An optical module

Abstract

The optical module provided by the present disclosure comprises a circuit board, an optical transmitting component comprising a laser assembly, the laser assembly being electrically connected to the circuit board and used for generating an optical signal, wherein the laser assembly comprises a carrier provided with a first high-frequency wire, the first high-frequency wire extending from one end of the carrier to the other end of the carrier and being electrically connected to the circuit board, a laser chip arranged on the carrier and located at the side of one end of the first high-frequency wire, the top of the laser chip being provided with an EA electrode, and an adapter resistor comprising a first electrode and a second electrode, the first electrode being electrically connected to the EA electrode and the second electrode being electrically connected to one end of the first high-frequency wire, and the width of the second electrode being close to the width of the first high-frequency wire. The optical module provided by the present disclosure facilitates guaranteeing the high-frequency performance of the laser assembly.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve.

[0003] To meet the demands of optical communication technology development, the transmission rate of optical modules is constantly increasing, especially in recent years, with higher-speed optical modules such as 800G gradually being introduced to the market. To achieve the transmission rate of optical modules such as 800G, it is necessary to integrate 8 optical transmitters and 8 optical receivers in a QSFP-DD or OSFP package. Achieving the required functions in such a small space poses a great challenge to high-frequency performance and other aspects. Utility Model Content

[0004] Some embodiments provide an optical module that facilitates ensuring the high-frequency performance of laser components.

[0005] Some embodiments provide an optical module, including: Circuit board; The light emitting component includes a laser assembly; the laser assembly is electrically connected to a circuit board for generating light signals; The laser components include: The carrier is provided with a first high-frequency line; the first high-frequency line extends from one end of the carrier to the other end of the carrier and is electrically connected to the circuit board. A laser chip is mounted on a carrier and located on the side of one end of the first high-frequency line; an EA electrode is mounted on the top of the laser chip. The adapter resistor includes a first electrode and a second electrode; the first electrode is electrically connected to the EA electrode, and the second electrode is electrically connected to one end of the first high-frequency line; the width of the second electrode is close to the width of the first high-frequency line, and the resistance value of the adapter resistor is less than 10Ω.

[0006] One of the above technical solutions has the following advantages or beneficial effects: The light emitting component includes a laser assembly, which includes a carrier, a laser chip, and a switching resistor. The laser chip is disposed on the carrier, a first high-frequency line is disposed on the carrier, and an EA electrode is disposed on the laser chip. The switching resistor includes a first electrode and a second electrode. The first electrode is electrically connected to the EA electrode, and the second electrode is electrically connected to one end of the first high-frequency line, so that the EA electrode and the first high-frequency line are electrically connected through the switching resistor. By electrically connecting the EA electrode and the first high-frequency line through the switching resistor, the switching resistor can replace or shorten the bonding wire between the EA electrode and the first high-frequency line. The width of the second electrode is close to the width of the first high-frequency line. Compared with the bonding wire connecting the EA electrode and the first high-frequency line, the width of the switching resistor is greater than the width of the bonding wire, which shortens or eliminates the bonding wire between the EA electrode and the first high-frequency line in the laser assembly, reduces the reflection of high-frequency signals between the EA electrode and the first high-frequency line, reduces the signal loss during transmission from the first high-frequency line to the EA electrode, and facilitates ensuring the high-frequency performance of the laser assembly. The resistance value of the adapter resistor is less than 10Ω, which can meet the requirements of electrical connection between the EA electrode and the first high-frequency line, and reduce the influence of the resistance value of the adapter resistor on the signal transmission from the first high-frequency line to the laser chip.

[0007] In some embodiments, an optical module is provided in which a groove is provided on the carrier, and the groove is located on the side of one end of a first high-frequency line; The laser chip is located in the groove, and the top surface of the laser chip is flush with the top surface of the carrier; one end of the adapter resistor is located on the laser chip, and the other end of the adapter resistor is located on the carrier; the first electrode is welded to the EA electrode, and the second electrode is welded to one end of the first high-frequency line.

[0008] Another technical solution described above has the following advantages or beneficial effects: a groove is provided on the carrier, and the laser chip is placed in the groove, making the top surface of the laser chip flush with the top surface of the carrier. This facilitates the placement of the transfer resistor on the laser chip and the carrier, thereby facilitating the electrical connection between the transfer resistor and the laser chip and the carrier. The first electrode is welded to the EA electrode, and the second electrode is welded to one end of the first high-frequency line, which facilitates a more stable electrical connection between the transfer resistor and the laser chip and the carrier.

[0009] In some embodiments, an optical module is provided in which the adapter resistor is located on the side of the laser chip, the first electrode is wire-connected to the EA electrode, and the second electrode is welded to one end of the first high-frequency line.

[0010] Another technical solution described above has the following advantages or beneficial effects: the transition resistor is located on the side of the laser chip, the first electrode is wire-connected to the EA electrode, and the second electrode is welded to one end of the first high-frequency line. Compared to a direct wire-connection between the EA electrode and the first high-frequency line, the transition resistor can raise one end of the first high-frequency line. Combined with the wire-connection of the first electrode to the EA electrode, the wire between the laser chip and the carrier in the laser assembly can be shortened, which helps to ensure the high-frequency performance of the laser assembly.

[0011] In some embodiments, an optical module is provided in which a pad is provided between the laser chip and one end of the first high-frequency line, and a gap is formed between the pad and the first high-frequency line. The adapter resistor is placed over the gap. The bottom surface of the first electrode is soldered to the connection pad. The top surface of the first electrode is wired to the EA electrode. The bottom surface of the second electrode is soldered to the first high-frequency line.

[0012] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: a pad is provided between the laser chip and one end of the first high-frequency line, the bottom surface of the first electrode is welded to the connection pad, the top surface of the first electrode is wire-connected to the EA electrode, and the bottom surface of the second electrode is welded to the first high-frequency line, which makes it convenient to set the transfer resistor on the side of the laser chip.

