Mobile phone display screen group

Abstract

The application provides a mobile phone display screen group, which comprises a display screen, a display screen frame and a mobile phone frame which are glued and connected. The application also comprises a flexible flat cable which is electrically connected with the display screen, and the flexible flat cable is provided with a bending area. The application further comprises a portable IC which is located in the bending area of the flexible flat cable, and the portable IC comprises a main body and a connecting flat cable which is connected with the main body and connected with the bending area. The shape of the connecting flat cable is consistent with the shape of the bending area, and the projection plane of the connecting flat cable overlaps with the projection plane of the bending area. The above structure realizes uniform stress.

Description

Technical Field

[0001] This application relates to the field of mobile phone screens, and more particularly to a mobile phone display assembly. Background Technology

[0002] The mobile phone display assembly serves as the core display and touch interaction component of a smartphone. In real life, there are frequent scenarios where the phone screen breaks and needs to be replaced.

[0003] In the bending section of the flexible ribbon cable of existing mobile phone displays, the thickness is usually only 0.1-0.3mm, which is insufficient in mechanical strength. During the installation process, even slight external force from manual operation or automated assembly equipment can cause the bending angle to exceed the design threshold, resulting in excessive bending. This can lead to breakage of internal copper foil circuits, damage to the insulation layer, or detachment of solder joints, causing malfunctions such as signal transmission interruption, screen distortion, and touch failure. In severe cases, it can even lead to the scrapping of the entire display module.

[0004] Therefore, a mobile phone display assembly with uniform stress is needed. Utility Model Content

[0005] In view of this, it is necessary to provide a mobile phone display assembly with uniform stress to solve the above problems.

[0006] Embodiments of this application provide a mobile phone display assembly, including: The display screen, the frame of which is glued to the phone frame; A flexible ribbon cable is electrically connected to the display screen, and the flexible ribbon cable has a bending area; A portable IC is located in the bending area of ​​the flexible ribbon cable. The portable IC includes a main body and a connecting ribbon cable connected to the main body. The connecting ribbon cable is connected to the bending area. The shape of the connecting cable is consistent with the shape of the bending area, and the projection surface of the connecting cable overlaps with the projection surface of the bending area.

[0007] In at least one embodiment of this application, the mobile phone display assembly further includes: An adhesive layer is located between the bending area and the connecting cable.

[0008] In at least one embodiment of this application, the adhesive layer is a flexible cushioning adhesive.

[0009] In at least one embodiment of this application, the flexible cable includes: The first connecting part is attached to and electrically connected to the display screen; The second connecting part is perpendicularly connected to the first connecting part and forms the bending area. The second connecting part is electrically connected to the mobile phone motherboard, and the main body is located at the second connecting part.

[0010] In at least one embodiment of this application, one end of the connecting cable is located at the first connecting portion and is soldered to the first connecting portion to fit the display screen; The other end of the connecting cable is located at the second connecting part and is soldered to the main body.

[0011] In at least one embodiment of this application, an insulating adhesive is provided at the end of the connecting cable that is welded to the first connecting part away from the display screen.

[0012] In at least one embodiment of this application, the insulating adhesive is ≤0.05mm.

[0013] In at least one embodiment of this application, the flexible cable is provided with a shielding layer.

[0014] In at least one embodiment of this application, the shielding layer is an EMI shielding film.

[0015] In at least one embodiment of this application, the bending area is either L-shaped or S-shaped.

[0016] The mobile phone display assembly described above designs the connecting cable of the portable IC to be perfectly aligned with the shape of the bending area of ​​the flexible cable and overlaps the projection surface. This allows the connecting cable to bend synchronously with the bending area during the bending process, thereby distributing stress evenly throughout the entire connecting cable area. This avoids over-bending caused by stress concentration and effectively protects the circuit from damage without increasing the cable thickness. Attached Figure Description

[0017] Figure 1 This is a front view of the mobile phone display assembly described in this application; Figure 2 This is a rear view of the mobile phone display assembly described in this application; Figure 3 This is a schematic diagram showing the installation status of the mobile phone display assembly described in this application; Figure 4 This is a schematic diagram of the installation status in the bending area; Explanation of main component symbols 100. Mobile phone display assembly; 10. Display screen; 20. Flexible ribbon cable; 21. Bending area; 22. First connecting part; 23. Second connecting part; 30. Portable IC; 31. Main body; 32. Connecting ribbon cable; 40. Adhesive layer; 50. Insulating adhesive; 60. Shielding layer. Detailed Implementation

[0018] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0019] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have an intervening component. When a component is considered to be "placed" on another component, it can be directly placed on the other component or may also have an intervening component. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "back," and similar expressions used in this article are for illustrative purposes only.

