A microstrip coupler and electronic device

Abstract

The application discloses a microstrip coupler and electronic equipment. The microstrip coupler comprises a main coupling device and at least one secondary coupling device. The main coupling device is arranged on a first circuit layer; each secondary coupling device is arranged on a different target circuit layer, and the target circuit layer and the first circuit layer are different circuit layers; a first side port of the main coupling device and a first side port of each secondary coupling device are connected through a via on a first side of the circuit layer, and a second side port of the main coupling device and a second side port of each secondary coupling device are connected through a via on a second side of the circuit layer. By connecting the same side ports of the main coupling device and the secondary coupling device through different vias, the main coupling device and the secondary coupling device can be connected in parallel, so that the coupling degree of the microstrip coupler is increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication, in particular to a microstrip coupler and electronic equipment. BACKGROUND

[0002] As a microwave and radio frequency device for power transmission, the coupler is widely used in communication, measurement and control, radar and other fields, and is used for power detection, power distribution and power feedback.

[0003] Two important performance indicators of the coupler are directivity and coupling degree, and the coupling degree and other indicators will directly affect the power output. However, the coupler cannot meet the requirements of coupling degree and directivity and other indicators while meeting the size requirements, thereby affecting the performance of the product using the coupler. CONTENT OF THE INVENTION

[0004] The microstrip coupler and electronic equipment provided by the present application can realize the parallel connection of the main coupling device and the secondary coupling device in three-dimensional space by connecting the same side ports of the main coupling device and the secondary coupling device through different vias and connecting the ports of different circuit layers through the vias, thereby increasing the coupling degree of the microstrip coupler. On the other hand, by reasonably arranging different coupling devices on different circuit layers, three-dimensional coupling is realized, which can reduce the area of the microstrip coupler in a plane and thereby reduce the overall volume of the microstrip coupler.

[0005] In order to solve the above technical problems, the present application provides a microstrip coupler, which includes a main coupling device and at least one secondary coupling device. The main coupling device is arranged on a first circuit layer, and each secondary coupling device is arranged on a different target circuit layer. The target circuit layer and the first circuit layer are different circuit layers. The first side port of the main coupling device and the first side port of each secondary coupling device are connected through a via on the first side of the circuit layer, and the second side port of the main coupling device and the second side port of each secondary coupling device are connected through a via on the second side of the circuit layer.

[0006] In order to solve the above technical problems, the present application provides an electronic device, which includes the above-mentioned microstrip coupler.

[0007] The microstrip coupler and the electronic device provided in some embodiments of the present application include a main coupling device and at least one secondary coupling device, the main coupling device is arranged on a first circuit layer; each secondary coupling device is arranged on a different target circuit layer, and the target circuit layer is different from the first circuit layer; the first side port of the main coupling device and the first side port of each secondary coupling device are connected through a via on the first side of the circuit layer, and the second side port of the main coupling device and the second side port of each secondary coupling device are connected through a via on the second side of the circuit layer. On the one hand, by connecting the same side ports of the main coupling device and the secondary coupling device through different vias, and connecting the ports of different circuit layers through the vias, the main coupling device and the secondary coupling device can be connected in parallel in three-dimensional space, so as to increase the coupling degree of the microstrip coupler. On the other hand, by reasonably arranging different coupling devices on different circuit layers, three-dimensional coupling is realized, which can reduce the area of the microstrip coupler in a plane, and further reduce the overall volume of the microstrip coupler. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor. Among them:

[0009] Figure 1 is a structural schematic diagram of a microstrip coupler provided in some embodiments of the present application;

[0010] Figure 2 is a connection schematic diagram of a main coupling device and a secondary coupling device provided in some embodiments of the present application;

[0011] Figure 3 is Figure 2 is a connection schematic diagram of a main coupling device and a secondary coupling device provided in some embodiments of the present application;

[0012] Figure 4 is a connection schematic diagram of a main coupling device and a secondary coupling device provided in some embodiments of the present application;

[0013] Figure 5 is a connection schematic diagram of a main coupling device and a secondary coupling device provided in some embodiments of the present application;

[0014] Figure 6 is a connection schematic diagram of a main coupling device and a secondary coupling device provided in some embodiments of the present application;

