Camera mainboard auxiliary heat dissipation structure

Abstract

The utility model discloses a kind of camera mainboard auxiliary heat dissipation structure, it is related to camera technical field, including installation inner shell, PCB board is installed in the installation inner shell, the heat dissipation block is pasted on the PCB board, and the heat dissipation silicone sheet is clamped between the PCB board and heat dissipation block;The outside of the installation inner shell is equipped with heat dissipation shell, one end of the heat dissipation block is contacted with PCB board through heat dissipation silicone sheet, and the other end of the heat dissipation block is contacted with heat dissipation shell;The utility model forms continuous heat conduction path by heat dissipation silicone sheet, heat dissipation block and heat dissipation shell, can efficiently export the heat generated when PCB board works, simultaneously using the good thermal conductivity and reasonable structural design of aluminium profile heat dissipation shell, effectively reduce mainboard temperature, avoid the camera crash, color screen and other problems caused by high temperature, improve equipment running stability.

Description

Technical Field

[0001] This utility model relates to the field of camera technology, specifically to an auxiliary heat dissipation structure for a camera motherboard. Background Technology

[0002] As security monitoring, smart terminals and other fields continue to increase their requirements for camera performance, the integration of camera motherboards (PCBs) is gradually increasing. As a result, the heat generated during long-term operation is increasing significantly, and heat dissipation has become a key factor affecting the stability and lifespan of cameras.

[0003] The applicant had previously filed a patent application for the structural design of the camera (patent application number: CN202411560503.4, title: "A camera controlled by a push-cover action"). The patent mainly focuses on the push-cover control structure of the camera. By optimizing the assembly relationship between the push cover and the main body, the convenient operation and protection functions of the camera are realized, and good results are achieved in terms of structural compactness and user experience.

[0004] However, in the practical application of the aforementioned existing technologies, the applicant discovered that: because the overall structure of the camera needs to balance the flexibility of the sliding cover operation with space utilization, the motherboard (PCB board) is usually integrated into a closed or semi-closed mounting housing, which limits its heat exchange path with the external environment; at the same time, the chips, capacitors and other components on the motherboard continuously generate a large amount of heat when working under high load (such as high-definition video capture and continuous data processing), and the existing structure only passively dissipates heat through the mounting housing itself, resulting in low heat dissipation efficiency and causing the motherboard temperature to rise rapidly. When the temperature exceeds the tolerance threshold of the components, the camera is prone to problems such as image output lag, crashes, color screen issues, and even hardware damage, seriously affecting the reliability of the product and the user experience.

[0005] Therefore, in view of the technical defects of poor heat dissipation of the motherboard in the existing camera structure, there is an urgent need to design an auxiliary heat dissipation structure that can adapt to the compact installation space and efficiently dissipate the heat of the motherboard, so as to solve the problem of abnormal camera operation caused by excessive temperature and further improve the stability and service life of the camera. Utility Model Content

[0006] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the above problems.

[0007] A camera motherboard auxiliary heat dissipation structure includes an inner mounting shell, a PCB board mounted inside the inner mounting shell, a heat sink attached to the PCB board, and a heat dissipation silicone pad sandwiched between the PCB board and the heat sink. The inner housing is fitted with a heat dissipation outer shell. One end of the heat dissipation block contacts the PCB board through a heat dissipation silicone pad, and the other end of the heat dissipation block contacts the heat dissipation outer shell.

[0008] As a further embodiment of this utility model: the mounting inner shell includes an upper shell and a lower shell that are mated to each other, and the upper shell and the lower shell together form a mounting cavity for accommodating the PCB board.

[0009] As a further embodiment of this utility model: a clearance space is formed at the joint between the upper shell and the lower shell to accommodate the heat sink, so that the end of the heat sink away from the PCB board can contact the inner wall of the heat sink shell through the clearance space.

[0010] As a further embodiment of this utility model: the upper shell has an extension portion extending relative to one end of the lower shell along its length direction, and the extension portion and one side of the corresponding end of the lower shell enclose the clearance space.

[0011] As a further embodiment of this utility model: one end of the PCB board is placed inside the mounting cavity, and the other end of the PCB board extends out of the mounting cavity and is placed in the clearance space, and the extended end is correspondingly matched with the heat sink to achieve thermal contact.

[0012] As a further embodiment of this utility model: the heat dissipation shell is made of aluminum profile.

