Modular graphics card cooling device

Abstract

The utility model relates to a display card heat dissipation technology field discloses a modularization display card heat dissipation device, including display card subassembly, both sides of display card subassembly are provided with heat dissipation subassembly, display card subassembly includes first base plate, and both sides upper end and lower end middle part of first base plate are fixedly provided with mounting panel, and the upper end of four mounting panels all is seted up with mounting hole no.

Description

Technical Field

[0001] This utility model relates to the field of graphics card heat dissipation technology, and in particular to a modular graphics card heat dissipation device. Background Technology

[0002] A graphics card is a hardware core in a computer that specifically processes graphics data and converts digital signals into visible images. It uses a powerful processor (GPU) and video memory to handle graphics computing tasks such as gaming, design, and video rendering. The graphics card cooling system is a key component attached to the GPU, typically consisting of metal heatsinks, heat pipes, and a fan. Its function is to quickly conduct and dissipate the heat generated by the GPU during high-performance operation into the air, ensuring that the graphics card operates stably within a safe temperature range and preventing performance degradation or damage due to overheating.

[0003] Existing graphics card cooling systems typically mount the graphics card on a base plate with multiple heatsinks. The heatsinks increase the heat exchange area between the graphics card and the air, while fans or liquid cooling are used to cool the heatsinks. However, some graphics cards have a fixed base plate, making it inconvenient for users to adjust the cooling area when the graphics card is installed in a small case.

[0004] Therefore, those skilled in the art have provided a modular graphics card cooling device to solve the problems mentioned in the background art. Utility Model Content

[0005] The purpose of this utility model is to address the shortcomings of existing technologies by proposing a modular graphics card cooling device. Users can choose to install cooling components on one or both sides according to the chassis space and cooling requirements to flexibly adjust the cooling area. The device is quickly positioned using docking slots and fixed with bolts, effectively solving the problem of poor adaptability of traditional fixed cooling devices.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a modular graphics card heat dissipation device, including a graphics card assembly, wherein heat dissipation components are provided on both sides of the graphics card assembly; The graphics card assembly includes a first substrate, with mounting plates fixedly disposed at the upper and lower middle parts of both sides of the first substrate. Each of the four mounting plates has a mounting hole at its upper end. Limiting blocks are fixedly disposed at the front and rear ends of both sides of the first substrate. Each of the four limiting blocks has a mating groove on its inner side. The heat dissipation assembly includes a second substrate and multiple heat pipes. Two mounting holes are opened in the middle of one side of the second substrate, and threaded sleeves are fixedly provided at one end of each of the multiple heat pipes.

[0007] Furthermore, the middle part of one side of the second substrate is movably disposed within two mounting plates, and the front end and rear end of one side of the second substrate are respectively movably disposed within two mating grooves.

[0008] Furthermore, bolts are installed through the interiors of both mounting holes 2 and 2 mounting holes 1, and the lower ends of both bolts are fixed by nuts.

[0009] Furthermore, a graphics card body is fixedly disposed at the center of the upper end of the first substrate, and one end of each of the multiple heat pipes is fixedly connected to multiple heat dissipation copper pipes on one side of the graphics card body through a threaded sleeve. A first cooling fan is fixedly disposed at the lower end of the first substrate.

[0010] Furthermore, multiple first heat sinks are fixedly arranged on both sides of the upper end of the first substrate, and multiple through holes are opened on one side of each of the multiple first heat sinks. The heat dissipation copper pipes on both sides of the graphics card body are respectively inserted into the multiple through holes.

[0011] Furthermore, a plurality of second heat sinks are fixedly disposed on the upper end of the second substrate, and a plurality of through holes are provided on one side of each of the plurality of second heat sinks.

[0012] Furthermore, multiple heat pipes are respectively disposed through multiple through holes, and a second cooling fan is fixedly disposed at the lower end of the second substrate.

[0013] This utility model has the following beneficial effects: This invention proposes a modular graphics card cooling device. Through its modular design, users can flexibly choose to install cooling components on one or both sides of the graphics card based on the actual space layout and cooling requirements, thereby adjusting the effective heat dissipation area and capacity. During installation, the mating slots allow for quick positioning, followed by reliable fixing with bolts and nuts. This expandable modular cooling component gives the graphics card cooling device a certain degree of adaptability. Attached Figure Description

[0014] Figure 1 This is a three-dimensional axonometric schematic diagram of the present invention; Figure 2 This is an exploded isometric view of the graphics card assembly and heat dissipation assembly of this utility model; Figure 3 In this utility model Figure 2 Enlarged view of point A; Figure 4 In this utility model Figure 2 Enlarged view of point B; Figure 5 This is an isometric view of the exploded structure of the graphics card assembly of this utility model; Figure 6 This is an isometric view of the exploded structure of the heat dissipation component of this utility model.

