optical matching chip 320 by gold wires.

[0210] In some embodiments, the front side of the optical chip 310 faces away from the upper surface of the circuit board 300, and the back side of the optical chip 310 faces the upper surface of the circuit board 300. The pads on the front side of the optical chip 310 are connected to the pads on the circuit board 300 via gold wires. The front side of the optical matching chip 320 faces the upper surface of the circuit board 300, and the back side of the optical matching chip 320 faces away from the upper surface of the circuit board 300. The solder balls on the front side of the optical matching chip 320 are directly soldered to the pads on the circuit board 300. The solder balls on the front side of the optical matching chip 320 are connected to the pads on the front side of the optical chip 310 via a high-frequency signal line 350.

[0211] In some embodiments, the optical chip 310 and the optical matching chip 320 can be stacked.

[0212] In some embodiments, the front side of the optical chip 310 and the front side of the optical matching chip 320 both face the circuit board 300, and the back side of the optical chip 310 and the back side of the optical matching chip 320 both face away from the circuit board 300. The solder balls on the front side of the optical chip 310 are soldered to the solder pads on the back side of the optical matching chip 320, and the solder balls on the front side of the optical matching chip 320 are soldered to the circuit board 300.

[0213] In some embodiments, the front side of the optical chip 310 and the front side of the optical matching chip 320 both face away from the circuit board 300, while the back side of the optical chip 310 and the back side of the optical matching chip 320 both face the circuit board 300. The pads on the front side of the optical chip 310 are wire-connected to the circuit board 300, the pads on the front side of the optical matching chip 320 are wire-connected to the circuit board 300, and the pads on the front side of the optical chip 310 are wire-connected to the pads on the front side of the optical matching chip 320.

[0214] In some embodiments, the front side of the optical chip 310 faces away from the upper surface of the circuit board 300, and the back side of the optical chip 310 faces the upper surface of the circuit board 300. The front side of the optical matching chip 320 faces the upper surface of the circuit board 300, and the back side of the optical matching chip 320 faces away from the upper surface of the circuit board 300. The solder balls on the front side of the optical matching chip 320 are directly soldered to the pads of the circuit board 300, and the pads on the front side of the optical chip 310 are wire-connected to the pads on the back side of the optical matching chip 320.

[0215] In some embodiments, a first thermal pad 710 may be provided on the optical matching chip 320. The first thermal pad 710 can conduct heat from the optical matching chip 320 upwards. The first thermal pad 710 can be connected to the first heat sink 600 so that the first thermal pad 710 can conduct heat from the optical matching chip 320 to the first heat sink 600.

[0216] In some embodiments, a second thermally conductive pad 720 may be disposed around the optical chip 310. The second thermally conductive pad 720 is thermally connected to the optical chip 310 via a third thermally conductive assembly, so that heat from the optical chip 310 can be conducted to the second thermally conductive pad 720 through the third thermally conductive assembly. The second thermally conductive pad 720 may be connected to the cover plate 2011 of the housing 201, so that heat from the second thermally conductive pad 720 can be conducted to the housing 201. The second thermally conductive pad 720 may be connected to the first heat sink 600, so that the second thermally conductive pad 720 can conduct heat from the optical chip 310 to the first heat sink 600. For example, the third thermally conductive assembly may be a third heat sink, or a combination of a first thermally conductive via, a fourth heat sink, and a second thermally conductive via. The front side of the optical chip 310 faces away from the upper surface of the circuit board 300, while the back side faces away from the upper surface of the circuit board 300. The pads on the front side of the optical chip 310 are wire-connected to the pads on the circuit board 300. The third thermal interface material is a third heat sink. Alternatively, the front side of the optical chip 310 faces away from the upper surface of the circuit board 300, while the back side faces away from the upper surface of the circuit board 300. The solder balls on the front side of the optical chip 310 are directly connected to the circuit board 300. The third thermal interface material is a combination of the first thermal via, the fourth heat sink, and the second thermal via.

[0217] The second thermal pad 720 can be a second thermal pad 720a, a second thermal pad 720b, or a second thermal pad 720c.

[0218] In some embodiments, two first lens assemblies 400 form a set of lens assemblies. One set of lens assemblies is arranged along the length of the circuit board 300. Two sets of lens assemblies can be arranged along the length of the circuit board 300, and another two sets of lens assemblies can be arranged along the length of the circuit board 300, enabling the optical module to achieve multi-channel optical signal transmission. For example, the first and third lens assemblies can be arranged along the length of the circuit board 300, the second and fourth lens assemblies can be arranged along the length of the circuit board 300, the first and second lens assemblies can be arranged along the width of the circuit board 300, and the third and fourth lens assemblies can be arranged along the width of the circuit board 300.

[0219] In some embodiments, two lens assemblies of a set of lens assemblies may be arranged facing each other along the length of the circuit board 300.

[0220] In some embodiments, two lens assemblies of a set of lens assemblies may be arranged side by side along the length of the circuit board 300.

[0221] In some embodiments, a second thermal pad 720a may be disposed around the optical chip 310 below the first lens holder 410a on the left side of the first lens assembly or the second lens assembly. The second thermal pad 720a can conduct heat from the optical chip 310 upwards. The second thermal pad 720a can be connected to the housing 201 so that the second thermal pad 720a can conduct heat from the optical chip 310 to the first heat sink 600.

[0222] In some embodiments, the optical chip 310 below the first lens holder 410a on the right side of the first lens assembly, the optical chip 310 below the first lens holder 410a on the left side of the third lens assembly, the optical chip 310 below the first lens holder 410a on the right side of the second lens assembly, and the optical chip 310 below the first lens holder 410a on the left side of the fourth lens assembly may have a second thermally conductive pad 720b disposed around it. The second thermally conductive pad 720b can conduct heat from the optical chip 310 upwards. The second thermally conductive pad 720b can be connected to the first heat sink 600 so that the second thermally conductive pad 720b can conduct heat from the optical chip 310 to the first heat sink 600.

[0223] In some embodiments, a second thermal pad 720c may be disposed around the optical chip 310 below the first lens holder 410a on the right side of the third or fourth lens assembly. The second thermal pad 720c can conduct heat from the optical chip 310 upwards. The second thermal pad 720c can be connected to the first heat sink 600 so that the second thermal pad 720c can conduct heat from the optical chip 310 to the first heat sink 600.

[0224] like Figure 5 and Figure 6b As shown, considering the bending radius of the optical fiber, the optical fiber array 500 fixed on the optical fiber bracket 420 bends towards the central axis of the circuit board and then bundles together before running towards the opening 2131 of the optical module.

[0225] Figure 7 This is a wiring diagram of a fiber optic array for a first type of optical module provided according to some embodiments. For example... Figure 5 and Figure 7As shown, considering the bending radius of the optical fiber, the optical fiber array 500 fixed on the optical fiber bracket 420 bends towards the central axis of the circuit board and then bundles together before running towards the opening 2131 of the optical module.

[0226] Figure 8 This is a partial structural diagram of a second type of optical module provided according to some embodiments. Figure 9 This is a wiring diagram of a fiber optic array for a second type of optical module provided according to some embodiments. For example... Figure 8 and Figure 9 As shown, in some embodiments, two first lens assemblies 400 form a set of lens assemblies. One set of lens assemblies is arranged along the width direction of the circuit board 300, and four sets of lens assemblies are arranged along the length direction of the circuit board 300. This not only enables multi-channel optical signal transmission but also reduces the width space occupied by the lens assembly array on the circuit board 300, thus reducing the width dimension of the circuit board 300. For example, the first, second, third, and fourth sets of lens assemblies can be arranged along the length direction of the circuit board 300.

[0227] Considering the bending radius of the optical fiber, the optical fiber array 500, fixed on the optical fiber bracket 420, is routed and bundled towards the opening 2131 of the optical module.

[0228] Figure 10 An exploded view of a first lens assembly is provided according to some embodiments. Figure 11a This is a structural diagram of a first lens holder according to some embodiments. Figure 11b This is a cross-sectional view of a first lens holder according to some embodiments. Figure 10 , Figure 11a and Figure 11b As shown, in some embodiments, the first lens holder 410a may include a first lens holder body 411. The first lens holder body 411 is located in the optical output path of the optical chip 310, so that the first lens holder body 411 can transmit the optical signal emitted by the optical chip 310 to the fiber array 500. The optical chip 310 is located in the optical output path of the first lens holder body 411, so that the first lens holder body 411 can transmit the optical signal emitted by the fiber array 500 to the optical chip 310.

[0229] In some embodiments, the optical chip 310 and the optical matching chip 320 can be laid flat, with the optical matching chip 320 located on one side of the first lens bracket body 411, and the optical matching chip 320 can be thermally connected to the housing 201.

[0230] In some embodiments, the optical chip 310 and the optical matching chip 320 can be stacked, the first lens support body 411 covers a portion of the optical matching chip 320, and a portion of the optical matching chip 320 is exposed. The exposed portion of the optical matching chip 320 can be thermally connected to the housing 201.

[0231] In some embodiments, the first lens holder 410a may include a first arm 412. One end of the first arm 412 may be connected to one end of the first lens holder body 411, that is, the first lens holder body 411 may extend the first arm 412 to one side to increase the contact area between the first lens holder 410a and the circuit board 300 and improve the connection stability between the first lens holder 410a and the circuit board 300.

