A conveying device for semiconductor production

Abstract

The application provides a conveying device for semiconductor production, and relates to the technical field of semiconductor conveying, which comprises a conveying mechanism, the conveying mechanism comprises two support frames, conveying pieces are arranged between the two support frames, and a plurality of chassis are connected between the two support frames, and an electrostatic elimination structure is arranged on the chassis, the electrostatic elimination structure comprises two first connecting seats which are mounted on the chassis through bolts, connecting pipes are connected to the two first connecting seats, and ion wind rods are connected between the two connecting pipes. The ion wind rods can generate a large number of ions with positive and negative charges, the ions can quickly neutralize static electricity generated due to friction in the conveying process, the risk of static electricity accumulation is significantly reduced, the breakdown damage caused by electrostatic discharge to semiconductor products is reduced, the production yield of semiconductor products is effectively improved, and the production cost is reduced; after the electrostatic elimination, the possibility of dust and impurities being adsorbed due to static electricity is reduced, and the cleanliness of the surface of the semiconductor products is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor conveying technology, and more specifically, to a conveying device for semiconductor production. Background Technology

[0002] In the semiconductor manufacturing industry, the production process of semiconductor products has extremely stringent environmental requirements, especially in terms of electrostatic control. Semiconductor materials themselves have extremely high insulation and sensitivity, and even a small amount of static electricity accumulation during transportation can cause serious problems. Currently, the most common conveying device in the semiconductor product transportation process is the belt conveyor. Semiconductor products are typically placed on pallets and transported by the belt conveyor. However, during transportation, friction causes charge separation on the surface of the materials, resulting in static electricity. The accumulation of static electricity can have many adverse effects. For example, electrostatic discharge may damage the tiny circuit structures inside semiconductor devices, leading to decreased product performance or even complete product failure, increasing the defect rate and production costs. Therefore, we propose an improvement to this issue by developing a conveying device for semiconductor production. Utility Model Content

[0003] This utility model provides a conveying device for semiconductor production, including a conveying mechanism. The conveying mechanism includes two support frames, a conveying component is disposed between the two support frames, and a plurality of base frames are connected between the two support frames. An electrostatic elimination structure is disposed on the base frame. The electrostatic elimination structure includes two first connecting seats that are bolted to the base frame. A connecting pipe is inserted into each of the two first connecting seats, and an ion air bar is connected between the two connecting pipes. A first hand-tightening bolt is threaded onto the first connecting seat, and one end of the first hand-tightening bolt passes into the first connecting seat and abuts against the outer surface of the connecting pipe.

[0004] As a preferred technical solution of this application, the conveying component includes two rotating shafts rotatably connected between two support frames via bearings. A plurality of conveyor belts are arranged between the two rotating shafts. Two drive wheels are rotatably connected to the inner side of the conveyor belts, and the two drive wheels are respectively mounted on the outer surfaces of the two rotating shafts.

[0005] As a preferred technical solution of this application, gaps are left between the several conveyor belts.

[0006] As a preferred technical solution of this application, one end of one of the rotating shafts is connected to a motor, and the motor is connected to one of the support frames.

[0007] As a preferred technical solution of this application, a plurality of support seats are connected between the two support frames, and a plurality of support plates are arranged above the plurality of support seats, with reinforcing rods connecting the support plates and the support seats.

[0008] As a preferred technical solution of this application, the top of the support plate is smoothly disposed, and the top of the support plate is slidably connected to the inner side of the conveyor belt.

[0009] As a preferred technical solution of this application, a limiting structure is provided at the top of both support frames.

[0010] As a preferred technical solution of this application, the limiting structure includes a plurality of second connecting seats mounted on a support frame, each of the plurality of second connecting seats having a connecting rod inserted through it, and a limiting plate being fixedly connected between one end of the plurality of connecting rods.

[0011] As a preferred technical solution of this application, one end of the limiting plate is fixedly connected to a guide plate, the guide plate is inclined and located at the entrance of the conveying mechanism.