[0013] In some embodiments, an optical module is provided in which a first matching circuit is further disposed on the carrier, and the first matching circuit is located on the side of the laser chip; The first matching circuit includes a first pad, a first resistor group, and a second pad array. The first resistor group includes multiple first resistors, and the second pad array includes multiple second pads. One end of the first resistor is connected to the first pad, and the other end of the first resistor is connected to the corresponding second pad. One of the multiple second pads is electrically connected to ground on the carrier. The first pad is wire-connected to the EA electrode or the first electrode.

[0014] Another technical solution described above has the following advantages or beneficial effects: the first matching circuit is located on the side of the laser chip, facilitating the electrical connection of the laser chip to the first matching circuit. The first matching circuit includes a first pad, a first resistor group, and a second pad array. The first resistor group includes multiple first resistors, and the second pad array includes multiple second pads. One end of each first resistor is connected to a first pad, and the other end is connected to a corresponding second pad. One of the multiple second pads is electrically connected to ground on the carrier. The first matching circuit can form a structure where multiple first resistors are connected in parallel through the first resistor group, facilitating the selection of a suitable first resistor for electrical connection to the laser chip based on its actual performance, ensuring that the laser chip can be matched with a suitable first resistor.

[0015] In some embodiments, an optical module is provided in which a first matching circuit is further disposed on the carrier, and the first matching circuit is located on the side of the laser chip; The first matching circuit includes a third pad, a second resistor group, and a fourth pad array. The second resistor group includes a second resistor and multiple third resistors, and the fourth pad array includes multiple fourth pads. One end of the second resistor is connected to the third pad, and the other end of the second resistor is connected to the fourth pad. The third resistors are connected in series through the fourth pads.

[0016] Another technical solution described above has the following advantages or beneficial effects: the first matching circuit is located on the side of the laser chip, facilitating the electrical connection of the laser chip to the first matching circuit. The first matching circuit includes a third pad, a second resistor group, and a fourth pad array. The second resistor group includes a second resistor and multiple third resistors, and the fourth pad array includes multiple fourth pads. The first matching circuit can form a structure where the second resistor is connected in series with several third resistors through the second resistor group, facilitating the selection of a suitable matching resistor to electrically connect the laser chip based on its actual performance, so that the laser chip can be matched with a suitable matching resistor.

[0017] In some embodiments, an optical module is provided in which a second high-frequency line and a second matching circuit are further disposed on the carrier. The second high-frequency line extends from one end of the carrier to the other end of the carrier, and the second high-frequency line is located on one side of the laser chip, while the second matching circuit is located on the other side of the laser chip. One end of the second high-frequency line is wired to the second matching circuit, and the wire passes over the laser chip.

[0018] Another technical solution described above has the following advantages or beneficial effects: the second high-frequency line extends from one end of the carrier to the other end, and the second high-frequency line is located on one side of the laser chip, while the second matching circuit is located on the other side of the laser chip, facilitating the electrical connection of the second high-frequency line to the laser chip or the second matching circuit. One end of the second high-frequency line is wired to the second matching circuit, and this wire crosses the laser chip, facilitating the use of the second matching circuit as the end of the second high-frequency line.

[0019] In some embodiments, an optical module is provided, wherein an LD electrode is disposed on the top of the laser chip, an EA electrode is close to one end of the laser chip, and the LD electrode is close to the other end of the laser chip; a matching capacitor is disposed on the carrier, the matching capacitor is close to the other end of the laser chip, and the matching capacitor is wire-connected to the LD electrode.

[0020] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: the LD electrode is close to the other end of the laser chip, and the matching capacitor is close to the other end of the laser chip, which facilitates the connection of the matching capacitor to the laser chip.

[0021] Some embodiments provide an optical module, including: Circuit board; The light emitting component includes a laser assembly; the laser assembly is electrically connected to a circuit board for generating light signals; The laser components include: The carrier is provided with a first high-frequency line; the first high-frequency line extends from one end of the carrier to the other end of the carrier and is electrically connected to the circuit board. A laser chip is mounted on a carrier and located on the side of one end of the first high-frequency line; an EA electrode is mounted on the top of the laser chip. An electrical adapter is provided, with one end electrically connected to the EA electrode and the other end electrically connected to one end of the first high-frequency line; wherein the width of the electrical adapter is close to the width of the first high-frequency line, and the electrical adapter shortens the wire length between the EA electrode and the first high-frequency line.

[0022] Another technical solution described above has the following advantages or beneficial effects: The optical emitting component includes a laser assembly, which includes a carrier, a laser chip, and an electrical adapter. The laser chip is mounted on the carrier, a first high-frequency line is mounted on the carrier, and an EA electrode is mounted on the laser chip. One end of the electrical adapter is electrically connected to the EA electrode, and the other end of the electrical adapter is electrically connected to one end of the first high-frequency line, thus electrically connecting the EA electrode and the first high-frequency line. By electrically connecting the EA electrode and the first high-frequency line through the electrical adapter, the electrical adapter can replace or shorten the bonding wire between the EA electrode and the first high-frequency line. The width of the electrical adapter is close to the width of the first high-frequency line, and the electrical adapter shortens the length of the bonding wire between the EA electrode and the first high-frequency line. Compared to the bonding wire electrically connecting the EA electrode and the first high-frequency line, this shortens or eliminates the bonding wire between the EA electrode and the first high-frequency line in the laser assembly, reducing the reflection of high-frequency signals between the EA electrode and the first high-frequency line, reducing signal loss during transmission from the first high-frequency line to the EA electrode, and facilitating the maintenance of the high-frequency performance of the laser assembly.

