PI reinforcing plate suitable for die cutting process

Abstract

The utility model relates to PI reinforcing plate technical field especially a kind of PI reinforcing plate suitable for die cutting process, including PI board, the side of PI board is attached with first heat conduction plate, multiple sets of through holes are vertically and horizontally penetrated in the first heat conduction plate, and multiple sets of through holes are evenly arranged;The PI reinforcing plate suitable for die cutting process, solve the complete metal plate in prior art and make the cutting more difficult shortcomings.

Description

Technical Field

[0001] This utility model relates to the field of PI reinforcing plate technology, and in particular to a PI reinforcing plate suitable for die-cutting process. Background Technology

[0002] PI reinforcement boards, also known as stiffeners or reinforcing boards, are used to strengthen the mechanical strength of FPCs (flexible printed circuits). Since some FPCs generate a lot of heat due to heavy loads, some existing PI reinforcement boards have heat dissipation structures installed inside to assist in the heat dissipation of the FPC.

[0003] Existing auxiliary heat dissipation structures are mostly made of metal plates with high thermal conductivity, such as copper or aluminum plates. When die-cutting, the complete metal plate makes cutting difficult and is not conducive to die-cutting processing. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies where the presence of complete metal plates makes cutting difficult, and to propose a PI reinforcing plate suitable for die-cutting processes.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] Design a PI reinforcing plate suitable for die-cutting process, including a PI plate, a first heat-conducting plate attached to one side of the PI plate, and multiple sets of through holes are opened through the top and bottom of the first heat-conducting plate, and the multiple sets of through holes are evenly arranged.

[0007] Preferably, a silicone grease sheet is attached to the outer end of the first heat-conducting plate.

[0008] Preferably, both the silicone grease sheet and the outer end of the PI plate are adhered with a protective film.

[0009] Preferably, it further includes a heat dissipation and conduction component, which includes a second heat conduction plate. The PI plate has a cavity inside, and the second heat conduction plate is nested inside the cavity. The outer wall of the PI plate has a through groove, and the second heat conduction plate is integrally formed with a connecting post. The connecting post can pass through the through groove and fit against the surface of the first heat conduction plate.

[0010] Preferably, silicone grease is applied between the connecting post and the first heat-conducting plate.

[0011] Preferably, the connecting column is fixed to the first heat-conducting plate by soldering.

[0012] The PI reinforcing plate proposed in this utility model, which is suitable for die-cutting process, has the following advantages:

[0013] By creating multiple sets of through holes evenly arranged in the horizontal and vertical directions on the first heat-conducting plate, the multiple sets of through holes form easily breakable areas, making it easier for the first heat-conducting plate to be cut in the vertical, horizontal, and 45° chamfered directions during die cutting, thus making the PI plate with heat dissipation structure suitable for die cutting processing. Attached Figure Description

[0014] Figure 1 A schematic diagram of the three-dimensional structure with the main body as the core;

[0015] Figure 2 A schematic diagram of the explosive dismantling structure, with the main body as the core.

[0016] Figure 3 A cross-sectional structural diagram of the main body;

[0017] Figure 4 for Figure 3 A magnified structural diagram of area A.

[0018] In the diagram: 1. PI plate; 2. First heat-conducting plate; 3. Silicone grease sheet; 4. Protective film; 5. Through hole; 6. Cavity; 7. Through groove; 8. Second heat-conducting plate; 9. Connecting post. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Example 1

[0021] Reference Figures 1-4 A PI reinforcing plate suitable for die-cutting process includes a PI plate 1, a first heat-conducting plate 2 attached to one side of the PI plate 1, and multiple sets of through holes 5 are opened through the top and bottom of the first heat-conducting plate 2, and the multiple sets of through holes 5 are evenly arranged.

[0022] Furthermore, refer to Figure 2 , Figure 4 The first heat-conducting plate 2 has a silicone grease sheet 3 attached to the outer end.

[0023] Furthermore, refer to Figure 2 , Figure 4 The silicone grease sheet 3 and the outer end of the PI plate 1 are both bonded with a protective film 4.

