Insert capacitor for high voltage bus filtering and high voltage bus filtering structure

Abstract

The application provides an insert type capacitor for high-voltage bus filtering and a high-voltage bus filtering structure, and relates to the technical field of electromagnetic compatibility of power electronic equipment. The insert type capacitor for high-voltage bus filtering comprises a capacitor core package having a first electrode and a second electrode, a grounding piece arranged at one end of the capacitor core package, the grounding piece being electrically connected with the first electrode, the grounding piece being capable of forming electrical contact with an equipment cabinet so that the first electrode of the capacitor core package is electrically connected, an insert body being electrically connected with the second electrode, the insert body being capable of being at least partially embedded in an opening of a high-voltage bus, and the insert body being fixedly connected with the inner wall of the opening so that the second electrode of the capacitor core package is electrically connected with the high-voltage bus. The insert type capacitor for high-voltage bus filtering can reduce installation requirements and improve use flexibility.

Description

Technical Field

[0001] This application relates to the field of electromagnetic compatibility technology for power electronic equipment, and in particular to an insert capacitor and a high-voltage bus filter structure for high-voltage bus filtering. Background Technology

[0002] In fields with high electromagnetic compatibility requirements, such as electric vehicles, medical equipment, and industrial automation, filtering devices need to be added to the high-voltage ports to filter out noise in order to meet the requirements of electromagnetic compatibility standards.

[0003] A filter typically includes a filter capacitor and a magnetic core assembly. Filter capacitors include X capacitors and Y capacitors. Y capacitors are used to filter out common-mode noise, and the current common form is a feedthrough capacitor.

[0004] However, feedthrough capacitors have high installation requirements and low flexibility in use. Utility Model Content

[0005] In view of the above problems, this application provides an embedded capacitor and a high-voltage bus filter structure for high-voltage bus filtering, in order to solve the problems of high installation requirements and low flexibility of use of feedthrough capacitors in the prior art.

[0006] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0007] A first aspect of this application provides an embedded capacitor for high-voltage bus filtering, comprising:

[0008] A capacitor core package has a first electrode and a second electrode;

[0009] A grounding component is installed at one end of the capacitor core and is electrically connected to the first electrode. The grounding component can form an electrical contact with the equipment casing so that the first electrode of the capacitor core is grounded and conductive.

[0010] The insert body is electrically connected to the second electrode; the insert body can be at least partially built into the opening of the high-voltage bus, and the insert body is fixedly connected to the inner wall of the opening, so that the second electrode of the capacitor core is electrically connected to the high-voltage bus.

[0011] In one possible implementation, the insert body includes an end plate portion and an insert portion;

[0012] The end plate is located at the end of the capacitor core package away from the grounding component, and the end plate is welded to the second electrode.

[0013] The embedded part is located on the side of the end plate away from the capacitor core package. The embedded part is built into the opening of the high voltage bus and is fixedly connected to the inner wall of the opening.

[0014] In one possible implementation, the insert is fixedly connected to the inner wall of the opening by welding, pressing, or bonding with a conductive adhesive.

[0015] In one possible implementation, the insert body further includes a tube portion disposed on the side of the end plate portion near the capacitor core package, and the tube portion is disposed circumferentially along the outer peripheral wall of the capacitor core package.

[0016] In one possible implementation, the embedded capacitor for high-voltage bus filtering also includes an insulating element disposed at one end of the tube body near the grounding element. The insulating element is arranged circumferentially along the outer peripheral wall of the capacitor core to achieve electrical isolation between the embedded body and the grounding element.

[0017] In one possible implementation, the gap between the insulator and the capacitor core is filled with an insulating layer.

[0018] And / or, the gap between the tube body and the capacitor core is filled with an insulating layer.

[0019] In one possible implementation, the grounding element is an elastic conductive element that makes elastic contact with the equipment casing.

[0020] In one possible implementation, the grounding element includes a fixed part and an elastic part, the fixed part being welded to the first electrode and the elastic part being elastically abutting against the equipment housing.

[0021] In one possible implementation, the grounding element is a spring sheet or conductive foam.

[0022] A second aspect of this application provides a high-voltage bus filter structure, including an embedded capacitor for high-voltage bus filtering as described above.