[0023] In some embodiments, an optical module is provided in which a second high-frequency line, a first matching circuit, and a second matching circuit are further disposed on the carrier; the second high-frequency line extends from one end of the carrier to the other end of the carrier, the second high-frequency line is located between the laser chip and the first high-frequency line, and one end of the first high-frequency line and one end of the second high-frequency line are located on one side of the laser chip; The first matching circuit and the second matching circuit are located on the other side of the laser chip; one end of the electrical adapter is wired to the first matching circuit, and one end of the second high-frequency line is wired to the second matching circuit, with the wire crossing the laser chip.

[0024] Another technical solution described above has the following advantages or beneficial effects: the second high-frequency line is located between the laser chip and the first high-frequency line, with one end of the first high-frequency line and one end of the second high-frequency line located on one side of the laser chip, facilitating the rational layout of the first and second high-frequency lines on the carrier. The first matching circuit and the second matching circuit are located on the other side of the laser chip, facilitating their placement on the carrier and enabling the first matching circuit to be electrically connected to the laser chip. One end of the second high-frequency line is wire-connected to the second matching circuit, with the wire crossing the laser chip, facilitating the use of the second matching circuit as the end of the second high-frequency line. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly introduced below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0026] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments; Figure 2 This is a partial structural diagram of a switch according to some embodiments; Figure 3 This is a structural diagram of an optical module according to some embodiments; Figure 4 An exploded view of an optical module according to some embodiments; Figure 5 This is a partial schematic diagram of a light emitting component according to some embodiments; Figure 6A This is a structural diagram of a laser assembly according to some embodiments; Figure 6B This is a diagram showing the electrical connection state of a laser component and a circuit board according to some embodiments; Figure 7A Structure of a laser assembly according to some embodiments Figure 1 ; Figure 7B Structure of a laser assembly according to some embodiments Figure 2 ; Figure 7C Structure of a laser assembly according to some embodiments Figure 3 ; Figure 8 This is a structural diagram of yet another laser assembly according to some embodiments; Figure 9A For another laser assembly structure according to some embodiments Figure 1 ; Figure 9B For another laser assembly structure according to some embodiments Figure 2 ; Figure 9C For another laser assembly structure according to some embodiments Figure 3 ; Figure 10 This is a structural diagram of another laser assembly according to some embodiments; Figure 11 This is a structural diagram of a matching circuit according to some embodiments; Figure 12 This is a structural diagram of another matching circuit according to some embodiments. Detailed Implementation

[0027] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0028] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude the applicability to or configuration of devices to perform additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0029] In optical communication technology, information is loaded onto light to generate optical signals, which are then used to transmit information between information processing devices. Connections are established between these devices via optical transmission equipment. Optical power loss is minimal during transmission through this equipment, allowing for long-distance transmission with relatively low power loss. Light boasts extremely high transmission speeds, and the cost of optical transmission equipment, such as fiber optic cables, is lower than that of electrical transmission equipment like copper wires. Using optical signals to transmit information offers advantages such as long-distance transmission, high speed, and low cost.

[0030] Information processing equipment typically includes switches, servers, optical network units (ONUs), optical distribution networks (ODNs), optical line terminals (OLTs), gateways, routers, mobile phones, computers, tablets, televisions, etc.; optical transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can recognize and process electrical signals, while optical transmission equipment can transmit optical signals. Therefore, optical modules are needed between the optical transmission equipment and the information processing equipment to perform the conversion between optical and electrical signals.

[0031] In some embodiments, the optical signal input and / or optical signal output of the optical module are connected to an optical fiber, and the electrical signal input and / or electrical signal output of the optical module are connected to a switch; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the switch; a second electrical signal from the switch is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0032] Information processing equipment connected to optical modules can also be referred to as the host computer for optical modules. In access network transmission scenarios, the host computer for optical modules is usually an ONU, ODN, or OLT; in data center transmission scenarios, the host computer for optical modules is usually a Switch or Server.

[0033] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments. For example... Figure 1 As shown, switch 100 has multiple optical module interfaces. Multiple optical modules are inserted into the switch through these interfaces, establishing electrical signal communication between the optical modules and the switch. Optical fiber 101 is connected to the optical modules, establishing optical signal communication between the optical fiber and the optical modules. One end of optical fiber 101 is connected to the optical module, and the other end of optical fiber 101 (…) Figure 1(not shown in the image) connects to another optical module ( Figure 1 (Not shown in the image), another optical module accesses the server ( Figure 1 (not shown in the image) or another switch ( Figure 1 (Not shown in the image).

[0034] In some embodiments, the optical fiber 101 and the optical module 200 are detachably connected; in other embodiments, the optical fiber 101 and the optical module 200 are non-detachably connected.

[0035] The switch 100 is configured to provide data electrical signals to the optical module 200, or receive data electrical signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0036] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0037] Figure 2 This is a partial structural diagram of a switch according to some embodiments. To clearly show the connection relationship between the optical module 200 and the switch 100, Figure 2 Only the structure of the switch 100 related to the optical module 200 is shown. (Example) Figure 2 As shown, in some embodiments, the switch 100 further includes a PCB circuit board 102 disposed in the receiving cavity, and a cage 103 disposed on the surface of the PCB circuit board 102; the optical module 200 is inserted into the cage 103 and fixed by the cage 103.

[0038] In some embodiments, a heat sink 104 is provided on the cage 103 to dissipate heat for the optical module; in some embodiments, the heat sink 104 has protruding structures such as fins to increase the heat dissipation area.

[0039] In some embodiments, an electrical connector is provided inside the cage 103, which is configured to access the electrical interface of the optical module 200.

[0040] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the cage 103 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 103 and then diffused through the heat sink 104.

[0041] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 103, thereby establishing an electrical signal connection between the optical module 200 and the switch 100.

[0042] In some embodiments, the optical interface of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0043] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 203 and 204, one of which is an electrical interface and the other is an optical interface. In some embodiments, the shell forms an opening that serves as both an electrical interface and an optical interface.

