A conducting bracket for high-voltage control box and high-voltage control box

Abstract

The utility model relates to a kind of conducting bracket and high voltage control box for high voltage control box, involve power battery pack control technical field, the conducting bracket includes injection molding structure, the injection molding structure has butt joint hole and fixing part;And conducting structure, the conducting structure is integrated in the injection molding structure, the conducting structure includes high voltage acquisition copper sheet and low voltage control copper bar;Wherein, the high voltage acquisition copper sheet and the low voltage control copper bar are integrated structure by the injection molding structure, for simultaneously realizing high voltage sampling and low voltage control function.The utility model can realize the electrical connection between standardization relay and control system, while reducing cost and improving versatility.

Description

Technical Field

[0001] This utility model relates to the field of power battery pack control technology, and in particular to a conductive bracket for use in a high-voltage control box and a high-voltage control box. Background Technology

[0002] With the rapid development of new energy electric vehicle technology, the high-voltage control system within the power battery pack, as a core component, has become increasingly important. In the high-voltage control system of the power battery pack, relays, as key electronic components, are responsible for controlling the on / off state of the high-voltage circuit and the distribution of current. New high-voltage control systems typically employ customized relay designs, specifically tailored to the requirements of particular vehicle models to meet different installation space and electrical connection needs. Simultaneously, the control system also needs to perform both high-voltage sampling and low-voltage control functions to ensure the safe operation and effective management of the battery pack.

[0003] However, existing customized relay solutions have several technical challenges. First, customized relays are costly to develop and typically only fit a single vehicle model, lacking versatility and limiting their application across different models. Second, as the industry moves towards standardization, the compatibility of standardized relays with existing control systems becomes a technical hurdle. Furthermore, existing connection solutions suffer from structural complexity and installation difficulties in integrating high-voltage sampling and low-voltage control functions, impacting the overall performance and reliability of the high-voltage control system. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a conductor bracket and a high-voltage control box for use in a high-voltage control box, which can realize the electrical connection between standardized relays and control systems, while reducing costs and improving versatility.

[0005] To achieve the above objectives, the present invention adopts the following technical solution.

[0006] In a first aspect, the present invention provides a conductive bracket for use in a high-voltage control box, comprising: Injection molded structure, the injection molded structure having mating holes and fasteners; and A conductive structure, integrated in the injection molding structure, includes a high-voltage acquisition copper sheet and a low-voltage control copper busbar; The high-voltage sampling copper sheet and the low-voltage control copper busbar are integrated into a single structure through the injection molding structure, which is used to simultaneously realize high-voltage sampling and low-voltage control functions.

[0007] Furthermore, in the aforementioned conductive bracket, the injection-molded structure also includes a positioning component, which is used to cooperate with the positioning hole of the relay in the high-voltage control box to guide the position of the relay end.

[0008] Furthermore, in the aforementioned conductive bracket, the fixing component is a snap-fit ​​structure, used for fixed connection with the snap-fit ​​component of the base of the high-voltage control box.

[0009] Furthermore, in the aforementioned conductive bracket, the high-voltage acquisition copper sheet and the low-voltage control copper busbar are connected to the high-voltage and low-voltage terminals of the relay by laser welding.

[0010] Furthermore, in the aforementioned conductive bracket, the high-voltage acquisition copper sheet and the low-voltage control copper busbar can also be connected to the relay via bolt fastening.

[0011] Furthermore, in the aforementioned conductive bracket, the high-voltage acquisition copper sheet and the low-voltage control copper busbar can also be connected to a relay via a plug-in connection.

[0012] Furthermore, in the aforementioned conductive bracket, the high-voltage acquisition copper sheet is used to output the high-voltage sampling signal of the relay to the BMS integrated circuit board, and the low-voltage control copper busbar is used to receive the low-voltage control signal of the BMS integrated circuit board.

[0013] Furthermore, in the aforementioned conductive bracket, the high-voltage acquisition copper sheet and the low-voltage control copper busbar are flexibly arranged to adapt to the placement of the relay in the control box.

[0014] Furthermore, in the aforementioned conductive bracket, the conductive bracket acts as a bottom clamping device for the unpacked relay.

[0015] Secondly, this utility model provides a high-voltage control box, comprising: The conductive support described in any one of the first aspects above; A relay having a high-voltage terminal and a low-voltage terminal; and The base has a snap-fit ​​component; The relay is installed inside the base, and the conductive bracket is connected to the snap-fit ​​component via a fixing component; The high-voltage acquisition copper strip of the conductive bracket is connected to the high-voltage terminal of the relay for acquiring the high-voltage sampling signal of the high-voltage terminal; the low-voltage control copper busbar of the conductive bracket is connected to the low-voltage terminal of the relay for transmitting the low-voltage control signal from the BMS integrated circuit board.