[0023] The embedded capacitor for high-voltage busbar filtering provided in this application embodiment allows the insert body to be embedded in an opening of the high-voltage busbar and fixedly connected to the inner wall of the opening, thereby achieving electrical connection between the capacitor core and the high-voltage busbar through the insert body. This design allows for greater flexibility in the fixing method of the insert body to the inner wall of the opening, reduces sensitivity to opening size tolerances, and lowers the requirements for busbar machining accuracy.

[0024] During installation, the embedded capacitor is a pre-assembled unit. One end of the insert body is inserted into the opening on the high-voltage busbar and secured. Simultaneously, the direct electrical contact between the grounding component and the equipment casing eliminates the need for separate steps of welding or screwing the grounding wire. This not only simplifies assembly but also reduces the risk of failure due to poor welding or loose screws, improving reliability. Furthermore, it fully utilizes the space beneath the high-voltage busbar, offering greater operational flexibility.

[0025] The capacitor core can function as an independent functional unit, with its capacitance value flexibly designed by changing the dielectric material, electrode area, and number of layers. The insert body is responsible for the mechanical and electrical connection with the opening on the high-voltage busbar. Different capacitance values ​​can be obtained by replacing the internal capacitor cores without changing the external mounting dimensions (i.e., the size of the opening the insert body fits). This greatly enhances design flexibility, allowing for rapid adaptation to different filtering requirements without altering the busbar structure. Furthermore, the insert body can be specifically designed according to the thickness of the high-voltage busbar and the opening location, thus better adapting to busbar structures of different thicknesses and shapes, further improving installation flexibility.

[0026] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the embedded capacitors and high-voltage bus filtering structures for high-voltage bus filtering provided by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific implementation. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A perspective view of the high-voltage bus filter structure provided in the embodiments of this application;

[0029] Figure 2 A perspective view of an embedded capacitor for high-voltage bus filtering provided in an embodiment of this application;

[0030] Figure 3 This is an assembly diagram of the high-voltage bus filter structure provided in the embodiments of this application;

[0031] Figure 4 A perspective view of the capacitor core package of an embedded capacitor for high-voltage bus filtering provided in an embodiment of this application;

[0032] Figure 5 A cross-sectional view of the insert body of an insert capacitor for high-voltage bus filtering provided in an embodiment of this application;

[0033] Figure 6 A perspective view of the grounding element of an embedded capacitor for high-voltage bus filtering provided in an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100. Embedded capacitor; 200. Equipment housing; 300. High-voltage busbar; 301. Opening;

[0036] 10. Capacitor core; 11. First electrode; 12. Second electrode;

[0037] 20. Grounding component; 21. Fixing part; 22. Elastic part;

[0038] 30. Insert body; 31. End plate part; 32. Embedding part; 33. Pipe body part;

[0039] 40. Insulating components;

[0040] 50. Insulation layer. Detailed Implementation

[0041] First, those skilled in the art should understand that these embodiments are merely for explaining the technical principles of this application and are not intended to limit the scope of protection of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.

[0042] Secondly, it should be noted that, in the description of the embodiments of this application, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0043] As described in the background section, feedthrough capacitors in related technologies suffer from high installation requirements and low flexibility in use. This is due to several factors: First, as a pre-encapsulated rigid unit, the installation of a feedthrough capacitor relies on a high-precision mechanical fit with the openings in the busbar copper bus. Any dimensional or geometric tolerances can lead to assembly difficulties or introduce stress, thus imposing stringent requirements on the busbar's machining accuracy and assembly process. Second, the capacitance value of a feedthrough capacitor is tightly coupled with its physical volume, resulting in increased capacitor size in scenarios requiring high capacitance, making it difficult to adapt to space-constrained layouts. Third, as a standard component with fixed dimensions and shapes, feedthrough capacitors cannot flexibly adapt to customized busbar designs with different thicknesses, shapes, or hole positions.

[0044] To address the aforementioned technical problems, this application provides an embedded capacitor and a high-voltage bus filter structure for high-voltage bus filtering. The embedded capacitor for high-voltage bus filtering includes: a capacitor core having a first electrode and a second electrode; a grounding element disposed at one end of the capacitor core, electrically connected to the first electrode; the grounding element can form electrical contact with the equipment housing to enable grounding and conduction of the first electrode of the capacitor core; and an embedded body electrically connected to the second electrode; the embedded body can be at least partially built into an opening in the high-voltage bus, and the embedded body is fixedly connected to the inner wall of the opening to enable electrical conduction between the second electrode of the capacitor core and the high-voltage bus.