[0044] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0045] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0046] The direction of the line connecting the two openings 203 and 204 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 203 is located at the end of the optical module 200. Figure 3 (The right end), opening 204 is also located at the end of optical module 200 ( Figure 3 (The left end). Alternatively, opening 203 is located at the end of optical module 200, while opening 204 is located on the side of optical module 200.

[0047] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0048] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0049] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0050] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the switch 100.

[0051] In some embodiments, the circuit board may further include a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0052] In some embodiments, the circuit board further includes gold fingers 301 formed on its end surface, the gold fingers 301 being composed of a plurality of independent pins.

[0053] In some implementations, the gold fingers 301 are disposed on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to applications with high pin count requirements.

[0054] In some implementations, the gold fingers 301 of the circuit board 300 extend from the electrical interface and insert into the electrical connector of the switch 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the switch, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0055] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the switch, or to release the fixed connection between the optical module 200 and the switch.

[0056] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the switch 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the switch, so as to release the fixation between the optical module 200 and the switch, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0057] In some embodiments, the optical module includes a light emitting component 400. In some embodiments, the optical module includes a light receiving component 500.

[0058] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0059] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0060] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0061] In some embodiments, the optical module 200 further includes an optical transmission component 700 disposed within the housing. The optical transmission component 700 is used to establish an optical connection between the optical transmitting component 400, the optical receiving component 500 and the external optical fiber 101 (hereinafter referred to as the external optical fiber), so that the optical signal generated by the optical transmitting component 400 can be coupled to the external optical fiber, and the optical signal input from the external optical fiber can be coupled to the optical receiving component.

[0062] In some embodiments, the optical transmission component 700 includes an optical fiber adapter and an optical fiber, which may be an internal optical fiber relative to an external optical fiber. One end of the optical fiber is connected to the optical fiber adapter, and the other end is connected to the optical transmitting component 400 or the optical receiving component 500. Exemplarily, the optical transmission component 700 includes multiple optical fiber adapters and multiple optical fibers. The optical transmitting component 400 can be connected to one or more optical fiber adapters via multiple optical fibers, and the optical receiving component 500 can be connected to multiple optical fiber adapters via multiple optical fibers. Of course, in this embodiment, the structure of the optical fiber adapter is not limited to one type; it can also be an LC connector, where the optical fiber adapter connects to one optical fiber.

[0063] In some embodiments, the optical transmission component 700 may include two optical fiber adapters and multiple optical fibers, each optical fiber adapter being connected to the optical transmitting component 400 and the optical receiving component 500 via the multiple optical fibers.

[0064] In some embodiments, a mounting hole 302 is provided on the circuit board 300, and the light emitting component 400 is assembled and connected to the mounting hole 302. For example, the light emitting component 400 is embedded in the mounting hole 302.

[0065] In some embodiments, the mounting hole 302 is a through hole, such that the top of the light emitting component 400 is above the mounting hole 302 and the bottom of the light emitting component 400 is below the mounting hole 302.

[0066] In some embodiments, a DSP chip 303 is disposed on the front side of the circuit board 300; the DSP chip 303 is used to transmit high-frequency signals to the light emitting component 400, etc. The light emitting component 400 receives the high-frequency signals transmitted by the DSP chip 303 to generate light signals. Two opposing surfaces on the circuit board 300 are the main bearing surfaces of the circuit board 300; one of these surfaces is called the front surface of the circuit board 300, facing the upper cover plate 2011; the other surface is the back surface of the circuit board 300, facing the bottom plate 2021. The front and back surfaces of the circuit board 300 are opposing surfaces.

[0067] In some embodiments, the light receiving component 500 is disposed on the back side of the circuit board 300. Of course, in this embodiment, the light receiving component 500 is not limited to being disposed on the back side of the circuit board 300, but may also be disposed on the front side of the circuit board 300.

[0068] In some embodiments, the optical transmission component 700 may include a fiber optic adapter and multiple optical fibers. The optical transmitting component 400 can be optically connected to the fiber optic adapter through a portion of the multiple optical fibers, and the optical receiving component 500 can be optically connected to the fiber optic adapter through a portion of the multiple optical fibers.

[0069] Figure 5 This is a partial schematic diagram of a light emitting component according to some embodiments. Figure 5 The present invention illustrates the structure of a light emitting component, but the structure of the light emitting component in this embodiment is not limited to that described above. Figure 5 The structure shown. (As illustrated) Figure 5 As shown, in some embodiments, the optical emitting component 400 includes a laser component 400a, which generates an optical signal. The optical signal output by the laser component 400a can be coupled to an optical fiber after passing through a lens or other device, and then transmitted to an optical fiber adapter via the optical fiber.

[0070] In some embodiments, the light emitting component 400 may include laser components 400a arranged side by side. Exemplarily, multiple laser components 400a may be arranged side by side on the emitting base.

[0071] Figure 6A This is a structural diagram of a laser assembly according to some embodiments. Figure 6B This is a diagram showing the electrical connection state of a laser component and a circuit board according to some embodiments. Figures 6A-6B As shown, in some embodiments, the laser assembly 400a includes a carrier 410 and a laser chip 420. The laser chip 420 is disposed on the carrier 410, on which a circuit pattern is formed. The carrier 410 carries the laser chip 420, which is electrically connected to the circuit pattern on the carrier 410. The laser chip 420 is also electrically connected to a circuit board 300 via the carrier 410. Exemplarily, the carrier 410 is wire-connected to the circuit board 300.

[0072] In some embodiments, the laser chip 420 may be disposed at the edge of the carrier 410, such as at the edge of one end of the carrier 410. For example, one edge of the laser chip 420 may be close to one edge of the carrier 410 to reduce the risk of the carrier 410 blocking the output light of the laser chip 420.

[0073] In some embodiments, the laser chip 420 may be disposed on the top surface of the carrier 410. Alternatively, in some embodiments, the carrier 410 may have a groove, and the laser chip 420 may be disposed within this groove.

