A heat-generating substrate packaging structure

Abstract

The utility model relates to a kind of packaging structures, specifically a kind of heating base material packaging structure, including base material and packaging support, the support inner cavity of packaging support has first cavity mouth and limiting step structure, base material is bonded in limiting step structure and is equipped with conductive heating structure, so that base material is located at the position close to first cavity mouth.The utility model is bonded with the mode of being fixed in packaging support with the base material equipped with conductive heating structure, with the mode of being bonded so that there is mounting structure with adhesive medium as buffer layer between base material and packaging support, the rigid clamping of traditional metal edge binding frame can be avoided, it is not easy to damage when using, base material's surface can also be fully utilized, avoid metal edge binding frame to affect the use area of base material surface, base material can be applied to packaging support of different materials with the mode of being bonded, it is beneficial to expand the material selection range of packaging support, so that packaging support is more easily produced and manufactured and meets use requirement, it is beneficial to improve service life.

Description

Technical Field

[0001] This utility model relates to a packaging structure, specifically a heat-generating substrate packaging structure. Background Technology

[0002] Electric heating products often use heating bases with heating functions. Heating bases usually have a heating plate that can support the heated object. This heating plate is mostly made of glass or ceramic. The common installation method for traditional heating plates is embedded installation, that is, fixing the heating plate to the base with a metal edge frame or plastic elastic clamp. The metal edge frame has a rigid clamping and lacks cushioning, which can easily lead to local stress concentration and breakage due to vibration or assembly errors. The plastic elastic clamp requires high temperature resistance and is therefore expensive. If a low-cost plastic is used, it is easy to age and deform due to heat over a long period of use, affecting the clamping effect. In addition, due to the brittle nature of the heating plate material, it is not suitable for drilling holes for locking. Therefore, the installation method of the heating plate directly affects the convenience and service life of the product. Utility Model Content

[0003] Regarding the aforementioned problem that the installation method of existing heating bases affects usage and product lifespan, the technical solution adopted by this utility model to solve this problem is: A heating substrate encapsulation structure includes a substrate and an encapsulation bracket. The encapsulation bracket has an inner cavity for mounting the substrate, which has a first opening for placing the substrate and a limiting step structure for restricting the mounting position of the substrate. The substrate is bonded to the limiting step structure and is provided with a conductive heating structure, so that the substrate is located near the first opening.

[0004] As described above, a heating substrate encapsulation structure includes a placement surface a on the top side and a heating surface b on the bottom side. The substrate is bonded to the limiting step structure with a high-temperature resistant structural adhesive, such that the placement surface a of the substrate is flush with the first cavity opening, or the heating surface b of the substrate is flush with the first cavity opening.

[0005] As described above, in a heating substrate encapsulation structure, the heating surface b of the substrate is attached with a conductive heating layer having a planar or curved structure, and the substrate is made of a brittle material.

[0006] In the heating substrate encapsulation structure described above, a heat insulation component is further provided between the heating surface b and the inner cavity of the support, and the area of ​​the heat insulation component in contact with the heating surface b is greater than or equal to the area of ​​the conductive heating layer.

[0007] In the above-described heating substrate encapsulation structure, a heat-conducting component is further provided between the substrate and the thermal insulation component. The conductive heating layer is located within the area where the heat-conducting component contacts the substrate, or the maximum area c of the conductive heating layer is less than or equal to the contact area d of the heat-conducting component contacting the substrate. When the heat-conducting component is a conductor, an insulating component or insulating layer is provided between the conductive heating layer and the heat-conducting component.

[0008] In the above-described heating substrate encapsulation structure, the heat insulation component has an insulating inner cavity for accommodating the heat-conducting component near the conductive heating layer. The bracket has a second cavity for installing a temperature sensor. The first cavity is located at the top of the packaging bracket, and the second cavity is located at the bottom of the packaging bracket. The thermal insulation component has a sensor through hole at the position corresponding to the second cavity for the temperature sensor to pass through. The sensor through hole connects the second cavity and the thermal insulation cavity.

