Glue-filling heat-dissipation type supercapacitor module

Abstract

The utility model relates to super capacitor technical field, and disclose a kind of glue filling heat dissipation type super capacitor module, including capacitor inner component, capacitor outer component is configured outside capacitor inner component, capacitor inner component includes positive electrode plate and negative electrode plate, insulating medium is clamped between positive electrode plate and negative electrode plate, play the role of isolating positive and negative two electrode plates, and further guarantee insulating property;Positive electrode plate, negative electrode plate and insulating medium are integrally encapsulated in heat-conducting encapsulation glue.The utility model is arranged in array form by the aluminum alloy integrally formed heat dissipation fin of outer encapsulation shell two ends, and the isosceles trapezoidal heat dissipation groove of outer encapsulation plate surface, significantly increase the contact area of module and air;With the efficient heat conduction of heat-conducting encapsulation glue, the rapid conduction and emission of heat are realized, the heat dissipation efficiency of module is effectively improved, and the stable work of super capacitor under high temperature working condition is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of supercapacitor technology, specifically to a potting heat dissipation type supercapacitor module. Background Technology

[0002] Supercapacitor modules are widely used in new energy vehicles, smart grids, and rail transportation due to their advantages such as high power density, fast charging and discharging speed, and long cycle life. Encapsulated supercapacitor modules use thermally conductive encapsulant to encapsulate the internal components of the capacitor to improve insulation and initial heat dissipation. However, existing encapsulated supercapacitor modules still have the following problems in use:

[0003] Limited heat dissipation efficiency: The unreasonable distribution of heat dissipation fins in some modules or the way they are combined with the outer packaging shell leads to poor heat conduction, which makes it impossible to quickly dissipate the heat generated by the components inside the capacitor, affecting the working stability and lifespan of the module.

[0004] Insufficient installation stability: The module's installation structure is simple and relies on only a few mounting points for fixation. Under vibration or impact conditions, it is prone to displacement or even detachment from the equipment mounting position. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this utility model provides a potting heat dissipation type supercapacitor module. By setting up an array of aluminum alloy heat dissipation fins, a silicone sealing ring, and a four-corner welded mounting base with internal threads, it solves the problems of limited heat dissipation efficiency, insufficient installation stability, and poor sealing performance mentioned in the background technology.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: a potting heat dissipation type supercapacitor module, including an inner capacitor component, and an outer capacitor component is disposed outside the inner capacitor component.

[0009] The internal component of the capacitor includes a positive electrode plate and a negative electrode plate, with an insulating medium sandwiched between them to isolate the two electrode plates and ensure insulation. The positive electrode plate, negative electrode plate, and insulating medium are encapsulated in a thermally conductive encapsulant, which can quickly conduct the heat generated during the operation of the internal component of the capacitor and improve the insulation and sealing performance of the module. Each of the positive and negative electrode plates has an electrode pin fixedly connected to its front end for electrical connection between the module and an external circuit.

[0010] The external capacitor assembly includes an outer casing fitted over the inner capacitor assembly, providing both protection and heat conduction. The front end of the outer casing has a pin-through groove, providing a channel for the electrode pins to pass through. The corresponding electrode pin passes through the pin-through groove, and a sealing ring is provided at the pin-through groove to effectively seal the gap and prevent the intrusion of external dust and moisture. Multiple heat dissipation fins are fixedly connected in an array to the outer walls at both ends of the outer casing, increasing the contact area with air and quickly dissipating the heat conducted by the outer casing. The top and bottom ends of the outer casing are covered with an outer casing plate, achieving sealed protection for the inner capacitor assembly. Several heat dissipation grooves are formed on the surface of the outer casing plate, further enhancing the module's heat dissipation capacity. Mounting bases are fixedly connected to the outer walls at the four corners of the outer casing, and mounting holes are formed on the upper and lower surfaces of the mounting bases, facilitating stable installation of the module on the equipment.

[0011] As a further improvement of this utility model: the thermally conductive encapsulant is an epoxy resin thermally conductive adhesive, and the thermally conductive encapsulant completely covers the sides and top of the positive electrode plate and the negative electrode plate, ensuring that heat can be efficiently conducted from the electrode plate to the outer encapsulation shell.

[0012] As a further improvement of this utility model: the sealing ring is made of silicone, the inner ring of the sealing ring is tightly fitted to the outer wall of the electrode pin, and the outer ring of the sealing ring is tightly fitted to the inner wall of the pin through groove, thereby achieving a reliable seal by utilizing the elastic deformation of silicone.

[0013] As a further improvement of this utility model, the heat dissipation fins are made of aluminum alloy, and the heat dissipation fins and the outer packaging shell are integrally formed, which ensures the continuity of heat conduction and improves heat dissipation efficiency.

[0014] As a further improvement of this utility model, the heat dissipation grooves are evenly spaced and parallel, and the cross-sectional shape of the heat dissipation grooves is an isosceles trapezoid, which increases the heat dissipation area of ​​the outer packaging plate and avoids dust accumulation.