[0074] In some embodiments, a ground layer may be provided on the surface of the laser chip 420, and the laser chip 420 is mounted on the ground layer.

[0075] Figure 7A Structure of a laser assembly according to some embodiments Figure 1 , Figure 7B Structure of a laser assembly according to some embodiments Figure 2 , Figure 7C Structure of a laser assembly according to some embodiments Figure 3 .like Figures 7A-7C As shown, in some embodiments, a first high-frequency line 411 is formed on the carrier 410. The first high-frequency line 411 extends from one end of the carrier 410 to the other end. Exemplarily, one end of the first high-frequency line 411 is close to the laser chip 420, such as one end of the first high-frequency line 411 extending to one side of the laser chip 420. The first high-frequency line 411 is electrically connected to the laser chip 420 and is used to transmit high-frequency signals to the laser chip 420.

[0076] In some embodiments, a ground layer is formed on the side of the first high-frequency line 411. Of course, in some embodiments, a ground layer may also be provided inside the carrier 410 or on the bottom surface of the carrier 410. The ground layer on the surface of the carrier 410 can be electrically connected to the ground layer inside the carrier 410 or on the bottom surface via vias.

[0077] In some embodiments, a matching capacitor 440 is provided on the carrier 410. The matching capacitor 440 can be electrically connected to the laser chip 420. The matching capacitor 440 can be located on the side of the laser chip 420, such as near the other end of the laser chip 420.

[0078] In some embodiments, a first matching circuit 450a is provided on the carrier 410. The first matching circuit 450a is electrically connected to the laser chip 420 and also electrically connected to the ground plane on the carrier 410. The first matching circuit 450a serves as a matching circuit for the laser chip 420. The first matching circuit 450a may include a resistor or an inductor. Of course, in some embodiments, a second matching circuit may also be provided on the carrier 410. The second matching circuit may also be electrically connected to the laser chip 420, so that the second matching circuit serves as a matching circuit for the laser chip 420. The first matching circuit 450a may be disposed on the other side of the laser chip 420. Of course, in some embodiments, the first matching circuit 450a may also be disposed on one side of the laser chip 420.

[0079] In some embodiments, an EA electrode 421 is formed on the top of the laser chip 420. The EA electrode 421 is electrically connected to one end of the first high-frequency line 411. The EA electrode 421 may be located close to one end of the laser chip 420. The EA electrode 421 may be wire-connected to one end of the first high-frequency line 411.

[0080] In some embodiments, the EA electrode 421 can be wired to the first matching circuit 450a.

[0081] In some embodiments, an LD electrode 422 is formed on the top of the laser chip 420. The LD electrode 422 can be electrically connected to a matching capacitor 440. The LD electrode 422 and the matching capacitor 440 can be located near the other end of the laser chip 420, facilitating the electrical connection of the LD electrode 422 to the laser chip 420. Exemplarily, the LD electrode 422 can be wire-connected to the matching capacitor 440.

[0082] In some embodiments, the EA electrode 421 can be directly wire-bonded to the first high-frequency line 411 (for ease of description, the direct wire bonding 1 between the EA electrode 421 and the first high-frequency line 411) to achieve electrical connection between the EA electrode 421 and the first high-frequency line 411 through the wire bonding 1. Exemplarily, the EA electrode 421 is bonded to one end of the first high-frequency line 411 via gold wire bonding to achieve interconnection between the laser chip 420 and the carrier 410. Since the length, arch height, and span of the wire bonding 1 have a significant impact on high-frequency signal transmission, and the length of the wire bonding 1 is generally not less than 150 μm, and even greater than 250 μm, the wire bonding generates parasitic inductance, causing significant reflection in laser components with speeds such as 200 G. Moreover, the higher the speed of the laser component, the more pronounced the parasitic inductance effect of the wire bonding becomes, giving the wire bonding the characteristic of suppressing high frequencies, and this characteristic is further enhanced with increasing wire length. Therefore, in order to meet the high-frequency performance requirements of the laser component 400a, it is necessary to strictly control the wire bonding length between the EA electrode 421 and the first high-frequency line 411, and keep the wire bonding as short as possible.

[0083] In some embodiments, the laser assembly 400a further includes an electrical adapter 430 electrically connected to the first high-frequency line 411. For example, one end of the electrical adapter 430 is welded to the EA electrode 421, and the other end is welded to one end of the first high-frequency line 411. The width of the electrical adapter 430 is close to the width of the first high-frequency line 411, but greater than the width of the wire used to directly connect the EA electrode 421 to the first high-frequency line 411. In some embodiments, the length of the electrical adapter 430 can be less than the length of the wire, reducing the reflection of high-frequency signals between the EA electrode 421 and the first high-frequency line 411 in the laser assembly 400a, reducing signal loss during transmission from the first high-frequency line 411 to the EA electrode 421, and further ensuring the high-frequency performance of the laser assembly 400a. The electrical adapter 430 can be a resistor with a relatively small resistance value or an adapter substrate, etc.; wherein, the resistor includes an electrode that facilitates electrical connection between the EA electrode 421 and the first high-frequency line 411, and the adapter substrate is provided with a circuit pattern that can be soldered to connect the EA electrode 421 and the first high-frequency line 411, etc.

[0084] In some embodiments, the electrical connection between the EA electrode 421 and the first high-frequency line 411 can also be achieved by combining an electrical adapter 430 with a bonding wire (referred to as bonding wire 2 for ease of description). The length of bonding wire 2 is less than the length of bonding wire 1. Alternatively, the sum of the lengths of the electrical adapter 430 and bonding wire 2 may be less than the length of bonding wire 2.

[0085] The electrical connection between the EA electrode 421 and the first high-frequency line 411 is achieved by the electrical adapter 430. Compared with the use of wire bonding 1 to achieve the electrical connection between the EA electrode 421 and the first high-frequency line 411, the wire bonding used for the electrical connection between the EA electrode 421 and the first high-frequency line 411 can be eliminated or shortened, thereby improving the high-frequency performance of the laser component 400a.