[0015] Legend: 1. Graphics card assembly; 101. First base plate; 102. Mounting plate; 103. Mounting hole one; 104. Limiting block; 105. Connecting groove; 106. First heat sink; 107. Through hole one; 108. Graphics card body; 109. First cooling fan; 2. Heat dissipation assembly; 201. Second base plate; 202. Mounting hole two; 203. Heat pipe; 204. Threaded sleeve; 205. Second heat sink; 206. Through hole two; 207. Second cooling fan. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Reference Figure 1 - Figure 6 This utility model provides an embodiment of a modular graphics card cooling device, including a graphics card assembly 1, with cooling components 2 on both sides of the graphics card assembly 1. The graphics card assembly 1 includes a first substrate 101, with mounting plates 102 fixedly disposed at the upper and lower middle parts of both sides of the first substrate 101. Each of the four mounting plates 102 has a mounting hole 103 at its upper end. Limiting blocks 104 are fixedly disposed at the front and rear ends of both sides of the first substrate 101, with mating grooves 105 formed on the inner side of each of the four limiting blocks 104. A graphics card body 108 is fixedly installed at the center of the upper end of the first substrate 101. One end of each of the multiple heat pipes 203 is fixedly connected to a multiple heat dissipation copper pipe on one side of the graphics card body 108 through a threaded sleeve 204. A first cooling fan 109 is fixedly installed at the lower end of the first substrate 101. Multiple first heat sinks 106 are fixedly installed on both sides of the upper end of the first substrate 101. Multiple through holes 107 are opened on one side of each of the multiple first heat sinks 106. The heat dissipation copper pipes on both sides of the graphics card body 108 are respectively installed through the multiple through holes 107.

[0018] Specifically, identical heat dissipation components 2 are set on both sides of the graphics card component 1, and users can choose which side of the graphics card component 1 to install the heat dissipation component 2 according to their actual needs. The graphics card assembly 1 mainly includes a first substrate 101. Both the first substrate 101 and the first heat sink 106 are made of aluminum alloy, which has good thermal conductivity and can quickly transfer the heat generated by the graphics card body 108 to the first heat sink 106 and the first substrate 101. At the same time, a first cooling fan 109 is fixedly installed at the lower end of the first substrate 101. The first cooling fan 109 is a common axial cooling fan in the prior art. It obtains power through a standard power interface and drives the fan blades to rotate. When the first cooling fan 109 is started, the airflow it generates blows directly onto the first substrate 101. The airflow accelerates the heat exchange between the surface of the first substrate 101 and the air, thereby forcibly convection and carrying away the heat accumulated on the first substrate 101 and the first heat sink 106, and exhausting it to the outside of the chassis or into the chassis air duct, thus achieving basic active cooling of the graphics card core area. Secondly, mounting plates 102 are provided in the middle of both sides of the first substrate 101, and limit blocks 104 are provided at the upper and lower ends of both sides. The mounting plates 102 and limit blocks 104 are made of the same aluminum alloy material as the first substrate 101 and have certain thermal conductivity to avoid local heat accumulation on the first substrate 101 due to poor thermal conductivity of the mounting plates 102 and limit blocks 104. Next, a mounting hole 103 is provided at the upper end of the mounting plate 102, which corresponds to a mounting hole 202. After the mounting hole 103 and the mounting hole 202 are aligned, the user passes the bolt through the two holes and then screws on the nut to complete the fixing of the first substrate 101 and the second substrate 201. At the same time, the mating groove 105 provided inside the limiting block 104 plays a certain guiding role. When installing the heat dissipation component 2, the user aligns the front end and rear end of one side of the second substrate 201 with the mating groove 105 respectively, and then splices the two substrates together. This structure plays a limiting role for the second substrate 201, ensuring that the mounting hole 103 and the mounting hole 202 can be accurately aligned. In addition, a graphics card body 108 is provided at the upper center of the first substrate 101. The graphics card body 108 is a conventional graphics card structure in the prior art. Multiple heat dissipation copper pipes are extended and fixed on both sides of the graphics card body 108. These heat dissipation copper pipes are respectively installed through the through holes 107 of the first heat sink 106 to conduct the heat generated by the GPU core along the copper pipes.

[0019] Reference Figure 1 - Figure 6The heat dissipation assembly 2 includes a second substrate 201 and multiple heat pipes 203. Two mounting holes 202 are opened in the middle of one side of the second substrate 201. One end of each of the multiple heat pipes 203 is fixedly provided with a threaded sleeve 204. The middle of one side of the second substrate 201 is movably disposed in two mounting plates 102. The front end and rear end of one side of the second substrate 201 are respectively movably disposed in two docking grooves 105. Bolts are provided through the two mounting holes 202 and the two mounting holes 103, and the lower ends of the two bolts are fixed by nuts.

[0020] Specifically, the second substrate 201 is made of the same aluminum alloy as the first substrate 101, which has good thermal conductivity and facilitates subsequent heat dissipation. A threaded sleeve 204 is provided at one end of the multiple heat pipes 203. The threaded sleeve 204 has an internal thread that matches the thread at one end of the heat dissipation copper pipe on the graphics card body 108. Through the threaded sleeve 204, the user can connect the heat pipes 203 to the heat dissipation copper pipe, thereby extending the heat conduction path of the heat dissipation copper pipe. The heat pipes 203 are made of the same copper material as the heat dissipation copper pipe, which gives the heat pipes 203 excellent heat conduction performance and can form a continuous heat transfer path with the original heat dissipation copper pipe of the graphics card body 108.