[0232] In some embodiments, the first lens holder 410a may include a second arm 413. One end of the second arm 413 may be connected to the other end of the first lens holder body 411, that is, the first lens holder body 411 may extend the second arm 413 to one side to increase the contact area between the first lens holder 410a and the circuit board 300 and improve the connection stability between the first lens holder 410a and the circuit board 300.

[0233] In some embodiments, the second arm 413 and the first arm 412 may be located on the same side of the first lens holder body 411, that is, the first lens holder body 411 extends the first arm 412 and the second arm 413 to one side, which can further increase the connection stability between the first lens holder 410a and the circuit board 300. For example, the first lens holder body 411 extends the first arm 412 and the second arm 413 in the direction of the optical matching chip 320.

[0234] Both the second arm 413 and the first arm 412 can be located on the side of the first lens bracket body 411 where the optical matching chip 320 is disposed. That is, the first arm 412 and the second arm 413 extend from the first lens bracket body 411 toward the optical matching chip 320, so that a first clearance notch 414 can be formed on the side of the first lens bracket 410a facing the optical matching chip 320. The optical matching chip 320 can be disposed at the first clearance notch 414, that is, the first arm 412 and the second arm 413 are located on both sides of the optical matching chip 320, so as to facilitate thermal connection between the optical matching chip 320 and the housing 201. The first thermally conductive pad 710 can be disposed at the first clearance notch 414 so that the first thermally conductive pad 710 can be connected to the top of the optical matching chip 320.

[0235] The above describes the first lens holder 410a and the optical matching chip 320 when they are laid flat. When the optical chip 310 and the optical matching chip 320 are stacked, the first lens holder 410a covers a portion of the optical matching chip 320. The first region of the optical matching chip 320 is located between the first arm 412 and the second arm 413, exposing the first region of the optical matching chip 320 and facilitating a thermally conductive connection between the optical matching chip 320 and the housing 201. The top of the first region of the optical matching chip 320 is connected to the first thermally conductive pad 710, enabling a thermally conductive connection between the top of the first region of the optical matching chip 320 and the housing 201.

[0236] One first lens bracket 410a can form one first clearance notch 414, and a set of first lens brackets 410a can form two first clearance notches 414.

[0237] In some embodiments, the two first clearance notches 414 of a set of lens assemblies can be arranged facing each other, such that two lens assemblies in the set of lens assemblies can be arranged facing each other along the length direction of the circuit board 300.

[0238] In some embodiments, two first clearance notches 414 of a set of lens assemblies can be arranged side by side, such that two lens assemblies in a set of lens assemblies can be arranged side by side along the length of the circuit board 300.

[0239] In some embodiments, a stop surface 4111 may be formed on the top of the first lens support body 411. The stop surface 4111 may be formed by an inward recess from the top surface 4115 of the first lens support body 411. The stop surface 4111 may be in contact with the end face of the fiber optic bracket 420. A positioning post 416 may be provided on the stop surface 4111.

[0240] In some embodiments, the height difference between the end of the stop surface 4111 away from the first support arm 412 and the stop surface 4111 is less than the height difference between the end of the stop surface 4111 near the first support arm 412 and the clearance surface 4112, so that the stop surface 4111 is an inclined surface.

[0241] In some embodiments, a clearance surface 4112 may be formed on the top of the first lens holder body 411. The clearance surface 4112 may be formed by an inward recess from the top surface 4115 of the first lens holder body 411. The clearance surface 4112 may be located between two stop surfaces 4111.

[0242] In some embodiments, the clearance surface 4112 is recessed into the stop surface 4111 so that there is a gap between the clearance surface 4112 and the end face of the fiber optic support 420. This gap can be used to accommodate the small bends or adjustment space generated during the fiber optic array routing process, so as to avoid signal attenuation or physical damage to the fiber due to excessive bending.

[0243] A transition surface 4116 can be provided between the stop surface 4111 and the top surface 4115 of the first lens bracket body 411. The transition surface 4116 is an inclined surface so that the stop surface 4111 and the top surface 4115 of the first lens bracket body 411 form a smooth transition, reducing the risk of friction between the optical fiber and the bracket edge during optical fiber routing.

[0244] In some embodiments, a first storage groove 418 may be formed at the bottom of the first lens holder 410a. The first storage groove 418 may be formed by an inward recess from the bottom of the first lens holder 410a. A first lens array 417 may be formed at the bottom of the first storage groove 418. The first lens array 417 may be located above the optical chip 310. The first lens array 417 may be a collimating / focusing lens array, so that the first lens array 417 can collimate the optical signal emitted by the optical chip 310 or focus the received optical signal onto the optical chip 310.

[0245] In some embodiments, a placement protrusion may be formed at the bottom of the first lens holder 410a. The placement protrusion may be formed by protruding outward from the bottom of the first lens holder 410a. A first lens array 417 may be formed at the top of the placement protrusion. The first lens array 417 may be located below the optical chip 310. The first lens array 417 may be a collimating / focusing lens array, so that the first lens array 417 can collimate the optical signal emitted by the optical chip 310 or focus the received optical signal onto the optical chip 310.

[0246] like Figure 11a As shown, in some embodiments, the first lens array 417 may include a sub-lens array. For example, the first lens array 417 may include a first sub-lens array 417a. The first sub-lens array 417a may include eight first sub-lenses. The first sub-lens array 417a can receive optical signals emitted by the optical chip 310 or focus received optical signals onto the optical chip 310.

[0247] In some embodiments, the first lens array 417 may include a plurality of sub-lens arrays. For example, the first lens array 417 may include a first sub-lens array 417a and a second sub-lens array, which are arranged side-by-side. The first lens array 417 includes a first sub-lens array 417a, a second sub-lens array, a fifth sub-lens array, and a sixth sub-lens array, which are arranged side-by-side.

[0248] In some embodiments, a second storage slot 4113 may be formed on the top of the first lens holder 410a. The second storage slot 4113 may be formed by an inward recess from the top of the first lens holder 410a. A second lens array 415 may be disposed within the second storage slot 4113. The second lens array 415 may be located in the light output path of the first lens array 417. The second lens array 415 may be a collimating / focusing lens array, so that the second lens array 415 can collimate / focus the light signal emitted from the fiber array 500 into the fiber array 500.

[0249] In some embodiments, the first lens array 417 is located above the optical chip 310, and the second lens array 415 may be located above the first lens array 417, so that the second lens array 415 may be located in the light output path of the first lens array 417.

[0250] In some embodiments, the first lens array 417 is located below the optical chip 310, and the second lens array 415 may be located below the first lens array 417, so that the second lens array 415 can be located in the light output path of the first lens array 417.

[0251] like Figure 11b As shown, in some embodiments, the second lens array 415 may include a sub-lens array. For example, the second lens array 415 may include a third sub-lens array 415a. The third sub-lens array 415a may be located in the light-emitting path of the first sub-lens array 417a, and the first sub-lens array 417a may be located in the light-emitting path of the third sub-lens array 415a.

[0252] The first lens array 417 of the first lens holder 410a includes a first sub-lens array 417a, the second lens array 415 of the first lens holder 410a includes a third sub-lens array 415a, and the first lens holder 410a may be the first lens holder 410c.

[0253] like Figure 11bAs shown, in some embodiments, the first lens holder 410a is located above the optical chip 310, and the third sub-lens array 415a can be located above the first sub-lens array 417a, so that the third sub-lens array 415a can be located in the light output path of the first sub-lens array 417a, and the first sub-lens array 417a can be located in the light output path of the third sub-lens array 415a.

[0254] In some embodiments, the first lens holder 410a is located below the optical chip 310, and the third sub-lens array 415a may be located below the second sub-lens array 417b, so that the third sub-lens array 415a may be located in the light output path of the first sub-lens array 417a, and the first sub-lens array 417a may be located in the light output path of the third sub-lens array 415a.

[0255] In some embodiments, the second lens array 415 may include multiple sub-lens arrays. For example, the second lens array 415 may include a third sub-lens array 415a and a fourth sub-lens array, arranged side-by-side. The third sub-lens array 415a may be located in the light-emitting path of the first sub-lens array 417a, and the fourth sub-lens array may be located in the light-emitting path of the second sub-lens array. Alternatively, the second lens array 415 may include a third sub-lens array 415a, a fourth sub-lens array, a seventh sub-lens array, and an eighth sub-lens array, arranged side-by-side. The third sub-lens array 415a may be located in the light-emitting path of the first sub-lens array 417a, the fourth sub-lens array may be located in the light-emitting path of the second sub-lens array, the seventh sub-lens array may be located in the light-emitting path of the fifth sub-lens array, and the eighth sub-lens array may be located in the light-emitting path of the sixth sub-lens array.

[0256] The first lens array 417 is located above the optical chip 310. The third sub-lens array 415a can be located above the first sub-lens array 417a. The fourth sub-lens array can be located above the second sub-lens array. The seventh sub-lens array can be located above the fifth sub-lens array. The eighth sub-lens array can be located above the sixth sub-lens array, so that the second lens array 415 can be located above the first lens array 417, thereby allowing the second lens array 415 to be located in the light output path of the first lens array 417.