[0009] As described above, in a heating substrate encapsulation structure, the inner cavity of the bracket is provided with a first wire hole for the substrate to connect to an external circuit, and at least two second cavity openings are respectively arranged at the bottom of the encapsulation bracket.

[0010] The heating substrate encapsulation structure described above further includes a support base for mounting the encapsulation bracket or the substrate. The inner cavity of the support base is provided with a reinforcing rib structure for limiting the installation position of the encapsulation bracket. The reinforcing rib structure is circumferentially spaced around the hollow position of the inner cavity of the base.

[0011] As described above, in a heating substrate encapsulation structure, the encapsulation bracket is fixed to the inner cavity of the base by adhesive bonding or welding, and the bottom of the bracket base has a third cavity for mounting a temperature sensor. Alternatively, the substrate may be fixed to the limiting edge structure of the bracket base by means of adhesive bonding or welding, such that the substrate is located near the fourth cavity of the bracket base.

[0012] As described above, in a heating substrate encapsulation structure, the support base has a second wire hole for the substrate to connect to an external circuit, and at least two second wire holes are respectively arranged on the support base near the outer edge.

[0013] The beneficial effects of this utility model are as follows: This invention uses an adhesive method to fix a substrate with a conductive heating structure onto a packaging bracket. The packaging bracket restricts the installation position of the substrate through a limiting step structure, bringing the substrate close to the first cavity opening of the bracket's inner cavity. The adhesive method creates an installation structure with an adhesive medium as a buffer layer between the substrate and the packaging bracket, avoiding the rigid clamping of traditional metal edging frames. This prevents damage during use and allows for full utilization of the substrate's surface area, avoiding the impact of metal edging frames on the substrate's usable area. The adhesive method is applicable to packaging brackets of different materials, expanding the material selection range for packaging brackets, making them easier to manufacture and meet usage requirements, and improving their service life. Attached Figure Description

[0014] Figure 1 This utility model provides a three-dimensional encapsulation structure for a heating substrate. Figure 1 .

[0015] Figure 2 This utility model provides a three-dimensional encapsulation structure for a heating substrate. Figure 2 .

[0016] Figure 3 This is an internal structural diagram of a heating substrate encapsulation structure according to the present invention.

[0017] Figure 4 for Figure 3 A magnified view of A.

[0018] Figure 5 This utility model provides a three-dimensional encapsulation structure for a heating substrate. Figure 3 .

[0019] Figure 6 This is a schematic diagram of the heating surface of a heating substrate encapsulation structure according to the present invention.

[0020] Figure 7 A three-dimensional breakdown of a heating substrate encapsulation structure according to this utility model. Figure 1 .

[0021] Figure 8 A three-dimensional breakdown of a heating substrate encapsulation structure according to this utility model. Figure 2 .

[0022] Figure 9 A three-dimensional breakdown of a heating substrate encapsulation structure according to this utility model. Figure 3 . Detailed Implementation

[0023] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0024] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0025] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0026] Example 1 This embodiment provides a heating substrate encapsulation structure, including a substrate 1 and an encapsulation bracket 2. The encapsulation bracket 2 has a bracket cavity 20 for mounting the substrate 1, which has a first cavity 21 for placing the substrate 1 and a limiting step structure 23 for limiting the installation position of the substrate 1. The substrate 1 is bonded to the limiting step structure 23 and is provided with a conductive heating structure, so that the substrate 1 is located near the first cavity 21.

