PCBA electromagnetic compatibility performance optimization structure
Patent Information
- Application Number
- CN202522063935.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-25
- Publication Date
- 2026-10-13
- Estimated Expiration
- 2035-09-25
AI Technical Summary
尤其是在高密度、高频率的电路设计中，电磁干扰（EMI）和电磁敏感度（EMS）问题尤为突出，容易导致信号失真、数据传输错误、系统功能异常甚至设备损坏，严重影响产品的稳定性和安全性
[0015]本实用新型的优点是：第一，弹片体积小，重量轻，结构简单，便于更换和维修；第二，弹片直接焊接在PCB板上，具有良好的导电性能和接地效果；第三，通过弹片与外壳相互压缩，起到良好的机械缓冲并保持接触。
Smart Images
Figure CN224852391U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCBA technology, and more specifically, to a PCBA electromagnetic compatibility performance optimization structure. Background Technology
[0002] With the rapid development of electronic and computer technologies, the number of integrated electronic devices in modern electronic systems has increased dramatically, system functions have become increasingly complex, and product integration has continuously improved, leading to a more complex electromagnetic environment within electronic systems. Against this backdrop, electromagnetic compatibility (EMC) issues have gradually become one of the key factors affecting the performance and reliability of electronic equipment. Especially in high-density, high-frequency circuit designs, electromagnetic interference (EMI) and electromagnetic susceptibility (EMS) problems are particularly prominent, easily leading to signal distortion, data transmission errors, abnormal system functions, and even equipment damage, seriously affecting product stability and safety.
[0003] In traditional PCBA structures, the PCB board is usually directly mechanically assembled and electrically contacted with the equipment casing to achieve grounding and electromagnetic shielding. Although the structure is simple, this direct contact method has obvious shortcomings in practical applications: On the one hand, due to processing and assembly tolerances, poor contact between the PCB and the casing is prone to occur, resulting in increased grounding impedance and weakening the shielding effect; on the other hand, the equipment may undergo structural deformation due to vibration, impact or temperature changes during operation, affecting contact stability and even causing intermittent conduction failure, thereby reducing the overall EMC performance. Utility Model Content
[0004] This invention aims to solve the technical problems of poor contact and insufficient contact stability in existing structures. To overcome the defects of the prior art, this invention provides an improved structure that achieves electrical conduction between the PCB board and the housing through a spring. By utilizing the elastic deformation capability of the spring, it can not only ensure good electrical contact and low grounding impedance, but also provide good buffering and maintain stable contact during mechanical assembly, preventing conduction failure. It can adapt to structural changes under different working conditions, thereby significantly improving the EMC performance and mechanical reliability of the equipment.
[0005] To achieve the purpose of this utility model, the following technical solution is adopted: An optimized EMC (Electromagnetic Compatibility) structure for a PCBA includes a housing; a PCB board mounted on the housing, comprising a housing mating portion mounted inside the housing and a connector mating portion mounted outside the housing; a connector fixedly mounted on the connector mating portion, with the PCB board fixedly connected to electronic components via the connector and relatively fixed to the housing; and a spring, comprising a connecting portion and an elastic portion; the connecting portion is fixedly connected to the PCB board, and the elastic portion abuts against the housing. The spring achieves an elastic electrical connection between the PCB board and the housing, ensuring good electrical contact and low grounding impedance. Furthermore, the elastic deformation capability of the spring provides a buffering effect during mechanical assembly, adapting to structural deformation caused by vibration, impact, or temperature changes, improving contact stability, effectively avoiding EMC performance degradation due to poor contact or intermittent conduction failure, and enhancing the electromagnetic compatibility and mechanical reliability of the equipment.
[0006] Preferably, the connecting part is fixed to the PCB board by welding. Welding ensures a strong and reliable connection, reduces contact resistance, further lowers grounding impedance, and avoids loosening or oxidation problems that may occur with screws or crimping. It also resists vibration and impact, improving structural stability and long-term reliability.