[0257] The first lens array 417 is located below the optical chip 310. The third sub-lens array 415a can be located below the first sub-lens array 417a. The fourth sub-lens array can be located below the second sub-lens array. The seventh sub-lens array can be located below the fifth sub-lens array. The eighth sub-lens array can be located below the sixth sub-lens array. The second lens array 415 is located in the light output path of the first lens array 417, so that the second lens array 415 can be located below the first lens array 417, thereby allowing the second lens array 415 to be located in the light output path of the first lens array 417.

[0258] Figure 12a Another structure of a first lens holder according to some embodiments. Figure 1 . Figure 12b Another structure of a first lens holder according to some embodiments. Figure 2 . Figure 12c This is a cross-sectional view of another first lens holder provided according to some embodiments. Figure 12a and Figure 12b As shown, the first lens array 417 of the first lens holder 410a includes a first sub-lens array 417a and a second sub-lens array 417b, the second lens array 415 of the first lens holder 410a includes a third sub-lens array 415a and a fourth sub-lens array 415b, and the first lens holder 410a may be the first lens holder 410d.

[0259] Figure 13a This is a structural diagram of a fiber optic bracket provided according to some embodiments. Figure 13b This is a cross-sectional view of a fiber optic bracket provided according to some embodiments. Figure 14 This is a structural diagram of a first lens assembly provided according to some embodiments. For example... Figure 13a , Figure 13b and Figure 14 As shown, in some embodiments, the fiber optic bracket 420 can be a first fiber optic bracket 420a, which can form a positioning hole 423. The positioning hole 423 can be correspondingly provided with a positioning post 416. The positioning post 416 can be inserted into the positioning hole 423 to achieve precise positioning between the lens bracket 410 and the first fiber optic bracket 420a. The cooperation between the positioning hole 423 and the positioning post 416 can ensure the stability of the relative position between the first fiber optic bracket 420a and the lens bracket 410, thereby improving the optical coupling efficiency and optical transmission performance of the optical module.

[0260] In some embodiments, the positioning hole 423 may be recessed inward from the end face 427 of the first fiber optic bracket 420a, but not penetrate to the front end face of the first fiber optic bracket 420a, so as to avoid the positioning hole 423 affecting the structural strength of the first fiber optic bracket 420a. The shape and size of the positioning hole 423 may match the positioning post 416 to ensure that the two can fit tightly and prevent loosening.

[0261] In some embodiments, the positioning hole 423 can extend from the end face 427 of the first fiber optic bracket 420a to the front face of the first fiber optic bracket 420a, forming a through hole. The positioning post 416 can pass through the through hole to increase the connection stability between the lens bracket 410 and the first fiber optic bracket 420a.

[0262] Since the first fiber optic bracket 420a is positioned above the lens bracket 410, the front end face of the first fiber optic bracket 420a can be positioned above the rear end face 427 of the first fiber optic bracket 420a, so that the fiber optic array 500 inside the first fiber optic bracket 420a is positioned from bottom to top.

[0263] In some embodiments, a first jacking hole 422 may be formed at the front end of the first fiber optic bracket 420a. The first jacking hole 422 may be located between two positioning holes 423. The fiber optic array 500 may be inserted into the first jacking hole 422 so that the fiber optic array 500 can be fixed to the first fiber optic bracket 420a.

[0264] In some embodiments, a fixing groove 426 may be formed in the middle of the first fiber optic bracket 420a. The optical fibers of the fiber optic array 500 can be inserted into the first jack 422 and placed in the fixing groove 426 so that the fiber optic array 500 can be fixed in the first fiber optic bracket 420a.

[0265] In some embodiments, a second insertion hole 424 may be formed at the end of the first fiber optic bracket 420a. The second insertion hole 424 may be located between two positioning holes 423. The second insertion hole 424 may communicate with a fixing groove 426 so that the optical fiber located in the fixing groove 426 can extend into the second insertion hole 424 until it extends out of the end face of the first fiber optic bracket 420a.

[0266] like Figure 13a and Figure 13b As shown, in some embodiments, the second jack 424 may include a first sub-jack 424a, which can be inserted into the first sub-fiber array. The first sub-jack 424a may be located in the output optical path of the third sub-lens array 415a, so that the first sub-fiber array can be located in the output optical path of the third sub-lens array 415a.

[0267] In some embodiments, the second lens array 415 is located above the first lens array 417, and the second jack 424 may be located above the second lens array 415 so that the fiber array 500 can be located above the second lens array 415. For example, the first sub-jack 424a may be located above the third sub-lens array 415a so that the first sub-fiber array is located above the third sub-lens array 415a.

[0268] In some embodiments, the second lens array 415 is located below the first lens array 417, and the second jack 424 may be located below the second lens array 415, so that the fiber array 500 can be located below the second lens array 415. For example, the first sub-jack 424a may be located below the third sub-lens array 415a, so that the first sub-fiber array is located below the third sub-lens array 415a.

[0269] In some embodiments, an observation hole 425 may be formed on the top of the first fiber optic bracket 420a. The observation hole 425 may communicate with the fixing groove 426 inside the first fiber optic bracket 420a, so as to observe the insertion of the fiber optic cables of the fiber array 500 into the first fiber optic bracket 420a through the observation hole 425. After the fiber optic cable is inserted into the first fiber optic bracket 420a through the first insertion hole 422, sealant may be applied to the observation hole 425 to form a sealing adhesive, thereby sealing the observation hole 425.

[0270] The stop surface 4111 of the lens bracket 410 can be correspondingly set with the end face 427 of the first fiber bracket 420a, and the end face 427 of the first fiber bracket 420a can contact and connect with the stop surface 4111 of the lens bracket 410 so that the first fiber bracket 420a is connected to the lens bracket 410.

[0271] In some embodiments, the end face 427 of the first fiber optic bracket 420a can be inclined and the end face 427 of the first fiber optic bracket 420a is parallel to the stop face 4111, which can increase the contact area between the stop face 4111 and the end face 427 of the first fiber optic bracket 420a, thereby improving the connection stability between the first fiber optic bracket 420a and the lens bracket 410.

[0272] Figure 15 A partial cross-sectional view of a first type of optical module provided according to some embodiments. Figure 1 .like Figure 15As shown, the optical chip 310 is disposed below the lens support 410, the first sub-lens array 417a is located above the optical chip 310, the third sub-lens array 415a is located above the first sub-lens array 417a, and the fiber array 500 of the first fiber support 420a is located above the third sub-lens array 415a. The optical signal emitted by the optical chip 310 is sequentially collimated by the first sub-lens array 417a and focused into the fiber array 500 by the third sub-lens array 415a, or the optical signal emitted by the fiber array 500 is sequentially collimated by the third sub-lens array 415a and focused into the optical chip 310 by the first sub-lens array 417a.

[0273] Figure 16 This is a structural diagram of a housing according to some embodiments. Figure 16 As shown, in some embodiments, the cover plate 2011 may include an inner top surface 2111.

[0274] In some embodiments, the cover plate 2011 may be recessed inward to form a third clearance groove 2112. The third clearance groove 2112 may allow the fiber optic array 500 to pass through.

[0275] In some embodiments, the third side plate 2015 may be recessed inward to form a storage notch 2151. The storage notch 2151 may avoid the second thermal pad 720a, so that the second thermal pad 720a can be disposed at the storage notch 2151, and the heat on the second thermal pad 720a can be conducted to the first heat sink 600.

[0276] In some embodiments, the middle of the third side plate 2015 protrudes outward to form a limiting protrusion 2152. The limiting protrusion 2152 can contact and connect with one end face of the circuit board 300 to define the position of the circuit board 300 in the housing 201.

[0277] In some embodiments, housing 201 may include a base plate 2014. One end of the base plate 2014 may be connected to a second side plate 2013 having an opening 2131, both sides of the base plate 2014 are respectively connected to a first side plate 2012, and the other end of the base plate 2014 is not connected to a third side plate 2015, so that one end of housing 201 faces downward. The downward opening of housing 201 covers the circuit board 300, so that the optical module forms a relatively closed cavity.

[0278] Figure 17a This is a partial cross-sectional schematic diagram of a third type of optical module provided according to some embodiments. Figure 17aAs shown, the front sides of the optical chip 310 and the optical matching chip 320 face away from the upper surface of the circuit board 300, while the back sides of the optical chip 310 and the optical matching chip 320 face the upper surface of the circuit board 300. The pads on the front of the optical matching chip 320 are connected to the pads on the circuit board 300 via gold wires, as are the pads on the front of the optical chip 310 and the optical matching chip 320. The lens bracket 410 can be located above the optical chip 310.

[0279] In some embodiments, a third storage slot 330 may be formed on the top of the circuit board 300, and a third heat sink 600b may be disposed in the third storage slot 330. An optical chip 310 may be disposed at one top end of the third heat sink 600b so that heat on the optical chip 310 can be conducted to the third heat sink 600b.

[0280] The third heat sink 600b can be made of ceramic or metal thermally conductive materials, which not only allows the third heat sink 600b to conduct heat away, but also supports the optical chip 310.

[0281] Figure 17b This is a cross-sectional schematic diagram of a third type of optical module provided according to some embodiments. Figure 17c This is a cross-sectional schematic diagram of a fourth type of optical module provided according to some embodiments. Figure 17d This is a partial structural diagram of a third type of optical module provided according to some embodiments. For example... Figure 17b , Figure 17c and Figure 17d As shown, in some embodiments, a second thermal pad 720 may be provided at the other end of the top of the third heat sink 600b so that heat on the third heat sink 600b can be conducted to the second thermal pad 720.