[0027] Specifically, the substrate 1 is a heating plate of the heating substrate encapsulation structure, which can adopt a plate structure and different shapes such as round, rectangular, and polygonal. The substrate 1 is preferably made of any brittle material such as glass, ceramic, stone, or plastic. The substrate 1 includes a placement surface a for supporting the heated object and a heating surface b for conductive heating. The placement surface a is located at the top of the substrate 1, and the heating surface b is located at the bottom of the substrate 1. Preferably, the placement surface a and the heating surface b are flat surfaces. During assembly, the substrate 1 is placed into the bracket cavity 20 of the encapsulation bracket 2. The edge of the heating surface b of the substrate 1 is bonded to the limiting step structure 23 with high-temperature resistant structural adhesive, so that the substrate 1 is located near the first cavity opening 21. Preferably, the placement surface a of the substrate 1 is flush with the first cavity opening 21 for user convenience.

[0028] Specifically, the heating surface b of the substrate 1 is provided with a conductive heating structure. The conductive heating structure is formed by attaching a conductive heating layer 11 with a planar or curved structure. The conductive heating layer 11 is a heating material attached to the surface of the substrate 1 to generate heat after electricity is applied. The heating material can be attached to the surface of the substrate 1 by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, etc., and a fixed heating area is formed after high-temperature sintering. The conductive heating layer 11 can be formed into a planar heating layer by one of the following materials: nano-metal oxide, nano-semiconductor metal oxide, graphene material, carbon paste material, etc. The conductive heating layer 11 preferably uses nano-semiconductor metal oxide as the conductive heating material. The thickness of the conductive heating layer 11 is less than 1 mm. The nano-semiconductor metal oxide can be one or a combination of materials such as tin, antimony, nickel, and ammonium as nanoparticles. The conductive heating layer 11 includes a heating layer for conductive heating and an electrode layer for leading out an external power supply. At least two electrode layers are used for the connection and connection of the heating circuit, respectively. The electrode layer can be made of one of the materials with good conductivity such as gold, silver, copper, aluminum, and tin. After the external power supply is connected, the heating layer begins to heat up and conducts heat towards the heated object through the substrate 1.

[0029] Specifically, the inner cavity 20 of the bracket is provided with a first wire through hole 24 for the substrate 1 to connect to the external circuit. At least two first wire through holes 24 are respectively arranged on the left and right sides of the encapsulation bracket 2. The external circuit structure led out from the electrode layer of the conductive heating layer 11 can pass through the first wire through hole 24 to the outside for power circuit connection. The two first wire through holes 24 can be used to correspond to the circuit access and out, without affecting the normal use of the product or the appearance of the product through the first cavity 21, which is convenient for users.

[0030] Optionally, at least two first wiring holes 24 of the package holder 2 can be arranged on the same side of the package holder 2 to accommodate different wiring requirements.

[0031] Alternatively, the package bracket 2 may also use only a single first wire hole 24 for the insertion and exit of circuit structures.

[0032] Alternatively, the high-temperature resistant structural adhesive may be any one of inorganic ceramic adhesives (silicate-based / phosphate-based), organosilicon high-temperature resistant structural adhesives, modified epoxy resin adhesives, polyimide adhesives, etc.

[0033] Optionally, such as Figure 8As shown, the heating surface b of the substrate 1 can also be flush with the first cavity 21. In this case, the substrate 1 is exposed outside the first cavity 21 of the bracket inner cavity 20, forming a structure in which the outer periphery of the substrate 1 is not surrounded by the encapsulation bracket 2, thereby increasing the exposed usable area of ​​the substrate 1. During assembly, the substrate 1 is placed outside the bracket inner cavity 20 and the heating surface b is attached to the limiting step structure 23 by the above-mentioned adhesive connection, so that the substrate 1 is located close to the first cavity 21. This is an exposed assembly method, which can be flexibly selected and used according to market and production needs.

[0034] Optionally, such as Figure 5 As shown, the heating surface b of the substrate 1 can also be used as a support surface on the upper side of the substrate 1 to heat the object in close proximity.