[0013] As a further embodiment of this utility model: a fixed bracket is provided on the outer side of the heat dissipation shell.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention utilizes a continuous heat conduction path formed by a thermal silicone pad, a heat sink, and a heat sink housing to efficiently dissipate the heat generated during PCB board operation. Simultaneously, the excellent thermal conductivity of the aluminum profile heat sink housing and its rational structural design effectively reduce motherboard temperature, preventing issues such as camera crashes and color screens caused by high temperatures, thus improving device operational stability. Furthermore, the extension of the upper shell and the corresponding part of the lower shell form a clearance space, providing an installation location for the heat sink and cleverly achieving direct contact between the heat sink and the heat sink housing. The components are compactly assembled through the combination of the split structure of the inner shell and the clearance space, adapting to the space constraints of the camera.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is an exploded structural diagram of the present invention with the fixed support removed; Figure 3 This is a cross-sectional structural diagram of the present invention with the fixed bracket removed.

[0018] The reference numerals and names in the figure are as follows: 1. Inner shell; 2. PCB board; 3. Heat sink; 4. Thermal pad; 5. Outer shell; 6. Mounting cavity; 7. Clearance space; 8. Extension; 9. Fixing bracket; 10. Upper shell; 11. Lower shell. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-3 In this embodiment of the utility model, a camera motherboard auxiliary heat dissipation structure includes an inner housing 1, a PCB board 2, a heat sink 3, a heat dissipation silicone pad 4, a heat dissipation outer shell 5, and a fixing bracket 9. The components work together to form a complete heat dissipation path and installation system.

[0021] The inner housing 1 serves as the basic mounting carrier for the PCB board 2 and consists of an upper housing 10 and a lower housing 11 that are connected to each other. The upper housing 10 and the lower housing 11 can be connected by snap-fit, screw fixing, or other conventional detachable connection structures. After connection, the two enclose a closed or relatively closed mounting cavity 6. The size of the mounting cavity 6 is adapted to the size of the main body of the PCB board 2 and is used to accommodate and limit the non-primary heat-generating areas of the PCB board 2 to prevent the PCB board 2 from shaking during use.

[0022] The upper shell 10 extends along its length to form an extension 8. The extension 8 protrudes from the edge that abuts with the lower shell 11 toward the side away from the lower shell 11. Its extension length is determined according to the size of the protruding part of the PCB board 2 and the installation requirements of the heat sink 3. An open clearance space 7 is formed between the inner sidewall of the extension 8 and the outer sidewall of the corresponding end of the lower shell 11. The outline of the clearance space 7 matches the shape of the heat sink 3 and is connected to one end of the mounting cavity 6 to form a through receiving channel.

[0023] The mounting method of PCB board 2 is adapted to the mounting cavity 6 and the clearance space 7: one end (non-main heat-generating end) is embedded in the mounting cavity 6 and fixed by the positioning rib, screw or buckle structure in the mounting cavity 6; the other end (main heat-generating end, which integrates high heat-dissipating components such as chips) extends out from the opening of the mounting cavity 6 and is placed in the clearance space 7, so that the heat-generating area can be directly exposed in the clearance space 7, which facilitates heat transfer.

[0024] The heat sink 3 has a block-like structure, and its size matches the size of the clearance space 7, allowing it to be perfectly embedded within the clearance space 7 and forming a limiting position with the surrounding structure. The surface of the heat sink 3 closest to the PCB board 2 corresponds to the heat-generating area at the protruding end of the PCB board 2, with a thermal silicone pad 4 sandwiched between them. The thickness of the thermal silicone pad 4 is designed according to the gap between the PCB board 2 and the heat sink 3. Its two sides are tightly fitted to the surface of the PCB board 2 and the corresponding surface of the heat sink 3, respectively. Through its own deformation, it fills any possible tiny gaps, ensuring sufficient thermal contact between the heat sink 3 and the PCB board 2 and reducing thermal resistance.

[0025] The surface of the heat sink 3 away from the PCB board 2 is directly attached to the inner wall of the heat sink housing 5. This attachment surface is either flat or an arc surface that matches the inner wall of the heat sink housing 5 to increase the contact area. The heat sink housing 5 has a hollow shell structure, and its internal cavity size is adapted to the shape of the mounting inner shell 1, fitting perfectly on the outside of the mounting inner shell 1. In one embodiment, a certain gap is left between the inner wall of the heat sink housing 5 and the outer wall of the mounting inner shell 1 to prevent the mounting inner shell 1 from directly absorbing heat and affecting the heat dissipation efficiency.