[0012] As a preferred technical solution of this application, a second hand-tightening bolt is threaded onto the second connecting seat, and the bottom end of the second hand-tightening bolt penetrates into the second connecting seat and abuts against the outer surface of the connecting rod.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: In the scheme of this application: This application utilizes an electrostatic elimination structure to generate a large number of positively and negatively charged ions in the ion bar. These ions rapidly neutralize the static electricity generated during transport due to friction, significantly reducing the risk of static electricity accumulation. This reduces the breakdown damage to semiconductor products caused by electrostatic discharge, effectively improving the yield rate of semiconductor products and reducing production costs. After static electricity elimination, the possibility of dust and impurities adsorbed by static electricity is reduced, ensuring the cleanliness of the semiconductor product surface and improving product quality and reliability. Attached Figure Description

[0014] Figure 1 A schematic diagram of the semiconductor manufacturing conveying device provided in this application; Figure 2 A schematic diagram of the limiting structure provided in this application; Figure 3 A partial structural schematic diagram of the semiconductor manufacturing conveying device provided in this application; Figure 4 A schematic diagram of the conveyor belt provided in this application; Figure 5 A schematic diagram of the support plate provided in this application.

[0015] The image shows: 1. Conveying mechanism; 101. Support frame; 102. Base frame; 103. Rotating shaft; 104. Drive wheel; 105. Conveyor belt; 106. Motor; 107. Reinforcing rod; 108. Support plate; 109. Support seat; 2. Static elimination structure; 201. First connecting seat; 202. Connecting pipe; 203. First hand-tightening bolt; 204. Ionizing air bar; 3. Limiting structure; 301. Second connecting seat; 302. Connecting rod; 303. Limiting plate; 304. Guide plate; 305. Second hand-tightening bolt. Detailed Implementation

[0016] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0017] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0018] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0019] For an example, please refer to... Figure 1 and Figure 3 A semiconductor manufacturing conveying device includes a conveying mechanism 1. The conveying mechanism 1 includes two support frames 101, a conveying component is disposed between the two support frames 101, and a plurality of base frames 102 are connected between the two support frames 101. An electrostatic elimination structure 2 is disposed on the base frame 102. The electrostatic elimination structure 2 includes two first connecting seats 201 bolted to the base frame 102. A connecting pipe 202 is inserted into each of the two first connecting seats 201, and an ion air bar 204 is connected between the two connecting pipes 202. A first hand-tightening bolt 203 is threaded onto the first connecting seat 201. One end of the first hand-tightening bolt 203 is inserted into the first connecting seat 201 and abuts against the outer surface of the connecting pipe 202. Loosening the first hand-tightening bolt 203 allows the ion air bar 204 to be rotated to adjust its angle, while tightening the first hand-tightening bolt 203 fixes the connecting pipe 202, thereby fixing the ion air bar 204. The ion bar 204 can generate a large number of positively and negatively charged ions. These ions can quickly neutralize the static electricity generated by friction during the transportation process, significantly reducing the risk of static electricity accumulation. This reduces the breakdown damage to semiconductor products caused by electrostatic discharge, effectively improves the production yield of semiconductor products, and reduces production costs. After static electricity is eliminated, the possibility of dust and impurities adsorbed by static electricity is reduced, ensuring the cleanliness of the semiconductor product surface and improving the quality and reliability of the product. The ion bar 204 is an existing component, and its specific structure and working principle are existing technologies, which will not be described in detail in this application.

[0020] Furthermore, the conveying component includes two rotating shafts 103 rotatably connected between two support frames 101 via bearings. Several conveyor belts 105 are arranged between the two rotating shafts 103. Two drive wheels 104 are rotatably connected to the inner side of the conveyor belts 105. The two drive wheels 104 are respectively mounted on the outer surface of the two rotating shafts 103, and the rotating shafts 103 can support the drive wheels 104.

[0021] Furthermore, gaps are left between several conveyor belts 105, and the gaps are designed to facilitate the function of the ion air bar 204.

[0022] Furthermore, one end of one of the rotating shafts 103 is connected to a motor 106, which is connected to one of the support frames 101. The motor 106 drives the rotating shaft 103 connected to it to rotate, thereby driving the drive wheel 104 and the conveyor belt 105 to rotate. During the rotation of the conveyor belt 105, it can transport the tray containing semiconductors.

[0023] Furthermore, a number of support seats 109 are connected between the two support frames 101, and a number of support plates 108 are arranged above the support seats 109. A reinforcing rod 107 is connected between the support plate 108 and the support seat 109, and the reinforcing rod 107 and the support seat 109 can support the support plate 108.

