A voltage doubling rectifier module insulation structure for a high voltage power supply

Abstract

The utility model discloses a kind of voltage doubling rectification module insulation structures for high voltage power supply, it is related to high voltage power supply technical field, including insulating part, the insulating part is composed of high heat conduction insulation layer, electric field homogenization layer and arc resistance layer, the electric field homogenization layer is between high heat conduction insulation layer and arc resistance layer, further including high heat conduction filler layer and mechanical strength filler layer, the high heat conduction filler layer and mechanical strength filler layer are all arranged in insulating part, the high heat conduction insulation layer of the utility model cooperates with high heat conduction filler layer, high heat conduction filler layer high concentration end is contacted with high voltage component, with the help of high-efficiency heat export of aluminium nitride and other fillers;Heat conduction column is through the thickness direction of insulating part, further reduce thermal resistance, simultaneously, mechanical strength filler layer is along specific direction concentration increasing, strengthen structural mechanical performance, and gradient filler design weakens the interface problem of traditional laminated structure, avoid interface breakdown and delamination.

Description

Technical Field

[0001] This utility model belongs to the field of high voltage power supply technology, and in particular relates to an insulation structure for a voltage multiplier rectifier module used in high voltage power supplies. Background Technology

[0002] In the process of localization of precision instruments such as transmission electron microscopes and electron beam exposure machines, high-voltage power supplies are core components, and their stable operation directly determines the performance of the instruments. Currently, domestic high-voltage power supplies generally face the critical problem of frequent micro-discharge phenomena. This problem not only interferes with the normal output of the high-voltage power supply, but also significantly shortens the service life of the equipment, becoming an important bottleneck restricting the breakthrough of localization of related precision instruments.

[0003] The generation of micro-discharges is closely related to multiple factors. From the perspective of the core inducing factors, the insulating medium is the key influencing factor. When the insulating medium is in the discharge space, it is easy to transform from a stable insulating state to a breakdown state under operating conditions such as voltage fluctuations and frequency changes, thereby triggering micro-discharges. At the same time, the non-uniform electric field distribution in the high-voltage system, the inherent defects inside the insulating material, and the deficiencies in the structural design of the voltage multiplier rectifier module itself will further aggravate the local electric field concentration, leading to the repeated occurrence of micro-discharge phenomena, which poses a serious threat to the reliability and operational safety of the high-voltage power supply. It is urgent to optimize the insulation structure in a targeted manner to solve the above problems. Based on this, an insulation structure for a voltage multiplier rectifier module for high-voltage power supplies is proposed here. Utility Model Content

[0004] The purpose of this invention is to provide an insulation structure for a voltage multiplier rectifier module for high-voltage power supplies, which solves the problem that existing insulating media are prone to breakdown under changing operating conditions, and micro-discharges occur repeatedly due to the superposition of non-uniform electric fields in the system.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model relates to an insulation structure for a voltage multiplier rectifier module in a high-voltage power supply, comprising an insulating component. The insulating component consists of a high thermal conductivity insulating layer, an electric field homogenization layer, and an arc-resistant layer. The electric field homogenization layer is located between the high thermal conductivity insulating layer and the arc-resistant layer. It also includes: A high thermal conductivity filler layer and a mechanical strength filler layer are provided inside the insulating component. The filler concentration of the high thermal conductivity filler layer gradually decreases along the direction from the high thermal conductivity insulating layer to the arc-resistant layer, and the filler concentration of the mechanical strength filler layer gradually increases along the direction from the high thermal conductivity insulating layer to the arc-resistant layer.

[0006] Preferably, the electric field homogenization layer includes an insulating substrate, within which a high dielectric constant fiber layer and a thermally conductive fiber layer are disposed, wherein the high dielectric constant fiber layer and the thermally conductive fiber layer are interwoven.

[0007] Preferably, the fiber density of the high dielectric constant fiber layer gradually decreases along the electric field homogenization layer from one end near the high thermal conductivity insulating layer to one end near the arc-resistant layer, and the fiber density of the thermally conductive fiber layer gradually increases along the electric field homogenization layer from one end near the high thermal conductivity insulating layer to one end near the arc-resistant layer.

