Smart card

Abstract

The application discloses a kind of smart cards. Smart card, including: card base, card base includes at least one functional layer, functional layer includes at least partially exposed arrangement scintillator layer;Chip, fixed in card base. Functional layer in card base includes at least one at least partially exposed arrangement scintillator layer, scintillator layer can be used to measure radiation, when radiation particle passes through scintillator layer, scintillator layer will emit light scintillation, since scintillator layer at least partially exposed arrangement, thus user can visually observe the scintillation of scintillator layer, remind user around there is radiation, and then user can take action in time to prevent radiation hazards, protect the health of user, effectively improve the use performance of smart card, expand the use of smart card, improve the added value of smart card, and smart card cost is low, small, convenient to carry, can timely discover radiation hazards.

Description

Technical Field

[0001] This application relates to the field of smart card technology, and more particularly to a smart card. Background Technology

[0002] Smart cards typically refer to cards with an embedded chip module. Smart cards include standard cards, all with specific dimensions and made of plastic. They are media used to identify individuals and store their information. Various smart cards, such as work permits, ID cards, various financial transaction cards, and membership cards, are widely used in people's lives.

[0003] Due to limitations in the structural materials of existing smart cards, their performance cannot meet the requirements. Utility Model Content

[0004] This application provides a smart card whose functional layer includes at least one partially exposed scintillator layer. The scintillator layer can be used to measure radiation. When a radiating particle passes through the scintillator layer, the scintillator layer emits light and flashes. The user can visually observe the flashing of the scintillator layer, alerting the user to the presence of radiation in the surrounding area. The user can then take timely action to prevent radiation hazards, protecting the user's health, effectively improving the performance of the smart card, expanding its uses, increasing its added value, and the smart card is low in cost, small in size, and easy to carry.

[0005] This application provides a smart card, comprising: a card base, the card base including at least one functional layer, the functional layer including at least partially exposed scintillator layer; and a chip fixed to the card base.

[0006] According to the embodiments provided in this application, along the thickness direction of the card base, the functional layer includes a first surface layer, a first printed substrate layer, an intermediate layer, a second printed substrate layer, and a second surface layer stacked together; at least one of the first surface layer and the second surface layer includes the scintillator layer.

[0007] According to the embodiments provided in this application, the first surface layer includes the scintillator layer, and a first slot is formed on the first surface layer, wherein the chip is at least partially located within the first slot.

[0008] According to the embodiments provided in this application, the functional layer further includes a thickness compensation layer disposed between the first surface layer and the first printed substrate layer, wherein the sum of the thicknesses of the thickness compensation layer and the scintillator layer is equal to the thickness of the second surface layer.

[0009] According to the embodiments provided in this application, the thickness of the scintillator layer is greater than or equal to 0.065 mm and less than or equal to 0.075 mm; and / or, the thickness of the thickness compensation layer is greater than or equal to 0.005 mm and less than or equal to 0.015 mm; and / or, the thickness of the second surface layer is greater than or equal to 0.075 mm and less than or equal to 0.085 mm.

[0010] According to the embodiments provided in this application, the thickness compensation layer comprises a transparent water-based laminate.

[0011] According to the embodiments provided in this application, the scintillator layer includes a scintillator crystal and polyvinyl alcohol.

[0012] According to the embodiments provided in this application, at least one of the first printed substrate layer, the intermediate layer, and the second printed substrate layer includes a rice husk card base material layer.

[0013] According to the embodiments provided in this application, the rice husk card base material layer includes rice husk fiber and bio-based plastic.

[0014] According to the embodiments provided in this application, at least one of the two opposing surfaces of the rice husk card base material layer is provided with a waterproof coating along the thickness direction of the card base.