[0015] As a further improvement of this utility model: the connection between the mounting base and the outer packaging shell is by welding, and the mounting hole is provided with an internal thread. Welding ensures the connection strength of the mounting base, and the internal thread facilitates stable installation by bolts.

[0016] As a further improvement of this utility model: both the outer packaging shell and the outer packaging plate are made of stainless steel, and the connection between the two is by bolt fixing. Stainless steel is corrosion resistant and has high strength, and bolt fixing facilitates the disassembly and maintenance of the module.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. In this utility model, the integrated aluminum alloy heat dissipation fins arranged in an array at both ends of the outer packaging shell, and the isosceles trapezoidal heat dissipation grooves on the surface of the outer packaging plate, significantly increase the contact area between the module and the air; combined with the efficient heat conduction of the thermally conductive encapsulating adhesive, the rapid conduction and dissipation of heat are realized, effectively improving the heat dissipation efficiency of the module and ensuring the stable operation of the supercapacitor under high temperature conditions.

[0019] 2. In this utility model, the module can be stably fixed on the equipment by means of the internally threaded mounting base welded at the four corners of the outer packaging shell and the mounting holes. Compared with the traditional design with a few mounting points, the four-corner mounting method greatly improves the installation stability of the module and can effectively resist the displacement risk caused by vibration or impact.

[0020] 3. In this utility model, the silicone sealing ring set at the pin insertion groove has its inner and outer rings tightly fitted with the electrode pin and the pin insertion groove, respectively, to achieve a reliable seal at the pin insertion point, effectively preventing external dust and moisture from entering the module, and improving the insulation performance and service life of the capacitor. Attached Figure Description

[0021] Figure 1 The overall three-dimensional structure of this utility model Figure 1 ;

[0022] Figure 2 The overall three-dimensional structure of this utility model Figure 2 ;

[0023] Figure 3 This is a perspective view of the capacitor internal component of this utility model;

[0024] Figure 4 This is a perspective view of the capacitor external component of this utility model.

[0025] In the diagram: 1. Internal capacitor assembly; 2. External capacitor assembly; 11. Positive electrode plate; 12. Negative electrode plate; 13. Insulating medium; 14. Thermally conductive encapsulant; 15. Electrode leads; 21. Outer encapsulation shell; 22. Lead pass-through groove; 23. Sealing ring; 24. Heat sink fins; 25. Outer encapsulation plate; 26. Heat sink groove; 27. Mounting base; 28. Mounting hole. Detailed Implementation

[0026] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0027] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] Please see Figures 1-4 In this embodiment of the present invention, a potting heat dissipation type supercapacitor module includes an inner capacitor component 1 and an outer capacitor component 2 disposed outside the inner capacitor component 1.

[0030] The capacitor internal component 1 includes a positive electrode plate 11 and a negative electrode plate 12. An insulating medium 13 is sandwiched between the positive electrode plate 11 and the negative electrode plate 12 to isolate the positive and negative electrode plates and thus ensure insulation. The positive electrode plate 11, the negative electrode plate 12 and the insulating medium 13 are encapsulated in a thermally conductive encapsulant 14. The thermally conductive encapsulant 14 can quickly conduct the heat generated by the capacitor internal component 1 during operation and improve the insulation and sealing performance of the module. An electrode pin 15 is fixedly connected to the front end of the positive electrode plate 11 and the negative electrode plate 12 respectively to realize the electrical connection between the module and the external circuit.

[0031] The capacitor outer component 2 includes an outer encapsulation shell 21 sleeved on the outside of the capacitor inner component 1, which provides both protection and heat conduction for the capacitor inner component 1. The front end of the outer encapsulation shell 21 has a pin-through groove 22, providing a channel for the electrode pins 15 to pass through. The corresponding electrode pins 15 pass through the pin-through groove 22, and a sealing ring 23 is provided at the pin-through groove 22 to effectively seal the gap at the pin-through point and prevent external dust and moisture from entering. Multiple heat dissipation fins 24 are fixedly connected in an array on the outer walls of both ends of the outer encapsulation shell 21, increasing the contact area with air and quickly dissipating the heat conducted by the outer encapsulation shell 21. The upper and lower ends of the outer encapsulation shell 21 are covered with an outer encapsulation plate 25 to achieve closed protection for the capacitor inner component 1. Several heat dissipation grooves 26 are opened on the surface of the outer encapsulation plate 25 to further enhance the heat dissipation capacity of the module. Mounting bases 27 are fixedly connected to the outer walls of the four corners of the outer encapsulation shell 21. Mounting bases 27 have mounting holes 28 on the upper and lower surfaces of the mounting bases 27 to facilitate the stable installation of the module on the equipment.

[0032] The thermally conductive encapsulant 14 is an epoxy resin thermally conductive adhesive, and the thermally conductive encapsulant 14 completely covers the sides and top of the positive electrode plate 11 and the negative electrode plate 12, ensuring that heat can be efficiently conducted from the electrode plates to the outer encapsulation shell 21.