[0086] In some embodiments, the electrical adapter 430 can be an adapter resistor 431, which can be a resistor with a relatively small resistance, such as a 0Ω resistor or a resistor with a resistance less than 10Ω. The adapter resistor 431 includes a first electrode and a second electrode. The first electrode is electrically connected to the EA electrode 421, and the second electrode is electrically connected to one end of the first high-frequency line 411. The width of the second electrode is close to the width of the first high-frequency line 411. Exemplarily, the width of the second electrode can be slightly smaller than the width of the first high-frequency line 411. The adapter resistor 431 can be placed horizontally or vertically on the side of the laser chip 420. Alternatively, the adapter resistor 431 can be placed on the laser chip 420 and can extend from the laser chip 420 to the carrier 410.

[0087] The adapter resistor 431 can be a small resistance resistor with a package size of 008004 (0.25mm × 0.125mm × 0.125mm) or 006003 (0.16mm × 0.08mm × 0.08mm) and a value of 0Ω.

[0088] In some embodiments, a groove 412 is formed on the carrier 410, the bottom of which is lower than the top of the carrier 410. The groove 412 is located on the side of one end of the first high-frequency line 411. The laser chip 420 is disposed in the groove 412, which can reduce the height difference between the top of the laser chip 420 and the top of the carrier 410. The adapter resistor 431 is placed horizontally on the laser chip 420, with one end of the adapter resistor 431 on the laser chip 420 and the other end on the carrier 410, facilitating the welding of the first electrode to the EA electrode 421 and the welding of the second electrode to the first high-frequency line 411. By electrically connecting the EA electrode 421 and the first high-frequency line 411 through the adapter resistor 431, the adapter resistor 431 replaces the wire bonding 1, thereby eliminating the wire bonding between the EA electrode 421 and the first high-frequency line 411 and eliminating the influence of the wire bonding 1 on the high-frequency performance of the laser component 400a.

[0089] In some embodiments, the depth of the groove 412 is greater than or equal to the thickness of the laser chip 420, so that the top of the laser chip 420 is flush with the top of the carrier 410, which makes it easier to electrically connect the EA electrode 421 and the first high-frequency line 411 through the transition resistor 431. The depth of the groove 412 can be 90-200 μm.

[0090] A ground layer may be provided at the bottom of the groove 412, and the ground layer at the bottom of the groove 412 may be electrically connected to the ground layer on the top surface of the carrier 410 through a via. Alternatively, a ground layer may be provided on the side wall of the groove 412, and the ground layer at the bottom of the groove 412 may be electrically connected to the ground layer on the side wall of the groove 412.

[0091] In some embodiments, the width of the groove 412 may be greater than the width of the laser chip 420, facilitating the placement of the laser chip 420 within the groove 412. The greater width of the groove 412 than the laser chip 420 creates a gap between the edge of the laser chip 420 and the sidewall of the groove 412, allowing the transition resistor 431 to span this gap for electrical connection between the laser chip 420 and the carrier 410. Exemplarily, the first electrode of the transition resistor 431 is located above the EA electrode 421, and the second electrode of the transition resistor 431 is located above one end of the first high-frequency line 411.

[0092] Figure 8 This is a structural diagram of yet another laser assembly according to some embodiments. For example... Figure 8 As shown, in some embodiments, a second high-frequency line 413 is also formed on the carrier 410. The second high-frequency line 413 extends from one end of the carrier 410 to the other end. One end of the second high-frequency line 413 can be close to the laser chip 420. The second high-frequency line 413 can be electrically connected to the laser chip 420, and the second high-frequency line 413 can transmit high-frequency signals to the laser chip 420. The second high-frequency line 413 and the first high-frequency line 411 can transmit differential signals to the laser chip 420.

[0093] In some embodiments, the second high-frequency line 413 can be electrically connected to the laser chip 420 by means of wire bonding, electrical adapter, or a combination of electrical adapter and wire bonding.

[0094] In some embodiments, a second matching circuit 450b is provided on the carrier 410. The second matching circuit 450b can be electrically connected to the laser chip 420, and the second matching circuit 450b is also electrically connected to the ground plane on the carrier 410. The second matching circuit 450b can be located on one side of the laser chip 420, and of course, in some embodiments, the second matching circuit 450b can also be located on the other side of the laser chip 420.

[0095] In some embodiments, the second matching circuit 450b may be electrically connected to one end of the second high-frequency line 413, so that the second matching circuit 450b serves as the end of the second high-frequency line 413. Exemplarily, the second matching circuit 450b may be wire-connected to one end of the second high-frequency line 413 (for ease of description, this wire is referred to as wire 3), and wire 3 may span across the laser chip 420.

[0096] In some embodiments, the first matching circuit 450a is located near one end of the carrier 410, and the second matching circuit 450b is located on the side of the first matching circuit 450a away from the carrier 410.

[0097] Figure 9A For another laser assembly structure according to some embodiments Figure 1 , Figure 9B For another laser assembly structure according to some embodiments Figure 2 , Figure 9C For another laser assembly structure according to some embodiments Figure 3 .like Figures 9A-9C As shown, in some embodiments, the laser chip 420 is disposed on the top of the carrier 410, and the transition resistor 431 is disposed on the side of the laser chip 420. The first electrode of the transition resistor 431 is electrically connected to the EA electrode 421 via a wire bonding 2, and the second electrode of the transition resistor 431 is soldered to one end of the first high-frequency line 411.

[0098] The adapter resistor 431 is located on the side of the laser chip 420. When the first high-frequency line 411 is electrically connected through the adapter resistor 431, one end of the first high-frequency line 411 can be raised, thereby making the wire bonding 2 shorter than the wire bonding 1. The adapter resistor 431 can be placed horizontally or vertically on the side of the laser chip 420 to accommodate different heights of the laser chip 420, so as to keep the wire bonding 2 within a relatively short range, thereby shortening the wire bonding length between the laser chip 420 and the first high-frequency line 411, and thus improving the high-frequency performance of the laser assembly 400a.