[0015] The smart card provided in this embodiment includes a card base and a chip module. The functional layer in the card base includes at least one scintillator layer that is at least partially exposed. The scintillator layer can be used to measure radiation. When radiation particles pass through the scintillator layer, the scintillator layer will emit light and flash. Since the scintillator layer is at least partially exposed, the user can intuitively observe the flashing of the scintillator layer, alerting the user to the presence of radiation in the surrounding area. The user can then take timely action to prevent radiation hazards, protect the user's health, effectively improve the performance of the smart card, expand the uses of the smart card, increase the added value of the smart card, and the smart card is low in cost, small in size, easy to carry, and can detect radiation hazards in a timely manner. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a smart card according to an embodiment of this application;

[0018] Figure 2 This is an embodiment of the present application. Figure 1Schematic diagram of the cross section at point AA;

[0019] Figure 3 This is another embodiment of the present application. Figure 1 A cross-sectional view at point AA.

[0020] Figure label:

[0021] 1. Card base; 11. First surface layer; 12. First printed substrate layer; 13. Intermediate layer; 14. Second printed substrate layer; 15. Second surface layer; 16. Thickness compensation layer; 2. Chip; 3. Magnetic strip. Detailed Implementation

[0022] The features and exemplary embodiments of various aspects of this application will now be described in detail. In the following detailed description, numerous specific details are set forth in order to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples thereof.

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The embodiments will now be described in detail with reference to the accompanying drawings.

[0024] Relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another; they do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion; such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0025] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above another layer or region, or that it contains other layers or regions between it and another layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" another layer or region.

[0026] Additionally, the term "and / or" in this article is merely a description of the relationship between related objects; it indicates that three relationships can exist. For example, A and / or B can represent: A existing alone; A and B existing simultaneously; and B existing alone. Furthermore, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0027] It should be understood that in the embodiments of this application, "B corresponding to A" means that B is associated with A; B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0028] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of a smart card according to an embodiment of this application; Figure 2 This is an embodiment of the present application. Figure 1 A cross-sectional view at point AA.

[0029] This application provides a smart card, including: a card base 1, which includes at least one functional layer, the functional layer including at least partially exposed scintillator layer; and a chip 2, fixed to the card base 1.

[0030] The smart card provided in this application includes a card base 1 and a chip 2. The functional layer in the card base 1 includes at least one scintillator layer that is at least partially exposed. The scintillator layer can be used to measure radiation. When radiation particles pass through the scintillator layer, the scintillator layer will emit light and flash. Since the scintillator layer is at least partially exposed, the user can intuitively observe the flashing of the scintillator layer, which alerts the user to the presence of radiation in the surrounding area. In turn, the user can take timely action to prevent radiation hazards, protect the user's health, effectively improve the performance of the smart card, expand the uses of the smart card, increase the added value of the smart card, and the smart card is low in cost, small in size, easy to carry, and can detect radiation hazards in a timely manner.

[0031] Scintillators are a class of special functional materials whose core characteristic is their ability to absorb the energy of high-energy particles (such as alpha and beta particles) or radiation (such as X-rays and gamma rays) and convert that energy into visible or near-ultraviolet light through a de-excitation process. This energy conversion process typically occurs on a nanosecond to microsecond timescale, exhibiting rapid response characteristics. Scintillators mainly include inorganic scintillators and organic scintillators.

[0032] Inorganic scintillators are mainly inorganic crystals doped with activators, such as sodium iodide (thallium), bismuth germanate (BGO), and lead tungstate, which are characterized by high density, strong radiation resistance, and high light yield. Rare earth elements (such as europium and cerium) are often used as activators to improve luminous efficiency.

[0033] Organic scintillators include aromatic compounds (such as anthracene and terphenyl) and novel copper-iodine cluster materials, with luminescence mechanisms based on molecular transitions or exciton recombination. Their advantage lies in their ability to be processed into flexible thin films or liquid forms, but their light output is typically lower than that of inorganic materials.

[0034] It should be noted that the scintillator layer provided in this application is a scintillator thin film material. The scintillator thin film is flexible, transparent, has a large area, and has uniform scintillator dispersion. This X-ray excited luminescent scintillator thin film can provide high X-ray imaging resolution for biological samples and industrial samples.

[0035] Optionally, the scintillator film material is obtained by coating scintillator ink onto a large substrate and then air-drying it.