[0016] In summary, compared with the prior art, the present invention has at least one of the following beneficial technical effects: This utility model's conductive bracket integrates the high-voltage sampling copper sheet and the low-voltage control copper busbar into a single injection-molded structure, effectively solving the connection and compatibility problem between standardized relays and control systems. This solution reduces the development cost of customized relays while improving product versatility, enabling it to adapt to the application needs of different vehicle models. Furthermore, the integrated conductive structure simplifies the installation process, reduces connection steps, and improves assembly efficiency. Simultaneously, this conductive bracket can simultaneously perform both high-voltage sampling and low-voltage control functions, avoiding the structural complexity caused by functional separation in traditional solutions, thereby improving the overall performance and reliability of the high-voltage control system. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the external structure of one embodiment of the conductive bracket of this utility model.

[0019] Figure 2 This is a schematic diagram of the internal structure of one embodiment of the conductive bracket of this utility model.

[0020] Figure 3 This is a schematic diagram of the bottom structure of one embodiment of the conductive bracket of this utility model.

[0021] Figure 4 This is a schematic diagram of an assembly structure of the conductive bracket and the relay of this utility model.

[0022] Figure 5 This is a schematic diagram of an assembly structure of the conductive bracket, base, and BMS integrated circuit board of this utility model.

[0023] Reference numerals: 100, Conductor bracket; 110, Injection molded structure; 111, Connecting hole; 112, Fixing component; 113, Positioning component; 120, Conductor structure; 121, High-voltage acquisition copper sheet; 122, Low-voltage control copper busbar; 200, Relay; 210, High-voltage terminal; 220, Low-voltage terminal; 230, Positioning hole; 300, Base; 310, Snap-fit ​​component; 400, BMS integrated circuit board. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application.

[0025] It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment in the following embodiments have their own emphasis; for parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0026] The following is in conjunction with the appendix Figure 1-5 The present invention will be described in further detail below.

[0027] Reference Figure 1 and Figure 2 A conductor support 100 for use in a high-voltage control box includes an injection-molded structure 110 and a conductor structure 120. The conductor support 100 adopts an integrated design, integrating electrical connection functions and mechanical support functions into a single component.

[0028] The injection-molded structure 110 forms the main frame of the conductor bracket 100, providing mechanical support and structural integrity for the entire assembly. The injection-molded structure 110 has mating holes 111 and fasteners 112. The mating holes 111 are located at specific positions on the injection-molded structure 110 and are used to achieve interface connection with a relay. The fasteners 112 are distributed along the edges or specific areas of the injection-molded structure 110, providing mounting and securing functions for the conductor bracket 100.

[0029] The conductive structure 120 is integrated into the injection-molded structure 110, forming the electrical connection portion of the conductive bracket 100. The conductive structure 120 includes a high-voltage acquisition copper strip 121 and a low-voltage control copper busbar 122. The high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122, as conductive elements, extend from different positions on the same side of the injection-molded structure 110, forming a predetermined electrical connection configuration.

[0030] In some embodiments, the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 are integrated into a single structure via an injection molding structure 110. The injection molding structure 110 encapsulates and secures the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 in a predetermined position while maintaining electrical isolation between them. This integrated structure combines mechanical support with electrical connection functions, forming a unified component.

[0031] The high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 simultaneously realize high-voltage sampling and low-voltage control functions. The high-voltage acquisition copper strip 121 is used for high-voltage signal acquisition and transmission, while the low-voltage control copper busbar 122 is used for low-voltage control signal processing. The two conductive elements maintain independent electrical paths in the conduction bracket 100, while achieving mechanical integration through the injection molding structure 110.

[0032] Reference Figure 3 The injection molding structure 110 also includes a positioning element 113. The positioning element 113 is integrated into the design of the injection molding structure 110 and is located near the central region of the component. The positioning element 113 has a circular feature structure that extends from the surface of the injection molding structure 110.

[0033] In some implementations, refer to Figure 4 The positioning element 113 is used to mate with the positioning hole 230 of the relay for precise positioning. The geometry and dimensions of the positioning element 113 match the positioning hole 230 of the relay to form a mating connection. When the conduction bracket 100 is assembled with the relay, the positioning element 113 is inserted into the positioning hole 230 of the relay to ensure accurate alignment between the two components.