[0045] The embedded capacitor for high-voltage busbar filtering provided in this application embodiment allows the insert body to be embedded in an opening of the high-voltage busbar and fixedly connected to the inner wall of the opening, thereby achieving electrical connection between the capacitor core and the high-voltage busbar through the insert body. This design allows for greater flexibility in the fixing method of the insert body to the inner wall of the opening, reduces sensitivity to opening size tolerances, and lowers the requirements for busbar machining accuracy.

[0046] During installation, the embedded capacitor is a pre-assembled unit. One end of the insert body is inserted into the opening on the high-voltage busbar and secured. Simultaneously, the direct electrical contact between the grounding component and the equipment casing eliminates the need for separate steps of welding or screwing the grounding wire. This not only simplifies assembly but also reduces the risk of failure due to poor welding or loose screws, improving reliability. Furthermore, it fully utilizes the space beneath the high-voltage busbar, offering greater operational flexibility.

[0047] The capacitor core can function as an independent functional unit, with its capacitance value flexibly designed by changing the dielectric material, electrode area, and number of layers. The insert body is responsible for the mechanical and electrical connection with the opening on the high-voltage busbar. Different capacitance values ​​can be obtained by replacing the internal capacitor cores without changing the external mounting dimensions (i.e., the size of the opening the insert body fits). This greatly enhances design flexibility, allowing for rapid adaptation to different filtering requirements without altering the busbar structure. Furthermore, the insert body can be specifically designed according to the thickness of the high-voltage busbar and the opening location, thus better adapting to busbar structures of different thicknesses and shapes, further improving installation flexibility.

[0048] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0049] Please refer to the attached document. Figure 1-6 The first aspect of this application provides an embedded capacitor 100 for high-voltage bus filtering, comprising:

[0050] The capacitor core package 10 has a first electrode 11 and a second electrode 12;

[0051] A grounding element 20 is disposed at one end of the capacitor core package 10 and is electrically connected to the first electrode 11. The grounding element 20 can form an electrical contact with the equipment housing 200 so that the first electrode 11 of the capacitor core package 10 can be grounded and connected.

[0052] The insert body 30 is electrically connected to the second electrode 12; the insert body 30 can be at least partially built into the opening 301 of the high voltage bus 300, and the insert body 30 is fixedly connected to the inner wall of the opening 301, so that the second electrode 12 of the capacitor core package 10 can be electrically connected to the high voltage bus.

[0053] In this embodiment of the application, please refer to Figure 3 As shown, the grounding component 20 is electrically connected to the first electrode 11 and directly forms electrical contact with the equipment housing 200. This not only eliminates the need for welding or screwing the grounding wire, simplifying the assembly process, but also shortens the path length of the grounding loop, reducing the parasitic inductance and overall impedance of the grounding path. This ensures that the capacitor core 10 provides a low-impedance discharge path for high-frequency noise, thereby improving the high-frequency performance of the filter.

[0054] In this embodiment of the application, please refer to Figure 3 As shown, the insert body 30 is electrically connected to the second electrode 12. The insert body 30 is at least partially embedded in the opening 301 of the high-voltage bus 300, and the insert body 30 is fixed to the inner wall of the opening 301. This allows the second electrode 12 of the capacitor core 10 to be connected to the high-voltage bus 300 through the insert body 30, thereby shortening the current path and reducing the contact resistance and parasitic inductance at the connection point. The insert body 30 and the grounding component 20 simultaneously avoid lead inductance from the high-voltage side and the grounding side, respectively. This effectively reduces the total parasitic inductance of the filter circuit formed by the capacitor core 10, enabling the capacitor core 10 to achieve better filtering performance within its operating frequency range.

