Graphics card expansion heat dissipation device
Patent Information
- Application Number
- CN202522245341.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-23
- Publication Date
- 2026-10-13
- Estimated Expiration
- 2035-10-23
AI Technical Summary
[0005]本实用新型的目的在于提供一种显卡扩展散热装置，用以解决现有技术中显卡散热效率低，导致显卡高温降频的技术问题
[0013]本实用新型的有益效果为：本实用新型通过一个导热板与显卡的散热鳍片接触传导热量，并通过导热板连接的散热管散热，能够在不影响的显卡原有散热装置的情况，额外增加散热路径，提升散热效率。同时本实用新型在使用时，导热板可以穿过显卡后部的散热孔与显卡散热鳍片进行接触，保持散热管在机箱外，能够将热量传递到机箱外部，进一步提升显卡的散热效率。
Smart Images
Figure CN224851513U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of computer hardware technology, and specifically relates to a graphics card extended heat dissipation device. Background Technology
[0002] Data processing and model training in the geophysical field are characterized by large volumes, which places high demands on the computing power of graphics cards. In order to improve computing power density and reduce data synchronization time, the use of multiple graphics cards (GPUs) in parallel on the same machine is becoming increasingly common, resulting in greater heat generation. Heat dissipation has become a critical issue affecting the computing power of graphics cards.
[0003] Taking the Nvidia V100 graphics card as an example, its operating temperature can reach around 80°C, and the maximum operating temperature of HBM2 memory is 85°C. When the temperature reaches 87°C, the graphics card will automatically reduce its frequency to prevent overheating. If the temperature continues to rise to 90°C, the graphics card will automatically shut down to protect the hardware.
[0004] Currently, there are three main methods for cooling graphics cards: air cooling, liquid cooling, and phase change material cooling. Air cooling dissipates heat through heat sinks and fans, circulating hot air within the chassis. However, in scenarios with multiple GPUs (3-4 cards) in parallel computing, the lack of an effective exhaust path for the heat causes the temperature around the GPU to rise rapidly, triggering a throttling mechanism and resulting in a performance loss of 10-25%. Therefore, traditional fan scheduling algorithms cannot adapt to the instantaneous high power consumption of deep learning tasks, causing the GPU to reach its temperature threshold (typically 80°C) within seconds of startup and be forced to throttle. For example, a server rack equipped with 72 Blackwell GPUs consumes 120kW, and the traditional heat sink + fan combination struggles to keep the chip temperature within a safe threshold. Furthermore, increased fan speeds lead to noise pollution (>45dB). While liquid cooling is 3-5 times more efficient than air cooling, it requires high precision in the cold plate manufacturing process, complex piping sealing and maintenance, increasing costs by more than 40%, and also carries the risk of leakage. Although phase change materials (such as paraffin-based composite materials) can absorb instantaneous heat through solid-liquid phase change, their thermal conductivity is generally lower than 5 W / (m•K), and the volume expansion after phase change can easily lead to interfacial contact failure. Utility Model Content
[0005] The purpose of this invention is to provide a graphics card extended heat dissipation device to solve the technical problem of low heat dissipation efficiency of graphics cards in the prior art, which leads to high temperature and frequency reduction of graphics cards.
[0006] To solve the above-mentioned technical problems, this utility model provides a graphics card extended heat dissipation device, including a heat-conducting plate and a closed heat pipe; One end of the heat-conducting plate is used to contact the heat dissipation fins of the graphics card and form an interference fit with them, while the other end is connected to a closed heat pipe to conduct heat from the heat dissipation fins of the graphics card. The heat dissipation pipe is filled with coolant.
[0007] Furthermore, the inner wall of the heat dissipation pipe is uniformly provided with grooves extending along the axial direction of the heat dissipation pipe.
[0008] Furthermore, the heat-conducting plate is a U-shaped heat-conducting plate, with its sealed end connected to the heat dissipation pipe and its open end used to form an interference fit structure with one of the heat dissipation fins in the graphics card heat dissipation plate.