[0034] In some embodiments, the positioning element 113 provides an alignment function to prevent the conductor bracket 100 from shifting position during installation. The mating connection of the positioning element 113 with the relay positioning hole 230 ensures that the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 maintain the correct spatial relationship with the corresponding terminals of the relay. The configuration of the positioning element 113 eliminates positioning errors during assembly and improves the reliability of the electrical connection.

[0035] The positioning element 113 is designed to maintain an appropriate spatial relationship with other structural features within the injection-molded structure 110. The positioning element 113 is positioned so as not to interfere with the function of the mating hole 111 and the fastener 112, while providing an accurate positioning reference for the installation of the entire guide bracket 100.

[0036] Reference Figure 3 The positioning element 113 is a boss structure. The boss structure extends outward from the surface of the injection-molded structure 110, forming a prominent geometric feature. The boss structure has a cylindrical or similar three-dimensional shape and extends vertically upward from the base surface of the injection-molded structure 110.

[0037] In some embodiments, the boss structure has a guiding function. When the conductor bracket 100 is assembled with the relay, the boss structure guides the alignment process between the conductor bracket 100 and the relay. The outer surface shape and dimensions of the boss structure are designed to match the positioning hole 230 of the relay to form a mating connection.

[0038] The guiding function of the boss structure is achieved through its geometry. In some cases, the top of the boss structure may have a chamfered or rounded design to facilitate the insertion of the locating hole 230 of the relay. The sidewalls of the boss structure provide radial positioning to ensure that the conduction bracket 100 maintains the correct spatial position relative to the relay.

[0039] The height and diameter of the boss structure are designed to fit appropriately with the positioning hole 230 of the relay. When the boss structure is inserted into the positioning hole 230, a stable mechanical connection is formed between the two components. The guiding function of the boss structure reduces positioning errors during assembly and improves the accuracy of the connection between the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 and the relay terminals.

[0040] Reference Figure 5 The fastener 112 is a snap-fit ​​structure. The snap-fit ​​structure extends from the injection-molded structure 110, forming a feature for mechanical connection. The snap-fit ​​structure of the fastener 112 has elastic deformation capability, allowing for reversible mechanical connection during assembly.

[0041] Figure 5 The assembly configuration of the conductor bracket 100 with the base 300 and the BMS integrated circuit board 400 is shown. The base 300 serves as a basic support structure, providing a mounting platform for the entire assembly. The base 300 includes a snap-fit ​​member 310 designed to mate with the snap-fit ​​structure of the fastener 112.

[0042] In some cases, the snap-fit ​​structure of the fastener 112 is used to fix it to the snap-fit ​​member 310 of the base 300. A mechanical engagement is formed between the snap-fit ​​structure and the snap-fit ​​member 310, and the connection is achieved through elastic deformation and springback mechanism. When the conductor bracket 100 is installed on the base 300, the snap-fit ​​structure of the fastener 112 contacts the snap-fit ​​member 310 and undergoes elastic deformation.

[0043] The geometry of the snap-fit ​​structure is designed to match the shape of the snap-fit ​​member 310. During assembly, the snap-fit ​​structure may include beveled surfaces or guide features to facilitate mating with the snap-fit ​​member 310. When the snap-fit ​​structure is fully inserted into the snap-fit ​​member 310, the elastically deformed snap-fit ​​structure springs back to its original shape, forming a locking connection.

[0044] The snap-fit ​​structures of the fasteners 112 are distributed at specific locations on the conductor bracket 100, corresponding to the positions of the snap-fit ​​members 310 on the base 300. Multiple fasteners 112 may be arranged along the edge or periphery of the conductor bracket 100, forming multi-point connections with a corresponding number of snap-fit ​​members 310. This configuration provides a stable mechanical connection between the conductor bracket 100 and the base 300.

[0045] Furthermore, refer to Figure 4The high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122 are connected to the high-voltage terminal 210 and the low-voltage terminal 220 of the relay 200 by laser welding. Figure 4 An exploded view of the conductor bracket 100 and the relay 200 is shown, illustrating the connection configuration between the two components.

[0046] The relay 200, as an electrical control component, includes a high-voltage terminal 210 and a low-voltage terminal 220. The high-voltage terminal 210 is used to process high-voltage electrical signals, while the low-voltage terminal 220 is used to process low-voltage control signals. The relay 200 also includes a positioning hole 230, which cooperates with the positioning element 113 of the conductor bracket 100 to achieve precise positioning.