[0055] The embedded capacitor 100 for high-voltage busbar filtering provided in this application embodiment has an insert body 30 that can be embedded into an opening 301 of the high-voltage busbar 300 and fixedly connected to the inner wall of the opening 301, thereby achieving electrical connection between the capacitor core 10 and the high-voltage busbar 300 through the insert body 30. This design allows for greater flexibility in the fixing method of the insert body 30 to the inner wall of the opening 301, reduces sensitivity to opening size tolerances, and lowers the requirements for busbar machining accuracy.

[0056] During installation, the embedded capacitor 100 is a pre-assembled integral structure. One end of the embedded body 30 is inserted into the opening 301 of the high-voltage busbar 300 and fixed. Simultaneously, the grounding component 20 has direct electrical contact with the equipment housing 200, eliminating the need for separate steps of welding or screwing the grounding wire. This not only simplifies assembly but also reduces the risk of failure due to poor welding or loose screws, improving reliability. Furthermore, it allows for full utilization of the space beneath the high-voltage busbar 300, providing greater flexibility in use.

[0057] The capacitor core 10 can function as an independent functional unit, and its capacitance value can be flexibly designed by changing the dielectric material, electrode area, and number of layers. The insert body 30 is responsible for the mechanical and electrical connection with the opening 301 of the high-voltage bus 300. Different capacitance values ​​can be obtained by replacing the internal capacitor core 10 with different specifications without changing the external mounting dimensions (i.e., the size of the opening 301 that the insert body adapts to). This greatly enhances design flexibility, allowing for rapid adaptation to different filtering requirements without modifying the busbar structure design. Furthermore, the insert body 30 can be specifically designed according to the thickness of the high-voltage busbar and the opening position, thus better adapting to busbar structures of different thicknesses and shapes, further improving installation flexibility.

[0058] In one possible implementation, please see Figure 2 and Figure 5 As shown, the insert body 30 includes an end plate portion 31 and an insert portion 32;

[0059] The end plate portion 31 is disposed at the end of the capacitor core package 10 away from the grounding member 20, and the end plate portion 31 is welded to the second electrode 12;

[0060] The embedded part 32 is disposed on the side of the end plate part 31 away from the capacitor core package 10. The embedded part 32 is built into the opening 301 of the high voltage bus 300, and the embedded part 32 is fixedly connected to the inner wall of the opening 301.

[0061] In this embodiment, the end plate portion 31 serves as the connection interface between the insert body 30 and the capacitor core package 10. The side plane of the end plate portion 31 facing the capacitor core package 10 is in contact with the end face of the capacitor core package 10, providing favorable conditions for welding the second electrode 12, ensuring the strength and consistency of the weld, and avoiding the difficulties and risks of welding directly on irregular surfaces or small leads. When the insert portion 32 is fixed to the inner wall of the opening 301 (e.g., by welding or pressing), the mechanical and thermal stresses generated will mainly concentrate in the insert portion 32. As a buffer interface, the end plate portion 31 can effectively block and disperse these stresses, preventing them from being directly transmitted to the interior of the capacitor core package 10, thereby improving the reliability and lifespan of the capacitor core package 10.

[0062] The insert 32 serves as the mechanical and electrical interface between the insert body 30 and the high-voltage busbar 300. The length and shape of the insert 32 (e.g., cylindrical or rectangular) can be flexibly designed according to the thickness of the high-voltage busbar 300, ensuring it can be reliably embedded in the opening 301 and form sufficient connection strength. The outer peripheral wall of the insert 32 can achieve a large contact area with the inner wall of the opening 301. This provides favorable conditions for using processes such as welding, conductive adhesive bonding, or crimping, thereby effectively reducing contact resistance and connection impedance, ensuring high-current conduction capability and high-frequency filtering effect.

[0063] In one possible implementation, the embedded part 32 is fixedly connected to the inner wall of the opening 301 by welding, pressing or bonding with a conductive adhesive.

[0064] In this embodiment, the embedded part 32 can be fixedly connected to the inner wall of the opening 301 by welding. Welding achieves a metallurgical bond between the metals, forming a near-integral electrical connection. This provides lower contact resistance and contact inductance, effectively ensuring high current conduction capability and high-frequency filtering performance. Moreover, the connection strength is high, capable of withstanding severe mechanical vibration and impact, and has high reliability.