[0007] Preferably, a mounting opening is provided on one end face of the housing; the PCB board is horizontally mounted on the mounting opening of the housing, and the spring is located at the mounting opening, with the elastic part pressed against the inner wall of the mounting opening. By arranging the spring at the mounting opening position, the elastic part is directly pressed against the inner wall of the mounting opening, resulting in a compact structure. At the same time, the design of the mounting opening facilitates the quick positioning and installation of the PCB board, while ensuring reliable contact between the spring and the housing.
[0008] Preferably, the PCB board is provided with a positioning socket that mates with the mounting port, and the positioning socket is located at the junction of the housing mating part and the insertion mating part. Through the positioning socket's engagement with the mounting port, precise positioning of the PCB board and the housing can be achieved, avoiding assembly deviations from affecting the contact effect of the spring contacts. The positioning structure, located at the junction of the housing mating part and the insertion mating part, improves the overall structural stability and assembly efficiency.
[0009] Preferably, the outer casing is annular, and the mounting port is located on the lower end face of the outer casing. The mounting port is U-shaped with its opening facing downwards. The PCB board is inserted into the mounting port, with the outer casing mating part located inside the annulus and the connecting mating part extending outside the annulus. This structure facilitates the insertion and quick installation of the PCB board from below. The structure is symmetrical, the installation direction is clear, and assembly is convenient. Furthermore, the layout of the outer casing mating part inside the annulus and the connecting mating part extending outside the annulus is reasonable, ensuring both shielding effectiveness and convenient connection of external connectors.
[0010] Preferably, the connecting part is horizontally positioned, and the elastic part is bent and positioned above the connecting part, with the top end of the elastic part abutting against the inner top wall of the mounting opening. The horizontal positioning of the connecting part facilitates welding and fixing, while the upward bending of the elastic part against the inner top wall of the mounting opening ensures uniform force distribution and stable elastic contact on the spring sheet. Furthermore, the bending design improves the elastic deformation capability of the spring sheet, enhancing its adaptability to mechanical stress and thermal expansion and contraction.
[0011] Preferably, the outer shell mating part is circular in shape to match the shape of the outer shell, and the plug-in mating part is rectangular in shape to match the shape of the connector. Matching the shape of the outer shell mating part to the outer shell ensures good shielding effect and structural fit; matching the shape of the plug-in mating part to the connector facilitates stable installation of the connector and reduces poor contact caused by shape mismatch.
[0012] Preferably, the connector is provided with a snap-fit connector; the PCB board's mating portion is provided with snap-fit holes that engage with and position the snap-fit connector. Through the snap-fit engagement between the snap-fit connector and the snap-fit holes, the connector can be quickly installed and fixed on the PCB board. The snap-fit structure simplifies the assembly process while ensuring stable relative positioning between the connector and the PCB board, preventing EMC performance degradation due to loosening and improving signal transmission reliability.
[0013] Preferably, the lower outer wall of the snap-fit connector is provided with a positioning step; during snap-fit, the snap-fit connector passes through the snap-fit hole, and the positioning step abuts against the plate surface of the mating part. By abutting against the plate surface of the mating part, the axial displacement of the connector is further restricted, preventing loosening, avoiding over-insertion or incomplete insertion, improving the firmness of the connector installation, and avoiding poor contact caused by vibration or insertion / removal operations.
[0014] Preferably, the connector is provided with a plurality of arrayed pins; the PCB board has pinholes for the pins to pass through. This structure reduces the risk of pin damage, ensures reliable signal and power transmission, and the array design facilitates simultaneous connection of multiple signal channels, improving connection density and transmission efficiency, thus meeting the requirements of high-density circuit design.
[0015] The advantages of this utility model are: First, the spring is small in size, light in weight, simple in structure, and easy to replace and maintain; Second, the spring is directly soldered onto the PCB board, which has good conductivity and grounding effect; Third, the spring and the outer shell are compressed against each other, which provides good mechanical buffering and maintains contact. Attached Figure Description
[0016] Figure 1 is a schematic diagram of the optimized PCBA electromagnetic compatibility performance structure of this utility model. Figure 2 is a schematic diagram of the bottom surface of the optimized PCBA electromagnetic compatibility performance structure of this utility model. Figure 3 is an exploded view of the optimized PCBA electromagnetic compatibility performance structure of this utility model. Figure 4 is a schematic diagram of the wheel spring sheet of this utility model.