[0015] Figure 7 is Figure 4 is a connection schematic diagram of a main coupling device and a secondary coupling device provided in some embodiments of the present application;

[0016] Figure 8 is Figure 5 a connection diagram of the primary coupling device and the secondary coupling device shown in

[0017] Figure 9 is Figure 6 a connection diagram of the primary coupling device and the secondary coupling device shown in

[0018] Figure 10 is a structural diagram of an electronic device provided in some embodiments of the present application. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0020] According to some embodiments of the present application, please refer to Figures 1 to 9 , Figure 1 is a structural diagram of a microstrip coupler provided in some embodiments of the present application, Figure 2 is a connection diagram of a primary coupling device and a secondary coupling device provided in some embodiments of the present application, Figure 3 is Figure 2 a connection diagram of the primary coupling device and the secondary coupling device shown in Figures 4 to 6 are all connection diagrams of a primary coupling device and a secondary coupling device provided in some embodiments of the present application, Figure 7 is Figure 4 a connection diagram of the primary coupling device and the secondary coupling device shown in Figure 8 is Figure 5 a connection diagram of the primary coupling device and the secondary coupling device shown in Figure 9 is Figure 6 a connection diagram of the primary coupling device and the secondary coupling device shown in

[0021] As Figure 1 shown, the microstrip coupler 10 includes a primary coupling device 101 and at least one secondary coupling device 102. Here, the number of the secondary coupling device 102 can be determined according to actual conditions, such as 1, 2 or others. In the embodiments of the present application, as Figures 2 to 5 shown, the microstrip coupler 10 includes one secondary coupling device 102 for illustrative purposes. In addition, when there are multiple secondary coupling devices 102, the structures of the multiple secondary coupling devices 102 are the same or different, which is not limited here.

[0022] As Figures 2 to 5As shown, the main coupling device 101 is arranged on the first circuit layer P1; each secondary coupling device 102 is arranged on a different target circuit layer P2, and the target circuit layer P2 is different from the first circuit layer P1.

[0023] The first side port of the main coupling device 101 and the first side port of each secondary coupling device 102 are connected through the via on the first side of the circuit layer, and the second side port of the main coupling device 101 and the second side port of each secondary coupling device 102 are connected through the via on the second side of the circuit layer; wherein the first side port and the second side port can be an input port, an output port, a coupling port, an isolation port, etc.

[0024] It can be understood that the first side port of the main coupling device 101 is different from the second side port of the main coupling device 101, and the first side port is different from the second side port. In addition, the number of vias is greater than or equal to the number of ports on the coupling device.

[0025] When the first side port of the main coupling device 101 and the first side port of each secondary coupling device 102 are connected, and the second side port of the main coupling device 101 and the second side port of each secondary coupling device 102 are connected, the main coupling device 101 and each secondary coupling device 102 are connected in parallel. The parallel connection of the main coupling device 101 and the secondary coupling device 102 can realize the superposition of the coupling signals, and the superposition of the coupling signals can improve the coupling degree. Here, the superposition of the coupling signals includes in-phase parallel connection or phase compensation synthesis.

[0026] Exemplarily, the first side port of the main coupling device 101 and the first side port of the secondary coupling device 102 are connected through the via on the first side of the circuit layer, and the second side port of the main coupling device 101 and the second side port of the secondary coupling device 102 are connected through the via on the second side of the circuit layer.

[0027] Exemplarily, the first side port of the main coupling device 101 and the first side port of the secondary coupling device 102 are connected through the via on the first side of the circuit layer, and the second side port of the main coupling device 101 and the second side port of the secondary coupling device 102 are not connected. Here, at least two vias are arranged on the first circuit layer P1, and at least two vias are arranged on the target circuit layer P2.

[0028] Exemplarily, the second side port of the main coupling device 101 and the second side port of the secondary coupling device 102 are connected through the via on the second side of the circuit layer, and the first side port of the main coupling device 101 and the first side port of the secondary coupling device 102 are not connected. Here, at least two vias are arranged on the first circuit layer P1, and at least two vias are arranged on the target circuit layer P2.