[0026] The heat dissipation shell 5 is made of aluminum profile through extrusion molding process. Aluminum profile itself has good thermal conductivity and processing performance. Its outer surface can be designed as a smooth surface or a structure with heat dissipation fins according to heat dissipation requirements (the number and spacing of fins are determined according to the heat dissipation power calculation) to increase the contact area with air and accelerate heat dissipation.

[0027] A mounting bracket 9 is fixedly installed on the outer wall of the heat dissipation housing 5. The mounting bracket 9 can be made of metal or high-strength plastic and is fixed to the heat dissipation housing 5 by welding, screw connection or other means. The mounting bracket 9 has mounting holes for fixing the entire heat dissipation structure and the internal PCB board 2 to the camera body or external mounting base by bolts, clips or other connectors, to ensure that the structure remains stable under vibration, impact and other conditions.

[0028] The heat dissipation path formed by the above structure is as follows: the heat generated by the PCB board 2 during operation is first transferred to the heat dissipation silicone pad 4 in close contact with it. The heat dissipation silicone pad 4 efficiently conducts the heat to the heat sink 3. The heat sink 3 then transfers the heat to the inner wall of the heat dissipation shell 5 that is attached to it. Finally, the heat dissipation shell 5 dissipates the heat to the external environment through thermal radiation and air convection, thereby reducing the operating temperature of the PCB board 2 and ensuring the stable operation of the camera.

[0029] In summary, this utility model forms a continuous heat conduction path through the heat dissipation silicone pad 4, heat sink 3, and heat dissipation shell 5, which can efficiently dissipate the heat generated by the PCB board 2 during operation. At the same time, by utilizing the good thermal conductivity of the aluminum profile heat dissipation shell 5 and the reasonable structural design, the motherboard temperature is effectively reduced, avoiding problems such as camera crashes and color screens caused by high temperatures, thus improving the stability of device operation. In addition, the extension 8 of the upper shell 10 and the corresponding part of the lower shell 11 form a clearance space 7, which not only provides an installation position for the heat sink 3, but also cleverly realizes direct contact between the heat sink 3 and the heat dissipation shell 5. All components are compactly assembled through the split structure of the inner shell 1 and the cooperation of the clearance space 7, adapting to the space constraints of the camera.

[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

Claims

1. A camera motherboard auxiliary heat dissipation structure, characterized in that, It includes an inner housing, a PCB board is installed inside the inner housing, a heat sink is attached to the PCB board, and a heat dissipation silicone pad is sandwiched between the PCB board and the heat sink. The inner housing is fitted with a heat dissipation outer shell. One end of the heat dissipation block contacts the PCB board through a heat dissipation silicone pad, and the other end of the heat dissipation block contacts the heat dissipation outer shell.

2. The auxiliary heat dissipation structure for a camera motherboard according to claim 1, characterized in that, The mounting housing includes an upper housing and a lower housing that are mated together, and the upper housing and the lower housing together form a mounting cavity for accommodating the PCB board.

3. The auxiliary heat dissipation structure for a camera motherboard according to claim 2, characterized in that, The joint between the upper and lower shells forms a clearance space for accommodating the heat sink, so that the end of the heat sink away from the PCB board can contact the inner wall of the heat sink casing through the clearance space.

4. The auxiliary heat dissipation structure for a camera motherboard according to claim 3, characterized in that, The upper shell has an extension that extends relative to one end of the lower shell along its length, and the extension and one side of the corresponding end of the lower shell enclose the clearance space.

5. The auxiliary heat dissipation structure for a camera motherboard according to claim 4, characterized in that, One end of the PCB board is placed inside the mounting cavity, and the other end of the PCB board extends out of the mounting cavity and is placed in the clearance space. The extended end is matched with the heat sink to achieve thermal contact.

6. A camera motherboard auxiliary heat dissipation structure according to any one of claims 1-5, characterized in that, The heat dissipation casing is made of aluminum profile.

7. A camera motherboard auxiliary heat dissipation structure according to any one of claims 1-5, characterized in that, A fixed bracket is provided on the outer side of the heat dissipation shell.

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