[0282] In some embodiments, the top of the optical matching chip 320 may be connected to the bottom of the first thermal pad 710, and the top of the first thermal pad 710 may be connected to the housing 201, so that the heat on the optical matching chip 320 can be conducted to the outside of the optical module 200 in sequence through the first thermal pad 710 and the housing 201.

[0283] In some embodiments, the width of the first thermal pad 710 is smaller than the width of the optical matching chip 320, and the length of the first thermal pad 710 is smaller than the length of the optical matching chip 320, so that the edge of the optical matching chip 320 can be exposed, which facilitates the setting of pads on the edge of the optical matching chip 320, and thus facilitates wire bonding connection between the optical matching chip 320 and other devices.

[0284] In some embodiments, the top of the optical matching chip 320 can be connected to the bottom of the second heat sink 600a, the top of the second heat sink 600a can be connected to the bottom of the first thermal pad 710, and the top of the first thermal pad 710 can be connected to the housing 201, so that the heat on the optical matching chip 320 can be conducted to the outside of the optical module 200 in sequence through the second heat sink 600a, the first thermal pad 710 and the housing 201.

[0285] The material of the second heat sink 600a can be ceramic material or other non-metallic thermally conductive material, so that the second heat sink 600a can conduct heat away.

[0286] In some embodiments, the second heat sink 600a may include a first heat sink substrate 610a and a second heat sink substrate 620a. The top of the first heat sink substrate 610a may be connected to the first thermal pad 710, the bottom of the first heat sink substrate 610a may be connected to the top of the second heat sink substrate 620a, and the bottom of the second heat sink substrate 620a may be connected to the top of the optical matching chip 320, so that the heat on the optical matching chip 320 can be conducted to the housing 201 in sequence through the second heat sink substrate 620a, the first heat sink substrate 610a and the first thermal pad 710.

[0287] In some embodiments, the length of the second heat dissipation substrate 620a is smaller than the length of the optical matching chip 320, and the width of the second heat dissipation substrate 620a is smaller than the width of the optical matching chip 320, so that the edge of the optical matching chip 320 can be exposed, which facilitates the setting of pads on the edge of the optical matching chip 320, and thus facilitates wire bonding connection between the optical matching chip 320 and other devices.

[0288] In some embodiments, the length of the second heat dissipation substrate 620a is smaller than the length of the first heat dissipation substrate 610a, and the width of the second heat dissipation substrate 620a is smaller than the width of the first heat dissipation substrate 610a, so that the second heat dissipation component 600a can form a seventh clearance notch 650a. The seventh clearance notch 650a not only increases the contact area between the first heat dissipation component 600a and the first thermal pad 710, improving thermal conductivity, but also provides space for the gold wire to protect it from being squeezed by the first thermal pad 710.

[0289] In some embodiments, the second heat sink 600a may include a third heat sink substrate 630a. The top of the third heat sink substrate 630a may be connected to one side of the bottom of the first heat sink substrate 610a, and the bottom of the third heat sink substrate 630a may be connected to the circuit board 300 to guide the force point to the circuit board 300, avoid the optical matching chip 320 from being directly subjected to force, and thus protect the optical matching chip 320.

[0290] In some embodiments, the second heat sink 600a may include a fourth heat sink substrate 640a. The top of the fourth heat sink substrate 640a may be connected to the other side of the bottom of the first heat sink substrate 610a, and the bottom of the fourth heat sink substrate 640a may be connected to the circuit board 300 to guide the force point to the circuit board 300, avoid the optical matching chip 320 from being directly subjected to force, and thus protect the optical matching chip 320.

[0291] In some embodiments, the cover plate 2011a of the housing 201 may form a first snap-fit ​​protrusion 2111a, which may be connected to the top of the first thermal pad 710 so that heat on the first thermal pad 710 can be conducted to the first snap-fit ​​protrusion 2111a.

[0292] In some embodiments, the cover plate 2011a of the housing 201 may form a second snap-fit ​​protrusion 2112a, which may be connected to the top of the second thermal pad 720 so that heat on the second thermal pad 720 can be conducted to the second snap-fit ​​protrusion 2112a.

[0293] like Figure 17b As shown, the first thermally conductive assembly includes a second heat sink 600a and a first thermally conductive pad 710, and the second thermally conductive assembly includes a third heat sink 600b and a second thermally conductive pad 720.

[0294] like Figure 17c As shown, the first thermally conductive assembly includes a first thermally conductive pad 710, and the second thermally conductive assembly includes a third heat sink 600b and a second thermally conductive pad 720.

[0295] In some embodiments, the second snap-fit ​​protrusion 2112a protrudes beyond the first snap-fit ​​protrusion 2111a, allowing the second snap-fit ​​protrusion 2112a to better contact the top of the second thermal pad 720, thereby more efficiently conducting heat from the second thermal pad 720. This structural design of the first snap-fit ​​protrusion 2111a and the second snap-fit ​​protrusion 2112a also enhances the overall structural strength of the housing 201 to a certain extent, ensuring that the housing 201 will not deform due to excessive local stress during heat conduction, thus ensuring the stability and reliability of the entire optical module structure and providing a stable and suitable working environment for the internal components of the optical module.

[0296] In some embodiments, there is a gap between the first snap-fit ​​protrusion 2111a and the second snap-fit ​​protrusion 2112a. This gap can accommodate the lens holder 410, making the lens holder 410 more stable in the optical module, reducing the positional displacement of the lens assembly caused by the movement or vibration of the optical module, and ensuring the stability of optical signal transmission. For example, the first snap-fit ​​protrusion 2111a and the second snap-fit ​​protrusion 2112a can form a fourth storage slot 2113a, which can accommodate the lens holder 410.

[0297] Figure 17e This is a heat dissipation distribution diagram for a third type of optical module provided according to some embodiments. For example... Figure 17e As shown, the top of the optical matching chip 320 is connected to the first snap-fit ​​protrusion 2111a through the first thermal pad 710, so that the heat of the optical matching chip 320 is conducted to the first snap-fit ​​protrusion 2111a through the second heat sink 600a and the first thermal pad 710 in sequence.

[0298] like Figure 17e As shown, the optical chip 310 is located on one end of the third heat sink 600b, and the second thermal pad 720 is located on the other end of the third heat sink 600b. The top of the second thermal pad 720 is connected to the second snap-fit ​​protrusion 2112a, so that the heat of the optical chip 310 is conducted to the second snap-fit ​​protrusion 2112a in sequence through the third heat sink 600b and the second thermal pad 720.

[0299] like Figure 17e As shown, the fiber array 500 extends upward from the vertical circuit board 300 and bends to be parallel to the circuit board 300, and then extends along the length of the circuit board 300 toward the opening 2131 of the optical module.

[0300] Figure 18a This is a partial cross-sectional schematic diagram of a fifth optical module provided according to some embodiments. Figure 18a As shown, the front side of the optical chip 310 faces away from the upper surface of the circuit board 300, and the back side of the optical chip 310 faces the upper surface of the circuit board 300. The pads on the front side of the optical chip 310 are connected to the pads on the circuit board 300 via gold wires. The front side of the optical matching chip 320 faces the upper surface of the circuit board 300, and the back side of the optical matching chip 320 faces away from the upper surface of the circuit board 300. The solder balls on the front side of the optical matching chip 320 are directly soldered to the pads on the circuit board 300. The solder balls on the front side of the optical matching chip 320 are connected to the pads on the front side of the optical chip 310 via a high-frequency signal line 350. The lens bracket 410 can be located above the optical chip 310.

[0301] In some embodiments, a third storage slot 330 may be formed on the top of the circuit board 300, and a third heat sink 600b may be disposed in the third storage slot 330. An optical chip 310 may be disposed at one top end of the third heat sink 600b so that heat on the optical chip 310 can be conducted to the third heat sink 600b.

[0302] Figure 18b This is a cross-sectional schematic diagram of a fifth type of optical module provided according to some embodiments. Figure 18c This is a cross-sectional schematic diagram of a sixth optical module provided according to some embodiments. Figure 18d This is a partial structural diagram of a fifth optical module provided according to some embodiments. Figure 18b , Figure 18c and Figure 18d As shown, in some embodiments, a second thermal pad 720 may be provided at the other end of the top of the third heat sink 600b so that heat on the third heat sink 600b can be conducted to the second thermal pad 720.

[0303] In some embodiments, the top of the optical matching chip 320 can be connected to the bottom of the second heat sink 600a, the top of the second heat sink 600a can be connected to the bottom of the first thermal pad 710, and the top of the first thermal pad 710 can be connected to the housing 201, so that the heat on the optical matching chip 320 can be conducted to the outside of the optical module 200 in sequence through the second heat sink 600a, the first thermal pad 710 and the housing 201.

[0304] In some embodiments, the top of the optical matching chip 320 can be connected to the bottom of the first thermal pad 710, and the top of the first thermal pad 710 can be connected to the housing 201. This not only allows the heat on the optical matching chip 320 to be conducted to the outside of the optical module 200 through the first thermal pad 710 and the housing 201 in sequence, but also simplifies the structure of the optical module and facilitates its assembly.

[0305] In some embodiments, the cover plate 2011a of the housing 201 may form a first snap-fit ​​protrusion 2111a, which may be connected to the top of the first thermal pad 710 so that heat on the first thermal pad 710 can be conducted to the first snap-fit ​​protrusion 2111a.