[0008] Preferably, it also includes a heat-conducting release post, which includes a plurality of heat-conducting columns and a plurality of discharge columns. The heat-conducting columns extend from the outer surface of the high thermal conductivity insulation layer to the outer surface of the arc-resistant layer along the thickness direction of the insulation component, and the discharge columns extend from the outer surface of the high thermal conductivity insulation layer to the interior of the electric field homogenization layer along the thickness direction of the insulation component.

[0009] Preferably, the end of the insulating element is provided with an insulating seal.

[0010] Preferably, a micron-sized conductive fiber mesh is provided in the middle of the interior of the insulating substrate, and the micron-sized conductive fiber mesh is made of carbon fiber or metal oxide coated fiber.

[0011] This utility model has the following beneficial effects: 1. The high thermal conductivity insulation layer and the high thermal conductivity filler layer of this utility model work together. The high thermal conductivity filler layer has a high concentration end that contacts the high-voltage components and efficiently dissipates heat with the help of fillers such as aluminum nitride. The heat-conducting pillar runs through the thickness direction of the insulation component, further reducing thermal resistance and solving the heat dissipation problem in high-voltage operation. At the same time, the mechanical strength filler layer has a concentration that increases in a specific direction. The mechanical properties of the structure are enhanced by fillers such as silica. The gradient filler design weakens the interface problem of traditional laminated structures, avoids interface breakdown and delamination, significantly improves the durability of the insulation structure, and extends the overall service life of the high-voltage power supply.

[0012] 2. In this invention, the high dielectric constant fiber layer and the thermally conductive fiber layer are interwoven in the electric field homogenization layer, and the fiber density varies in a gradient along a specific direction. Combined with a micron-level conductive fiber mesh, the electric field can be smoothly distributed, avoiding local electric field concentration. The discharge column in the thermal discharge pile uses a nonlinear resistive material, which can provide an adaptive discharge channel when local charge accumulates. Combined with the functionally gradient-distributed filler layer in the insulation component, the performance differences between layers and stress concentration are reduced. Micro-discharge is suppressed from both the cause and the propagation path, ensuring long-term stable operation of the high-voltage power supply under high-voltage conditions.

[0013] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall appearance structure of this utility model; Figure 2 This utility model Figure 1 A schematic diagram of the cross-sectional structure; Figure 3 This is a schematic diagram of the structure of the insulating component of this utility model; Figure 4 This is a schematic diagram of the electric field homogenization layer of this utility model.