[0047] In some embodiments, the high-voltage acquisition copper sheet 121 is connected to the high-voltage terminal 210 by laser welding. The laser welding process causes localized melting at the contact surfaces of the high-voltage acquisition copper sheet 121 and the high-voltage terminal 210, forming a metallurgical bond. The energy density and duration of the laser beam are controlled to ensure the mechanical strength and electrical conductivity of the welded joint.

[0048] In some embodiments, the low-voltage control bus 122 is connected to the low-voltage terminal 220 by laser welding. Laser welding creates a permanent connection between the low-voltage control bus 122 and the low-voltage terminal 220. The heat-affected zone generated during the welding process is controlled within a localized area, avoiding thermal damage to surrounding materials and components.

[0049] Laser welding provides a high-precision and high-reliability connection method for linking the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122 to the relay 200. The heat input of laser welding can be precisely controlled, ensuring consistent geometry and dimensions of the welded joint. The laser welding process requires no filler material, and the welded joint has low resistance, ensuring effective transmission of electrical signals.

[0050] In some embodiments, the joints formed by laser welding possess excellent mechanical and electrical properties. The welded joints withstand mechanical stress and thermal cycling loads, maintaining connection stability. The precise control capability of laser welding enables the formation of a reliable electrical path between the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122 and their respective terminals.

[0051] In some other embodiments, unlike the welding connection described above, the high-voltage acquisition copper plate 121 and the low-voltage control copper busbar 122 are connected to the relay 200 by bolt fastening. The bolt fastening method provides a mechanical fixation connection between the high-voltage acquisition copper plate 121 and the low-voltage control copper busbar 122 and the relay 200, while ensuring electrical conductivity.

[0052] The bolt-locking connection method uses bolts to fix the high-voltage acquisition copper plate 121 to the high-voltage terminal 210 of the relay 200. Both the high-voltage acquisition copper plate 121 and the high-voltage terminal 210 have bolt holes. Bolts pass through these holes and are tightened using nuts or threads. The bolt tightening torque is controlled within a predetermined range to ensure the contact pressure and electrical conductivity of the connection joint.

[0053] In some embodiments, the low-voltage control copper busbar 122 is connected to the low-voltage terminal 220 of the relay 200 by bolt fastening. The contact surfaces of the low-voltage control copper busbar 122 and the low-voltage terminal 220 are provided with corresponding bolt holes. Bolt fasteners pass through these bolt holes and are tightened to form a mechanical connection. The bolt fastening connection generates contact pressure between the low-voltage control copper busbar 122 and the low-voltage terminal 220, ensuring effective transmission of electrical signals.

[0054] The bolt-fitted connection is detachable, allowing the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 to be separated from the relay 200 during maintenance or replacement. The bolt fasteners are selected based on conductivity and mechanical strength to ensure stable electrical and mechanical performance of the connection during long-term use.

[0055] The contact surfaces of bolted connections undergo surface treatment to remove oxide layers and contaminants, ensuring good electrical contact. The specifications and materials of the bolt fasteners are selected based on current load and mechanical stress requirements. Bolted connections form joints that withstand vibration and thermal cycling loads, maintaining long-term connection stability.

[0056] Bolted connections and laser welding offer alternative connection options. Depending on specific application requirements and manufacturing process conditions, the connection between the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 and the relay 200 can be achieved using either bolted connections or laser welding. Bolted connections provide maintainability, while laser welding provides a permanent connection.

[0057] In some embodiments, the high-voltage acquisition copper plate 121 and the low-voltage control copper busbar 122 can also be connected to a relay via a plug-in connection.

[0058] Specifically, the high-voltage acquisition copper plate 121 and the low-voltage control copper busbar 122 are connected to the relay 200 via a plug-in connection. The plug-in connection method uses a pluggable connector to achieve the electrical connection between the high-voltage acquisition copper plate 121 and the low-voltage control copper busbar 122 and the relay 200.

[0059] The ends of the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 are designed as plug structures, while the high-voltage terminal 210 and the low-voltage terminal 220 of the relay 200 are correspondingly designed as socket structures. An electrical connection is formed between the plug structure and the socket structure through mechanical insertion. During the insertion process, contact pressure is generated between the two components to ensure effective transmission of electrical signals.

[0060] Plug-in connections offer detachable connectivity, facilitating system maintenance and component replacement. The contact surfaces of plug-in connections may be gold-plated or treated with other surface treatments to improve contact resistance stability and corrosion resistance.

[0061] The plug-in connection method, laser welding, and bolt fastening methods offer a variety of connection options, allowing you to choose the appropriate connection method based on specific application requirements and manufacturing process conditions.