[0035] Example 2 This embodiment provides a heating substrate encapsulation structure. A heat insulation component 3 is also provided between the heating surface b and the inner cavity 20 of the support. The area of ​​the heat insulation component 3 in contact with the heating surface b is greater than or equal to the area of ​​the conductive heating layer 11. The heat insulation component 3 is used to block the heat loss of the conductive heating layer 11 of the substrate 1 during heating. When heating, the heat emitted by the conductive heating layer 11 is blocked and accumulated by the heat insulation component 3 and conducted towards the placement surface a, further ensuring the effective utilization of heat and improving heating efficiency.

[0036] Example 3 This embodiment provides a heating substrate encapsulation structure. A heat-conducting component 4 is also provided between the substrate 1 and the thermal insulation component 3. The thermal insulation component 3 has an insulating inner cavity 31 for accommodating the heat-conducting component 4 near the conductive heating layer 11. The conductive heating layer 11 is located within the area where the heat-conducting component 4 contacts the substrate 1, or the maximum distribution area c of the conductive heating layer 11 is less than or equal to the contact area d of the heat-conducting component 4 contacting the substrate 1. When heating, the heat emitted by the conductive heating layer 11 is blocked by the thermal insulation component 3, and the heat is retained in the sealed space between the substrate 1 and the thermal insulation component 3. After being absorbed by the heat-conducting component 4, this heat is transferred to the contact area of ​​the substrate 1 covered by the heat-conducting component 4, compensating the temperature of the area outside the heating area of ​​the substrate 1 or the load contact area, so that the entire substrate 1 can obtain a uniform heating temperature, balance the overall temperature rise, and achieve the effect of uniform heating and uniform heat distribution.

[0037] Furthermore, in some embodiments, the heat-conducting element 4 can be a conductor with good electrical conductivity. In this case, an insulating element 6a or an insulating layer 6b is provided between the heat-conducting element 4 and the conductive heating layer 11 for insulation isolation. The insulating element 6a or the insulating layer 6b can be made of existing insulating materials, such as mica sheets, oxides, nitrides, glass, ceramics, silicates, etc. The insulating element 6a can be installed between the substrate 1 and the thermal insulation element 3 by adhesive bonding or embedding. The insulating layer 6b can be attached and formed between the substrate 1 and the thermal insulation element 3 by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, etc. The area of ​​the insulating element 6a or the insulating layer 6b is larger than the area of ​​the heat-conducting element 4. The heat-conducting element 4 is located within the laying range of the insulating element 6a or the insulating layer 6b to achieve comprehensive and stable isolation.

[0038] Furthermore, in some embodiments, when the thickness of the heat-conducting element 4 is relatively thin (less than or equal to 1 mm), the heat insulation element 3 may not have an insulation cavity 31. The heat-conducting element 4 can be directly placed between the substrate 1 and the heat insulation element 3, and the position of the heat-conducting element 4 can be stabilized by adhesive or friction clamping. The area of ​​the conductive heating layer 11 is less than or equal to the area of ​​the heat-conducting element 4, and the area of ​​the heat-conducting element 4 is less than or equal to the area of ​​the heat insulation element 3.

[0039] Example 4 This embodiment provides a heating substrate encapsulation structure, which also includes a support base 5 for mounting the encapsulation bracket 2. The inner cavity 51 of the support base 5 is provided with a reinforcing rib structure 52 for limiting the installation position of the encapsulation bracket 2. The reinforcing rib structure 52 is circumferentially spaced around the hollow position of the inner cavity 51. The encapsulation bracket 2 is fixed to the support base 5 by adhesive or welding. The support base 5 can be made of any material such as metal, plastic, or wood. During assembly, the encapsulation bracket 2, which contains the substrate 1 and / or thermal insulation component 3, is placed into the inner cavity 51 of the support base 5. The reinforcing rib structure 52 can be used to secure the encapsulation bracket 2. The outer surface of the package is subjected to interference clamping or interference assembly to prevent it from loosening and falling off under the action of surface friction. Alternatively, the package bracket 2 is fixed to the reinforcing rib structure 52 by bonding or welding (the material of the bracket base 5 is selected for compatibility). This further improves the installation stability of the package bracket 2. Compared with the traditional method of directly fixing the heating plate to the base by edge clamping or elastic clamping, the installation method of this embodiment can avoid the damage to the substrate 1 body caused by the metal edge clamping method and also avoid the material selection limitations of plastic elastic clamping. This is conducive to meeting the usage requirements and is convenient for users.