[0306] In some embodiments, the cover plate 2011a of the housing 201 may form a second snap-fit ​​protrusion 2112a, which may be connected to the top of the second thermal pad 720 so that heat on the second thermal pad 720 can be conducted to the second snap-fit ​​protrusion 2112a.

[0307] like Figure 18bAs shown, the first thermally conductive assembly includes a first thermally conductive pad 710, and the second thermally conductive assembly includes a third heat sink 600b and a second thermally conductive pad 720.

[0308] like Figure 18c As shown, the first thermally conductive assembly includes a second heat sink 600a and a first thermally conductive pad 710, and the second thermally conductive assembly includes a third heat sink 600b and a second thermally conductive pad 720.

[0309] In some embodiments, the second snap-fit ​​protrusion 2112a protrudes beyond the first snap-fit ​​protrusion 2111a, allowing the second snap-fit ​​protrusion 2112a to better contact the top of the second thermal pad 720, thereby more efficiently conducting heat from the second thermal pad 720. This structural design of the first snap-fit ​​protrusion 2111a and the second snap-fit ​​protrusion 2112a also enhances the overall structural strength of the housing 201 to a certain extent, ensuring that the housing 201 will not deform due to excessive local stress during heat conduction, thus ensuring the stability and reliability of the entire optical module structure and providing a stable and suitable working environment for the internal components of the optical module.

[0310] In some embodiments, the first snap-fit ​​protrusion 2111a and the second snap-fit ​​protrusion 2112a can form a fourth storage slot 2113a, which can hold the lens bracket 410 to make the position of the lens bracket 410 in the optical module more stable, reduce the positional displacement of the lens assembly caused by the movement or vibration of the optical module, and ensure the stability of optical signal transmission.

[0311] Figure 19a This is a partial cross-sectional schematic diagram of a seventh optical module provided according to some embodiments. Figure 19b This is a cross-sectional schematic diagram of a seventh optical module provided according to some embodiments. Figure 19c This is a partial structural diagram of a seventh optical module according to some embodiments. Figure 19a , Figure 19b and Figure 19c As shown, the front of the optical chip 310 and the front of the optical matching chip 320 both face the upper surface of the circuit board 300, while the back of the optical chip 310 and the back of the optical matching chip 320 both face away from the upper surface of the circuit board 300. The solder balls on the front of the optical matching chip 320 are directly soldered to the pads of the circuit board 300, and the solder balls on the front of the optical chip 310 are also directly soldered to the pads of the circuit board 300. The solder balls on the front of the optical matching chip 320 and the solder balls on the front of the optical chip 310 are connected through a high-frequency signal line 350. The lens bracket 410 can be located above the optical chip 310.

[0312] In some embodiments, a fourth heat sink 600c may be provided on the intermediate layer of the circuit board 300. One end of the fourth heat sink 600c may be connected to the grounding solder ball of the optical chip 310 through a first thermally conductive via 361, so that the heat of the optical chip 310 can be conducted to the fourth heat sink 600c through the first thermally conductive via 361. The other end of the fourth heat sink 600c may be connected to the second thermally conductive pad 720 through a second thermally conductive via 362, so that the heat of the fourth heat sink 600c can be conducted to the second thermally conductive pad 720 through the second thermally conductive via 362.

[0313] In some embodiments, the top of the optical matching chip 320 may be connected to the bottom of the first thermal pad 710, and the top of the first thermal pad 710 may be connected to the housing 201, so that the heat on the optical matching chip 320 can be conducted to the outside of the optical module 200 in sequence through the second heat sink 600a, the first thermal pad 710 and the housing 201.

[0314] In some embodiments, the cover plate 2011a of the housing 201 may form a first snap-fit ​​protrusion 2111a, which may be connected to the top of the first thermal pad 710 so that heat on the first thermal pad 710 can be conducted to the first snap-fit ​​protrusion 2111a.

[0315] In some embodiments, the cover plate 2011a of the housing 201 may form a second snap-fit ​​protrusion 2112a, which may be connected to the top of the second thermal pad 720 so that heat on the second thermal pad 720 can be conducted to the second snap-fit ​​protrusion 2112a.

[0316] like Figure 19b As shown, the first thermally conductive assembly includes a first thermally conductive pad 710, and the second thermally conductive assembly includes a first thermally conductive via 361, a fourth heat sink 600c, a second thermally conductive via 362, and a second thermally conductive pad 720.

[0317] In some embodiments, the second snap-fit ​​protrusion 2112a protrudes beyond the first snap-fit ​​protrusion 2111a, allowing the second snap-fit ​​protrusion 2112a to better contact the top of the second thermal pad 720, thereby more efficiently conducting heat from the second thermal pad 720. This structural design of the first snap-fit ​​protrusion 2111a and the second snap-fit ​​protrusion 2112a also enhances the overall structural strength of the housing 201 to a certain extent, ensuring that the housing 201 will not deform due to excessive local stress during heat conduction, thus ensuring the stability and reliability of the entire optical module structure and providing a stable and suitable working environment for the internal components of the optical module.

[0318] In some embodiments, the first snap-fit ​​protrusion 2111a and the second snap-fit ​​protrusion 2112a can form a fourth storage slot 2113a, which can hold the lens bracket 410 to make the position of the lens bracket 410 in the optical module more stable, reduce the positional displacement of the lens assembly caused by the movement or vibration of the optical module, and ensure the stability of optical signal transmission.

[0319] Figure 19d This is a heat dissipation distribution diagram for a seventh type of optical module provided according to some embodiments. For example... Figure 19d As shown, the optical matching chip 320 is connected to the first snap-fit ​​protrusion 2111a through the first thermal pad 710, so that the heat of the optical matching chip 320 is conducted to the first snap-fit ​​protrusion 2111a through the first thermal pad 710.

[0320] like Figure 19d As shown, a second thermal pad 720 is provided around the optical chip 310. The top of the second thermal pad 720 is connected to the second snap-fit ​​protrusion 2112a, so that the heat of the optical chip 310 is conducted to the second snap-fit ​​protrusion 2112a in sequence through the third heat sink 600b and the second thermal pad 720.

[0321] like Figure 19d As shown, the fiber array 500 extends upward from the vertical circuit board 300 and bends to be parallel to the circuit board 300, and then extends along the length of the circuit board 300 toward the opening 2131 of the optical module.

[0322] Figure 20a This is a partial structural diagram of a ninth type of optical module provided according to some embodiments. Figure 20b This is a partial exploded view of a ninth optical module provided according to some embodiments. Figure 21 This is an exploded view of a second lens assembly provided according to some embodiments. Figure 20a , Figure 20b and Figure 21 As shown, in some embodiments, the lens assembly may be a second lens assembly 400a, which may include a second lens bracket 410b and an optical fiber bracket 420, with the optical fiber bracket 420 and the second lens bracket 410b arranged along the height direction of the circuit board 300.

[0323] In some embodiments, the optical module may include at least two second lens assemblies 400a, which may be arranged along the length of the circuit board 300. The two second lens assemblies 400a may form a fifth lens assembly and a sixth lens assembly, which may be arranged along the width of the circuit board, enabling the optical module to achieve multi-channel optical signal transmission.

[0324] In some embodiments, the solder balls on the front side of the optical chip 310 are directly soldered to the pads on the back side of the optical matching chip 320, making the connection line between the optical chip 310 and the optical matching chip 320 extremely short. The extremely short connection line almost eliminates these parasitic effects, enabling the channel to support higher speeds and significantly reducing parasitic parameters.

[0325] Figure 22a This is a structural diagram of a second lens holder according to some embodiments. Figure 22b This is a structural diagram of another second lens holder provided according to some embodiments. Figure 22c This is a cross-sectional view of a second lens holder according to some embodiments. Figure 22a , Figure 22b and Figure 22c As shown, in some embodiments, the second lens holder 410b may include a second lens holder body 411a. The second lens holder body 411a may be located in the output optical path of the optical chip 310, so that the second lens holder body 411a can transmit the optical signal emitted by the optical chip 310 to the fiber array 500. The optical chip 310 is located in the output optical path of the second lens holder body 411a, so that the second lens holder body 411a can transmit the optical signal emitted by the fiber array 500 to the optical chip 310.

[0326] In some embodiments, the optical chip 310 and the optical matching chip 320 can be laid flat, with the optical matching chip 320 located on one side of the second lens bracket body 411a, and the optical matching chip 320 can be thermally connected to the housing 201.

[0327] In some embodiments, the optical chip 310 and the optical matching chip 320 can be stacked, the second lens bracket body 411a covers a portion of the optical matching chip 320, and a portion of the optical matching chip 320 is exposed. The exposed portion of the optical matching chip 320 can be thermally connected to the housing 201.

[0328] In some embodiments, the second lens holder 410b may include a first arm 412a. The middle of the first arm 412a may be connected to one end of the second lens holder body 411a to increase the contact area between the lens holder 410a and the circuit board 300 and improve the connection stability between the lens holder 410a and the circuit board 300.

[0329] In some embodiments, the second lens holder 410b may include a second arm 413a. The middle of the second arm 413a may be connected to the other end of the second lens holder body 411a to increase the contact area between the second lens holder 410b and the circuit board 300 and improve the connection stability between the second lens holder 410b and the circuit board 300.