[0062] Furthermore, refer to Figure 5 The conductive structure 120 is used to convert the electrical signal output of the relay 200 to the BMS integrated circuit board 400. The conductive structure 120 forms an electrical transmission path in the conductive bracket 100, realizing the signal connection between the relay 200 and the BMS integrated circuit board 400.

[0063] The BMS integrated circuit board 400, as the control unit of the battery management system, receives and processes electrical signals from the relay 200. The BMS integrated circuit board 400... Figure 5 The green planar component is shown in the image and is positioned adjacent to other components of the conductive bracket 100. The BMS integrated circuit board 400 forms an electrical interface with the conductive structure 120 to enable signal communication within the system.

[0064] In some embodiments, the conduction structure 120 transmits the high-voltage signal from the relay 200 to the BMS integrated circuit board 400 via the high-voltage acquisition copper strip 121. The high-voltage acquisition copper strip 121 receives the high-voltage electrical signal from the high-voltage terminal 210 of the relay 200 and transmits the signal to the corresponding interface of the BMS integrated circuit board 400 through the electrical path of the conduction structure 120. The conductivity of the high-voltage acquisition copper strip 121 ensures that the high-voltage signal maintains signal integrity during transmission.

[0065] In some embodiments, the conduction structure 120 transmits the low-voltage control signal from the relay 200 to the BMS integrated circuit board 400 via the low-voltage control bus 122. The low-voltage control bus 122 receives the low-voltage control signal from the low-voltage terminal 220 of the relay 200 and transmits the signal to the BMS integrated circuit board 400 through the electrical connection established by the conduction structure 120. The electrical characteristics of the low-voltage control bus 122 are suitable for the transmission requirements of low-voltage signals.

[0066] The conduction structure 120 forms an electrical bridge between the relay 200 and the BMS integrated circuit board 400. The high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 of the conduction structure 120 process signals of different voltage levels while maintaining electrical isolation between the two signal paths. The design of the conduction structure 120 ensures that the high-voltage and low-voltage signals do not interfere with each other when transmitted to the BMS integrated circuit board 400.

[0067] In some embodiments, the connection between the conductive structure 120 and the BMS integrated circuit board 400 is achieved in various ways. A laser-welded connection is formed between the conductive structure 120 and the BMS integrated circuit board 400, establishing a metallurgical bond between the conductive elements of the conductive structure 120 and the interface of the BMS integrated circuit board 400 through a laser welding process. The laser-welded connection provides stable electrical conductivity and mechanical connection strength.

[0068] In some embodiments, the conductive structure 120 is connected to the BMS integrated circuit board 400 by bolt fastening. The bolt fastening connection forms a mechanical fixation between the conductive structure 120 and the BMS integrated circuit board 400, while ensuring effective transmission of electrical signals. The contact pressure of the bolt fastening connection is controlled within an appropriate range to ensure the electrical conductivity of the connection joint.

[0069] In some implementations, the conductive structure 120 is connected to the BMS integrated circuit board 400 via a terminal-plugging connection. The terminal-plugging connection uses a pluggable connector to achieve the electrical connection between the conductive structure 120 and the BMS integrated circuit board 400. The terminal-plugging connection provides a detachable connection method, facilitating system maintenance and component replacement.

[0070] The signal conversion function of the conduction structure 120 is achieved through its internal electrical path configuration. The conduction structure 120 receives electrical signals from the relay 200 and transmits the signals to the corresponding interface of the BMS integrated circuit board 400 through a predetermined electrical path. The electrical path design of the conduction structure 120 takes into account factors such as signal integrity, electrical isolation, and transmission efficiency.

[0071] In some implementations, the conduction structure 120 maintains the electrical characteristics of the signal during transmission. The high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 of the conduction structure 120 have appropriate resistance and inductance values ​​to ensure that the signal does not experience significant attenuation or distortion during transmission. The material selection and geometric design of the conduction structure 120 optimize signal transmission performance.

[0072] Furthermore, refer to Figure 2The bending patterns of the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122 can be adjusted to accommodate different placement configurations of the relay 200 within the control box. The conduction bracket 100 achieves compatibility with relays 200 in different installation orientations and positions by adjusting the bending configuration of the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122.

[0073] In some embodiments, the bending angle of the high-voltage acquisition copper strip 121 is adjusted according to the horizontal placement of the relay 200 in the control box. When the relay 200 is horizontally positioned, the high-voltage acquisition copper strip 121 extends from the injection-molded structure 110 and is bent horizontally to form a spatial position that matches the high-voltage terminals of the relay 200. The bending angle of the high-voltage acquisition copper strip 121 is set to 90 degrees or other appropriate angle to ensure an effective electrical connection with the horizontally placed relay 200.