[0040] Alternatively, in some embodiments, such as Figure 9As shown, the bracket base 5 can be used as a packaging bracket 2 to directly mount the substrate 1. The inner cavity 51 of the bracket base 5 has a fourth cavity 55 for placing the substrate 1 and a limiting edge structure 56 for limiting the installation position of the substrate 1. The heating surface b of the substrate 1 can be attached to the limiting edge structure 56 by the above-mentioned adhesive connection. At this time, the substrate 1 is exposed outside the fourth cavity 55 of the inner cavity 51, forming a structure in which the outer periphery of the substrate 1 is not surrounded by the bracket base 5, thereby increasing the exposed usable area of ​​the substrate 1. During assembly, the substrate 1 is placed outside the inner cavity 51 of the base and the heating surface b is attached to the limiting edge structure 56 by the above-mentioned adhesive connection, so that the substrate 1 is located close to the fourth cavity 55. This is an exposed assembly method, which can be flexibly selected and used according to market and production needs.

[0041] Example 4 This embodiment provides a heating substrate encapsulation structure that can be adapted to install a temperature sensor for temperature control. The temperature sensor is installed at the bottom of the encapsulation bracket 2, with its probe extending into the interior to contact the surface of the substrate 1 or the heat-conducting component 4 to obtain real-time heating temperature. The bracket cavity 20 has a second cavity 22 for installing the temperature sensor. The first cavity 21 is located at the top of the encapsulation bracket 2, and the second cavity 22 is located at the bottom of the encapsulation bracket 2. The thermal insulation component 3 has a sensor through hole 32 at the position corresponding to the second cavity 22, through which the temperature sensor passes. The sensor through hole 32 connects the second cavity 22 and the thermal insulation cavity 31. A first wire through hole 24 is located at the first cavity 21 and the second cavity 22. Between 2, the temperature sensor can be one of NTC temperature sensor, thermocouple sensor, PTD temperature sensor, infrared temperature sensor, or semiconductor temperature sensor. At least two second cavities 22 are respectively arranged at the bottom of the package bracket 2. The second cavities 22 are respectively arranged at the position corresponding to the conductive heating layer 11 and at the position outside the conductive heating layer 11, so that the temperature sensor can detect the position corresponding to the conductive heating layer 11 and the position outside the conductive heating layer 11 respectively. It is compatible with at least two kinds of temperature sensors to detect the surface of the heat-conducting component 4, further ensuring the accuracy of the detected heating temperature, and also avoiding the failure of a single temperature sensor from affecting the actual use, making it convenient for users.

[0042] Specifically, the bottom of the bracket base 5 has a third cavity 53 for installing a temperature sensor, which makes it easy to assemble the temperature sensor. The position of the third cavity 53 corresponds to the position of the second cavity 22. The bracket base 5 has a second wire hole 54 for the substrate 1 to connect to the external circuit. At least two second wire holes 54 are respectively arranged near the outer edge of the bracket base 5. The position of the second wire hole 54 corresponds to the position of the first wire hole 24, which facilitates the wiring of the heating circuit.

[0043] Optionally, the bracket base 5 may have at least two second cable holes 54 arranged on the same side of the bracket base 5 to accommodate different wiring requirements.

[0044] Alternatively, the bracket base 5 may also use only a single second wire hole 54 for the insertion and exit of circuit structures.