[0020] This application provides a mobile phone display assembly, including a display screen, a flexible ribbon cable, and a movable IC. The display screen frame is glued to the mobile phone frame. The flexible ribbon cable is electrically connected to the display screen and has a bending area. The movable IC is located in the bending area of ​​the flexible ribbon cable. The movable IC includes a main body and a connecting ribbon cable connected to the main body, and the connecting ribbon cable is connected to the bending area. The shape of the connecting ribbon cable is consistent with the shape of the bending area, and the projection surface of the connecting ribbon cable overlaps with the projection surface of the bending area.

[0021] The mobile phone display assembly described above designs the connecting cable of the portable IC to be perfectly aligned with the shape of the bending area of ​​the flexible cable and overlaps the projection surface. This allows the connecting cable to bend synchronously with the bending area during the bending process, thereby distributing stress evenly throughout the entire connecting cable area. This avoids over-bending caused by stress concentration and effectively protects the circuit from damage without increasing the cable thickness.

[0022] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0023] Please see Figures 1-4 This application provides a mobile phone display assembly 100, including a display screen 10, a flexible ribbon cable 20, and a movable IC 30. The frame of the display screen 10 is glued to the mobile phone frame. The flexible ribbon cable 20 is electrically connected to the display screen 10, and the flexible ribbon cable 20 has a bending area 21. The movable IC 30 is located in the bending area 21 of the flexible ribbon cable 20. The movable IC 30 includes a main body 31 and a connecting ribbon cable 32 connected to the main body 31. The connecting ribbon cable 32 is connected to the bending area 21. The shape of the connecting ribbon cable 32 is consistent with the shape of the bending area 21, and the projection surface of the connecting ribbon cable 32 overlaps with the projection surface of the bending area 21.

[0024] In this embodiment, it should be noted that the mobile phone display assembly 100 includes a display screen 10, a flexible ribbon cable 20, and a movable IC 30 disposed in the bending area 21 of the flexible ribbon cable 20. The frame of the display screen 10 is fixed to the mobile phone frame by adhesive bonding, so that the display screen 10 is stably positioned and supported in the whole device. The flexible ribbon cable 20 is electrically connected to the display screen 10 and forms a preset bending area 21 on the path of docking with the mobile phone motherboard to adapt to the bending wiring of the device space. The movable IC 30 is disposed in the bending area 21 and includes a main body 31 and a connecting ribbon cable 32 electrically fused to the main body 31. The connecting ribbon cable 32 is directly connected to the bending area 21, and its planar shape is consistent with the shape of the bending area 21. In the projection perpendicular to the plane of the ribbon cable, the projection surface of the connecting ribbon cable 32 and the projection surface of the bending area 21 overlap at least in the functional area.

[0025] During assembly, the flexible ribbon cable 20 is first electrically connected and initially positioned to the display screen 10. Then, the movable IC 30 is placed at the corresponding position in the bending area 21, so that the connecting ribbon cable 32 is laid and attached along the direction of the bending area 21. Subsequently, the connecting ribbon cable 32 and the bending area 21 are fixed by conventional methods such as hot pressing or dispensing, so that the two form a consistent relationship in geometric path and spatial position. To ensure the accuracy of the overlap relationship, jig guidance or visual alignment can be used during the positioning of the connecting ribbon cable 32 to ensure that the boundary of the connecting ribbon cable 32 is consistent with the boundary of the bending area 21 within the design tolerance, so that the connecting ribbon cable 32 deforms synchronously with the bending area 21 during subsequent bending and forming. This embodiment does not introduce any additional structures other than the display screen 10, flexible ribbon cable 20, movable IC 30 and its connecting ribbon cable 32. All components are conventionally available parts in the industry, and the assembly process follows the conventional processes of display modules and FPCs, with good manufacturability and consistency.

[0026] Since the shape of the connecting cable 32 is consistent with the shape of the bending area 21 and their projection surfaces overlap, when the flexible cable 20 is bent during the assembly or use of the whole machine, the connecting cable 32 and the bending area 21 bend synchronously along the same curvature path. This avoids relative slippage and uneven local tension / compression caused by the inconsistent paths between the connecting cable 32 and the bending area 21, and reduces stress concentration at the bending corner.