[0033] The sealing ring 23 is made of silicone. The inner ring of the sealing ring 23 fits tightly against the outer wall of the electrode pin 15, and the outer ring of the sealing ring 23 fits tightly against the inner wall of the pin through groove 22. Reliable sealing is achieved by utilizing the elastic deformation of silicone.

[0034] The heat dissipation fins 24 are made of aluminum alloy, and the heat dissipation fins 24 and the outer packaging shell 21 are integrally formed, which ensures the continuity of heat conduction and improves heat dissipation efficiency.

[0035] The heat dissipation slots 26 are evenly spaced and parallel, and the cross-sectional shape of the heat dissipation slots 26 is an isosceles trapezoid, which increases the heat dissipation area of ​​the outer encapsulation plate 25 and avoids dust accumulation.

[0036] The mounting base 27 is connected to the outer casing 21 by welding, and the mounting hole 28 is provided with internal threads. Welding ensures the connection strength of the mounting base 27, and the internal threads facilitate stable installation by bolts.

[0037] Both the outer casing 21 and the outer packaging plate 25 are made of stainless steel, and the two are connected by bolts. Stainless steel is corrosion resistant and has high strength, and bolt fixing facilitates the disassembly and maintenance of the module.

[0038] The working principle of this utility model is as follows: In use, the module is first fixed to the mounting position of the target device by bolts through the mounting holes 28 on the four corner mounting bases 27 of the outer packaging shell 21; when the supercapacitor module is working, the heat generated by the positive electrode plate 11 and the negative electrode plate 12 is quickly conducted to the outer packaging shell 21 through the thermally conductive encapsulating adhesive 14, and then exchanged with the air through the array-shaped heat dissipation fins 24 at both ends and the heat dissipation grooves 26 on the outer packaging plate 25 to achieve efficient heat dissipation; the silicone sealing ring 23 at the electrode pin 15 through-hole tightly fits the pin and through-hole, preventing external dust and moisture from entering and ensuring internal insulation performance; if maintenance is required, the fixing bolts of the outer packaging plate 25 can be unscrewed to inspect or replace the internal components.

[0039] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A potting-type heat dissipation supercapacitor module, comprising an inner capacitor assembly (1), wherein an outer capacitor assembly (2) is disposed outside the inner capacitor assembly (1), characterized in that: The capacitor internal component (1) includes a positive electrode plate (11) and a negative electrode plate (12). An insulating medium (13) is sandwiched between the positive electrode plate (11) and the negative electrode plate (12). The positive electrode plate (11), the negative electrode plate (12) and the insulating medium (13) are encapsulated in a thermally conductive encapsulating adhesive (14). An electrode pin (15) is fixedly connected to the front end of the positive electrode plate (11) and the negative electrode plate (12). The capacitor outer assembly (2) includes an outer encapsulation shell (21) sleeved on the outside of the capacitor inner assembly (1). The outer encapsulation shell (21) has a pin through groove (22) at its front end. The corresponding electrode pin (15) passes through the pin through groove (22). A sealing ring (23) is provided at the pin through groove (22). Multiple heat dissipation fins (24) are fixedly connected in an array on the outer side walls of both ends of the outer encapsulation shell (21). An outer encapsulation plate (25) is covered at both the upper and lower ends of the outer encapsulation shell (21). Several heat dissipation grooves (26) are opened on the surface of the outer encapsulation plate (25). Mounting seats (27) are fixedly connected to the outer side walls of the four corners of the outer encapsulation shell (21). Mounting holes (28) are opened on the upper and lower surfaces of the mounting seats (27).

2. The potting heat dissipation type supercapacitor module according to claim 1, characterized in that: The thermally conductive encapsulant (14) is an epoxy resin thermally conductive adhesive, and the thermally conductive encapsulant (14) completely covers the sides and top of the positive electrode plate (11) and the negative electrode plate (12).

3. The potting heat dissipation type supercapacitor module according to claim 1, characterized in that: The sealing ring (23) is made of silicone. The inner ring of the sealing ring (23) is tightly fitted to the outer wall of the electrode pin (15), and the outer ring of the sealing ring (23) is tightly fitted to the inner wall of the pin through groove (22).

4. The potting heat dissipation type supercapacitor module according to claim 1, characterized in that: The heat dissipation fins (24) are made of aluminum alloy, and the heat dissipation fins (24) and the outer packaging shell (21) are integrally formed.

5. A potting heat dissipation type supercapacitor module according to claim 1, characterized in that: The heat dissipation grooves (26) are evenly spaced and parallel, and the cross-sectional shape of the heat dissipation grooves (26) is an isosceles trapezoid.

6. The potting heat dissipation type supercapacitor module according to claim 1, characterized in that: The mounting base (27) is connected to the outer casing (21) by welding, and the mounting hole (28) is provided with an internal thread.

7. A potting heat dissipation type supercapacitor module according to claim 1, characterized in that: The outer packaging shell (21) and the outer packaging plate (25) are both made of stainless steel, and the two are connected by bolts.

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