[0016] The attached diagram lists the components represented by each number as follows: 1. Insulating component; 11. High thermal conductivity insulating layer; 12. Electric field homogenization layer; 121. Insulating matrix; 122. High dielectric constant fiber layer; 123. Thermally conductive fiber layer; 13. Arc resistant layer; 2. Thermal release post; 21. Thermally conductive column; 22. Discharge column; 3. Insulating edge sealing; 4. High thermal conductivity filler layer; 5. Mechanical strength filler layer; 6. Micron-level conductive fiber mesh. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figures 1-4As shown, this utility model provides an insulation structure for a voltage multiplier rectifier module for a high-voltage power supply, including an insulating component 1. The insulating component 1 is composed of a high thermal conductivity insulating layer 11, an electric field homogenization layer 12, and an arc-resistant layer 13. The arc-resistant layer 13 can be made of a polymer composite material with excellent corona resistance and aging resistance. The electric field homogenization layer 12 is located between the high thermal conductivity insulating layer 11 and the arc-resistant layer 13. An insulating seal 3 is wrapped around the end of the insulating component 1, and the insulating seal 3 is tightly fitted to the end of the insulating component 1. It also includes a high thermal conductivity filler layer 4 and a mechanical strength layer. The filler layer 5, high thermal conductivity filler layer 4, and mechanical strength filler layer 5 are all arranged in a functional gradient within the insulating component 1. The filler concentration of the high thermal conductivity filler layer 4 gradually decreases along the direction from the high thermal conductivity insulating layer 11 to the arc-resistant layer 13, while the filler concentration of the mechanical strength filler layer 5 gradually increases along the direction from the high thermal conductivity insulating layer 11 to the arc-resistant layer 13. The end of the high thermal conductivity filler layer 4 with the highest concentration contacts the high-voltage component. The highest concentration of high thermal conductivity filler (such as aluminum nitride AlN) in the material ensures efficient heat dissipation. The dielectric constant is achieved by adding... As the concentration of specific ceramic fillers (such as strontium titanate) is adjusted to a higher level, and the high thermal conductivity filler layer 4 and mechanical strength filler layer 5 extend from the inner layer (high thermal conductivity insulation layer 11) to the outside, the concentration of high thermal conductivity filler gradually decreases, while the concentration of fillers that enhance mechanical strength (such as silicon dioxide SiO2) is increased in a gradient, and the concentration of fillers that adjust dielectric constant is decreased in a gradient. This allows the overall material properties to smoothly transition from high thermal conductivity and medium-high dielectric constant to high mechanical strength and suitable dielectric constant. This gradient design weakens the obvious bonding interface present in traditional laminated insulation structures. By gradually changing the filler concentration, the properties of each layer of material gradually transition, reducing the performance differences and stress concentration between layers, thereby eliminating the risk of interface breakdown and delamination, greatly improving the reliability and stability of the insulation structure, and extending its service life. At the same time, the continuous change of dielectric constant provides an ideal transition region for electric field distribution, making the electric field intensity more smoothly distributed along the insulation structure, effectively avoiding the electric field concentration phenomenon at the interface, and improving the long-term operational stability and lifespan of the voltage multiplier rectifier module under high voltage conditions.

[0019] Among them, see Figure 4As shown, the electric field homogenization layer 12 includes an insulating substrate 121. The insulating substrate 121 can be made of highly transparent, corona-resistant silicone gel or epoxy resin, which can maintain good insulation performance and optical transparency under long-term strong electric field. A high-dielectric-constant fiber layer 122 and a thermally conductive fiber layer 123 are disposed within the insulating substrate 121. The high-dielectric-constant fiber layer 122 and the thermally conductive fiber layer 123 are interwoven to form a continuous, three-dimensional fiber-reinforced network with gradually changing properties. The high-dielectric-constant fiber layer 122 can be made of glass fiber coated with barium titanate. The high dielectric constant of barium titanate effectively regulates the electric field distribution and suppresses local electric field concentration, thereby improving the withstand voltage of the overall insulation structure. The fiber density of the fiber layer is not uniformly set, but gradually decreases along the electric field homogenization layer 12 from one end near the high thermal conductivity insulation layer 11 to one end near the arc-resistant layer 13, so that the dielectric properties can be smoothly transitioned between layers, further optimizing the uniformity of the electric field along the surface and in the body. The thermally conductive fiber layer 123 is made of silicon carbide fiber or other high thermal and electrical conductivity fibers, which have good thermal conductivity and a certain charge dissipation capability. Its fiber density is designed to gradually increase in the same direction, that is, from the side near the high thermal conductivity insulation layer 11 to the side of the arc-resistant layer 13. This gradient design helps to establish a directional heat conduction path, accelerate the external heat dissipation, and at the same time assist in the gradual discharge of charge to avoid accumulation. It not only achieves a seamless transition of the material's dielectric and thermal conductivity properties in space, but also synergistically enhances the bonding force and functional integration at the interlayer interface. Thus, it achieves integrated optimization in multiple key performance aspects such as electric field control, heat conduction and charge discharge, providing a reliable guarantee for the stable operation of the voltage multiplier rectifier module of the high-voltage power supply under extreme electro-thermal coupling conditions.