[0027] On the other hand, the bending strain at the bend is distributed across the entire effective length and width of the connecting cable 32, suppressing the risk of failure such as copper foil breakage, dielectric layer damage, or excessive stress peak at the solder joint caused by over-bending. At the same time, the movable IC 30 is positioned in the bending area 21 and deforms in coordination with the bending area 21 through the connecting cable 32, which can reduce the geometric disturbance of the rigid component to the flexible area, maintain the stability of the neutral layer position at the bend, and further reduce the strain gradient at the signal line and via.

[0028] Based on the aforementioned synergistic bending and stress homogenization effects, this embodiment achieves effective protection of the circuit and solder joints in the bending area 21 without increasing the overall thickness and number of layers of the flexible cable 20. This reduces the probability of over-bending defects during assembly and display abnormalities / touch malfunctions during subsequent use, improves the assembly yield and reliability of the display screen 10, and achieves the expected function without the need for additional special materials or complex processes.

[0029] In one specific embodiment, the mobile phone display assembly 100 further includes an adhesive layer 40. The adhesive layer 40 is located between the bending area 21 and the connecting cable 32.

[0030] In this embodiment, it should be noted that the adhesive layer 40 is located between the bending area 21 of the flexible cable 20 and the main body 31 of the movable IC 30. Specifically, after the flexible cable 20 forms a predetermined bending path, such as the bending arc segment defined by the assembly fixture, a layer of adhesive material is pre-laid on the area opposite to the connecting cable 32.

[0031] The connecting cable 32 is then positioned in this area, creating a continuous, uniform, and uninterrupted sandwich structure between the two layers with the adhesive layer 40. The coverage area of ​​the adhesive layer 40 should at least include the projected area of ​​the bending area 21 corresponding to the connecting cable 32, with a small safety margin outside the projected boundary to avoid edge peeling.

[0032] To ensure bonding quality, adhesives with certain flexibility and resilience, such as acrylic pressure-sensitive adhesives, modified silicone, or low-modulus epoxy adhesives, can be selected and quantitatively applied through any method such as dispensing, applying adhesive sheets, or screen printing.

[0033] After the connecting cable 32 is attached, a stable interface bonding strength is obtained by combining conventional room temperature pressing or warm pressure curing processes. In order to balance stress buffering and structural thickness control, the thickness of the adhesive layer 40 is preferably set to a small and mass-producible range in this embodiment, and uniformity is ensured by fixture height limiting and online thickness measurement, so that the adhesive layer can provide the necessary deformation absorption space in the bending area 21 without changing the original geometric path of the bending area 21.

[0034] It should be emphasized that this embodiment only introduces the adhesive layer 40 located between the bending area 21 and the connecting cable 32, without changing the geometric relationship that the connecting cable 32 and the bending area 21 have the same shape and overlapping projection surfaces, and without adding any structural components or functional units unrelated to this.

[0035] The adhesive layer 40 serves as a flexible buffer and stress transition medium between the bending area 21 and the connecting cable 32. In the bending or micro-vibration environment during module assembly and subsequent use, it can absorb and attenuate the peak interface stress caused by the difference in material modulus and curvature, thereby reducing the risk of peeling, warping and micro-cracks at the interface between the edge of the connecting cable 32 and the flexible cable 20.

[0036] The presence of the adhesive layer 40 also helps maintain the stable attachment of the connecting cable 32 relative to the bending area 21 during bending, suppressing stress concentration caused by local gaps or uneven contact, further stabilizing the position of the bending neutral plane, and reducing the strain gradient near the conductor and pad. In addition, the uniform and continuous adhesive layer improves interface damping, which helps reduce the transient transmission amplitude of drop or impact loads between the IC body and the FPC, and improves impact resistance and fatigue resistance.

[0037] In summary, by simply adding an adhesive layer 40 between the bending area 21 and the connecting cable 32, the interface reliability and overall assembly yield can be significantly improved without changing the original shape of the bending area 21 and the connecting cable 32 to match the projection, and the probability of failures caused by interface failures such as screen flickering and touch abnormalities can be reduced.

[0038] In one specific embodiment, the flexible ribbon cable 20 includes a first connecting portion 22 and a second connecting portion 23. The first connecting portion 22 is attached to and electrically connected to the display screen 10. The second connecting portion 23 is perpendicularly connected to the first connecting portion 22 and forms the bending area 21. The second connecting portion 23 is also electrically connected to the mobile phone motherboard. The main body portion 31 is located at the second connecting portion 23.