[0009] Furthermore, the heat-conducting plate is a U-shaped heat-conducting plate, with its sealed end connected to the heat dissipation pipe and its open end used for insertion and connection between two adjacent heat dissipation fins of the graphics card, forming an interference fit structure together with the two heat dissipation fins.
[0010] Furthermore, the heat-conducting plate is a T-shaped heat-conducting plate, with its flanges connected to the heat dissipation pipes, and its web used to be inserted between two adjacent heat dissipation fins of the graphics card, forming an interference fit structure together with the two heat dissipation fins.
[0011] Furthermore, the volume of the coolant accounts for 5% to 25% of the total volume of the heat dissipation pipe cavity.
[0012] Furthermore, the heat-conducting plate and the heat dissipation pipe are connected by welding.
[0013] The beneficial effects of this invention are as follows: This invention conducts heat through contact between a heat-conducting plate and the heat sink fins of the graphics card, and dissipates heat through the heat pipes connected to the heat-conducting plate. This adds an extra heat dissipation path without affecting the original heat dissipation device of the graphics card, thus improving heat dissipation efficiency. Furthermore, during use, the heat-conducting plate can pass through the heat dissipation holes at the rear of the graphics card to contact the heat sink fins, keeping the heat pipes outside the chassis, allowing heat to be transferred to the outside of the chassis, further improving the graphics card's heat dissipation efficiency. Attached Figure Description
[0014] Figure 1 This is a structural diagram of the graphics card extended heat dissipation device of this utility model; Figure 2 This is a schematic diagram of the groove on the inner wall of the heat dissipation pipe of this utility model; Figure 3 This is a diagram showing the assembly relationship between the graphics card extended cooling device and the graphics card heatsink fins of this utility model. Figure 4 This is a diagram showing the positional relationship between the graphics card expansion cooling device and the graphics card of this utility model. Detailed Implementation
[0015] This invention uses a heat-conducting plate to conduct heat through contact with the graphics card's heatsink fins, and then dissipates heat through a heat pipe connected to the heat-conducting plate. This adds an extra heat dissipation path without affecting the original graphics card cooling system, thus improving cooling efficiency. Furthermore, during use, the heat-conducting plate can pass through the ventilation holes at the rear of the graphics card to contact the heatsink fins, keeping the heat pipes outside the chassis, allowing heat to be transferred to the outside of the chassis, further improving the graphics card's cooling efficiency.
[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.
[0017] Example: This utility model discloses a graphics card extended heat dissipation device, the structure of which is as follows: Figure 1 As shown, the device includes a heat-conducting plate for clamping onto the heatsink fins and a sealed heat pipe. One end of the heat-conducting plate is designed for pluggable contact with the graphics card heatsink fins, dissipating heat from the fins upon contact. The other end is welded with a sealed heat pipe to conduct heat from the heat-conducting plate into the heat pipe. The heat pipe is filled with coolant.
[0018] In this embodiment, the connection between the heat-conducting plate and the heat dissipation pipe is welding. In other embodiments, a threaded connection may also be used.
[0019] In this embodiment, the heat dissipation pipe is a capillary heat dissipation pipe, and grooves are evenly distributed on the inner wall of the heat dissipation pipe, as shown in the figure. Figure 2 As shown. The groove extends axially along the heat dissipation pipe to form a flow channel for the condensate in the heat dissipation pipe.
[0020] In this embodiment, the coolant is pure water, and the volume of coolant filling the heat dissipation pipe is 15% of the volume of the heat dissipation pipe cavity. In other embodiments, the volume of coolant filling the heat dissipation pipe is 5% to 25% of the volume of the heat dissipation pipe cavity. The materials of the heat conduction plate and the heat dissipation pipe are selected from phosphor bronze alloy based on thermal conductivity, elasticity and cost.
[0021] As one embodiment, the heat-conducting plate can be a U-shaped heat-conducting plate or a T-shaped heat-conducting plate.