[0024] Working principle:

[0025] Multiple sets of through holes 5 make the first heat-conducting plate 2 easier to cut, see reference. Figure 2Multiple sets of through holes 5 are evenly arranged in the horizontal and vertical directions. Therefore, when die-cutting, the first heat-conducting plate 2 is easier to cut in the vertical, horizontal and 45° chamfer. The protective film 4 should be retained during cutting to prevent the PI plate 1 and the thermal grease 3 from getting dusty. Before use, the protective film 4 of the PI plate 1 should be removed so that the PI plate 1 can be combined with the FPC. After the coupling structure of the FPC is assembled, the protective film 4 of the thermal grease 3 should be removed so that the thermal grease 3 can be attached to the heat dissipation structure of the external device to form a heat conduction effect.

[0026] In use, the first heat-conducting plate 2 absorbs the heat from the PI plate 1 and conducts it to the thermal grease 3. The thermal grease 3 is used to fill the gap between the first heat-conducting plate 2 and the external device housing or heat dissipation structure. By using the thermal grease 3 to adhere to the external device housing or heat dissipation structure, temperature conduction is achieved, thereby improving heat dissipation capacity.

[0027] Example 2

[0028] To further improve the heat dissipation capacity of PI board 1, refer to Figure 4 It also includes a heat dissipation and conduction component, which includes a second heat conduction plate 8. A cavity 6 is opened inside the PI plate 1, and the second heat conduction plate 8 is nested inside the cavity 6. A through groove 7 is opened on the outer wall of the PI plate 1. A connecting post 9 is integrally formed on the second heat conduction plate 8. The connecting post 9 can pass through the through groove 7 and fit with the surface of the first heat conduction plate 2. The second heat conduction plate 8 also has a through hole 5 corresponding to the first heat conduction plate 2.

[0029] Furthermore, silicone grease is applied between the connecting post 9 and the first heat-conducting plate 2.

[0030] Furthermore, the connecting column 9 is fixed to the first heat-conducting plate 2 by soldering.

[0031] Working principle:

[0032] Multiple sets of through slots 7 and connecting posts 9 are provided. The first heat-conducting plate 2 and the second heat-conducting plate 8 are both made of copper. The first heat-conducting plate 2 and the second heat-conducting plate 8 are connected to each other through the connecting posts 9. By embedding the second heat-conducting plate 8 inside the PI plate 1, the PI plate 1 is used to prevent the second heat-conducting plate 8 from transferring electrical energy, and the second heat-conducting plate 8 can be closer to the coupling interface with high heat generation, thus improving the heat dissipation capacity.

[0033] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A PI reinforcing plate suitable for die-cutting process, comprising a PI plate (1), characterized in that: A first heat-conducting plate (2) is attached to one side of the PI plate (1). The first heat-conducting plate (2) has multiple sets of through holes (5) running through it from top to bottom. The multiple sets of through holes (5) are evenly arranged.

2. The PI reinforcing plate suitable for die-cutting process according to claim 1, characterized in that: A silicone grease sheet (3) is attached to the outer end of the first heat-conducting plate (2).

3. The PI reinforcing plate suitable for die-cutting process according to claim 2, characterized in that: The silicone grease sheet (3) and the outer end of the PI plate (1) are both adhered with a protective film (4).

4. The PI reinforcing plate suitable for die-cutting process according to claim 1, characterized in that: It also includes a heat dissipation and conduction component, which includes a second heat conduction plate (8). The PI plate (1) has a cavity (6) inside, and the second heat conduction plate (8) is nested inside the cavity (6). The outer wall of the PI plate (1) has a through groove (7), and the second heat conduction plate (8) is integrally formed with a connecting post (9). The connecting post (9) can pass through the through groove (7) and fit against the surface of the first heat conduction plate (2).

5. A PI reinforcing plate suitable for die-cutting process according to claim 4, characterized in that: Silicone grease is applied between the connecting post (9) and the first heat-conducting plate (2).

6. A PI reinforcing plate suitable for die-cutting process according to claim 4, characterized in that: The connecting column (9) is fixed to the first heat-conducting plate (2) by soldering.

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