[0039] In this embodiment, it should be noted that the flexible cable 20 is composed of a first connecting part 22 and a second connecting part 23, which are arranged approximately perpendicularly in the plane and form a preset bending area 21 at their intersection. The first connecting part 22 runs along the edge of the display screen 10 and is attached to and electrically connected to the driving or touch output terminals of the display screen 10, such as COF / COG or the Pad area, to achieve short-distance, low-stress coupling with the display screen 10 module.

[0040] The second connecting portion 23 extends from the bending area 21 into the internal space of the device body, reaching the motherboard I / O area, and docks with the mobile phone motherboard via electrical connections such as BTB, solder pads, or ZIF sockets. To reduce local stress at the rigid-flexible transition point of the second connecting portion 23, the main body 31 of the movable IC 30 is preferably arranged on the straight section of the second connecting portion 23, maintaining a designed safety distance from the inner edge of the bending area 21 to prevent the main body rigidly from directly entering the minimum curvature area.

[0041] During assembly, the first connecting part 22 is first bonded or welded to the display screen 10Pad area. Then, a positioning fixture controls the corner and inner bending radius of the bending area 21, causing the second connecting part 23 to rotate and align with the motherboard. Subsequently, the connecting cable 32 is attached to the designated area of ​​the second connecting part 23, ensuring that the connecting cable 32 and the bending area 21 maintain a consistent shape and overlapping projection. Conductor traces are laid at equal intervals within the bending area 21, avoiding right-angle bends to reduce motor coupling mismatch.

[0042] The first connecting part 22 fits snugly against the display screen 10, with a short path and minimal bending, reducing assembly disturbances near the display area. The second connecting part 23 undertakes spatial turning and connection to the motherboard. The connecting cable 32 is located in the second connecting part 23, keeping the rigid component away from the peak curvature area of ​​the precision area and bending area 21 of the display screen 10, reducing disturbances to the bending neutral layer, and suppressing local stress concentration and warping.

[0043] The vertically connected first connecting part 22 and second connecting part 23 form a clear bending zone 21 at the junction. With a fixed turning angle and inner bending radius, the bending trajectory is repeatable and the stress distribution is predictable. Combined with the synchronous bending relationship where the connecting cable 32 and the bending zone 21 have the same shape and overlapping projections, the bending strain is evenly diffused along the width and length of the bending zone 21, which significantly reduces copper foil microcracks, cover film whitening, and solder joint stress peaks.

[0044] Placing the main body 31 on the straight section of the second connection portion 23 facilitates the continuous layout of IC pin fan-out and ground reference layer, reducing impedance jumps and parasitic uncertainties within the bending region 21. The first connection portion 22 is close to the screen end and has a small loop area. Combined with shielding or grounding design, it reduces the risk of high-frequency coupling and crosstalk.

[0045] In one specific embodiment, one end of the connecting cable 32 is located at the first connecting portion 22 and is soldered to the first connecting portion 22 to adhere to the display screen 10. The other end of the connecting cable 32 is located at the second connecting portion 23 and is soldered to the main body portion 31.

[0046] In this embodiment, it should be noted that the connecting cable 32 adopts a double-ended soldering arrangement: its first end is located within the area of ​​the first connecting portion 22, and the connection is completed on the side of the first connecting portion 22 that is attached to the display screen 10. Two processes can be used: reflow soldering with solder paste or solder as the medium, or ACF hot-press connection with an anisotropic conductive film as the medium, which is cured and connected by a hot-pressing device. The first end is electrically connected to the pad array on the same side as the Pad or COF area of ​​the display screen 10.

[0047] The second end of the connecting cable 32 is located in the area of ​​the second connecting part 23 and is soldered and fixed to the pad row of the main body 31 of the movable IC 30. In the assembly process, the first end of the connecting cable 32 can be aligned with the screen side pad of the first connecting part 22 through the positioning fixture and soldered and fixed in one go, so that the connecting cable 32 forms a reliable, low-height end anchor on the side near the display screen 10.