[0036] Optionally, the scintillator layer provided in this application is a transparent film layer to ensure that the addition of the scintillator material does not affect the clarity and readability of the text, images or other markings on the smart card.

[0037] The materials used in scintillator layers must take into account their impact on human health and the environment. The materials used in scintillator layers themselves comply with relevant safety standards and regulations and will not have adverse environmental impacts.

[0038] Optionally, when the smart card is a dual-interface card, the smart card also includes a chip module, which includes a chip 2 and a carrier tape. The front of the carrier tape has a contact pad that powers the chip 2 during contact payment. The back of the carrier tape also includes contacts that are connected to the coil in the intermediate layer 13. During contactless payment, the coil powers the chip 2.

[0039] Optionally, the carrier tape includes a carrier and a strip. The strip and the chip 2 are electrically connected by leads. The carrier is the component used to carry the strip and connect and fix the chip 2. The strip is used for interface purposes and can adopt a copper-based structure with nickel-gold elements electroplated on the contact surface to ensure signal transmission effect while avoiding rust or damage.

[0040] Optionally, the carrier tape has chip 2 carrier areas that are isolated from each other and several functional areas, which are, in order, an input / output functional area, a clock functional area, a power supply functional area, a ground functional area, a reset functional area and an idle functional area.

[0041] The chip 2 provided in this application embodiment can be set to a conventional shape such as square, or it can be set to a circular, waist-shaped, irregular shape, or any other irregular shape.

[0042] Please see Figure 2 and Figure 3In some optional embodiments, along the thickness direction of the card base 1, the functional layer includes a first surface layer 11, a first printed substrate layer 12, an intermediate layer 13, a second printed substrate layer 14, and a second surface layer 15 stacked together; at least one of the first surface layer 11 and the second surface layer 15 includes a scintillator layer.

[0043] It is understood that in this embodiment, the first surface layer 11 and the second surface layer 15 are the outermost film layers in the smart card. Users can directly observe the first surface layer 11 and the second surface layer 15. Therefore, at least one of the first surface layer 11 and the second surface layer 15 can be made of scintillator material to utilize the characteristic of scintillator material to scintillate under strong radiation and realize the detection of radiation. For example, either the first surface layer 11 or the second surface layer 15 can be a scintillator layer to reduce the manufacturing cost. Alternatively, the first surface layer 11 and the second surface layer 15 can both be scintillator layers to make it easier for users to detect the scintillation.

[0044] The first printing substrate layer 12 and the second printing substrate layer 14 can be printed with the required patterns according to actual needs. Of course, they can also be left unprinted without any special restrictions.

[0045] Optionally, the first printed substrate layer 12, the intermediate layer 13, and the second printed substrate layer 14 each include at least one of a polyvinyl chloride (PVC) layer, a polyethylene terephthalate (PET) layer, a polycarbonate (PC) layer, and a polystyrene (PG) layer. Alternatively, depending on actual needs, the first printed substrate layer 12, the intermediate layer 13, and the second printed substrate layer 14 may also include other materials, such as environmentally friendly materials like rice husks, which will be described in detail later.

[0046] In some alternative embodiments, when the smart card is a contactless card, the intermediate layer 13 may include a circuit board, which includes a power supply coil and is electrically connected to the chip 2.

[0047] Optionally, the magnetic field of chip 2 near the card reader requires that the induced current generated by the power supply coil be sufficient to power contactless communication. The larger the area of ​​the power supply coil, the larger the induced current generated by the power supply coil.

[0048] Optionally, the power supply coils are arranged in a ring, specifically in a square or circular arrangement.

[0049] Optionally, the circuit board can be a flexible circuit board.

[0050] Optionally, the smart card may also include a magnetic stripe 3 disposed on the side of the second surface layer 15 opposite to the intermediate layer 13.

[0051] In some alternative embodiments, the first surface layer 11 includes a scintillator layer and a first slot is formed on the first surface layer 11, with the chip 2 located at least partially within the first slot.