[0029] In some embodiments, when the first side port of the main coupling device 101 and the first side port of each of the coupling devices 102 are connected through the via holes of the first side of the circuit layer, the first side port of the main coupling device 101 and the first side port of each of the coupling devices 102 are connected through the connecting lines, and the connecting lines are connected to the via holes of the first side of the circuit layer respectively to realize electrical connection.

[0030] Similarly, when the second side port of the main coupling device 101 and the second side port of each of the coupling devices 102 are connected through the via holes of the second side of the circuit layer, the second side port of the main coupling device 101 and the second side port of each of the coupling devices 102 are connected through the connecting lines, and the connecting lines are connected to the via holes of the first side of the circuit layer respectively to realize electrical connection.

[0031] In the formula, the via holes of the first side of the circuit layer and the via holes of the second side of the circuit layer are metallized through holes. The positions of the via holes can be set according to actual conditions, which are not limited here.

[0032] In the formula, the number of the connecting lines is determined according to the number of the via holes. The connecting lines are coupling lines, which can be parallel microstrip lines, strip lines or irregularly shaped coupling structures. The coupling lines can be arranged on any layer, and the coupling lines can adopt a plurality of coupling line structures.

[0033] In the formula, the distance between any two circuit layers (such as the first circuit layer P1 and the target circuit layer P2) determines the coupling degree. Here, the coupling degree of the microstrip coupler 10 can be adjusted by adjusting the length of the coupling lines used for the via hole connection of the two circuit layers.

[0034] In some embodiments, the target circuit layer P2 is located above or below the first circuit layer P1. When there are a plurality of target circuit layers P2, all the target circuit layers P2 are arranged above the first circuit layer P1, or all the target circuit layers P2 are arranged below the first circuit layer P1, or part of the target circuit layers P2 are arranged above the first circuit layer P1 and part of the target circuit layers P2 are arranged below the first circuit layer P1.

[0035] Here, at least one target circuit layer P2 and the first circuit layer P1 are arranged vertically and in layers, and this three-dimensional coupling structure can realize multiple coupling and parallel superposition of signals, can reduce the overall volume of the microstrip coupler 10 while improving the coupling degree, so that the electrical length of the microstrip coupler 10 is not limited to the traditional λ / 4 (λ is the wavelength). And the deterioration of electrical performance caused by size reduction is compensated.

[0036] In some embodiments, the at least one secondary coupling device 102 comprises at least one first secondary coupling device and at least one second secondary coupling device; here, the at least one first secondary coupling device is respectively arranged on a different target circuit layer P2 below the first circuit layer P1, and the at least one second secondary coupling device is respectively arranged on a different target circuit layer P2 above the first circuit layer P1.

[0037] Exemplarily, the at least one secondary coupling device 102 comprises one first secondary coupling device and one second secondary coupling device, the first secondary coupling device is arranged on one target circuit layer P2 below the first circuit layer P1, and the second secondary coupling device is arranged on one target circuit layer P2 above the first circuit layer P1.

[0038] Exemplarily, the at least one secondary coupling device 102 comprises two first secondary coupling devices and one second secondary coupling device, the two first secondary coupling devices are respectively arranged on different target circuit layers P2 below the first circuit layer P1, and the second secondary coupling device is respectively arranged on one target circuit layer P2 above the first circuit layer P1.

[0039] Exemplarily, the at least one secondary coupling device 102 comprises one first secondary coupling device and two second secondary coupling devices, the first secondary coupling device is arranged on one target circuit layer P2 below the first circuit layer P1, and the two second secondary coupling devices are respectively arranged on different target circuit layers P2 above the first circuit layer P1.

[0040] Here, the first secondary coupling device and the second secondary coupling device are the same or different in structure.

[0041] In some embodiments, when the target circuit layer P2 is arranged below the first circuit layer P1, the at least one secondary coupling device 102 is respectively arranged on different target circuit layers P2 below the first circuit layer P1.

[0042] In some embodiments, when the target circuit layer P2 is arranged above the first circuit layer P1, the at least one secondary coupling device 102 is respectively arranged on different target circuit layers P2 above the first circuit layer P1.