[0330] The second lens support body 411a extends two arms to both sides. The two arms located at one end of the second lens support body 411a are the first arms 412a, and the two arms located at the other end of the second lens support body 411a are the second arms 413b. (The two arms located on the same side of the second lens support body 411a are also mentioned.)

[0331] The first arm 412a, the second lens bracket body 411a, and the second arm 413a are connected in sequence so that the second lens bracket 410b can form a first clearance notch 414 and a second clearance notch 414a. The first clearance notch 414 and the second clearance notch 414a can be arranged opposite to each other so that the lens bracket 410a can be in the shape of "H".

[0332] In some embodiments, a light matching chip 320 may be provided in the first clearance notch 414 or the second clearance notch 414a, that is, a light matching chip 320 may be provided between the two arms located on the same side of the second lens bracket body 411a, so that the light matching chip 320 can be thermally connected to the housing 201.

[0333] The above describes the second lens holder 410b and the optical matching chip 320 when the optical chip 310 and the optical matching chip 320 are laid flat. When the optical chip 310 and the optical matching chip 320 are stacked, the second lens holder 410b covers a portion of the optical matching chip 320. The second region of the optical matching chip 320 is the area between the two arms on the same side of the second lens holder body 411a, so that the second region of the optical matching chip 320 is exposed, facilitating thermal conductivity between the optical matching chip 320 and the housing 201. The top of the second region of the optical matching chip 320 is connected to the first thermal pad 710, so that the top of the second region of the optical matching chip 320 is thermally connected to the housing 201.

[0334] like Figure 22a As shown, in some embodiments, a first storage groove 418a may be formed at the bottom of the second lens holder 410b. The first storage groove 418a may be formed by an inward recess from the bottom of the second lens holder 410b. A first lens array 417 may be formed at the bottom of the first storage groove 418a. The first lens array 417 may be located above the optical chip 310. The first lens array 417 may be a collimating / focusing lens array, so that the first lens array 417 can collimate the optical signal emitted by the optical chip 310 or focus the received optical signal onto the optical chip 310.

[0335] like Figure 22bAs shown, in some embodiments, a placement protrusion 419 may be formed at the bottom of the second lens holder 410b. The placement protrusion 419 may be formed by protruding outward from the bottom of the second lens holder 410b. A first lens array 417 may be formed at the top of the placement protrusion 419. The first lens array 417 may be located below the optical chip 310. The first lens array 417 may be a collimating / focusing lens array, so that the first lens array 417 can collimate the optical signal emitted by the optical chip 310 or focus the received optical signal onto the optical chip 310.

[0336] In some embodiments, the first lens array 417 may include a sub-lens array. For example, the first lens array 417 may include a first sub-lens array 417a. The first sub-lens array 417a may include eight first sub-lenses. The first sub-lens array 417a may receive optical signals emitted by the optical chip 310 or focus received optical signals onto the optical chip 310.

[0337] In some embodiments, the first lens array 417 may include a plurality of sub-lens arrays. For example, the first lens array 417 may include a first sub-lens array 417a and a second sub-lens array 417b, which are arranged side-by-side, such as... Figure 27a and Figure 27b As shown. The first lens array 417 includes a first sub-lens array 417a, a second sub-lens array 417b, a fifth sub-lens array, and a sixth sub-lens array, which are arranged side by side.

[0338] In some embodiments, a second storage slot 4113a may be formed on the top of the second lens holder 410b. The second storage slot 4113a may be formed by an inward recess from the top of the second lens holder 410b. A second lens array 415 may be disposed within the second storage slot 4113a. The second lens array 415 may be located in the light output path of the first lens array 417. The second lens array 415 may be a collimating / focusing lens array, so that the second lens array 415 can collimate / focus the light signal emitted from the fiber array 500 into the fiber array 500.

[0339] In some embodiments, the first lens array 417 is located above the optical chip 310, and the second lens array 415 may be located above the first lens array 417, so that the second lens array 415 may be located in the light output path of the first lens array 417.

[0340] In some embodiments, the first lens array 417 is located below the optical chip 310, and the second lens array 415 may be located below the first lens array 417, so that the second lens array 415 can be located in the light output path of the first lens array 417.

[0341] In some embodiments, the second lens array 415 may include a sub-lens array. For example, the second lens array 415 may include a third sub-lens array 415a. The third sub-lens array 415a may be located in the light output path of the first sub-lens array 417a, and the first sub-lens array 417a may be located in the light output path of the third sub-lens array 415a.

[0342] In some embodiments, the first lens array 417 is located above the optical chip 310, and the third sub-lens array 415a may be located above the first sub-lens array 417a, so that the third sub-lens array 415a may be located in the light output path of the first sub-lens array 417a, and the first sub-lens array 417a may be located in the light output path of the third sub-lens array 415a.

[0343] In some embodiments, the first lens array 417 is located below the optical chip 310, and the third sub-lens array 415a may be located below the first sub-lens array 417a, so that the third sub-lens array 415a may be located in the light output path of the first sub-lens array 417a, and the first sub-lens array 417a may be located in the light output path of the third sub-lens array 415a.

[0344] In some embodiments, the second lens array 415 may include multiple sub-lens arrays. For example, the second lens array 415 may include a third sub-lens array 415a and a fourth sub-lens array 415b, arranged side-by-side. The third sub-lens array 415a may be located in the light-emitting path of the first sub-lens array 417a, and the fourth sub-lens array 415b may be located in the light-emitting path of the second sub-lens array 417b, such as... Figure 26 As shown. The second lens array 415 may include a third sub-lens array 415a, a fourth sub-lens array 415b, a seventh sub-lens array, and an eighth sub-lens array. The third sub-lens array 415a, the fourth sub-lens array 415b, the seventh sub-lens array, and the eighth sub-lens array are arranged side by side. The third sub-lens array 415a may be located in the light output path of the first sub-lens array 417a, the fourth sub-lens array 415b may be located in the light output path of the second sub-lens array 417b, the seventh sub-lens array may be located in the light output path of the fifth sub-lens array, and the eighth sub-lens array may be located in the light output path of the sixth sub-lens array.

[0345] The first lens array 417 is located above the optical chip 310. The third sub-lens array 415a can be located above the first sub-lens array 417a. The fourth sub-lens array 415b can be located above the second sub-lens array 417b. The seventh sub-lens array can be located above the fifth sub-lens array. The eighth sub-lens array can be located above the sixth sub-lens array, so that the second lens array 415 can be located above the first lens array 417, thereby allowing the second lens array 415 to be located in the light output path of the first lens array 417.

[0346] The first lens array 417 is located below the optical chip 310. The third sub-lens array 415a can be located below the first sub-lens array 417a. The fourth sub-lens array 415b can be located below the second sub-lens array 417b. The seventh sub-lens array can be located below the fifth sub-lens array. The eighth sub-lens array can be located below the sixth sub-lens array. The second lens array 415 is located in the light output path of the first lens array 417, so that the second lens array 415 can be located below the first lens array 417, thereby allowing the second lens array 415 to be located in the light output path of the first lens array 417.

[0347] like Figure 22a As shown, the bottom of the second lens holder 410b forms a first storage groove 418a. The first lens array 417 of the second lens holder 410b may include a first sub-lens array 417a and a second sub-lens array 417b. The second lens array 415 of the second lens holder 410b may include a third sub-lens array 415a and a fourth sub-lens array 415b. The second lens holder 410b is the second lens holder 410e.

[0348] like Figure 22b As shown, a placement protrusion 419 is formed at the bottom of the second lens holder 410b. The first lens array 417 of the second lens holder 410b may include a first sub-lens array 417a and a second sub-lens array 417b. The second lens array 415 of the second lens holder 410b may include a third sub-lens array 415a and a fourth sub-lens array 415b. The second lens holder 410b is the second lens holder 410f.

[0349] In some implementations, a fixing groove 4118 may be formed on the top of the second lens holder 410b. The fixing groove 4118 can fix the second fiber optic holder 420b. The bottom of the fixing groove 4118 may be recessed inward to form a second storage groove 4113a.

[0350] In some embodiments, the bottom of the fixing groove 4118 may include a stop surface 4111a, which may be in contact with the end face of the second fiber optic bracket 420b to define the position of the second fiber optic bracket 420b in the height direction of the lens bracket 410a. A positioning post 416 may be provided on the stop surface 4111a.

[0351] In some embodiments, the bottom of the fixing groove 4118 may include a relief surface 4112a. The relief surface 4112a may be formed by an inward recess from a stop surface 4111a. The relief surface 4112a may be located between two stop surfaces 4111a.

[0352] In some embodiments, the two first limiting sidewalls 4119 disposed opposite to each other in the fixing groove 4118 can be in contact with the left and right sides of the second fiber optic bracket 420b to limit the position of the second fiber optic bracket 420b in the length direction of the lens bracket 410a.

[0353] In some embodiments, the two second limiting sidewalls 4120 disposed opposite to each other in the fixing groove 4118 can be in contact with the top and bottom surfaces of the second fiber optic bracket 420b to define the position of the second fiber optic bracket 420b in the width direction of the lens bracket 410a.

[0354] In some embodiments, the inward recess in the middle of the second limiting sidewall 4120 can form a dispensing notch 4117. Adhesive can be filled into the fixing groove 4118 through the dispensing notch 4117.