[0017] Explanation of reference numerals in the attached figures: 1. Outer shell; 11. Mounting port; 2. PCB board; 21. Outer shell mating part; 22. Connecting mating part; 23. Positioning socket; 24. Snap-fit hole; 25. Pin hole; 3. Connector; 31. Snap-fit connector; 32. Positioning step; 33. Lead pin; 4. Spring; 41. Connecting part; 42. Elastic part. Detailed Implementation
[0018] First, those skilled in the art should understand that these embodiments are merely used to explain the technical principles of the embodiments of this application and are not intended to limit the scope of protection of the embodiments of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.
[0019] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.
[0020] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0021] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments.
[0022] like Figures 1 to 4As shown, a PCBA electromagnetic compatibility performance optimization structure includes a housing 1 made of metal; a PCB board 2 mounted on the housing 1, comprising a housing mating part 21 installed inside the housing 1 and a connector mating part 22 installed outside the housing 1; a connector 3 fixedly mounted on the connector mating part 22, and the PCB board 2 is fixedly connected to electronic components via the connector 3, maintaining relative fixation with the housing 1; and a spring 4 including a connecting part 41 and an elastic part 42. The connecting part 41 is fixedly connected to the PCB board 2 by welding. The welding of the connecting part 41 ensures a strong and reliable connection, reduces contact resistance, further lowers grounding impedance, and avoids loosening or oxidation problems that may be caused by screws or crimping. It also resists vibration and impact, improving structural stability and long-term reliability. The elastic part 42 abuts against the housing 1. The elastic electrical connection between the PCB board 2 and the housing 1 is achieved by the spring 4, ensuring good electrical contact and low grounding impedance. The elastic deformation capability of the spring 4 can provide a buffering effect in mechanical assembly, adapt to structural deformation caused by vibration, impact or temperature changes, improve contact stability, effectively avoid EMC performance degradation caused by poor contact or intermittent conduction failure, and improve the electromagnetic compatibility and mechanical reliability of the equipment.
[0023] like Figures 2 to 3 As shown, a mounting opening 11 is provided on one end face of the outer casing 1; the PCB board 2 is horizontally mounted on the mounting opening 11 of the outer casing 1, and the spring piece 4 is located at the mounting opening 11, with the elastic part 42 pressed against the inner wall of the mounting opening 11. By arranging the spring piece 4 at the mounting opening 11, the elastic part 42 is directly pressed against the inner wall of the mounting opening 11, resulting in a compact structure. The design of the mounting opening 11 facilitates the rapid positioning and installation of the PCB board 2, while ensuring reliable contact between the spring piece 4 and the outer casing 1. The PCB board 2 is provided with positioning sockets 23 that are positioned and engaged with the mounting opening 11, located at the junction of the outer casing mating part 21 and the connecting mating part 22. In this embodiment, there are two positioning sockets 23, symmetrically arranged on the left and right sides of the PCB board 2. Through the positioning engagement of the positioning sockets 23 and the mounting opening 11, precise positioning of the PCB board 2 and the outer casing 1 can be achieved, avoiding assembly deviations from affecting the contact effect of the spring piece 4. The positioning structure is located at the junction of the outer casing mating part 21 and the connecting mating part 22, improving the overall structural stability and assembly efficiency.