[0065] The insert 32 can also be fixedly connected to the inner wall of the opening 301 by crimping. The entire process requires no heating, avoiding the risk of thermal damage to the dielectric material of the capacitor core 10, surrounding components, or busbar insulation layer caused by the high temperature of welding. Moreover, the installation process only requires using a tool to press the insert into the opening, which is highly efficient and suitable for automated production.

[0066] The embedded part 32 can also be fixedly connected to the inner wall of the opening 301 by means of conductive adhesive. This results in uniform stress distribution, effectively buffering and absorbing the internal stress caused by thermal expansion and contraction between different materials (such as copper busbar and insert), reducing the risk of fatigue. Moreover, the colloid can fill irregular gaps, which can reduce the machining tolerance requirements of the opening 301 of the high-voltage busbar 300 and reduce the requirements for the machining accuracy of the opening 301.

[0067] In one possible implementation, please see Figure 2 and Figure 5 As shown, the insert body 30 also includes a tube body 33, which is disposed on the side of the end plate 31 near the capacitor core package 10, and the tube body 33 is disposed circumferentially along the outer peripheral wall of the capacitor core package 10.

[0068] In this embodiment, the tube body 33 circumferentially wraps around the outer peripheral wall of the capacitor core 10. On one hand, this protects the capacitor core 10, effectively preventing external mechanical forces from directly acting on it, thereby improving the overall mechanical strength of the insert capacitor 100 and enabling it to withstand operational stress during installation and vibration during subsequent use. On the other hand, as part of the insert body 30, the tube body 33 forms an electrical connection with the insert portion 32 and the end plate portion 31. During operation, the tube body 33 is at the same potential (high potential) as the high-voltage busbar 300, acting as an equipotential shielding layer to help balance the electric field distribution around the capacitor core 10. This reduces electric field concentration (especially at the edges of the capacitor core 10), lowers the risk of partial discharge, and thus improves the insulation strength and withstand voltage of the entire insert capacitor 100, ensuring safe operation of the equipment under high voltage.

[0069] Furthermore, the end plate portion 31, the insert portion 32, and the tube body portion 33 can be integrally molded. On the one hand, this ensures that the insert body 30 and the insert capacitor 100 have sufficient integrity and rigidity to withstand severe mechanical and environmental stresses. On the other hand, it avoids the contact resistance present in separate connections, ensuring a lower and more stable electrical path impedance from the high-voltage bus 300 to the second electrode 12 of the capacitor core 10, which not only improves conductivity but also avoids failures caused by oxidation or loosening of the connection interface. Furthermore, it effectively reduces the parasitic inductance and resistance from the high-voltage bus 300 to the second electrode 12 of the capacitor core 10, ensuring that the filter maintains low impedance characteristics at higher frequencies.

[0070] In one possible implementation, please see Figure 2 and Figure 3 As shown, the embedded capacitor 100 used for high-voltage bus filtering also includes an insulating member 40. The insulating member 40 is disposed at one end of the tube body 33 near the grounding member 20. The insulating member 40 is disposed around the outer peripheral wall of the capacitor core 10 so as to achieve electrical isolation between the embedded body 30 and the grounding member 20.

[0071] It should be noted that the insert body 30 (including the tube body 33) is connected to the high-voltage bus 300 through the embedding part 32, and is therefore at a high potential. The grounding component 20, on the other hand, is connected to the equipment casing 200 and is at ground potential. There is a significant potential difference between the two. If the tube body 33 directly contacts the grounding component 20, it could cause a direct short circuit to ground, resulting in equipment damage or even a safety accident.

[0072] In this embodiment, by providing an insulating member 40 at the end of the tube body 33 near the grounding member 20, the high-voltage end and the grounding end are physically isolated, ensuring that the current can only flow through the preset path (i.e., the filtering path) inside the capacitor core 10, rather than a direct short circuit. The insulating member 40 is arranged circumferentially along the outer peripheral wall of the capacitor core 10, ensuring sufficient creepage distance between the high-voltage tube body 33 and the grounding member 20, effectively suppressing leakage current, preventing arcing, and ensuring safety.

[0073] In one possible implementation, please see Figure 3 As shown, the gap between the insulating component 40 and the capacitor core package 10 is filled with an insulating layer 50.

[0074] And / or, the gap between the tube body 33 and the capacitor core 10 is filled with an insulating layer 50.