[0052] In this embodiment, the smart card can be a contact card. The chip 2 is placed on the outermost first surface layer 11 to facilitate information interaction with the outside world. The chip 2 is accommodated and fixed by the first slot to avoid damage to the chip 2. The first surface layer 11 includes a scintillator layer, while the second surface layer 12 may include a polyvinyl chloride (PVC) material layer to reduce production costs and difficulty and facilitate preparation.

[0053] In this embodiment, a scintillator layer can be used instead of the first surface layer 11 originally prepared using a polyvinyl chloride (PVC) material layer.

[0054] Please see Figure 3 In some optional embodiments, the functional layer further includes a thickness compensation layer 16 disposed between the first surface layer 11 and the first printed substrate layer 12, wherein the sum of the thicknesses of the thickness compensation layer 16 and the scintillator layer is equal to the thickness of the second surface layer 15.

[0055] It should be noted that, due to factors such as the manufacturing process and material properties, the film thickness formed by the scintillator layer is relatively small, thinner than the thickness of the first surface layer 11 and the second surface layer 15 originally made of polyvinyl chloride. In order to make the thickness of the smart card provided in this application meet the requirements of ISO7816 standard, a thickness compensation layer 16 is additionally provided between the first surface layer 11 and the first printed substrate layer 12 in this embodiment. The thickness compensation layer 16 is used to compensate for the thickness difference between the scintillator layer and the first surface layer 11 originally made of polyvinyl chloride, so that the thickness of the smart card meets the standard.

[0056] The thickness of the second surface layer 15, which is made of polyvinyl chloride, is usually the same as the thickness of the first surface layer 11, which is made of polyvinyl chloride.

[0057] In some optional embodiments, the thickness of the scintillator layer is greater than or equal to 0.065 mm and less than or equal to 0.075 mm, depending on the actual manufacturing process and materials. For example, the thickness of the scintillator layer can be any of 0.065 mm, 0.07 mm, or 0.075 mm.

[0058] And / or, the thickness of the thickness compensation layer 16 is greater than or equal to 0.005 mm and less than or equal to 0.015 mm, depending on the actual thickness of the scintillator layer. For example, the thickness of the thickness compensation layer 16 can be any of 0.005 mm, 0.01 mm, or 0.015 mm.

[0059] And / or, the thickness of the second surface layer 15 is greater than or equal to 0.075 mm and less than or equal to 0.085 mm. The specific thickness is set according to the actual manufacturing process and materials. For example, the thickness of the second surface layer 15 can be any one of 0.075 mm, 0.08 mm, or 0.085 mm.

[0060] For example, the second surface layer 15 is made of polyvinyl chloride material and has a thickness of 0.08 mm. The thickness of the scintillator layer is equal to 0.07 mm. Correspondingly, the thickness of the thickness compensation layer 16 needs to be equal to 0.01 mm so that the sum of the thicknesses of the thickness compensation layer 16 and the scintillator layer is equal to the thickness of the second surface layer 15.

[0061] In some alternative embodiments, the thickness compensation layer 16 comprises a transparent water-based laminate.

[0062] It should be noted that the transparent water-based laminating adhesive has a certain degree of adhesion. Therefore, in addition to compensating for thickness, it can also bond the thickness compensation layer 16 and the first surface layer 11 including the scintillator layer and the first printed substrate, thereby increasing the adhesion between the scintillator layer and the first printed substrate. At the same time, the transparent water-based laminating adhesive is transparent and will not affect the exposure of the first printed substrate, that is, it will not affect the clarity and readability of the graphics and text.

[0063] Water-based laminating adhesives are environmentally friendly adhesives that use water as a solvent. They are typically made from polyurethane or acrylic resins using emulsification equipment. Their characteristics include environmental friendliness, low cost, and good bonding performance.

[0064] In some alternative embodiments, the scintillator layer includes a scintillator crystal and polyvinyl alcohol.