[0045] Example 5 This embodiment provides a heating substrate encapsulation structure. The heating surface b of the substrate 1 also has a conductive protective layer 12. The conductive protective layer 12 is located in the area between the outer edge of the substrate 1 and the outer edge of the conductive heating layer. The conductive material of the conductive protective layer 12 can be attached to the surface of the substrate 11 by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, etc. The area where the conductive material is attached is the conductive area. On this basis, the heating area and the conductive area are not connected or overlapped, and they are independent of each other. The conductive area surrounds the outer space of the heating area. The conductive protective layer 12 and the conductive heating layer are spaced apart. The conductive protective layer 12 is electrically connected to an external electrical control device used to trigger power-off protection to form a power-on circuit. When the substrate 1 is damaged, the conductive protective layer 12 is disconnected, causing the power-on circuit to be disconnected and triggering power-off protection.

[0046] In use, the heating area of ​​the conductive heating layer 11 can be electrically connected to an external power supply (mains power or power supply equipment) to conduct electricity and generate heat. The conductive area of ​​the conductive heating layer 11 can be electrically connected to an external electrical control device for triggering power-off protection to form a power-on circuit. Since the conductive material is attached to the surface of the substrate 1, the external electrical control device can detect the integrity of the power-on circuit in real time to determine whether the substrate 1 has been damaged or broken. When the substrate 1 is intact, the power-on circuit is conducting and is in normal use. When the substrate 1 is damaged or broken, the conductive area is simultaneously disconnected due to the damage to the substrate 1, causing the power-on circuit to be disconnected, which can be judged as an abnormal use state. Since the conductive material is formed on the substrate 1 by means of coating, adhesion, screen printing or physical vapor deposition, the conductive material itself does not have toughness and ductility. Therefore, when the substrate 1 is damaged or broken and affects the normal heating of the conductive heating layer 11, the damaged or broken part will inevitably pass through the conductive area surrounding the heating area before entering the heating area and damaging the heating material. On this basis, the substrate 1 is preferably made of a brittle material so that it can break more thoroughly when broken to ensure that the conductive material is disconnected. Therefore, when the substrate 1 is damaged or broken, the conductive material's attachment layer is broken. The breakage of the conductive material's attachment layer also means that the power circuit is broken. The power circuit is broken, which can immediately trigger the power-off protection mechanism of the external electrical control equipment, disconnect the circuit connecting the conductive heating layer 11 to avoid the risk of leakage. This achieves a power-off protection effect with fast response speed and high protection efficiency.

[0047] More specifically, the conductive protective layer 12 is a conductive material attachment path formed on the substrate 1 circumferentially around the heating area by means of coating, film or adhesive adhesion. The conductive protective layer 12 adopts an open ring structure and the thickness of the conductive protective layer 12 is less than 1 mm. One end of the conductive protective layer 12 has a first endpoint and the other end has a second endpoint. The first endpoint and the second endpoint are both connection terminals for connecting the conductive protective layer 12 to external electrical control equipment. After connecting to the external electrical control equipment, the first endpoint, the conductive protective layer 12, the second endpoint and the external electrical control equipment form a power circuit. When the conductive protective layer 12 is disconnected due to damage or breakage of the substrate 1, the power circuit will be broken. After the circuit is broken, the power-off protection mechanism of the external electrical control equipment can be triggered.

[0048] Optionally, the conductive layer of the conductive protective layer 12 can be made of one of the following materials with good conductivity: gold, silver, copper, aluminum, tin, etc. Preferably, the conductive layer is laid with silver paste made of silver material. Silver paste has high conductivity, can effectively conduct current, reduce power loss, and silver paste is easy to form on the surface of the substrate 1, which is convenient for processing and production.

[0049] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A heat-generating substrate encapsulation structure, comprising a substrate (1) and an encapsulation bracket (2), characterized in that: The encapsulation bracket (2) has a bracket cavity (20) for mounting the substrate (1) with a first cavity (21) for placing the substrate (1) and a limiting step structure (23) for limiting the mounting position of the substrate (1). The substrate (1) is bonded to the limiting step structure (23) and is provided with a conductive heating structure, so that the substrate (1) is located near the first cavity (21).