[0024] like Figure 2 and Figure 3The outer casing 1 is annular in shape, with a mounting port 11 located on its lower end face. The mounting port 11 is U-shaped and opens downwards. The PCB board 2 is inserted into the mounting port 11, with the outer casing mating part 21 located inside the annulus and the connecting mating part 22 extending outside the annulus. This structure facilitates the insertion and quick installation of the PCB board 2 from below. The structure is symmetrical, the installation direction is clear, and assembly is convenient. Furthermore, the layout of the outer casing mating part 21 inside the annulus and the connecting mating part 22 extending outside the annulus is reasonable, ensuring both shielding effectiveness and convenient connection of external connectors 3. Figure 4 As shown, the connecting part 41 is horizontally positioned, and the elastic part 42 is bent and positioned above the connecting part 41, with the top end of the elastic part 42 abutting against the top inner wall of the mounting opening 11. The horizontal positioning of the connecting part 41 facilitates welding and fixing, while the upward bending of the elastic part 42 abutting against the top inner wall of the mounting opening 11 ensures that the spring piece 4 is subjected to uniform force and stable elastic contact. Furthermore, the bending design improves the elastic deformation capability of the spring piece 4, enhancing its adaptability to mechanical stress and thermal expansion and contraction.
[0025] like Figure 3 As shown, the outer shell mating part 21 is circular in shape to match the shape of the outer shell 1, and the plug-in mating part 22 is rectangular in shape to match the shape of the connector 3. By matching the shape of the outer shell mating part 21 with the outer shell 1, good shielding effect and structural fit are ensured; by matching the shape of the plug-in mating part 22 with the connector 3, stable installation of the connector 3 is facilitated, and poor contact caused by shape mismatch is reduced.
[0026] like Figures 2 to 3As shown, the bottom of connector 3 has two symmetrically distributed snap-fit connectors 31; the PCB board 2 has snap-fit holes 24 on the mating part 22 that engage with the snap-fit connectors 31 for positioning. Through the snap-fit engagement of the snap-fit connectors 31 and the snap-fit holes 24, connector 3 can be quickly installed and fixed on the PCB board 2. The snap-fit structure simplifies the assembly process and ensures the relative position stability between connector 3 and PCB board 2, preventing EMC performance degradation due to loosening and improving signal transmission reliability. The lower outer wall of snap-fit connector 31 has a positioning step 32; during snap-fit, snap-fit connector 31 vertically passes through the snap-fit hole 24, and the positioning step 32 abuts against the surface of the mating part 22. The positioning step 32 abuts against the surface of the mating part 22, further restricting the axial displacement of connector 3, preventing loosening, avoiding over-insertion or under-insertion, improving the installation firmness of connector 3, and preventing poor contact due to vibration or insertion / removal operations. The connector 3 is provided with several vertically arranged pins 33 arranged in an array; the PCB board 2 has a pinhole 25 for the lower end of the pins 33 to pass through. The above structure reduces the risk of pin damage, ensures reliable signal and power transmission, and the array design facilitates the simultaneous connection of multiple signal channels, improves connection density and transmission efficiency, and meets the requirements of high-density circuit design.
[0027] The working principle of this optimized structure is as follows: During assembly, the spring contact 4 is first soldered onto the PCB board 2. Then, the positioning socket 23 of the PCB board 2 is aligned with the mounting port 11 of the outer casing 1 and inserted. During this process, the elastic part 42 of the spring contact 4 is compressed and generates a continuous rebound force, enabling the grounding layer of the PCB board 2 to form a reliable electrical connection with the outer casing 1 through the spring contact 4. Finally, the connector 3 is snapped and fixed onto the mating part 22 of the PCB board 2. This structure effectively ensures the stability of the PCB board grounding circuit, thereby significantly improving the electromagnetic compatibility performance of the entire device.
[0028] In summary, the advantages of this utility model are: The elastic pressure of the spring 4 enables a continuous and stable low-impedance electrical connection between the PCB board 2 and the outer shell 1, effectively avoiding poor contact caused by processing tolerances, vibration, impact or thermal expansion and contraction, and significantly improving the electromagnetic shielding effect and anti-interference capability of the equipment.
[0029] The spring sheet 4 structure has good elastic deformation capability, which can absorb and compensate for installation stress and structural deformation, play a buffering role, prevent conduction failure or structural damage caused by rigid connection, and extend the service life of equipment.