[0043] According to some embodiments of the present application, please refer to Figure 2 , the primary coupling device 101 comprises a first coupling member 201, a second coupling member 202 and a third coupling member 203, the first coupling member 201 and the second coupling member 202 are arranged on two sides of the third coupling member 203; the secondary coupling device 102 comprises a fourth coupling member 301 and a fifth coupling member 302.

[0044] The first end Port 11 of the first coupling member 201 and the first end Port 21 of the fourth coupling member 301 are connected through the first via hole on the first side of the circuit layer, and the second end Port 12 of the first coupling member 201 and the second end Port 22 of the fourth coupling member 301 are connected through the second via hole on the first side of the circuit layer.

[0045] The first end Port 31 of the second coupling member 202 and the first end Port 41 of the fifth coupling member 302 are connected through the third via hole on the second side of the circuit layer, and the second end Port 32 of the second coupling member 202 and the second end Port 42 of the fifth coupling member 302 are connected through the fourth via hole on the second side of the circuit layer.

[0046] In some embodiments, as shown in FIG. 1, the length of the first coupling member 201 is the same as the length of the fourth coupling member 301; the length of the second coupling member 202 is the same as the length of the fifth coupling member 302. Figure 2

[0047] In some embodiments, as shown in FIG. 2, the shape and size of the first coupling member 201 and the second coupling member 202 are the same; the shape and size of the fourth coupling member 301 and the fifth coupling member 302 are the same. The third coupling member 203 is square in shape; the first coupling member 201 and the second coupling member 202 are symmetrically arranged on both sides of the third coupling member 203, and the shape of the first coupling member 201 and the second coupling member 202 is regular and square with an opening; the fourth coupling member 301 and the fifth coupling member 302 are symmetrically arranged, and the shape of the fourth coupling member 301 and the fifth coupling member 302 is regular and square with an opening. Here, the opening of the fourth coupling member 301 and the fifth coupling member 302 is smaller than the opening of the first coupling member 201 and the second coupling member 202. Figure 2

[0048] In some embodiments, based on the structure shown in FIG. 3, please refer to FIG. 4, the first coupling member 201 includes a first coupling microstrip line 401, the second coupling member 202 includes a second coupling microstrip line 402, the direction of the first coupling microstrip line 401 and the second coupling microstrip line 402 is opposite, the third coupling member 203 includes a main transmission microstrip line 403, the main transmission microstrip line 403 undertakes the function of the main path of signal; the fourth coupling member 301 includes a third coupling microstrip line 404, and the fifth coupling member 302 includes a fourth coupling microstrip line 405. Among them, the coupling line width, spacing and dielectric constant of the first coupling microstrip line 401, the second coupling microstrip line 402, the main transmission microstrip line 403, the third coupling microstrip line 404 and the fourth coupling microstrip line 405 can be set according to the impedance matching requirement. Figure 2 Figure 3

[0049] ​​​​The first end Port1 of the first coupled microstrip line 401 and the first end Port2 of the third coupled microstrip line 404 are connected through the first via on the first side of the circuit layer, and the second end Port3 of the first coupled microstrip line 401 and the second end Port4 of the third coupled microstrip line 404 are connected through the second via on the first side of the circuit layer. Here, the first side of the circuit layer realizes the electrical connection of the ends of the first coupled microstrip line 401 and the third coupled microstrip line 404 through the first via and the second via.

[0050] The first end Port5 of the second coupled microstrip line 402 and the first end Port6 of the fourth coupled microstrip line 405 are connected through the third via on the second side of the circuit layer, and the second end Port7 of the second coupled microstrip line 402 and the second end Port8 of the fourth coupled microstrip line 405 are connected through the fourth via on the second side of the circuit layer. Here, the second side of the circuit layer realizes the electrical connection of the ends of the second coupled microstrip line 402 and the fourth coupled microstrip line 405 through the third via and the fourth via.

[0051] The first end Port1 of the first coupled microstrip line 401 corresponds to the first end Port11 of the first coupling piece 201, the first end Port2 of the third coupled microstrip line 404 corresponds to the first end Port21 of the fourth coupling piece 301, the second end Port3 of the first coupled microstrip line 401 corresponds to the second end Port12 of the first coupling piece 201, and the second end Port4 of the third coupled microstrip line 404 corresponds to the second end Port22 of the fourth coupling piece 301.