[0075] In this embodiment, by filling the gap between the insulating component 40 and the capacitor core 10 with an insulating layer 50, a robust and seamless insulating barrier is formed, effectively preventing high-voltage grounding breakdown or arcing. Furthermore, it effectively prevents external foreign objects from entering the gap between the tube body 33 and the capacitor core 10, ensuring long-term insulation stability in harsh environments. Simultaneously, the insulating layer 50 firmly solidifies the capacitor core 10 and the insulating component 40 into a single unit. This effectively suppresses minor vibrations of the capacitor core 10 under vibration, preventing wear or breakage of its electrodes and surrounding components due to long-term fretting. The insulating layer 50 also absorbs and buffers external mechanical stress and impacts, providing protection for the capacitor core 10.

[0076] By filling the gap between the tube body 33 and the capacitor core 10 with an insulating layer 50, the air gap between the tube body 33 and the capacitor core 10 is eliminated, avoiding the risk of partial discharge and ensuring the long-term reliability of the product under high voltage. Furthermore, the insulating layer 50 firmly integrates the capacitor core 10 with the tube body 33 and the insulating component 40 into a single unit, providing sufficient mechanical support and making the embedded capacitor 100 structure more robust. Simultaneously, it prevents moisture, corrosive gases, or other contaminants from penetrating the interior of the capacitor core 10, thus achieving excellent environmental sealing.

[0077] Furthermore, the insulating layer 50 can be an insulating potting compound. During the manufacturing process, the gaps between the insulating component 40 and the capacitor core package 10, as well as the gaps between the tube body 33 and the capacitor core package 10, can be filled in one potting process, thereby simultaneously meeting multiple product requirements such as high-voltage insulation, mechanical fixation, and environmental protection, while simplifying the production process and ensuring product consistency.

[0078] In one possible implementation, the grounding element 20 is an elastic conductive element, and the grounding element 20 is in elastic contact with the equipment housing 200.

[0079] In this embodiment, the grounding element 20 is an elastic conductive element. On one hand, the grounding element 20 can absorb and buffer vibration energy through its own deformation, maintaining continuous contact pressure on the equipment housing 200. Even if the equipment housing 200 undergoes slight displacement due to vibration, the grounding element 20 can compensate through expansion and contraction, ensuring a stable and uninterrupted grounding path, effectively improving the reliability of the system in harsh mechanical environments. On the other hand, as an elastic conductive element, the grounding element 20 has a certain compression stroke, allowing it to adapt to minor unevenness on the surface of the equipment housing 200, compensating for accumulated tolerances in the dimensional chain through different compression amounts. This reduces the requirements for the machining accuracy and overall assembly accuracy of the equipment housing 200, simplifies the production process, and improves production yield and efficiency. Furthermore, the continuous pressure provided by the elastic contact allows the grounding element 20 to undergo slight deformation with the microscopic protrusions on the surface of the equipment housing 200, increasing the effective actual contact area, thereby further reducing contact resistance, resulting in lower impedance of the high-frequency noise discharge path and better filtering effect.

[0080] In one possible implementation, please see Figure 6 As shown, the grounding component 20 includes a fixed part 21 and an elastic part 22. The fixed part 21 is welded to the first electrode 11, and the elastic part 22 elastically abuts against the equipment housing 200.

[0081] In this embodiment, the grounding component 20 is welded to the first electrode 11 via a fixing part 21 to ensure the weld joint is strong and has low resistance. This ensures a stable and efficient electrical connection between the first electrode 11 of the capacitor core 10 and the grounding component 20, effectively avoiding contact problems. The elastic part 22 needs to repeatedly contact the equipment housing 200 and withstand vibration. By providing the elastic part 22, the grounding component 20 ensures that the elastic contact force does not decay over a long period of time, and can withstand millions of vibration cycles while maintaining good performance, achieving high mechanical reliability.

[0082] In one possible implementation, the grounding element 20 is a spring sheet or conductive foam.

[0083] In some embodiments, the grounding element 20 employs a spring sheet. The metal spring sheet provides a large contact pressure, forming a metal-to-metal contact with the equipment housing 200, thereby achieving very low contact resistance. As a metal conductor, the spring sheet can carry a large current, meeting the requirements for discharging large noise currents or applications with instantaneous high currents. Furthermore, the metal spring sheet has a long mechanical life and stability; its elasticity and conductivity remain stable at high temperatures and it is not prone to aging.