[0355] Figure 23a This is another structure of a second lens holder according to some embodiments. Figure 1 . Figure 23b This is another structure of a second lens holder according to some embodiments. Figure 2 .like Figure 23a and Figure 23b As shown, the bottom of the second lens holder 410b forms a first storage groove 418a, the first lens array 417 includes a first sub-lens array 417a, a second sub-lens array 417b, a fifth sub-lens array 417c and a sixth sub-lens array 417d, the second lens array 415 may include a third sub-lens array 415a, a fourth sub-lens array 415b, a seventh sub-lens array 415c and an eighth sub-lens array 415d, and the second lens holder 410b is the second lens holder 410g.

[0356] Figure 24a This is a structural diagram of another fiber optic bracket provided according to some embodiments. Figure 24b This is a cross-sectional view of another fiber optic bracket provided according to some embodiments. For example... Figure 24a and Figure 24bAs shown, the fiber optic bracket 420 may include a second fiber optic bracket 420b, and the second jack 424 of the second fiber optic bracket 420b may include a first sub-jack 424a and a second sub-jack 424b. The first sub-jack 424a and the second sub-jack 424b may be arranged along the height direction of the second fiber optic bracket 420b. A first sub-fiber array may be inserted into the first sub-jack 424a, and a second sub-fiber array may be inserted into the second jack 424b.

[0357] In some embodiments, the second lens array 415 is located above the first lens array 417, and the second jack 424 may be located above the second lens array 415 so that the fiber array 500 can be located above the second lens array 415. For example, the first sub-jack 424a may be located above the third sub-lens array 415a so that the first sub-fiber array is located above the third sub-lens array 415a. The second sub-jack 424b may be located above the fourth sub-lens array 415b so that the second sub-fiber array is located above the fourth sub-lens array 415b.

[0358] In some embodiments, the second lens array 415 is located below the first lens array 417, and the second jack 424 may be located below the second lens array 415, so that the fiber array 500 can be located below the second lens array 415. For example, the first sub-jack 424a may be located below the third sub-lens array 415a, so that the first sub-fiber array is located below the third sub-lens array 415a. The second sub-jack 424b may be located below the fourth sub-lens array 415b, so that the second sub-fiber array is located below the fourth sub-lens array 415b.

[0359] In some embodiments, the length of the first sub-socket 424a is smaller than the length of the second sub-socket 424b, which not only allows the second sub-socket 424b to support the optical fiber inserted into the first sub-socket 424a, but also facilitates the filling of sealant through the observation hole 425.

[0360] In some embodiments, the fiber optic bracket 420 may be a third fiber optic bracket, and the second jack 424 of the third fiber optic bracket may include a first sub-jack 424a, a second sub-jack 424b, a third sub-jack, and a fourth sub-jack. The first sub-jack 424a, the second sub-jack 424b, the third sub-jack, and the fourth sub-jack may be arranged along the height direction of the second fiber optic bracket 420b. The first sub-fiber array may be inserted into the first sub-jack 424a, the second sub-fiber array may be inserted into the second sub-jack 424b, the third sub-fiber array may be inserted into the third sub-jack, and the fourth sub-fiber array may be inserted into the fourth sub-jack.

[0361] In some embodiments, the second lens array 415 is located above the first lens array 417, and the second jack 424 may be located above the second lens array 415 so that the fiber array 500 can be located above the second lens array 415. For example, the first sub-jack 424a may be located above the third sub-lens array 415a so that the first sub-fiber array is located above the third sub-lens array 415a. The second sub-jack 424b may be located above the fourth sub-lens array 415b so that the second sub-fiber array is located above the fourth sub-lens array 415b. The third sub-jack may be located above the seventh sub-lens array so that the third sub-fiber array is located above the seventh sub-lens array. The fourth sub-jack may be located above the eighth sub-lens array so that the fourth sub-fiber array is located above the eighth sub-lens array.

[0362] In some embodiments, the second lens array 415 is located below the first lens array 417, and the second jack 424 may be located below the second lens array 415, so that the fiber array 500 can be located below the second lens array 415. For example, the first sub-jack 424a may be located below the third sub-lens array 415a, so that the first sub-fiber array is located below the third sub-lens array 415a. The second sub-jack 424b may be located below the fourth sub-lens array 415b, so that the second sub-fiber array is located below the fourth sub-lens array 415b. The third sub-jack may be located below the seventh sub-lens array, so that the third sub-fiber array is located below the seventh sub-lens array. The fourth sub-jack may be located below the eighth sub-lens array, so that the fourth sub-fiber array is located below the eighth sub-lens array.

[0363] Figure 25 This is a cross-sectional view of a second lens assembly provided according to some embodiments. Figure 25 As shown, the end face 427 of the first fiber optic bracket 420a can be tilted, and the end face 427 of the first fiber optic bracket 420a is parallel to the stop face 4111, which can increase the contact area between the stop face 4111 and the end face 427 of the first fiber optic bracket 420a, thereby improving the connection stability between the first fiber optic bracket 420a and the lens bracket 410.

[0364] Figure 26 This is a partial cross-sectional view of a ninth optical module provided according to some embodiments. Figure 26As shown, the optical chip 310 is disposed below the second lens support 410b. The first sub-lens array 417a and the second sub-lens array 417b are located above the optical chip 310. The third sub-lens array 415a is located above the first sub-lens array 417a, and the fourth sub-lens array 415b is located above the second sub-lens array 417b. One fiber array 500 of the second fiber support 420b is located above the third sub-lens array 415a, and another fiber array 500 of the second fiber support 420b is located above the fourth sub-lens array 415b. One line of optical signal emitted by the optical chip 310 is collimated by the first sub-lens array 417a and focused by the third sub-lens array 415a into one fiber array 500. Another line of optical signal emitted by the optical chip 310 is collimated by the second sub-lens array 417b and focused by the fourth sub-lens array 415b into another fiber array 500. Alternatively, the optical signal emitted from one fiber array 500 is collimated by the third sub-lens array 415a and focused into the optical chip 310 by the first sub-lens array 417a in sequence, while the optical signal emitted from another fiber array 500 is collimated by the fourth sub-lens array 415b and focused into the optical chip 310 by the second sub-lens array 417b in sequence.

[0365] The lens bracket 410 of the tenth type of optical module can be a first lens bracket or a second lens bracket. Taking the second lens bracket 410e as an example, the tenth type of optical module is introduced. Figure 27a This is a partial cross-sectional schematic diagram of a tenth optical module provided according to some embodiments. Figure 27b This is a cross-sectional view of a tenth type of optical module provided according to some embodiments. Figure 27c This is a partial structural diagram of a tenth optical module according to some embodiments. Figure 27a , Figure 27b and Figure 27c As shown, the front of the optical chip 310 and the front of the optical matching chip 320 both face the circuit board 300, while the back of the optical chip 310 and the back of the optical matching chip 320 both face away from the circuit board 300. The solder balls on the front of the optical chip 310 are soldered to the solder pads on the back of the optical matching chip 320, and the solder balls on the front of the optical matching chip 320 are soldered to the circuit board 300. The second lens bracket 410e is disposed above the optical chip 310.

[0366] The solder balls on the front of the optical matching chip 320 are directly soldered to the pad in the middle of the front of the optical matching chip 320 (the middle of the top of the optical matching chip 320). This not only allows the optical chip 310 and the optical matching chip 320 to be electrically connected, but also allows the heat on the optical chip 310 to be conducted to the optical matching chip 320.

[0367] In some embodiments, the two ends of the top of the optical matching chip 320 can be connected to the bottom of the first thermal pad 710, and the top of the first thermal pad 710 can be connected to the housing 201, so that the heat on the optical matching chip 320 can be conducted to the outside of the optical module 200 in sequence through the first thermal pad 710 and the housing 201.

[0368] In some embodiments, the cover plate 2011c of the housing 201 may form a first snap-fit ​​protrusion 2111c, which may be connected to the top of the first thermal pad 710 so that heat on the first thermal pad 710 can be conducted to the first snap-fit ​​protrusion 2111c.

[0369] like Figure 27b As shown, the first thermally conductive assembly includes a first thermally conductive pad 710, and the second thermally conductive assembly includes an optical matching chip 320 and the first thermally conductive pad 710.

[0370] Two adjacent first snap-fit ​​protrusions 2111c can form a fourth storage slot 2113c, which can hold the second lens bracket 410e to make the position of the second lens bracket 410e in the optical module more stable, reduce the positional displacement of the lens assembly caused by the movement or vibration of the optical module, and ensure the stability of optical signal transmission.

[0371] Figure 27d This is a heat dissipation distribution diagram for a tenth type of optical module provided according to some embodiments. For example... Figure 27d As shown, the optical matching chip 320 is connected to the first snap-fit ​​protrusion 2111c through the first thermal pad 710, so that the heat of the optical matching chip 320 is conducted to the first snap-fit ​​protrusion 2111c through the first thermal pad 710.

[0372] like Figure 27d As shown, the fiber array 500 extends upward from the vertical circuit board 300 and bends to be parallel to the circuit board 300, and then extends along the length of the circuit board 300 toward the opening 2131 of the optical module.