[0052] The first end Port5 of the second coupled microstrip line 402 corresponds to the first end Port31 of the second coupling piece 202, the first end Port6 of the fourth coupled microstrip line 405 corresponds to the first end Port41 of the fifth coupling piece 302, the second end Port7 of the second coupled microstrip line 402 corresponds to the second end Port32 of the second coupling piece 202, and the second end Port8 of the fourth coupled microstrip line 405 corresponds to the second end Port42 of the fifth coupling piece 302.

[0053] In some embodiments, as shown in Figure 3 The main transmission microstrip line 403 has a first end Port00 and a second end Port01.

[0054] When the first end Port00 of the main transmission microstrip line 403 is the input end and the second end Port01 of the main transmission microstrip line 403 is the output end, the first end Port5 of the second coupled microstrip line 402 is the forward coupling end (i.e. the reverse isolation end), and the second end Port3 of the first coupled microstrip line 401 is the reverse coupling end (i.e. the forward isolation end).

[0055] When the first end Port00 of the main transmission microstrip line 403 is an output end and the second end Port01 of the main transmission microstrip line 403 is an input end, the first end Port5 of the second coupling microstrip line 402 is a reverse coupling end (i.e., a forward isolation end), and the second end Port3 of the first coupling microstrip line 401 is a forward coupling end (i.e., a reverse isolation end).

[0056] According to some embodiments of the present application, referring to Figure 3 , the first end Port1 of the first coupling microstrip line 401 is connected to the first load device 20, and the second end Port7 of the second coupling microstrip line 402 is connected to the second load device 30. Here, the first load device 20 and the second load device 30 are the same or different.

[0057] In some embodiments, the first load device 20 and the second load device 30 are used to adjust or optimize the reflection coefficient, and the first load device 20 and the second load device 30 can be all structures or elements for adjusting the reflection coefficient. For example, any combination of RLC (resistor, inductor, and capacitor), active device, microstrip line, digital adjustable load, analog adjustable load, resonator, varactor, etc.

[0058] Here, the optimization or adjustment of the reflection system can solve the problem of deterioration of directivity caused by the miniaturization of the microstrip coupler 10, and can improve the isolation by phase cancellation of reflected waves and leakage signals, so that the forward and reverse directivity can be improved in the signal transmission performance of a specific frequency band, for example, to solve the performance defects of the traditional microstrip coupler in the VHF frequency band due to insufficient electrical length, so that the power can support the range of 1-50W.

[0059] In an application scenario, in the VHF frequency band 136-174MHz range, the microstrip coupler 10 provided by the present application can improve the directivity by more than 37dB, and the coupling degree can be improved by more than 6.69dB. The microstrip coupler 10 provided by the present application can reduce the volume of the coupler to less than 1 / 5 of the traditional λ / 4 structure under the premise of ensuring electrical performance, and can meet the circuit layout requirements of high power density.

[0060] According to some embodiments of the present application, referring to Figures 4 to 6 , the main coupling device 101 includes a first coupling member 201, a second coupling member 202, and a third coupling member 203, and the first coupling member 201 and the second coupling member 202 are arranged on both sides of the third coupling member 203; the secondary coupling device 102 includes a fourth coupling member 301.

[0061] As Figure 4As shown, the first end Port11 of the first coupling member 201 and the first end Port21 of the fourth coupling member 301 are connected through a first via on the first side of the circuit layer, and the second end Port12 of the first coupling member 201 and the second end Port22 of the fourth coupling member 301 are connected through a second via on the first side of the circuit layer. The structure of the fourth coupling member 301 may be the same as or different from that of the first coupling member 201.

[0062] like Figure 5 As shown, the first end Port 31 of the second coupling member 202 and the first end Port 21 of the fourth coupling member 301 are connected through a first via on the first side of the circuit layer, and the second end Port 32 of the second coupling member 202 and the second end Port 22 of the fourth coupling member 301 are connected through a second via on the first side of the circuit layer. The structure of the fourth coupling member 301 may be the same as or different from that of the second coupling member 202.