2. The heat-generating substrate encapsulation structure as described in claim 1, characterized in that: The substrate (1) includes a placement surface a on the top side and a heating surface b on the bottom side. The substrate (1) is bonded to the limiting step structure (23) with high temperature resistant structural adhesive, so that the placement surface a of the substrate (1) is flush with the first cavity (21), or the heating surface b of the substrate (1) is flush with the first cavity (21).

3. The heat-generating substrate encapsulation structure as described in claim 2, characterized in that: The heating surface b of the substrate (1) is attached with a conductive heating layer (11) having a planar or curved structure, and the substrate (1) is made of a brittle material.

4. The heat-generating substrate encapsulation structure as described in claim 3, characterized in that: A heat insulation component (3) is also provided between the heating surface b and the inner cavity (20) of the support. The area of ​​the heat insulation component (3) in contact with the heating surface b is greater than or equal to the area of ​​the conductive heating layer (11).

5. The heat-generating substrate encapsulation structure as described in claim 4, characterized in that: A heat-conducting element (4) is also provided between the substrate (1) and the heat insulation component (3). The conductive heating layer (11) is located within the range where the heat-conducting element (4) contacts the substrate (1), or the maximum layout area c of the conductive heating layer (11) is less than or equal to the contact area d of the heat-conducting element (4) in contact with the substrate (1). When the heat-conducting element (4) is a conductor, an insulating element (6a) or an insulating layer (6b) is provided between the conductive heating layer (11) and the heat-conducting element (4).

6. The heat-generating substrate encapsulation structure as described in claim 5, characterized in that: The thermal insulation component (3) has an insulation cavity (31) for accommodating the heat-conducting component (4) at a position close to the conductive heating layer (11). The inner cavity (20) of the bracket has a second cavity (22) for installing a temperature sensor. The first cavity (21) is located at the top of the encapsulation bracket (2), and the second cavity (22) is located at the bottom of the encapsulation bracket (2). The thermal insulation component (3) has a sensor through hole (32) at the position corresponding to the second cavity (22) for the temperature sensor to pass through. The sensor through hole (32) connects the second cavity (22) and the thermal insulation inner cavity (31).

7. The heat-generating substrate encapsulation structure as described in claim 6, characterized in that: The inner cavity (20) of the bracket is provided with a first wire hole (24) for the substrate (1) to connect to the external circuit. The first wire hole (24) is located between the first cavity opening (21) and the second cavity opening (22). At least two second cavity openings (22) are respectively arranged at the bottom of the packaging bracket (2).

8. A heat-generating substrate encapsulation structure as described in any one of claims 1-7, characterized in that: It also includes a support base (5) for mounting the packaging bracket (2) or the substrate (1), wherein the inner cavity (51) of the support base (5) is provided with a reinforcing rib structure (52) for limiting the installation position of the packaging bracket (2), and the reinforcing rib structure (52) is arranged circumferentially around the hollow position of the inner cavity (51).

9. The heat-generating substrate encapsulation structure as described in claim 8, characterized in that: The encapsulation bracket (2) is fixed to the inner cavity (51) of the base by adhesive or welding, and the bottom of the bracket base (5) has a third cavity (53) for mounting a temperature sensor. Alternatively, the substrate (1) may be fixed to the limiting edge structure (56) of the bracket base (5) by means of bonding or welding, such that the substrate (1) is located near the fourth cavity (55) of the bracket base (5).

10. The heat-generating substrate encapsulation structure as described in claim 8, characterized in that: The bracket base (5) has a second wire hole (54) for the substrate (1) to connect to the external circuit, and at least two second wire holes (54) are respectively arranged on the bracket base (5) near the outer edge.

Images