Ultra-thin camera module

Abstract

The utility model relates to camera module field discloses a kind of ultra-thin camera module, including lens, circuit board, optical filter, chip and steel sheet, lens is located on the upper end of circuit board, first recess is opened in the upper end of circuit board, optical filter is located on the upper end of circuit board, and completely covers first recess, second recess is opened in the lower end of circuit board, and the area of second recess is greater than the area of first recess, chip is located on the upper wall of second recess, and using flip chip packaging technology is electrically connected with circuit board, steel sheet is located in the lower end of circuit board;The scheme is connected by using flip chip packaging technology to make chip and circuit board, not only can eliminate the height occupied by traditional connection process gold wire arc top, to reduce the overall height of camera module, avoid the risk that camera module appears failure caused by gold wire fracture simultaneously, improve the stability of chip and circuit board connection.

Description

Technical Field

[0001] This utility model relates to the field of camera modules, specifically to an ultra-thin camera module. Background Technology

[0002] As consumer electronics devices, especially smartphones, tablets, and wearable devices, rapidly develop towards thinner and smaller designs, the market has increasingly stringent requirements for the size of their core components. As a key component for realizing imaging functions in such devices, the overall height of the camera module directly affects the thickness of the device body and the internal space layout. Therefore, reducing the height of the camera module has become one of the core directions of technological research and development in the industry.

[0003] The prior art discloses a camera module (publication number: CN219999489U), including a circuit board, a photoelectric sensor, an infrared cut-off filter, a motor assembly, and a lens arranged sequentially along the optical axis. A mounting groove is provided on the circuit board corresponding to the position of the photoelectric sensor. A first annular groove is provided around the mounting groove on the circuit board, with the bottom surface of the first annular groove being higher than the bottom surface of the mounting groove. The photoelectric sensor is disposed in the mounting groove, and its top surface is adapted to the bottom surface of the first annular groove. The periphery of the photoelectric sensor is bonded to the bottom surface of the first annular groove via gold wire, and the top surface of the gold wire is adapted to the top surface of the circuit board, thereby effectively reducing the height of the camera module.

[0004] In existing technologies, photoelectric sensors are placed directly on the top surface of the circuit board. However, after connecting them with gold wires, the height of the arc top will exceed the top surface of the circuit board, requiring additional space to be reserved. This increases the overall height of the camera module and cannot be adapted to the internal space layout of ultra-thin devices. To address this issue, we propose an ultra-thin camera module. Utility Model Content

[0005] The present invention aims to provide an ultra-thin camera module to solve the problem of the high overall height of existing camera modules.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an ultra-thin camera module, comprising a lens, a circuit board, a filter, a chip, and a steel sheet. The lens is disposed on the upper end of the circuit board, and a first groove is formed on the upper end of the circuit board. The filter is disposed on the upper end of the circuit board and completely covers the first groove. A second groove is formed on the lower end of the circuit board, and the area of ​​the second groove is larger than the area of ​​the first groove. The chip is disposed on the upper wall of the second groove and is electrically connected to the circuit board using a flip-chip packaging process. The steel sheet is disposed on the lower end of the circuit board.

[0007] The beneficial effects of this solution are as follows: This solution uses flip-chip packaging technology to electrically connect the chip and the circuit board, which not only eliminates the height occupied by the gold wire arc top in the traditional connection process, thereby reducing the overall height of the camera module, but also avoids the risk of camera module failure due to gold wire breakage, improving the stability of the chip-circuit board connection. Furthermore, placing the steel sheet at the bottom of the circuit board achieves full coverage of the bottom of the circuit board and forms an upper and lower clamping structure for the chip with the circuit board, thereby forming a stable clamping force on the chip and effectively limiting the chip's displacement in the vertical direction.

[0008] Preferably, as an improvement, the chip and the circuit board are fixedly connected using gold balls.

[0009] The beneficial effects are: the connection point formed by the gold ball is clamped between the chip and the circuit board, and is less affected by external impacts and humidity changes, which can effectively reduce the risk of failure due to connection failure during long-term use of the module and extend the product's service life.

[0010] Preferably, as an improvement, the sidewall of the second groove is provided with a gap of 0.3-0.4mm from the periphery of the chip, and the gap is filled with filler glue.

[0011] The beneficial effects are: after the filler adhesive cures, it forms a dense colloidal layer that can isolate the chip from the external environment and effectively prevent dust, moisture and other impurities from entering the second groove.

[0012] Preferably, as an improvement, the circuit board has semi-circular grooves on both sides of the second groove, and reference points are provided in the semi-circular grooves.

[0013] The beneficial effects are as follows: In the chip flip packaging process, the mounting equipment can quickly calculate the center coordinates and horizontal orientation of the second groove by identifying the position of the reference point, and then accurately adjust the placement position of the chip to ensure that the relative positional deviation between the chip and the second groove is controlled within the micrometer level.

[0014] Preferably, as an improvement, the lens is fixedly connected to the circuit board using AA glue.

[0015] Preferably, as an improvement, the filter is fixedly connected to the circuit board using IR adhesive.