[0063] like Figure 6 As shown, the first end Port00 of the third coupling member 203 and the first end Port21 of the fourth coupling member 301 are connected through a first via on the first side of the circuit layer, and the second end Port01 of the third coupling member 203 and the second end Port22 of the fourth coupling member 301 are connected through a second via on the first side of the circuit layer. The structure of the fourth coupling member 301 may be the same as or different from that of the third coupling member 203.

[0064] In some embodiments, when there are multiple such Figures 4-6 When the secondary coupling device 102 is mentioned, the connection method between any one of the multiple secondary coupling devices 102 and the main coupling device 101 can be as follows: Figures 4-6 One of the methods shown is illustrated. Based on this, the connection methods between the multiple secondary coupling devices 102 and the main coupling device 101 can be different.

[0065] In some embodiments, such as Figures 4-6 As shown, the first coupling member 201 and the second coupling member 202 have the same shape and size; the third coupling member 203 has a regular shape and is square; the first coupling member 201 and the second coupling member 202 are symmetrically arranged on both sides of the third coupling member 203, and the first coupling member 201 and the second coupling member 202 have regular shapes and are square with openings respectively.

[0066] In some embodiments, such as Figure 4 As shown, the length of the first coupling member 201 is the same as the length of the fourth coupling member 301; the fourth coupling member 301 has a regular shape and is a square with an opening, and the opening of the fourth coupling member 301 is smaller than the opening of the first coupling member 201.

[0067] In some embodiments, such as Figure 5As shown, the length of the second coupling member 202 is the same as the length of the fourth coupling member 301; the fourth coupling member 301 has a regular shape and is a square with an opening, and the opening of the fourth coupling member 301 is smaller than the opening of the second coupling member 202.

[0068] In some embodiments, such as Figure 6 As shown, the length of the third coupling member 203 is the same as the length of the fourth coupling member 301; the fourth coupling member 301 has a regular shape and is square.

[0069] In some embodiments, based on Figures 4 to 6 For the structure shown, please refer to [link / reference]. Figures 7 to 9 The first coupling element 201 includes a first coupling microstrip line 401, the second coupling element 202 includes a second coupling microstrip line 402, wherein the first coupling microstrip line 401 and the second coupling microstrip line 402 are in opposite directions, the third coupling element 203 includes a main transmission microstrip line 403, and the fourth coupling element 301 includes a third coupling microstrip line 404.

[0070] like Figure 7 As shown, the first end Port1 of the first coupling microstrip line 401 and the first end Port2 of the third coupling microstrip line 404 are connected through a first via on the first side of the circuit layer, and the second end Port3 of the first coupling microstrip line 401 and the second end Port4 of the third coupling microstrip line 404 are connected through a second via on the first side of the circuit layer. The structure of the third coupling microstrip line 404 may be the same as or different from the structure of the first coupling microstrip line 401.

[0071] like Figure 8 As shown, the first end Port5 of the second coupled microstrip line 402 and the first end Port2 of the third coupled microstrip line 404 are connected through a first via on the first side of the circuit layer, and the second end Port7 of the second coupled microstrip line 402 and the second end Port4 of the third coupled microstrip line 404 are connected through a second via on the first side of the circuit layer. The structure of the third coupled microstrip line 404 may be the same as or different from that of the second coupled microstrip line 402.

[0072] like Figure 9 As shown, the first end Port00 of the main transmission microstrip line 403 and the first end Port2 of the third coupling microstrip line 404 are connected through a first via on the first side of the circuit layer, and the second end Port01 of the main transmission microstrip line 403 and the second end Port4 of the third coupling microstrip line 404 are connected through a second via on the first side of the circuit layer. The structure of the third coupling microstrip line 404 may be the same as or different from that of the main transmission microstrip line 403.

[0073] In some embodiments, such as Figure 7As shown, when the first end Port00 of the main transmission microstrip line 403 is an input end and the second end Port01 of the main transmission microstrip line 403 is an output end, the second end Port3 of the first coupling microstrip line 401 is a reverse coupling end (i.e., a forward isolation end); when the first end Port00 of the main transmission microstrip line 403 is an output end and the second end Port01 of the main transmission microstrip line 403 is an input end, the second end Port3 of the first coupling microstrip line 401 is a forward coupling end (i.e., a reverse isolation end).