[0048] Subsequently, the main body of the connecting cable 32 is laid along the preset bending path, allowing it to naturally adhere to the surface of the bending area 21. Then, its second end is hot-pressed, reflowed, or ACF-welded to the corresponding pad of the connecting cable 32 to achieve electromechanical fixation of the main body 31. To avoid free cantilever sections and local bulges, this embodiment performs light pressing and shaping on the middle section of the connecting cable 32 after welding at both ends, ensuring its continuity, fit, and absence of warping along the path of the bending area 21. Simultaneously, visual AOI and limiting fixtures control the alignment accuracy of both ends and the wettability of the end solder joints, ensuring welding continuity and geometric consistency.

[0049] The connecting cable 32 forms a rigid welding anchor point on the side of the screen side where the first connecting part 22 is attached to the display screen 10 and on the side of the main body where the second connecting part 23 is attached. During the bending process, the middle section only bears the controlled bending deformation, which significantly reduces the free end swing and end peeling force, and suppresses pad cracking and copper foil fatigue.

[0050] Since the connecting cable 32 is laid along the bending area 21 and formed after both ends are in place, the curvature of the connecting cable 32 and the bending area 21 is consistent during bending, avoiding relative slippage and local elongation / wrinkling caused by inconsistent paths, thereby making the strain more evenly distributed along the length and width directions.

[0051] In one specific embodiment, an insulating adhesive 50 is provided at the end of the connecting cable 32 that is opposite to the welding position of the first connecting part 22 and the display screen 10.

[0052] In this embodiment, it should be noted that an insulating adhesive 50 is added at the welding position between the connecting cable 32 and the first connecting part 22, on the end facing away from the display screen 10. The insulating adhesive 50 is a material with good electrical insulation and a certain degree of flexibility.

[0053] The adhesive material can be any of acrylic, silicone rubber or modified epoxy, and is arranged in the form of a linear or short strip pad in the outer edge area after the pad row, covering the transition zone between the end of the solder joint and the boundary of the adjacent cover film.

[0054] The planar coverage of the insulation layer should not intrude into the soldering area, exposed conductor area, and testing reference area. The edges should be rounded or beveled to avoid forming geometric steps. The thickness should be set according to the assembly space and target bending radius, and uniform laying should be achieved through height limiting fixtures and dispensing trajectory control.

[0055] After completing the soldering of the connecting cable 32 and the first connecting part 22 on the same side, the flux is cleaned and dried. Then, insulating adhesive 50 is applied to the end away from the display screen 10 according to the predetermined window, and then compacted at room temperature or cured by warm pressure to form a stable adhesive pad. To ensure that the bending trajectory and geometric synchronization are not disturbed, the leading edge of the insulating adhesive 50 maintains a safe clearance distance from the pad row, and the adhesive surface is flush with the FPC surface or has a slightly beveled end to facilitate a smooth transition during bending.

[0056] The insulating adhesive 50 forms a support pad at the end of the solder joint away from the display screen 10. When bent or under load, it can share the peeling force and bending stress at the tail of the solder joint and the boundary of the cover film, significantly reducing the stress peak at the root of the solder pad and suppressing solder joint cracks, copper foil lifting and cover film whitening.

[0057] In one specific embodiment, the flexible cable 20 is provided with a shielding layer 60.

[0058] Specifically, in this embodiment, the flexible cable 20 is provided with a shielding layer 60, and the shielding layer 60 may be an EMI shielding film. The EMI shielding film is continuously laid along the main routing area of ​​the flexible cable 20, and its coverage area includes at least the signal routing strips of the first connection portion 22, the bending area 21 and the second connection portion 23, and makes local avoidance in the device pads or alignment reference areas where windows are required.

[0059] The shielding film can be located outside the cover film or in the stack between the cover film and the dielectric layer, and form multiple electrical connections with the grounding network (GND) on the ribbon cable through conductive adhesive, conductive silver paste or metallized vias.

[0060] To avoid adverse effects on bending performance, the thickness and areal density of the shielding film are controlled within the flexible laminate bendable range, and a fine mesh or microporous structure is preferentially used on the inner bending side of the bending zone 21 to reduce bending stiffness and hysteresis.

[0061] Grounding leads are provided at grounding points at the first connection part 22 and the second connection part 23 respectively, which facilitates the arrangement of grounding at both ends or single end on the screen side and board side; in order to suppress loop area, the grounding points are arranged close to the fan-out area of ​​high-speed differential or clock signals, and the shielding continuity is ensured by equipotential copper foil bridging or grounding return line.