[0024] Furthermore, the top of the support plate 108 is smoothly disposed, and the top of the support plate 108 is slidably connected to the inner side of the conveyor belt 105. The support plate 108 can support the conveyor belt 105 to improve the stability during the semiconductor conveying process.

[0025] Furthermore, each of the two support frames 101 is provided with a limiting structure 3 at its top. The limiting structure 3 is used to limit the tray containing semiconductors to reduce the possibility of it shifting during transportation.

[0026] Furthermore, the limiting structure 3 includes several second connecting seats 301 mounted on the support frame 101. Each of the several second connecting seats 301 is connected with a connecting rod 302. A limiting plate 303 is fixedly connected between one end of each of the several connecting rods 302. The limiting plate 303 is used to limit the tray containing semiconductors to reduce the possibility of it shifting during transportation.

[0027] Furthermore, a guide plate 304 is fixedly connected to one end of the limiting plate 303. The guide plate 304 is inclined and located at the entrance of the conveying mechanism 1 so that the pallet can enter between the two limiting plates 303.

[0028] Furthermore, a second hand-tightening bolt 305 is threaded onto the second connecting seat 301. The bottom end of the second hand-tightening bolt 305 penetrates into the second connecting seat 301 and abuts against the outer surface of the connecting rod 302. Tightening the second hand-tightening bolt 305 can fix the position of the connecting rod 302, thereby fixing the position of the limiting plate 303. Loosening the second hand-tightening bolt 305 can move the limiting plate 303 to adjust its position according to the actual situation.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A conveying device for semiconductor manufacturing, characterized in that, The system includes a conveying mechanism (1), which includes two support frames (101). A conveying component is provided between the two support frames (101), and several base frames (102) are connected between the two support frames (101). An electrostatic elimination structure (2) is provided on the base frame (102). The electrostatic elimination structure (2) includes two first connecting seats (201) that are bolted to the base frame (102). A connecting pipe (202) is inserted into each of the two first connecting seats (201). An ion wind bar (204) is connected between the two connecting pipes (202). A first hand-tightening bolt (203) is threaded onto the first connecting seat (201). One end of the first hand-tightening bolt (203) is inserted into the first connecting seat (201) and abuts against the outer surface of the connecting pipe (202).

2. The semiconductor manufacturing conveying device according to claim 1, characterized in that, The conveying component includes a rotating shaft (103) rotatably connected between two support frames (101) via bearings. There are two rotating shafts (103), and a plurality of conveyor belts (105) are arranged between the two rotating shafts (103). Two drive wheels (104) are rotatably connected to the inner side of the conveyor belts (105), and the two drive wheels (104) are respectively mounted on the outer surface of the two rotating shafts (103).

3. The semiconductor manufacturing conveying device according to claim 2, characterized in that, A gap is left between several of the conveyor belts (105).

4. The semiconductor manufacturing conveying device according to claim 2, characterized in that, One end of one of the rotating shafts (103) is connected to a motor (106), and the motor (106) is connected to one of the support frames (101).

5. The semiconductor manufacturing conveying device according to claim 2, characterized in that, A plurality of support seats (109) are connected between the two support frames (101), and a plurality of support plates (108) are arranged above the plurality of support seats (109). A reinforcing rod (107) is connected between the support plate (108) and the support seat (109).

6. The semiconductor manufacturing conveying device according to claim 5, characterized in that, The top of the support plate (108) is smooth, and the top of the support plate (108) is slidably connected to the inner side of the conveyor belt (105).

7. The semiconductor manufacturing conveying device according to claim 1, characterized in that, Both of the support frames (101) are provided with a limit structure (3) at their top.

8. The semiconductor manufacturing conveying device according to claim 7, characterized in that, The limiting structure (3) includes several second connecting seats (301) mounted on the support frame (101), and connecting rods (302) are inserted and connected to each of the several second connecting seats (301). A limiting plate (303) is fixedly connected between one end of each of the several connecting rods (302).

9. The semiconductor manufacturing conveying device according to claim 8, characterized in that, One end of the limiting plate (303) is fixedly connected to a guide plate (304), the guide plate (304) is inclined and located at the entrance of the conveying mechanism (1).

10. The semiconductor manufacturing conveying apparatus according to claim 9, characterized in that, The second connecting seat (301) is threaded with a second hand-tightening bolt (305), the bottom end of which is inserted into the second connecting seat (301) and abuts against the outer surface of the connecting rod (302).

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