[0074] According to some embodiments of the present application, referring to Figures 7 to 9 , the first end Port1 of the first coupling microstrip line 401 is connected to the first load device 20, and the second end Port7 of the second coupling microstrip line 402 is connected to the second load device 30. Here, the first load device 20 and the second load device 30 are the same or different.

[0075] According to some embodiments of the present application, the microstrip coupler 10 further includes a housing, the first circuit layer P1 and the target circuit layer P2 are arranged in the housing, and the housing can play a protection and fixing role, such as isolating water vapor. In the housing, the coupling mode between the circuit layers can be a three-dimensional cross arrangement of a single or multiple coupling lines, and the coupling line positions can be distributed in any circuit layer.

[0076] Wherein, the housing can be made of metal or plastic material; the shape of the housing can be square, circular or other, which is not limited here. It can be understood that, in order to save cost and reduce the overall volume of the microstrip coupler 10, the size and shape of the housing can be set according to the size and arrangement position of the first circuit layer P1 and the target circuit layer P2.

[0077] In some embodiments, the first circuit layer P1 and the target circuit layer P2 are the same or different in structure. The first circuit layer P1 and the target circuit layer P2 can be a printed circuit board (PCB) or other, which is not limited here.

[0078] According to some embodiments of the present application, referring to Figure 10 , Figure 10 is a structural schematic diagram of an electronic device provided in some embodiments of the present application, and the electronic device 100 includes the microstrip coupler 10 of any of the above embodiments, which will not be described here.

[0079] In some embodiments, the electronic device 100 can be a base station, a smart phone, a router, a radar, a spectrum analyzer or other, which is not limited here.

[0080] In some embodiments, the electronic device 100 further includes a processor and a memory.

[0081] The processor involved in the present application can be referred to as a CPU (Central Processing Unit), can be an integrated circuit chip, and can also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components.

[0082] The memory used in the present application includes a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM) or an optical disk and various media that can store program codes.

[0083] In summary, the microstrip coupler 10 and the electronic device 100 provided in some embodiments of the present application include a main coupling device 101 and at least one secondary coupling device 102, the main coupling device 101 is arranged on the first circuit layer P1; each secondary coupling device 102 is arranged on a different target circuit layer P2, and the target circuit layer P2 is different from the first circuit layer P1; the first side port of the main coupling device 101 and the first side port of each secondary coupling device 102 are connected through the via hole on the first side of the circuit layer, and / or the second side port of the main coupling device 101 and the second side port of each secondary coupling device 102 are connected through the via hole on the second side of the circuit layer; wherein the first side port and the second side port include at least two ports. On the one hand, by connecting the same side ports of the main coupling device 101 and the secondary coupling device 102 through different via holes, and by connecting the ports of different circuit layers through the via holes, the parallel connection of the main coupling device 101 and the secondary coupling device 102 in three-dimensional space can be realized, so as to increase the coupling degree of the microstrip coupler 10. On the other hand, by reasonably arranging different coupling devices on different circuit layers, three-dimensional coupling is realized, which can reduce the area of the microstrip coupler 10 in a plane, and further reduce the overall volume of the microstrip coupler 10.

[0084] The above description is only an embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A microstrip coupler, characterized in that, include: The main coupling device is located on the first circuit layer; At least one secondary coupling device, each of the secondary coupling devices being disposed on a different target circuit layer; wherein the target circuit layer and the first circuit layer are different circuit layers; The first-side port of the main coupling device and the first-side port of each of the secondary coupling devices are connected through vias on the first side of the circuit layer, and the second-side port of the main coupling device and the second-side port of each of the secondary coupling devices are connected through vias on the second side of the circuit layer.

2. The microstrip coupler according to claim 1, characterized in that, The at least one secondary coupling device includes at least one primary coupling device and at least one secondary coupling device; The at least one primary coupling device is disposed on different target circuit layers below the first circuit layer, and the at least one secondary coupling device is disposed on different target circuit layers above the first circuit layer.

3. The microstrip coupler according to claim 1, characterized in that, The target circuit layer is located above or below the first circuit layer.