[0065] Optionally, the scintillator crystal may include sodium iodide (NaI(Tl)) crystals or zinc germanate-based nanomaterials. For example, the preparation process of the scintillator layer is as follows: the scintillator layer can be obtained by coating scintillator ink onto a substrate and then allowing it to air dry naturally. The scintillator ink is prepared using zinc germanate-based nanomaterials as the scintillator, polyvinyl alcohol as the film support material, ethylene glycol as the surfactant, and water as the solvent. The scintillator ink is injected into the ink cartridge of a microelectronic printer, and printing is performed to obtain a scintillator coating. After the scintillator coating is allowed to air dry at room temperature for 2–4 days, the scintillator layer is obtained.

[0066] The smart card mentioned in this application with nuclear radiation identification function can be manufactured by replacing the conventional transparent PVC film with a scintillator layer during the manufacturing process of ordinary smart cards. The scintillator layer can be spot-welded, laminated, and punched together with ordinary PVC substrate to reduce manufacturing costs.

[0067] Since this smart card with nuclear radiation identification function only replaces the thin film on the card surface, apart from appropriate adjustments to the spot welding and lamination process, the punched single card can continue to be manufactured normally. It can have the signature strip hot-stamped, the slotted encapsulation module milled, and subsequent personalization processes carried out normally.

[0068] In some alternative embodiments, at least one of the first printed substrate layer 12, the intermediate layer 13, and the second printed substrate layer 14 includes a rice husk card base material layer.

[0069] It's worth noting that smart cards made using rice husk fiber as the base material have environmental advantages. Rice husks are waste products from rice threshing, traditionally burned or discarded, causing pollution. Making rice husk fiber smart cards turns waste into treasure, reducing resource waste. Rice husk fiber smart cards can decompose into organic matter under natural conditions, causing less environmental pollution compared to PVC plastic cards. Furthermore, the production process of rice husk fiber consumes less energy and requires no logging, making it convenient and efficient. It reduces agricultural waste pollution and plastic usage, and smart cards using the rice husk fiber base material align with the concept of a "circular economy." Moreover, rice husk fiber material is more environmentally friendly and has lower material collection costs.

[0070] The rice husk card material layer 1 is made by softening the natural components (such as lignin) in the rice husk at high temperature, and then bonding the fibers together under high pressure. The following is a detailed breakdown of the manufacturing process:

[0071] The raw material processing steps include, firstly, pre-treatment of rice husks: rice husks contain 15%-20% silica and a large amount of lignin, and need to be processed as follows: washing: removing dirt, dust and other impurities from the surface of the rice husks; crushing: using machinery to grind the rice husks into fine powder (about 80-200 mesh) to form rice husk fiber particles; drying: drying the crushed rice husk fibers until the moisture content is below 8% to avoid bubbles or cracking during subsequent molding.

[0072] Following this, a high-temperature, high-pressure molding process is performed, utilizing the rice husk's own natural adhesive (lignin) to achieve glue-free bonding. Mixing and blending are optional; some processes incorporate small amounts of starch or plant fibers (such as bamboo fiber) to enhance the strength or surface smoothness of large sheets. No chemical adhesives are added, ensuring the final product is safe and environmentally friendly. Small amounts of bio-based plastics (such as PLA / PHA) are added to some processes to improve flexibility and water resistance.

[0073] The process involves hot pressing, specifically filling rice husk fiber powder into a metal mold. The mold is pre-designed to be the size of a single bank card (85.96*53.98mm, with a thickness of 0.64mm) and has a pre-reserved groove for placing chip 2. High-temperature heating: The mold is heated to 160-200℃ using a hot press, which softens and melts the lignin in the rice husk. High-pressure pressing: A high pressure of 10-20MPa (approximately 100-200 atmospheres) is applied to tightly bind the softened fibers, forming a dense structure. Pressure holding and cooling: The pressure is maintained until cooling and shaping. After the lignin is re-solidified, a stable three-dimensional network structure is formed between the fibers.

[0074] The post-molding processing steps specifically include: trimming and polishing: removing burrs at the mold parting line to ensure smooth edges; surface treatment: polishing or spraying a food-grade waterproof coating (such as PLA biodegradable material) to enhance water resistance.