[0022] When the heatsink is U-shaped, a heat pipe is welded to the sealed end of the U-shaped heatsink. The open end of the U-shaped heatsink is used to clamp onto one of the heatsinks of the graphics card heatsink, forming an interference fit between the heatsink and the heatsink. The open end of the U-shaped heatsink can also be inserted between two adjacent heatsinks of the graphics card heatsink, forming an interference fit between the two heatsinks. In this case, the assembly relationship between the graphics card cooling extension device and the graphics card heatsink is as follows: Figure 3 As shown.
[0023] When the heatsink is a T-shaped heatsink, heat pipes are welded to the flanges of the T-shaped heatsink, and the web is used to connect between two adjacent heatsinks of the graphics card heatsink, forming a pluggable interference fit structure with the two adjacent heatsinks of the graphics card heatsink.
[0024] When using the graphics card extended cooling device of this utility model, such as Figure 4 As shown, this invention is inserted into the rear heatsink of the graphics card. The heat-conducting plate clamps the aluminum heat dissipation fins inside the graphics card, or is inserted into the gap between two adjacent heatsink fins. The heat generated by the graphics card is conducted to the coolant in the heat pipes through the heatsink fins and the heat-conducting plate of this invention's extended heat dissipation device. The coolant heats up and evaporates into a gaseous state, then diffuses into the end away from the heat-conducting plate in the heat pipes. It then condenses at the end away from the heatsink, becoming a liquid coolant. Under the capillary effect of the grooves in the heat pipes, the liquid coolant flows back to the end closer to the heatsink. This achieves the goal of transferring the heat from the heatsink to the end away from the heatsink for release via the heat pipes and coolant.
[0025] The cooling device passes through the ventilation holes on the chassis, thus quickly dissipating heat from the graphics card's heatsink fins to the outside of the chassis and releasing it into the surrounding air. This expands the heat dissipation path, improves cooling efficiency, and prevents the graphics card from throttling and being damaged due to rapid temperature increases during heavy computations. Multiple graphics card expansion cooling devices of this invention can be connected to a single graphics card; the specific number of connected expansion cooling devices can be determined based on the graphics card's computational load and temperature.
[0026] In summary, the beneficial effects of this utility model include: no need to stop the machine or change the existing installation mode, convenient and quick to use, excellent heat dissipation effect, fully enclosed pumpless liquid cooling, heat pipes located outside the chassis, leakage will not affect the graphics card, safe and reliable, and no need to worry about corrosion or leakage.
Claims
1. A graphics card extended heat dissipation device, characterized in that, Includes a heat-conducting plate and enclosed heat dissipation pipes; One end of the heat-conducting plate is used to contact the heat dissipation fins of the graphics card and form an interference fit with them, while the other end is connected to a closed heat pipe to conduct heat from the heat dissipation fins of the graphics card. The heat dissipation pipe is filled with coolant.
2. The graphics card extended heat dissipation device according to claim 1, characterized in that, The inner wall of the heat dissipation pipe is uniformly provided with grooves extending along the axial direction of the heat dissipation pipe.
3. The graphics card extended heat dissipation device according to claim 1 or 2, characterized in that, The heat-conducting plate is a U-shaped heat-conducting plate, with its sealed end connected to the heat dissipation pipe and its open end used to form an interference fit structure with one of the heat dissipation fins of the graphics card.
4. The graphics card extended heat dissipation device according to claim 1 or 2, characterized in that, The heat-conducting plate is a U-shaped heat-conducting plate, with its sealed end connected to the heat dissipation pipe and its open end used to be inserted between two adjacent heat dissipation fins of the graphics card, forming an interference fit structure together with the two heat dissipation fins.
5. The graphics card extended heat dissipation device according to claim 1 or 2, characterized in that, The heat-conducting plate is a T-shaped heat-conducting plate, with its flanges connected to the heat dissipation pipes, and its web plate used to be inserted between two adjacent heat dissipation fins of the graphics card, forming an interference fit structure together with the two heat dissipation fins.
6. The graphics card extended heat dissipation device according to claim 1 or 2, characterized in that, The volume of the coolant accounts for 5% to 25% of the total volume of the heat sink cavity.
7. The graphics card extended heat dissipation device according to claim 1 or 2, characterized in that, The heat-conducting plate and the heat dissipation pipe are connected by welding.