[0021] Reference Figure 1 - Figure 6 The upper end of the second substrate 201 is fixedly provided with a plurality of second heat sinks 205, and a plurality of through holes 206 are opened on one side of each of the plurality of second heat sinks 205. A plurality of heat pipes 203 are respectively disposed in the plurality of through holes 206. The lower end of the second substrate 201 is fixedly provided with a second cooling fan 207.

[0022] Specifically, the multiple second heat sinks 205 are made of the same aluminum alloy as the second substrate 201, which gives them thermal conductivity. Each of the multiple through holes 206 opened on one side of the multiple second heat sinks 205 is provided with a heat pipe 203. The heat pipe 203 can transfer its own heat to the heat sink by passing through the second heat sink 205. Subsequently, the second heat sink 205 transfers heat to the second substrate 201. A second cooling fan 207, identical to the first cooling fan 109, is located at the lower end of the second substrate 201. This second cooling fan 207 is also a common axial cooling fan in the prior art, with the same structure, power supply, and operating principle as the first cooling fan 109. After the second cooling fan 207 is activated, the airflow it generates directly acts on the second substrate 201, thereby forcibly convection and expelling the heat transferred to the second heat sink 205 and the second substrate 201 via the heat pipe 203.

[0023] Working principle: Users can install heat dissipation components 2 on both sides of the graphics card component 1 according to the actual space layout and heat dissipation requirements inside the chassis. During installation, align the side of the second substrate 201 with the second mounting hole 202 with the corresponding mounting plate 102 and limiting block 104 on the graphics card component 1. Perform preliminary positioning by sliding the edge of the second substrate 201 into the mating groove 105 of the limiting block 104 to ensure that the two mounting holes 202 on the second substrate 201 are accurately aligned with the two mounting holes 103 on the mounting plate 102. Then, use bolts to pass through the aligned mounting holes 103 and mounting holes 202 and fix them with nuts to assemble the heat dissipation component 2 onto the graphics card component 1. Secondly, during disassembly, the user only needs to unscrew the nut and pull the bolt out from the mounting hole 103 and mounting hole 202 to release the fixation between the second substrate 201 and the first substrate 101, thus completing the disassembly of the heat dissipation component 2.

[0024] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A modular graphics card cooling device, comprising a graphics card assembly (1), characterized in that: The graphics card assembly (1) is provided with heat dissipation components (2) on both sides; The graphics card assembly (1) includes a first substrate (101), and mounting plates (102) are fixedly provided on the upper and lower middle parts of both sides of the first substrate (101). Mounting holes (103) are opened on the upper ends of the four mounting plates (102). Limiting blocks (104) are fixedly provided on the front and rear ends of both sides of the first substrate (101). Connecting grooves (105) are opened on the inner side of the four limiting blocks (104). The heat dissipation assembly (2) includes a second substrate (201) and a plurality of heat pipes (203). Two mounting holes (202) are opened in the middle of one side of the second substrate (201), and a threaded sleeve (204) is fixedly provided at one end of each of the plurality of heat pipes (203).

2. The modular graphics card cooling device according to claim 1, characterized in that: The second substrate (201) is movably disposed in the middle of one side of two mounting plates (102), and the front and rear ends of one side of the second substrate (201) are respectively movably disposed in two docking grooves (105).

3. The modular graphics card cooling device according to claim 2, characterized in that: Bolts are installed through the two mounting holes 202 and the two mounting holes 103, and the lower ends of the two bolts are fixed by nuts.

4. The modular graphics card cooling device according to claim 1, characterized in that: A graphics card body (108) is fixedly disposed at the upper center of the first substrate (101). One end of each of the multiple heat pipes (203) is fixedly connected to multiple heat dissipation copper pipes on one side of the graphics card body (108) through a threaded sleeve (204). A first cooling fan (109) is fixedly disposed at the lower end of the first substrate (101).

5. A modular graphics card cooling device according to claim 4, characterized in that: Multiple first heat sinks (106) are fixedly arranged on both sides of the upper end of the first substrate (101). Multiple through holes (107) are opened on one side of each of the multiple first heat sinks (106). The heat dissipation copper pipes on both sides of the graphics card body (108) are respectively installed through the multiple through holes (107).

6. The modular graphics card cooling device according to claim 1, characterized in that: The upper end of the second substrate (201) is fixedly provided with a plurality of second heat sinks (205), and a plurality of through holes (206) are provided on one side of each of the plurality of second heat sinks (205).

7. A modular graphics card cooling device according to claim 6, characterized in that: Multiple heat pipes (203) are respectively disposed through multiple through holes (206), and a second cooling fan (207) is fixedly disposed at the lower end of the second substrate (201).

Images