[0099] In some embodiments, the second electrode of the adapter resistor 431 is located above one end of the first high-frequency line 411, and the first electrode of the adapter resistor 431 is located above the second electrode, such that the adapter resistor 431 is placed vertically on the side of the laser chip 420. The first electrode of the adapter resistor 431 is soldered to one end of the first high-frequency line 411, and the second electrode of the adapter resistor 431 is wire-connected to the EA electrode 421.

[0100] In some embodiments, a pad 414 is provided on the side of one end of the first high-frequency line 411, close to the laser chip 420, such that the pad 414 is located between the laser chip 420 and one end of the first high-frequency line 411. A gap is formed between the pad 414 and the first high-frequency line 411. A transition resistor 431 covers the gap, the bottom surface of the first electrode of the transition resistor 431 is soldered to the pad 414, the top surface of the first electrode of the transition resistor 431 is electrically connected to the EA electrode 421 through a wire bonding 2, and the second electrode of the transition resistor 431 is soldered to one end of the first high-frequency line 411.

[0101] Figure 10 This is a structural diagram of another laser assembly according to some embodiments. Figure 10 As shown, in some embodiments, the first matching circuit 450a is located near the edge of the carrier 410, and the second matching circuit 450b is located on the side of the first matching circuit 450a away from the edge of the carrier 410. Exemplarily, the second matching circuit 450b may be located between the first matching circuit 450a and the laser chip 420.

[0102] In some embodiments, one end of the first matching circuit 450a is closer to one end of the carrier 410 than one end of the second matching circuit 450b, so that the first matching circuit 450a and the second matching circuit 450b are staggered on the side of the laser chip 420, which facilitates the electrical connection of the first matching circuit 450a and the second matching circuit 450b to the laser chip 420 and the second high-frequency line 413.

[0103] Figure 11 This is a structural diagram of a matching circuit according to some embodiments. Figure 11 The structure of a matching circuit is shown, and the structures of the first matching circuit 450a and the second matching circuit 450b can be referred to. Figure 11 The structure of the matching circuit is shown. (Example) Figure 11As shown, in some embodiments, the matching circuit 450 may include a first pad 451, a first resistor group 452a, and a second pad array 453a. The first resistor group 452a includes a plurality of first resistors 452, and the second pad array 453a includes a plurality of second pads 453. One end of the plurality of first resistors 452 is connected to the first pad 451, and the other end of the plurality of first resistors 452 is connected to the corresponding second pad 453. The plurality of first resistors 452 may be a plurality of resistors with different resistance values. For example, the first resistor group 452a may include 3, 4, or 5 first resistors 452, and the second pad array 453a may include 3, 4, or 5 second pads 453. The first pad 451 may be electrically connected to the EA electrode 421, the electrical adapter 430, or the second high-frequency line 413, etc., by wire bonding; any one of the second pads 453 in the second pad array 453a may be wire bonded to the ground plane on the carrier 410 or other matching circuit devices.

[0104] In some embodiments, the matching circuit 450 including the first resistor group 452a can form a structure in which multiple first resistors 452 are connected in parallel, which facilitates the selection of a suitable first resistor 452 to electrically connect to the laser chip 420 based on the actual performance of the laser chip 420, so that the laser chip 420 can be matched with a suitable first resistor 452.

[0105] In some embodiments, the first resistor group 452a may include five first resistors 452, and the second pad array 453a may include five second pads 453. The five first resistors 452 surround the periphery of the first pads 451, and the five second pads 453 surround the periphery of the five first resistors 452. One end of each of the five first resistors 452 is connected to the first pad 451; the other end of each of the five first resistors 452 is connected to one of the five second pads 453. One of the five second pads 453 may be wire-connected to the ground layer on the carrier 410. The resistance values ​​of the five first resistors 452 may be 40Ω, 45Ω, 50Ω, 55Ω, and 60Ω, respectively. Of course, in one embodiment, the resistance values ​​of the five first resistors 452 are not limited to these. Exemplarily, the first pad 451 may include five sides, and the five sides are connected to one end of each of the five first resistors 452.

[0106] Figure 12 This is a structural diagram of another matching circuit according to some embodiments. Figure 12 Another matching circuit structure is shown; the structures of the first matching circuit 450a and the second matching circuit 450b can be referred to. Figure 12 The circuit structure is shown. (As shown) Figure 12As shown, in some embodiments, the matching circuit 450 may include a third pad 454, a second resistor group 455, and a fourth pad array 456a. The second resistor group 455 may include a second resistor 4551 and a plurality of third resistors 4552. The plurality of third resistors 4552 may be resistors with different resistance values, or they may be resistors with the same resistance value. The fourth pad array 456a may include a plurality of fourth pads 456. One end of the second resistor 4551 is connected to the third pad 454, and the other end of the second resistor 4551 can be connected to the third resistors 4552 in sequence through the fourth pads 456. The second resistor group 455 may include two, three, or four third resistors 4552, and the fourth pad array 456a may include three, four, or five fourth pads 456. The third pad 454 can be wire-connected to the EA electrode 421, the electrical adapter 430, or the second high-frequency line 413, etc.; any one of the fourth pads 456 in the fourth pad array 456a can be wire-connected to the ground layer or other matching circuit devices on the carrier 410.

[0107] In some embodiments, the matching circuit 450, which includes the second resistor group 455, can form a structure in which the second resistor 4551 is connected in series with several third resistors 4552. This facilitates the selection of a suitable matching resistor based on the actual performance of the laser chip 420 to electrically connect the laser chip 420, so that the laser chip 420 can be matched with a suitable matching resistor.