[0074] In some embodiments, the bending method of the low-voltage control copper busbar 122 is coordinated with that of the high-voltage acquisition copper sheet 121 to accommodate the horizontal placement requirements of the relay 200. The low-voltage control copper busbar 122 extends from a predetermined position in the injection-molded structure 110 and is adjusted by bending to a spatial position corresponding to the low-voltage terminals of the relay 200. The bending angle and direction of the low-voltage control copper busbar 122 maintain an appropriate spatial relationship with the high-voltage acquisition copper sheet 121 to avoid mutual interference between the two conductive elements.

[0075] In some embodiments, the bending method of the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 is adapted to the vertical placement configuration of the relay 200 in the control box. When the relay 200 is vertically mounted, the bending angles of the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 are adjusted to match the vertical terminals of the relay 200. The high-voltage acquisition copper strip 121 is bent upwards or downwards from the injection-molded structure 110 to form a connection configuration with the high-voltage terminals of the vertically placed relay 200.

[0076] In some embodiments, the low-voltage control busbar 122 is adjusted by a corresponding bend in the vertically positioned configuration of the relay 200. The bending direction and angle of the low-voltage control busbar 122 are matched to the position of the low-voltage terminals of the vertically positioned relay 200. The low-voltage control busbar 122 achieves accurate docking with the relay 200 through the bending operation, while maintaining electrical isolation from the high-voltage acquisition copper plate 121.

[0077] In some embodiments, the bending method of the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 is adapted to the inclined placement configuration of the relay 200 in the control box. When the relay 200 is installed at an inclined angle, the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122 are connected to the terminals of the inclined relay 200 by adjusting the corresponding bending angle. The bending angle is calculated and set according to the inclination angle of the relay 200 to ensure accurate connection between the conductive components and the terminals of the relay 200.

[0078] In some embodiments, the high-voltage acquisition copper strip 121 and low-voltage control copper busbar 122 in the conducting structure 120 are adapted to various placement methods of the relay 200 by different bending radii. The selection of the bending radius takes into account the mechanical stress distribution and electrical performance requirements of the conductive elements. Smaller bending radii are suitable for compact installation spaces, while larger bending radii reduce stress concentration of the conductive elements at the bending location.

[0079] In some embodiments, the bending positions of the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122 are adjusted along the length of the conductive elements. The selection of the bending position is determined based on the specific installation position of the relay 200 in the control box. By adjusting the bending position, the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122 are bent at different lengths to accommodate different distance requirements between the relay 200 and the injection-molded structure 110.

[0080] In some embodiments, the bending adjustment function of the conductor support 100 is achieved through the material properties of the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122. The conductive element is made of copper, a material with good plastic deformation capacity, allowing bending during manufacturing without cracking or breakage. The ductility of copper ensures that the bent conductive element maintains good electrical conductivity and mechanical integrity.

[0081] In some embodiments, the bending method of the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122 is adjusted through mold design. During the injection molding process, different mold configurations produce conductive structures 120 with different bending angles and directions. The shape of the mold cavity determines the final geometric configuration of the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122 in the injection molding structure 110, achieving adaptability to different placement methods of the relays 200.

[0082] Furthermore, refer to Figure 3 and Figure 5 The conductor bracket 100, through the cooperation of the fixing member 112 and the snap-fit ​​member 310, clamps the relay 200. The conductor bracket 100 and the base 300 form a clamping configuration, and the relay 200 is located in the space between the conductor bracket 100 and the base 300.

[0083] In some embodiments, the retaining member 112 of the conductor bracket 100 is snap-fitted to the snap-fit ​​member 310 of the base 300. When the retaining member 112 and the snap-fit ​​member 310 are fully engaged, the conductor bracket 100 is pulled toward the base 300, generating a clamping force between the conductor bracket 100 and the base 300. The relay 200 is located between the lower surface of the conductor bracket 100 and the upper surface of the base 300, and bears the clamping force from both surfaces.

[0084] In some embodiments, the clamping force generated by the snap-fit ​​connection is transmitted to the relay 200 through the conductor bracket 100. The injection-molded structure 110 of the conductor bracket 100 moves downward under the action of the snap-fit ​​connection, and the lower surface of the injection-molded structure 110 contacts the upper surface of the relay 200. The relay 200 is simultaneously subjected to downward pressure from the conductor bracket 100 and upward supporting reaction force from the base 300, forming a compressed state.