[0062] The edges of the shielding film are chamfered or rounded and bonded to adjacent layers with low-modulus adhesive to avoid forming hard steps that could affect bending. In the AOI inspection window and fixture holding area, the shielding film is partially offset according to the process window to ensure visibility and stress safety.

[0063] The EMI shielding film forms an equivalent Faraday shield on the outside of the flexible flat cable 20, which can significantly reduce the radiated emissions of high-speed data lines and clock lines and crosstalk to external antennas or RF front-ends. At the same time, it suppresses the coupling interference of external electromagnetic fields to display / touch signals, improving the overall radiation and immunity indicators of the device.

[0064] In one specific embodiment, the bending area 21 is either an L-shape or an S-shape.

[0065] The geometry of the bending zone 21 is designed to be either L-shaped or S-shaped to accommodate different internal space and wiring requirements.

[0066] In an L-shaped bend, the centerline of the bend area 21 is formed by a near-straight line followed by a circular arc, achieving a turn of approximately 90°. This can also be set to 80°–120° depending on the structural space. To avoid wrinkles and abrupt changes in curvature, the inner bend radius R is preferably ≥0.30 mm, with a common range of 0.30–0.80 mm. The circular arc and straight line segments transition continuously using tangents, and no sharp corners are placed at the start and end of the bend.

[0067] In an S-shaped bend, the bend zone 21 is formed by two arcs with opposite curvature directions connected together to form an "S"-shaped channel. The radius R1 of the first arc and the radius R2 of the second arc can be equal or unequal. A short straight section or a continuous transition of curvature is set between the two arcs. The absolute values ​​of the turning angles of the two S-shaped segments are similar, so that the total turning angle is close to 0° or reaches a specified offset angle, which is used to achieve parallel displacement and avoidance.

[0068] L-shaped bends achieve compact 90° turns at restricted corners, shortening the board connection path and reducing ineffective deflection length. S-shaped bends can achieve translational avoidance and height misalignment compensation while maintaining basically consistent entry and exit directions, adapting to the spatial constraints of components such as batteries, speakers, and brackets.

[0069] Therefore, the mobile phone display assembly 100 provided above designs the connecting cable 32 of the movable IC 30 to be completely identical in shape and have overlapping projection surfaces with the bending area 21 of the flexible cable 20, so that the connecting cable 32 can bend synchronously with the bending area 21 during the bending process, thereby distributing the stress evenly to the entire area of ​​the connecting cable 32, avoiding the over-bending phenomenon caused by stress concentration, and effectively protecting the circuit from damage without increasing the thickness of the cable.

[0070] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. A mobile phone display screen assembly, characterized in that, include: The display screen, the frame of which is glued to the phone frame; A flexible ribbon cable is electrically connected to the display screen, and the flexible ribbon cable has a bending area; A portable IC is located in the bending area of ​​the flexible ribbon cable. The portable IC includes a main body and a connecting ribbon cable connected to the main body. The connecting ribbon cable is connected to the bending area. The shape of the connecting cable is consistent with the shape of the bending area, and the projection surface of the connecting cable overlaps with the projection surface of the bending area.

2. The mobile phone display assembly according to claim 1, characterized in that, The mobile phone display panel also includes: An adhesive layer is located between the bending area and the connecting cable.

3. The mobile phone display assembly according to claim 2, characterized in that, The adhesive layer is a flexible cushioning adhesive.

4. The mobile phone display assembly according to claim 1, characterized in that, The flexible cable includes: The first connecting part is attached to and electrically connected to the display screen; The second connecting part is perpendicularly connected to the first connecting part and forms the bending area. The second connecting part is electrically connected to the mobile phone motherboard, and the main body is located at the second connecting part.

5. The mobile phone display assembly according to claim 4, characterized in that, One end of the connecting cable is located at the first connecting part and is soldered to the first connecting part to fit the display screen; The other end of the connecting cable is located at the second connecting part and is soldered to the main body.

6. The mobile phone display assembly according to claim 5, characterized in that, Insulating adhesive is provided at the end of the connecting cable that is welded to the first connecting part away from the display screen.

7. The mobile phone display assembly according to claim 6, characterized in that, The insulating adhesive is ≤0.05mm thick.

8. The mobile phone display assembly according to claim 1, characterized in that, The flexible cable is equipped with a shielding layer.

9. The mobile phone display assembly according to claim 8, characterized in that, The shielding layer is an EMI shielding film.

10. The mobile phone display assembly according to claim 1, characterized in that... The bending area can be either L-shaped or S-shaped.

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