[0016] Preferably, as an improvement, the thickness of the steel sheet is set to 0.1-0.15 mm. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the camera module according to an embodiment of the present invention; Figure 2 This is a bottom view of the circuit board structure according to an embodiment of the present invention; Figure 3This is a three-dimensional structural diagram of the filter according to an embodiment of the present invention; Figure 4 This is a bottom view of the chip structure in an embodiment of the present invention; Figure 5 This is a partial cross-sectional view of the circuit board in an embodiment of the present invention. Detailed Implementation

[0018] The following detailed description illustrates the specific implementation method: The reference numerals in the accompanying drawings include: lens 1, circuit board 2, filter 3, chip 4, steel sheet 5, first groove 6, second groove 7, and semi-circular groove 8.

[0019] Example The basic implementation examples are as follows: Figures 1-5 As shown, Figure 1 An ultra-thin camera module is shown, comprising a lens 1, a circuit board 2, a filter 3, a chip 4, and a steel sheet 5. The lens 1 is fixedly mounted to the upper end of the circuit board 2 using AA adhesive. In this embodiment, the length, width, and height of the lens 1 are 8.33mm, 8.91mm, and 2.48mm, respectively. In this embodiment, the AA adhesive is type 2286AG, and the lens 1 encloses all the components on the upper end of the circuit board 2 within it. Figure 2 The circuit board 2 shown has a first groove 6 in the middle of its upper end, and the length and width of the first groove 6 are 4.17mm and 3.26mm respectively. Figure 3 The filter 3 shown is fixedly mounted to the upper end of the circuit board 2 using IR adhesive. In this embodiment, the IR adhesive is type DYT9K1 and completely covers the first groove 6. Figure 2 The circuit board 2 shown has a second groove 7 at the lower center that communicates with the first groove 6. The length and width of the second groove 7 are 6.46 mm and 4.94 mm, respectively. Figure 4 and Figure 5 The chip 4 shown is electrically connected to the circuit board 2 using a flip-chip packaging process, and the chip 4 and the circuit board 2 are fixedly connected by gold balls. A gap of 0.3-0.4mm is provided between the sidewall of the second groove 7 and the periphery of the chip 4. In this embodiment, the gap is set to 0.35mm, and the gap is filled with filler adhesive. After the filler adhesive cures, it forms a dense adhesive layer that isolates the periphery of the chip 4 from the external environment, effectively preventing dust, moisture, and other impurities from entering the interior of the second groove 7. In this embodiment, the filler adhesive is KUF-285. Semicircular grooves 8 are formed on both sides of the lower end of the second groove 7 on the circuit board 2. Reference points are provided within the semicircular grooves 8. By identifying the position of the reference points, the installation equipment can quickly calculate the center coordinates and horizontal orientation of the second groove 7, thereby accurately adjusting the placement position of the chip 4 to ensure that the relative positional deviation between the chip 4 and the second groove 7 is controlled within the micrometer level. Figure 1The steel sheet 5 is fixedly installed on the lower end of the circuit board 2 with conductive adhesive. In this embodiment, the conductive adhesive is CBF-800-D60 and the thickness of the steel sheet 5 is set to 0.1-0.15mm. In this embodiment, the thickness of the steel sheet 5 is set to 0.12mm.

[0020] This solution creates a first groove 6 and a second groove 7 on the circuit board 2, with the area of ​​the first groove 6 being smaller than the area of ​​the second groove 7. This allows the step formed by the first groove 6 and the second groove 7 to surround the chip 4. Combined with flip-chip packaging technology, the chip 4 is electrically connected to the circuit board 2. This not only eliminates the height occupied by the gold wire arc top in traditional connection processes, thereby reducing the overall height of the camera module, but also avoids the risk of camera module failure due to gold wire breakage, improving the stability of the connection between the chip 4 and the circuit board 2. Furthermore, the steel sheet 5 is placed at the lower end of the circuit board 2, thereby achieving full coverage of the lower end of the circuit board 2 and forming an upper and lower clamping structure for the chip 4 with the circuit board 2. This creates a stable clamping force on the chip 4, effectively limiting the vertical displacement of the chip 4.

[0021] The above descriptions are merely embodiments of this utility model. Commonly known technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the technical solution of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. An ultra-thin camera module, characterized in that: The device includes a lens, a circuit board, a filter, a chip, and a steel sheet. The lens is located on the upper end of the circuit board, and a first groove is formed on the upper end of the circuit board. The filter is located on the upper end of the circuit board and completely covers the first groove. A second groove is formed on the lower end of the circuit board, and the area of ​​the second groove is larger than the area of ​​the first groove. The chip is located on the upper wall of the second groove and is electrically connected to the circuit board using a flip-chip packaging process. The steel sheet is located on the lower end of the circuit board.

2. The ultra-thin camera module according to claim 1, characterized in that: The chip and circuit board are fixedly connected by gold balls.

3. The ultra-thin camera module according to claim 2, characterized in that: The second groove has a 0.3-0.4mm gap between its sidewall and the chip's perimeter, and the gap is filled with filler adhesive.

4. The ultra-thin camera module according to claim 3, characterized in that: The circuit board has semi-circular grooves on both sides of the second groove, and reference points are provided in the semi-circular grooves.

5. The ultra-thin camera module according to claim 4, characterized in that: The lens is fixedly connected to the circuit board using AA glue.

6. The ultra-thin camera module according to claim 5, characterized in that: The filter is fixedly connected to the circuit board using IR adhesive.

7. The ultra-thin camera module according to claim 6, characterized in that: The thickness of the steel sheet is set to 0.1-0.15mm.

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