[0085] In some embodiments, the clamping effect of the conduction bracket 100 on the relay 200 is achieved through the coordinated action of multiple fasteners 112. The multiple fasteners 112 are distributed at different positions on the conduction bracket 100, forming a multi-point snap-fit ​​connection with the corresponding snap-fit ​​member 310. This multi-point snap-fit ​​connection generates a distributed tensile force on the conduction bracket 100, causing the conduction bracket 100 to move simultaneously towards the base 300 at multiple positions, thus creating a uniform clamping force distribution on the relay 200.

[0086] In some embodiments, the clamping action of the conduction bracket 100 provides a mechanical fixing function for the unpacked relay 200. Since the unpacked relay 200 lacks an external protective housing, the clamping force of the conduction bracket 100 provides mechanical constraint and positional fixation for the unpacked relay 200. The conduction bracket 100 prevents the unpacked relay 200 from shifting or loosening under vibration or impact loads through its clamping action.

[0087] In some embodiments, the clamping configuration between the conductor bracket 100 and the base 300 forms a mounting cavity for the relay 200. After the relay 200 is inserted into the space between the conductor bracket 100 and the base 300, the retainer 112 and the snap-fit ​​connection of the snap-fit ​​member 310 lock the relay 200 in a predetermined position. The geometry of the clamping configuration matches the external dimensions of the relay 200, ensuring that the relay 200 maintains the correct spatial position under the clamped state.

[0088] In some embodiments, the clamping force of the conductor bracket 100 is controlled by the elastic deformation of the fixing member 112 and the snap-fit ​​member 310. During the snap-fit ​​connection process, the fixing member 112 and the snap-fit ​​member 310 undergo elastic deformation, and the elastic restoring force generated by the deformation forms a continuous clamping force. The designed value of the elastic deformation ensures that the clamping force is within an appropriate range, which can fix the relay 200 without causing mechanical damage to the relay 200.

[0089] In some embodiments, the clamping action of the conduction bracket 100 improves the quality of the electrical connection between the relay 200 and the conduction structure 120. The clamping force maintains stable contact between the high-voltage terminal 210 and the low-voltage terminal 220 of the relay 200 and the high-voltage acquisition copper strip 121 and the low-voltage control copper busbar 122. The clamping action reduces fretting at the contact interface, improving the reliability and long-term stability of the electrical connection.

[0090] This utility model's conductive bracket integrates the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122 into a single injection-molded structure 110, effectively solving the connection and compatibility problem between standardized relays and control systems. This solution reduces the development cost of customized relays while improving product versatility, enabling it to adapt to the application needs of different vehicle models. Furthermore, the integrated conductive bracket 100 simplifies the installation process, reduces connection steps, and improves assembly efficiency. Simultaneously, the conductive bracket 100 can simultaneously perform both high-voltage sampling and low-voltage control functions, avoiding the structural complexity caused by functional separation in traditional solutions, thereby improving the overall performance and reliability of the high-voltage control system.

[0091] This utility model embodiment also discloses a high-voltage control box.

[0092] Reference Figure 5 A high-voltage control box includes a conductor bracket 100, a relay 200, and a base 300. The high-voltage control box forms a complete electrical control system, integrating various components into a unified structural configuration.

[0093] The conductive bracket 100, serving as the electrical connection component of the high-voltage control box, includes an injection-molded structure 110 and a conductive structure 120. The injection-molded structure 110 has mating holes 111 and fasteners 112, providing mechanical support and mounting functionality for the conductive bracket 100. The conductive structure 120 is integrated within the injection-molded structure 110 and includes a high-voltage sampling copper strip 121 and a low-voltage control copper busbar 122. The high-voltage sampling copper strip 121 and the low-voltage control copper busbar 122 are integrated into a single structure via the injection-molded structure 110, simultaneously achieving high-voltage sampling and low-voltage control functions.

[0094] The relay 200, as an electrical control element of the high-voltage control box, has a high-voltage terminal 210 and a low-voltage terminal 220. The high-voltage terminal 210 processes high-voltage electrical signals, and the low-voltage terminal 220 processes low-voltage control signals. The relay 200 performs electrical switching and control functions in the high-voltage control box, and forms an electrical connection with the conductor bracket 100 through the high-voltage terminal 210 and the low-voltage terminal 220.

[0095] The base 300 serves as the basic support structure for the high-voltage control box and includes a snap-fit ​​connector 310. The base 300 provides a mechanical mounting platform and structural stability for the entire high-voltage control box system. The snap-fit ​​connector 310 is positioned at a predetermined location on the base 300 and engages with the fixing member 112 of the conductor bracket 100.