4. The microstrip coupler according to claim 1, characterized in that, The main coupling device includes a first coupling element, a second coupling element, and a third coupling element, wherein the first coupling element and the second coupling element are disposed on both sides of the third coupling element; The secondary coupling device includes a fourth coupling element and a fifth coupling element; Wherein, the first end of the first coupling member and the first end of the fourth coupling member are connected through a first via on the first side of the circuit layer, and the second end of the first coupling member and the second end of the fourth coupling member are connected through a second via on the first side of the circuit layer; the first end of the second coupling member and the first end of the fifth coupling member are connected through a third via on the second side of the circuit layer, and the second end of the second coupling member and the second end of the fifth coupling member are connected through a fourth via on the second side of the circuit layer.

5. The microstrip coupler according to claim 4, characterized in that, The first coupling element includes a first coupling microstrip line; the second coupling element includes a second coupling microstrip line, wherein the first coupling microstrip line and the second coupling microstrip line are in opposite directions; the third coupling element includes a main transmission microstrip line; the fourth coupling element includes a third coupling microstrip line; and the fifth coupling element includes a fourth coupling microstrip line. The first end of the first coupled microstrip line and the first end of the third coupled microstrip line are connected through a first via on the first side of the circuit layer, and the second end of the first coupled microstrip line and the second end of the third coupled microstrip line are connected through a second via on the first side of the circuit layer. The first end of the second coupled microstrip line and the first end of the fourth coupled microstrip line are connected through a third via on the second side of the circuit layer, and the second end of the second coupled microstrip line and the second end of the fourth coupled microstrip line are connected through a fourth via on the second side of the circuit layer.

6. The microstrip coupler according to claim 1, characterized in that, The main coupling device includes a first coupling element, a second coupling element, and a third coupling element, wherein the first coupling element and the second coupling element are disposed on both sides of the third coupling element; The secondary coupling device includes a fourth coupling element; Wherein, the first end of the first coupling member and the first end of the fourth coupling member are connected through a first via on the first side of the circuit layer, and the second end of the first coupling member and the second end of the fourth coupling member are connected through a second via on the first side of the circuit layer; Alternatively, the first end of the second coupling member and the first end of the fourth coupling member are connected through a first via on the first side of the circuit layer, and the second end of the second coupling member and the second end of the fourth coupling member are connected through a second via on the first side of the circuit layer. Alternatively, the first end of the third coupling member and the first end of the fourth coupling member are connected through a first via on the first side of the circuit layer, and the second end of the third coupling member and the second end of the fourth coupling member are connected through a second via on the first side of the circuit layer.

7. The microstrip coupler according to claim 6, characterized in that, The first coupling element includes a first coupling microstrip line; the second coupling element includes a second coupling microstrip line, wherein the first coupling microstrip line and the second coupling microstrip line are in opposite directions; the third coupling element includes a main transmission microstrip line; and the fourth coupling element includes a third coupling microstrip line. Wherein, the first end of the first coupled microstrip line and the first end of the third coupled microstrip line are connected through a first via on the first side of the circuit layer, and the second end of the first coupled microstrip line and the second end of the third coupled microstrip line are connected through a second via on the first side of the circuit layer; Alternatively, the first end of the second coupled microstrip line and the first end of the third coupled microstrip line are connected through a first via on the first side of the circuit layer, and the second end of the second coupled microstrip line and the second end of the third coupled microstrip line are connected through a second via on the first side of the circuit layer. Alternatively, the first end of the main transmission microstrip line and the first end of the third coupling microstrip line are connected through a first via on the first side of the circuit layer, and the second end of the main transmission microstrip line and the second end of the third coupling microstrip line are connected through a second via on the first side of the circuit layer.

8. The microstrip coupler according to claim 5 or 7, characterized in that, The first end of the first coupled microstrip line is connected to the first load device, and the second end of the second coupled microstrip line is connected to the second load device. The first load device may be the same as or different from the second load device.

9. The microstrip coupler according to claim 1, characterized in that, The microstrip coupler also includes a housing, in which the first circuit layer and the target circuit layer are disposed.

10. An electronic device, characterized in that, Includes the microstrip coupler as described in any one of claims 1-9.

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