[0020] In addition, participation Figure 1 and Figure 2 As shown, it also includes heat release posts 2, which include multiple heat-conducting columns 21 and multiple discharge columns 22. The heat-conducting columns 21 and discharge columns 22 form a regularly arranged micro-column channel. The heat-conducting columns 21 extend from the outer surface of the high thermal conductivity insulation layer 11 to the outer surface of the arc-resistant layer 13 along the thickness direction of the insulation component 1. The heat-conducting columns 21 can be made of aluminum nitride ceramic, which can greatly reduce the thermal resistance of the most dangerous area. The discharge columns 22 extend from the outer surface of the high thermal conductivity insulation layer 11 to the interior of the electric field homogenization layer 12 along the thickness direction of the insulation component 1. The discharge columns 22 are made of nonlinear resistive material, which is insulating under normal voltage, but when the voltage rises due to local charge accumulation, the resistance drops sharply, providing a transient and adaptive discharge channel for the charge. This is smarter and safer than a always-connected conductive grid.

[0021] The insulating substrate 121 has a micron-level conductive fiber mesh 6 in the middle of its interior. The micron-level conductive fiber mesh 6 is made of carbon fiber or metal oxide coated fiber, which can form a controllable electrostatic discharge path, guide the charge to be released slowly along the preset path, effectively prevent the accumulation of static charge, and suppress micro-discharge from the source.

[0022] The overall insulation structure combines high thermal conductivity, high insulation strength, excellent mechanical properties, and reliable arc resistance, making it ideal for high power density and high voltage level voltage multiplier rectifier systems.

[0023] It should also be noted that the application of this insulation structure is not limited by its type. Figure 1 The shape can be flexibly adjusted, for example, by using an arc or other customized shape. The core requirement is to ensure a tight fit and adaptation with the high-voltage rectifier module.

[0024] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0025] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An insulation structure for a voltage multiplier rectifier module in a high-voltage power supply, comprising an insulating component (1), characterized in that, The insulating component (1) is composed of a high thermal conductivity insulating layer (11), an electric field homogenization layer (12), and an arc-resistant layer (13). The electric field homogenization layer (12) is located between the high thermal conductivity insulating layer (11) and the arc-resistant layer (13), and further includes: A high thermal conductivity filler layer (4) and a mechanical strength filler layer (5) are provided in the insulating component (1). The filler concentration of the high thermal conductivity filler layer (4) gradually decreases from the high thermal conductivity insulating layer (11) to the arc-resistant layer (13), and the filler concentration of the mechanical strength filler layer (5) gradually increases from the high thermal conductivity insulating layer (11) to the arc-resistant layer (13).

2. The insulation structure of the voltage multiplier rectifier module for high-voltage power supply according to claim 1, characterized in that, The electric field homogenization layer (12) includes an insulating substrate (121), and the insulating substrate (121) contains a high dielectric constant fiber layer (122) and a thermally conductive fiber layer (123), which are interwoven.

3. The insulation structure of the voltage multiplier rectifier module for high-voltage power supply according to claim 2, characterized in that, The fiber density of the high dielectric constant fiber layer (122) gradually decreases along the electric field homogenization layer (12) from one end near the high thermal conductivity insulating layer (11) to one end near the arc-resistant layer (13), and the fiber density of the thermally conductive fiber layer (123) gradually increases along the electric field homogenization layer (12) from one end near the high thermal conductivity insulating layer (11) to one end near the arc-resistant layer (13).

4. The insulation structure of the voltage multiplier rectifier module for high-voltage power supply according to claim 1, characterized in that, It also includes a heat-conducting release pile (2), which includes a plurality of heat-conducting columns (21) and a plurality of discharge columns (22). The heat-conducting columns (21) extend from the outer surface of the high thermal conductivity insulation layer (11) to the outer surface of the arc-resistant layer (13) along the thickness direction of the insulation member (1), and the discharge columns (22) extend from the outer surface of the high thermal conductivity insulation layer (11) to the interior of the electric field homogenization layer (12) along the thickness direction of the insulation member (1).

5. The insulation structure of the voltage multiplier rectifier module for high-voltage power supply according to claim 1, characterized in that, The end of the insulating component (1) is provided with an insulating seal (3).

6. The insulation structure of the voltage multiplier rectifier module for a high-voltage power supply according to claim 2, characterized in that, The insulating substrate (121) has a micron-level conductive fiber mesh (6) in the middle of its interior. The micron-level conductive fiber mesh (6) is made of carbon fiber or metal oxide coated fiber.

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