[0096] In some implementations, the high-voltage control box integrates a BMS integrated circuit board 400 to form a complete battery management control system. The conduction structure 120 of the conduction bracket 100 converts the electrical signal output of the relay 200 to the BMS integrated circuit board 400, establishing a signal transmission path between the relay 200 and the BMS integrated circuit board 400. The high-voltage control box achieves electrical integration between the relay 200 and the BMS integrated circuit board 400 through the conduction bracket 100.

[0097] The high-voltage control box integrates the high-voltage acquisition copper sheet 121 and the low-voltage control copper busbar 122 into the injection-molded structure 110 through the integrated design of the conductive bracket 100, achieving effective connection and adaptation between the standardized relay 200 and the control system. This technical solution significantly reduces the R&D cost of customized relays. Furthermore, the bending adjustment function of the conductive structure 120 allows the conductive bracket 100 to adapt to various placement methods of the relay 200 within the control box, improving the product's versatility and compatibility. In addition, the conductive bracket 100, through the snap-fit ​​connection formed by the fixing part 112 and the snap-fit ​​part 310 of the base 300, provides appropriate clamping force to the relay 200, ensuring the stability and reliability of the electrical connection. The entire high-voltage control box system achieves signal transmission between the relay 200 and the BMS integrated circuit board 400 through the conductive structure 120, simplifying the installation process, reducing connection steps, improving assembly efficiency, and avoiding the structural complexity caused by functional separation in traditional solutions, thereby enhancing the overall performance and reliability of the high-voltage control system.

[0098] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A conductor bracket for use in a high-voltage control box, characterized in that, include: An injection molding structure (110) having a mating hole (111) and a fastener (112); and A conductive structure (120) is integrated in the injection molding structure (110), and the conductive structure (120) includes a high-voltage acquisition copper sheet (121) and a low-voltage control copper busbar (122); The high-voltage acquisition copper sheet (121) and the low-voltage control copper busbar (122) are integrated into a single structure through the injection molding structure (110) to simultaneously realize high-voltage sampling and low-voltage control functions.

2. The conductive bracket according to claim 1, characterized in that, The injection-molded structure (110) also includes a positioning element (113), which is used to cooperate with the positioning hole (230) of the relay (200) in the high-voltage control box to guide the position of the relay end.

3. The conductive bracket according to claim 1, characterized in that, The fastener (112) is a snap-fit ​​structure used to be fixedly connected to the snap-fit ​​connector (310) of the base (300) of the high-voltage control box.

4. The conductive bracket according to claim 1, characterized in that, The high-voltage acquisition copper sheet (121) and the low-voltage control copper busbar (122) are connected to the high-voltage terminal (210) and low-voltage terminal (220) of the relay (200) by laser welding.

5. The conductive bracket according to claim 4, characterized in that, The high-voltage acquisition copper plate (121) and the low-voltage control copper busbar (122) can also be connected to the relay (200) by bolt fastening.

6. The conductive bracket according to claim 5, characterized in that, The high-voltage acquisition copper plate (121) and the low-voltage control copper busbar (122) can also be connected to the relay (200) by plugging in.

7. The conductive bracket according to claim 1, characterized in that, The high-voltage acquisition copper strip (121) is used to output the high-voltage sampling signal of the relay (200) to the BMS integrated circuit board (400); the low-voltage control copper busbar (122) is used to receive the low-voltage control signal of the BMS integrated circuit board (400).

8. The conductive bracket according to claim 1, characterized in that, The high-voltage acquisition copper sheet (121) and the low-voltage control copper busbar (122) are flexibly arranged to accommodate the placement of the relay (200) in the control box.

9. The conductive bracket according to claim 1, characterized in that, The conductive bracket (100) acts as a bottom clamp for the relay (200).

10. A high-voltage control box, characterized in that, include: The conductive support (100) according to any one of claims 1-9; A relay (200) having a high-voltage terminal (210) and a low-voltage terminal (220); and A base (300) having a snap-fit ​​element (310); The relay (200) is installed in the base (300), and the conductive bracket (100) is connected to the snap-fit ​​member (310) through the fixing member (112); The high-voltage acquisition copper strip (121) of the conductive bracket (100) is connected to the high-voltage terminal (210) of the relay (200) for acquiring the high-voltage sampling signal of the high-voltage terminal (210); the low-voltage control copper busbar (122) of the conductive bracket (100) is connected to the low-voltage terminal (220) of the relay (200) for transmitting the low-voltage control signal from the BMS integrated circuit board (400).

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