[0075] Finally, the graphics and text are printed. Pre-treatment is required before printing, such as polishing and applying a base coat to seal gaps. Digital inkjet printing is used to avoid registration errors. Laser engraving can also be used to complete the printing, ultimately forming the required rice husk card base material layer.

[0076] In some optional embodiments, the rice husk card base material 1 comprises rice husk fiber and bio-based plastic. Considering that a rice husk card base material 1 formed solely from rice husk fiber using high-temperature, high-pressure molding may not pass the bending test required by standard bank cards, and that rice husk fiber may degrade prematurely in the natural environment, to address these issues, embodiments of the present invention can mix rice husk fiber and bio-based plastic to form the rice husk card base material 1, thereby improving flexibility and water resistance, slowing down the degradation rate of the rice husk card base material 1, and ensuring the lifespan of the smart card.

[0077] Optionally, bio-based plastics may include materials such as polylactic acid (PLA) and polyhydroxyalkanoates (PHA).

[0078] In some alternative embodiments, a waterproof coating is provided on at least one of the two opposing surfaces of the rice husk card base 1 material layer along the thickness direction of the card base 1, so as to improve the waterproof performance of the rice husk card base 1 material layer while maintaining the biodegradability of the rice husk card base 1 material layer.

[0079] Optionally, the material for the waterproof coating may include materials such as silica.

[0080] Optionally, the intermediate layer 13 includes a rice husk base material layer 1, and a waterproof coating is provided on both opposite surfaces of the intermediate layer 13 along the thickness direction of the base 1 to ensure waterproof effect.

[0081] Optionally, the first printed substrate layer 12, the intermediate layer 13, and the second printed substrate layer 14 may each include a rice husk card base 1 material layer, that is, the first printed substrate layer 12, the intermediate layer 13, and the second printed substrate layer 14 may be formed by an integral rice husk card base 1 material layer.

[0082] The smart card provided in this application embodiment can be used to realize electronic transaction functions. A smart card is a type of card with a predetermined length, width, and thickness, and also features portability and ease of use. A smart card can be a debit card, credit card, stored-value card, public transport card, access card, or membership card, but is not limited to the card types listed above.

[0083] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A smart card, characterized in that, include: The cardioid includes at least one functional layer, the functional layer including at least partially exposed scintillator layer, the scintillator layer including scintillator crystal and polyvinyl alcohol; The chip is fixed to the card base.

2. The smart card according to claim 1, characterized in that, Along the thickness direction of the card base, the functional layer includes a first surface layer, a first printed substrate layer, an intermediate layer, a second printed substrate layer, and a second surface layer stacked together; At least one of the first and second surface layers includes the scintillator layer.

3. The smart card according to claim 2, characterized in that, The first surface layer includes the scintillator layer, and a first slot is formed on the first surface layer, with the chip located at least partially within the first slot.

4. The smart card according to claim 3, characterized in that, The functional layer further includes a thickness compensation layer disposed between the first surface layer and the first printed substrate layer, wherein the sum of the thicknesses of the thickness compensation layer and the scintillator layer is equal to the thickness of the second surface layer.

5. The smart card according to claim 4, characterized in that, The thickness of the scintillator layer is greater than or equal to 0.065 mm and less than or equal to 0.075 mm; and / or, The thickness of the thickness compensation layer is greater than or equal to 0.005 mm and less than or equal to 0.015 mm; and / or, The thickness of the second surface layer is greater than or equal to 0.075 mm and less than or equal to 0.085 mm.

6. The smart card according to claim 4, characterized in that, The thickness compensation layer comprises a transparent water-based laminate.

7. The smart card according to claim 2, characterized in that, At least one of the first printed substrate layer, the intermediate layer, and the second printed substrate layer includes a rice husk card base material layer.

8. The smart card according to claim 7, characterized in that, The rice husk base material layer includes rice husk fiber and bio-based plastic.

9. The smart card according to claim 7, characterized in that, Along the thickness direction of the card base, at least one of the two opposing surfaces of the rice husk card base material layer is provided with a waterproof coating.

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