[0030] This optimized structure eliminates the need for complex fasteners or additional conductive materials. Through the cooperation of the spring 4, the positioning socket 23, and the mounting port 11, it enables the rapid and accurate positioning and installation of the PCB board 2, improving production assembly efficiency and reducing manufacturing costs.
[0031] The connector 3 is firmly fixed by the cooperation of the snap-fit connector 31 and the snap-fit hole 24, and the insertion depth is controlled by the positioning step 32, which ensures the stability of the external electrical connection and the integrity of the signal transmission.
[0032] In the description of the embodiments of this application, it should be noted that the terms "inner" and "outer" and other terms indicating direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or component must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.
[0033] In the description of this application, the references to terms such as "an embodiment," "some embodiments," "in this embodiment," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0034] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A PCBA electromagnetic compatibility performance optimization structure, characterized in that, include Outer shell (1); PCB board (2) is mounted on the housing (1), and PCB board (2) includes a housing mating part (21) mounted inside the housing (1) and a plug-in mating part (22) mounted outside the housing (1). The connector (3) is fixedly installed on the connector mating part (22), and the PCB board (2) is fixedly connected to the electronic components through the connector (3) and remains relatively fixed to the housing (1); The spring (4) includes a connecting part (41) and an elastic part (42); the connecting part (41) is fixedly connected to the PCB board (2), and the elastic part (42) abuts against the outer shell (1).
2. The PCBA electromagnetic compatibility performance optimization structure according to claim 1, characterized in that, The connecting part (41) is fixed on the PCB board (2) by welding.
3. The PCBA electromagnetic compatibility performance optimization structure according to claim 1, characterized in that, The outer casing (1) has an installation port (11) on one side end face; the PCB board (2) is horizontally arranged on the installation port (11) of the outer casing (1), and the spring piece (4) is located at the installation port (11), and the elastic part (42) is pressed against the inner wall of the installation port (11).
4. The PCBA electromagnetic compatibility performance optimization structure according to claim 3, characterized in that, The PCB board (2) is provided with a positioning socket (23) that is positioned and matched with the mounting port (11), and the positioning socket (23) is located at the junction of the outer shell mating part (21) and the plug-in mating part (22).
5. The PCBA electromagnetic compatibility performance optimization structure according to claim 3, characterized in that, The outer shell (1) is circular, the mounting port (11) is located on the lower end face of the outer shell (1), and the mounting port (11) is U-shaped with the opening facing downward. The PCB board (2) is inserted into the mounting port (11), and the outer shell mating part (21) is located inside the ring, and the plug-in mating part (22) extends to the outside of the ring.
6. The PCBA electromagnetic compatibility performance optimization structure according to claim 5, characterized in that, The connecting part (41) is horizontally arranged, and the elastic part (42) is bent and arranged above the connecting part (41), with the top end of the elastic part (42) abutting against the top inner wall of the mounting port (11).
7. The PCBA electromagnetic compatibility performance optimization structure according to claim 5, characterized in that, The outer shell mating part (21) is circular in shape matching the shape of the outer shell (1), and the plug mating part (22) is rectangular in shape matching the shape of the connector (3).
8. The PCBA electromagnetic compatibility performance optimization structure according to claim 1, characterized in that, The connector (3) is provided with a snap-fit connector (31); the PCB board (2) has a snap-fit hole (24) on its plug-in mating part (22) that is snap-fitted and positioned with the snap-fit connector (31).
9. The PCBA electromagnetic compatibility performance optimization structure according to claim 8, characterized in that, The lower outer wall of the snap connector (31) is provided with a positioning step (32); when snapped, the snap connector (31) passes through the snap hole (24) and the positioning step (32) abuts against the plate surface of the insertion and mating part (22).
10. The PCBA electromagnetic compatibility performance optimization structure according to claim 1, characterized in that, The connector (3) is provided with a plurality of arrayed lead pins (33); the PCB board (2) has a pinhole (25) for the lead pins (33) to pass through on the plug-in mating part (22).