[0108] In some embodiments, the second resistor group 455 may include a second resistor 4551 and four third resistors 4552, and the fourth pad array 456a may include five fourth pads 456. The third pads 454 and the five fourth pads 456 may be arranged sequentially along a certain direction of the carrier 410. One end of the second resistor 4551 is electrically connected to the third pad 454, and the other end of the second resistor 4551 is electrically connected to the fourth pad 456. The two ends of the four third resistors 4552 are respectively connected to the corresponding fourth pads 456, so that the second resistor 4551 and the four third resistors 4552 are arranged sequentially. The resistance value of the second resistor 4551 may be 40Ω, and the resistance values ​​of the four third resistors 4552 may be 5Ω. However, in some embodiments, the resistance value of the second resistor 4551 is not limited to 40Ω, and the resistance values ​​of the four third resistors 4552 are not limited to all being 5Ω; they may be 1Ω, 2Ω, or 3Ω, etc. Of course, the resistance values ​​of the four third resistors 4552 are not equal.

[0109] In some embodiments, the first matching circuit 450a and the second matching circuit 450b use Figure 11 and Figure 12 The combined structure of the matching circuit shown is illustrated.

[0110] In some embodiments, the structures of the first matching circuit 450a and the second matching circuit 450b are not limited to those of the second matching circuit 450b. Figure 11 and Figure 12 The structure shown can be used to... Figure 11 and Figure 12 The structure shown is modified.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: Circuit board; Light-emitting components, including laser assemblies; The laser component is electrically connected to the circuit board and is used to generate optical signals; The laser component includes: A carrier is provided with a first high-frequency line; the first high-frequency line extends from one end of the carrier to the other end of the carrier, and the first high-frequency line is electrically connected to the circuit board; A laser chip is disposed on the carrier, located on the side of one end of the first high-frequency line; an EA electrode is disposed on the top of the laser chip; The adapter resistor includes a first electrode and a second electrode; the first electrode is electrically connected to the EA electrode, and the second electrode is electrically connected to one end of the first high-frequency line; the width of the second electrode is close to the width of the first high-frequency line.

2. The optical module according to claim 1, characterized in that, The carrier is provided with a groove, which is located on the side of one end of the first high-frequency line; The laser chip is located within the groove, one end of the adapter resistor is located on the laser chip, and the other end of the adapter resistor is located on the carrier; The first electrode is welded to the EA electrode, and the second electrode is welded to one end of the first high-frequency line.

3. The optical module according to claim 1, characterized in that, The adapter resistor is located on the side of the laser chip, the first electrode is wire-connected to the EA electrode, and the second electrode is soldered to one end of the first high-frequency line.

4. The optical module according to claim 1, characterized in that, A pad is provided between the laser chip and one end of the first high-frequency line, and a gap is formed between the pad and the first high-frequency line. The adapter resistor covers the spacer, the bottom surface of the first electrode is soldered to the pad, the top surface of the first electrode is wired to the EA electrode, and the bottom surface of the second electrode is soldered to the first high-frequency line.

5. The optical module according to claim 1, characterized in that, The carrier is also provided with a first matching circuit, which is located on the side of the laser chip; The first matching circuit includes a first pad, a first resistor group, and a second pad array. The first resistor group includes multiple first resistors, and the second pad array includes multiple second pads. One end of the first resistor is connected to the first pad, and the other end of the first resistor is connected to the corresponding second pad. The first pad is wire-connected to the EA electrode or the first electrode.

6. The optical module according to claim 1, characterized in that, The carrier is also provided with a first matching circuit, which is located on the side of the laser chip; The first matching circuit includes a third pad, a second resistor group, and a fourth pad array. The second resistor group includes a second resistor and a plurality of third resistors, and the fourth pad array includes a plurality of fourth pads. One end of the second resistor is connected to the third pad, and the other end of the second resistor is connected to the fourth pad. The third resistors are connected in series through the fourth pads.

7. The optical module according to claim 1, characterized in that, The carrier is also provided with a second high-frequency line and a second matching circuit. The second high-frequency line extends from one end of the carrier to the other end of the carrier, and the second high-frequency line is located on one side of the laser chip, while the second matching circuit is located on the other side of the laser chip. One end of the second high-frequency line is wired to the second matching circuit, and the wire passes over the laser chip.

8. The optical module according to claim 1, characterized in that, The laser chip is also provided with an LD electrode on its top, with the EA electrode near one end of the laser chip and the LD electrode near the other end of the laser chip; a matching capacitor is provided on the carrier, with the matching capacitor near the other end of the laser chip, and the matching capacitor is wired to the LD electrode.

9. An optical module, characterized in that, include: Circuit board; Light-emitting components, including laser assemblies; The laser component is electrically connected to the circuit board and is used to generate optical signals; The laser component includes: A carrier is provided with a first high-frequency line; the first high-frequency line extends from one end of the carrier to the other end of the carrier, and the first high-frequency line is electrically connected to the circuit board; A laser chip is disposed on the carrier, located on the side of one end of the first high-frequency line; an EA electrode is disposed on the top of the laser chip; An electrical adapter is provided, with one end electrically connected to the EA electrode and the other end electrically connected to one end of the first high-frequency line; wherein the width of the electrical adapter is close to the width of the first high-frequency line, and the electrical adapter shortens the wire length between the EA electrode and the first high-frequency line.

10. The optical module according to claim 9, characterized in that, The carrier is also provided with a second high-frequency line, a first matching circuit, and a second matching circuit; the second high-frequency line extends from one end of the carrier to the other end of the carrier, the second high-frequency line is located between the laser chip and the first high-frequency line, and one end of the first high-frequency line and one end of the second high-frequency line are located on one side of the laser chip; The first matching circuit and the second matching circuit are located on the other side of the laser chip; one end of the electrical adapter is wired to the first matching circuit, and one end of the second high-frequency line is wired to the second matching circuit, with the wire crossing the laser chip.

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