[0084] In some embodiments, the grounding element 20 is made of conductive foam. The conductive foam has a high compression ratio, effectively filling larger gaps and compensating for greater dimensional tolerances and unevenness of the equipment housing 200. While providing electrical connection, the conductive foam also acts as a dustproof and moisture-proof seal. Furthermore, the conductive foam is soft and will not scratch the contact surfaces of the equipment housing 200. It also has good damping characteristics, absorbing and buffering vibration energy across a wider frequency range, providing superior vibration reduction.

[0085] A second aspect of this application also provides a high-voltage bus filter structure, including an embedded capacitor 100 for high-voltage bus filtering as described above.

[0086] Given that the high-voltage bus filter structure in this embodiment includes the embedded capacitor 100 for high-voltage bus filtering described in any of the above embodiments, the structure and beneficial effects of the high-voltage bus filter structure including the embedded capacitor 100 for high-voltage bus filtering will not be elaborated further in this embodiment.

[0087] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0088] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0089] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An insert capacitor for high-voltage bus filtering, characterized in that, include: The capacitor core (10) has a first electrode (11) and a second electrode (12); A grounding element (20) is disposed at one end of the capacitor core (10), and the grounding element (20) is electrically connected to the first electrode (11); the grounding element (20) can form an electrical contact with the equipment casing so that the first electrode (11) of the capacitor core (10) can be grounded and connected. The insert body (30) is electrically connected to the second electrode (12); the insert body (30) can be at least partially built into the opening of the high voltage bus, and the insert body (30) is fixedly connected to the inner wall of the opening, so that the second electrode (12) of the capacitor core (10) is electrically connected to the high voltage bus.

2. The embedded capacitor for high-voltage bus filtering according to claim 1, characterized in that, The insert body (30) includes an end plate portion (31) and an insert portion (32). The end plate portion (31) is disposed at one end of the capacitor core package (10) away from the grounding member (20), and the end plate portion (31) is welded to the second electrode (12); The embedded part (32) is disposed on the side of the end plate part (31) away from the capacitor core package (10). The embedded part (32) is built into the opening of the high voltage bus and is fixedly connected to the inner wall of the opening.

3. The embedded capacitor for high-voltage bus filtering according to claim 2, characterized in that, The embedded part (32) is fixedly connected to the inner wall of the opening by welding, pressing or bonding with a conductive adhesive.

4. The embedded capacitor for high-voltage bus filtering according to claim 2, characterized in that, The insert body (30) also includes a tube part (33), which is disposed on the side of the end plate part (31) near the capacitor core package (10) and is arranged circumferentially along the outer peripheral wall of the capacitor core package (10).

5. The embedded capacitor for high-voltage bus filtering according to claim 4, characterized in that, The embedded capacitor for high-voltage bus filtering also includes an insulating component (40), which is disposed at one end of the tube body (33) near the grounding component (20). The insulating component (40) is disposed circumferentially along the outer peripheral wall of the capacitor core (10) so as to achieve electrical isolation between the embedded body (30) and the grounding component (20).

6. The embedded capacitor for high-voltage bus filtering according to claim 5, characterized in that, The gap between the insulating element (40) and the capacitor core (10) is filled with an insulating layer (50). And / or, the gap between the tube body (33) and the capacitor core (10) is filled with an insulating layer (50).

7. The embedded capacitor for high-voltage bus filtering according to any one of claims 1-6, characterized in that, The grounding component (20) is an elastic conductive component, and the grounding component (20) is in elastic contact with the housing of the equipment.

8. The embedded capacitor for high-voltage bus filtering according to claim 7, characterized in that, The grounding component (20) includes a fixed part (21) and an elastic part (22). The fixed part (21) is welded to the first electrode (11), and the elastic part (22) is elastically abutted against the equipment casing.

9. The embedded capacitor for high-voltage bus filtering according to claim 8, characterized in that, The grounding element (20) is a spring sheet or conductive foam.

10. A high-voltage busbar filter structure, characterized in that, Includes the embedded capacitor for high-voltage bus filtering as described in any one of claims 1 to 9 above.

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