[0373] The lens bracket 410 of the eleventh type of optical module can be a first lens bracket and a second lens bracket. Taking the second lens bracket 410g as an example, the eleventh type of optical module is introduced. Figure 28a This is a partial cross-sectional schematic diagram of an eleventh optical module provided according to some embodiments. Figure 28b This is a cross-sectional view of an eleventh optical module provided according to some embodiments. Figure 28a ,and Figure 28bAs shown, the front of the optical chip 310 and the front of the optical matching chip 320 both face the circuit board 300, while the back of the optical chip 310 and the back of the optical matching chip 320 both face away from the circuit board 300. The solder balls on the front of the optical chip 310 are soldered to the solder pads on the back of the optical matching chip 320, and the solder balls on the front of the optical matching chip 320 are soldered to the circuit board 300. The second lens bracket 410g is disposed above the optical chip 310.

[0374] The solder balls on the front of the optical chip 310 are directly soldered to the electrode pads in the middle of the back of the optical matching chip 320 (the top middle of the optical matching chip 320). This not only allows the optical chip 310 and the optical matching chip 320 to be electrically connected, but also allows the heat on the optical chip 310 to be conducted to the optical matching chip 320.

[0375] Figure 28c This is a heat dissipation distribution diagram for an eleventh optical module provided according to some embodiments. For example... Figure 28c As shown, the optical matching chip 320 is connected to the first snap-fit ​​protrusion 2111c through the first thermal pad 710, so that the heat of the optical matching chip 320 is conducted to the first snap-fit ​​protrusion 2111c through the first thermal pad 710.

[0376] like Figure 28c As shown, the fiber array 500 extends upward from the vertical circuit board 300 and bends to be parallel to the circuit board 300, and then extends along the length of the circuit board 300 toward the opening 2131 of the optical module.

[0377] Except for the parts mentioned above that differ from the tenth optical module, the eleventh optical module is identical to the tenth optical module in both structure and function, and will not be described in detail here.

[0378] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: Circuit board; A housing, covering the circuit board, and a space between the housing and the circuit board is provided: Lens assembly; First heat-conducting assembly; Second heat-conducting assembly; The circuit board has the following on its surface: An optical matching chip is located on the upper surface of the circuit board and is electrically connected to the optical chip; The socket, located on the lower surface of the circuit board, is connected to the switch; The lens assembly includes: A lens holder is located on the upper surface of the circuit board and covers the optical chip; An optical fiber support is provided along the light input or output direction of the optical chip and connected to the lens support; a first heat-conducting assembly is connected at one end to the housing and at the other end to the optical matching chip; a second heat-conducting assembly is connected at one end to the housing and at the other end to the optical chip.

2. The optical module according to claim 1, characterized in that, Both the front side of the optical chip and the front side of the optical matching chip face away from the circuit board. The pads on the front side of the optical chip are wire-connected to the circuit board, the pads on the front side of the optical matching chip are wire-connected to the circuit board, and the pads on the front side of the optical chip are wire-connected to the pads on the front side of the optical matching chip. The circuit board is formed as follows: Third storage compartment; The housing includes: The first snap-fit ​​protrusion; The second snap-fit ​​protrusion has a gap between it and the first snap-fit ​​protrusion to facilitate the placement of the lens assembly; The first thermally conductive assembly includes: The top of the first thermal pad is connected to the first snap-fit ​​protrusion. The second heat sink has its top connected to the bottom of the first thermal pad and its bottom connected to the top of the optical matching chip. The second thermally conductive assembly includes: The top of the second thermal pad is connected to the bottom of the second snap-fit ​​protrusion; The third heat sink is located in the third storage slot, with one end of its top connected to the optical chip and the other end connected to the bottom of the second thermal pad.

3. The optical module according to claim 1, characterized in that, Both the front side of the optical chip and the front side of the optical matching chip face away from the circuit board. The pads on the front side of the optical chip are wire-connected to the circuit board, the pads on the front side of the optical matching chip are wire-connected to the circuit board, and the pads on the front side of the optical chip are wire-connected to the pads on the front side of the optical matching chip. The circuit board is formed as follows: Third storage compartment; The housing includes: The first snap-fit ​​protrusion; The second snap-fit ​​protrusion has a gap between it and the first snap-fit ​​protrusion to facilitate the placement of the lens assembly; The first thermally conductive assembly includes: The first thermal pad has its top connected to the first snap-fit ​​protrusion and its bottom connected to the top of the optical matching chip; The second thermally conductive assembly includes: The top of the second thermal pad is connected to the bottom of the second snap-fit ​​protrusion; The third heat sink is located in the third storage slot, with one end of its top connected to the optical chip and the other end connected to the bottom of the second thermal pad.

4. The optical module according to claim 2, characterized in that, The second heat sink includes: The top of the first heat dissipation substrate is connected to the first thermal pad. The second heat dissipation substrate has its top connected to the bottom of the first heat dissipation substrate and its bottom connected to the top of the optical matching chip. The third heat dissipation substrate has its top connected to the bottom side of the first heat dissipation substrate and its bottom connected to the upper surface of the circuit board. The fourth heat dissipation substrate is connected at the top to the other side of the bottom of the first heat dissipation substrate, and at the bottom to the upper surface of the circuit board. The length of the second heat dissipation substrate is smaller than the length of the optical matching chip, and the width of the second heat dissipation substrate is smaller than the width of the optical matching chip; the length of the second heat dissipation substrate is smaller than the length of the first heat dissipation substrate, and the width of the second heat dissipation substrate is smaller than the width of the first heat dissipation substrate.

5. The optical module according to claim 3, characterized in that, The length of the first thermal pad is smaller than the length of the optical matching chip, and the width of the first thermal pad is smaller than the width of the optical matching chip, so that the first thermal pad is far away from the edge of the optical matching chip.

6. The optical module according to claim 1, characterized in that, The optical chip faces away from the circuit board, the optical matching chip faces the circuit board, the pads on the front of the optical chip are wire-connected to the circuit board, the solder balls on the front of the optical matching chip are directly connected to the circuit board, a high-frequency signal line is formed on the upper surface of the circuit board, one end of the high-frequency signal line is wire-connected to the pads on the front of the optical chip, and the other end of the high-frequency signal line is directly connected to the solder balls on the front of the optical matching chip. The circuit board is formed as follows: Third storage compartment; The housing includes: The first snap-fit ​​protrusion; The second snap-fit ​​protrusion has a gap between it and the first snap-fit ​​protrusion to facilitate the placement of the lens assembly; The first thermally conductive assembly includes: The first thermal pad has its top connected to the first snap-fit ​​protrusion and its bottom connected to the top of the optical matching chip. The second thermally conductive assembly includes: The top of the second thermal pad is connected to the bottom of the second snap-fit ​​protrusion; The third heat sink is located in the third storage slot, with one end of its top connected to the optical chip and the other end connected to the bottom of the second thermal pad.

7. The optical module according to claim 1, characterized in that, The front sides of the optical chip and the optical matching chip face the circuit board. The solder balls on the front side of the optical chip are directly connected to the circuit board, and the solder balls on the front side of the optical matching chip are directly connected to the circuit board. A high-frequency signal line is formed on the upper surface of the circuit board. One end of the high-frequency signal line is directly connected to the solder ball on the front side of the optical chip, and the other end of the high-frequency signal line is directly connected to the solder ball on the front side of the optical matching chip. The housing includes: The first snap-fit ​​protrusion; The second snap-fit ​​protrusion has a gap between it and the first snap-fit ​​protrusion to facilitate the placement of the lens assembly; The first thermally conductive assembly includes: The first thermal pad has its top connected to the first snap-fit ​​protrusion and its bottom connected to the top of the optical matching chip. The second thermally conductive assembly includes: The top of the second thermal pad is connected to the bottom of the second snap-fit ​​protrusion; The first thermal via is located inside the circuit board, and its top is connected to the bottom of the optical chip; The second thermal via is located inside the circuit board, and its top is connected to the bottom of the second thermal pad; The fourth heat sink is located in the middle layer of the circuit board, with one top end connected to the bottom of the first heat-conducting via and the other top end connected to the bottom of the second heat-conducting via.

8. The optical module according to claim 1, characterized in that, The front side of the optical chip and the front side of the optical matching chip face the circuit board. The solder balls on the front side of the optical chip are directly connected to the solder pads on the back side of the optical matching chip, and the solder balls on the front side of the optical matching chip are directly connected to the circuit board. The housing includes: The first snap-fit ​​protrusion is connected to both ends of the optical matching chip via a first thermal pad; The first thermally conductive assembly includes: The top of the first thermal pad is connected to the first snap-fit ​​protrusion. The second thermally conductive assembly includes: The optical matching chip; The first heat-conducting assembly.

9. The optical module according to claim 2, characterized in that, The length of the second storage slot is greater than or equal to the length of the third heat sink, the width of the second storage slot is greater than or equal to the width of the third heat sink, and the depth of the second storage slot is equal to the thickness of the third heat sink.

10. The optical module according to claim 1, characterized in that, The housing includes: Cover plate; Two first side plates, the top of which are connected to the two sides of the cover plate, and the first bottom plate is connected to the upper surface of the circuit board; The second side plate is connected at its top to one end of the cover plate; The third side plate is connected to the other end of the cover plate at the top and to the upper surface of the circuit board at the bottom. The bottom protrudes outward to form a limiting protrusion; the limiting protrusion is connected to one end face of the circuit board. The base plate is connected to the second bottom of the first side plate on both sides, one end is connected to the second side plate, and the other end has a gap with the third side plate to facilitate the placement of the circuit board; the other end of the base plate is connected to the other end face of the circuit board.

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