VPX soft and hard combination backplane

Abstract

The utility model provides a kind of VPX soft and hard combination backboard, including first board area, first board area includes at most 18 layers of board material, thickness is 3.8mm to 4.2mm, first board area is provided with power supply auxiliary module, power connector and mainboard signal interface;Second board area, second board area includes at most 12 layers of board material, thickness is 1.3mm to 1.5mm, one side of second board area is provided with high-speed interface group, and the other side is provided with expansion interface group;Flexible soft cable, for connecting first board area and second board area, flexible soft cable includes at most 4 layers of board material, thickness is 0.48mm to 0.52mm.The utility model has the beneficial effects that integrated multi-layer PCB structure integrates each area, without additional expansion module, adapt to miniaturization portable device space demand, reduce overall occupied volume;The characteristics that flexible soft cable can be slightly bent can buffer stress generated in plugging process, protect connector and backboard ontology, realize high-speed signal's no interconnection direct connection transmission, reduce signal breakpoint.

Description

Technical Field

[0001] This utility model belongs to the field of backplate design, and in particular relates to a VPX rigid-soft backplate. Background Technology

[0002] VPX (VITA 46) backplanes, as the core interconnect carriers of high-performance computing systems, are widely used in military, aerospace, and industrial automation fields. With the increasing demand for miniaturization and portability of devices, traditional VPX backplanes have gradually revealed many shortcomings. Traditional VPX backplanes mostly adopt a multi-slot rigid architecture with a single board thickness, making them unsuitable for the limited space of miniaturized portable devices. Their high-speed signal transmission relies on a multi-segment conversion method of "rigid lines plus connectors," resulting in numerous signal breakpoints and significant signal loss in high-speed signal transmission such as HDMI and USB 3.0, making it difficult to meet the signal rate requirements of portable devices. Furthermore, traditional VPX backplanes have fixed interfaces, requiring dedicated VPX modules to expand the interfaces, further occupying space. They also lack sophisticated protection designs for harsh environments, making them prone to performance degradation in humid and dusty conditions.

[0003] Furthermore, in single-slot scenarios, traditional VPX backplanes suffer from cluttered power supply and motherboard interface layouts, leading to space conflicts and inconvenient installation and maintenance. Therefore, there is an urgent need for a VPX backplane that can achieve high-speed, low-loss signal transmission within limited space, is suitable for miniaturized applications, and is easy to install and maintain. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a VPX rigid-flex backplane, which is especially suitable for VPX backplanes using a non-interconnection method in a limited space.

[0005] The technical solution adopted by this utility model is: to provide a VPX rigid-flex backplane, comprising:

[0006] The first board area includes up to 18 layers of board material with a thickness of 3.8mm to 4.2mm. The first board area is provided with a power auxiliary module, a power connector and a motherboard signal interface.

[0007] The second board area includes up to 12 layers of board material with a thickness of 1.3mm to 1.5mm. A high-speed interface group is provided on one side of the second board area, and an expansion interface group is provided on the other side.

[0008] A flexible cable is used to connect the first board area and the second board area. The flexible cable includes up to four layers of board material with a thickness of 0.48 mm to 0.52 mm.

[0009] Furthermore, the flexible cable is a flexible printed circuit board.

[0010] Furthermore, the power auxiliary module and the power connector are located on the side of the first board area opposite to the external motherboard.

[0011] Furthermore, the motherboard signal interface is located on the side of the first board area facing the external motherboard.

[0012] The advantages and positive effects of this utility model are as follows: Due to the adoption of the above technical solution, the integrated multi-layer PCB structure integrates various areas without the need for additional expansion modules, adapting to the space requirements of miniaturized portable devices and reducing the overall volume occupied; the flexible cable's slight bending characteristic can buffer the stress generated during insertion and removal, protecting the connector and backplane body, realizing high-speed signal transmission without interconnection, and reducing signal breakpoints; the layout of rear-out power supply and front-out motherboard avoids component interference during installation and improves assembly efficiency; the functional chips of the second board area are concentrated on the same surface, and the power and signal transmission paths are clear, making it easy to quickly locate the problem point during later maintenance and debugging, reducing maintenance difficulty and time costs. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of a VPX rigid-flex backplate according to an embodiment of the present invention;

[0014] In the diagram: First board area 100; Second board area 200; Flexible cable 300; Power auxiliary module 101; Power connector 102; Main board signal interface 103; High-speed interface group 201; Expansion interface group 202. Detailed Implementation

[0015] The present disclosure will now be described more fully with reference to the accompanying drawings, which illustrate exemplary embodiments of the present disclosure. The technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without creative effort are within the scope of protection of the present disclosure.

[0016] like Figure 1 As shown, this utility model provides a VPX rigid-flex backplane, comprising:

[0017] The first board area 100 includes up to 18 layers of board material with a thickness of 3.8mm to 4.2mm. The first board area 100 is provided with a power auxiliary module 101, a power connector 102 and a motherboard signal interface 103.

[0018] The second board area 200 includes up to 12 layers of board material with a thickness of 1.3mm to 1.5mm. A high-speed interface group 201 is provided on one side of the second board area 200, and an expansion interface group 202 is provided on the other side.

[0019] Flexible cable 300 is used to connect the first board area 100 and the second board area 200. Flexible cable 300 includes up to 4 layers of board material with a thickness of 0.48 mm to 0.52 mm.

[0020] In a preferred embodiment, the backplane is stacked as follows: the flexible cable substrate sequentially includes a 1oz signal layer, two 1oz power plane layers, and a 1oz signal layer. The first board area substrate sequentially includes a 2oz top signal layer, a 1oz ground plane layer, a 1oz signal layer, a 1oz ground plane layer, a 1oz signal layer, two 1oz power plane layers, four layers shared with the flexible cable, two 1oz power plane layers, a 1oz signal layer, a 1oz ground plane layer, a 1oz signal layer, a 1oz ground plane layer, and a 2oz bottom signal layer. The second board area substrate sequentially includes a 1oz top signal layer, a 1oz ground plane layer, a 1oz signal layer, a 1oz power plane layer, four layers shared with the flexible cable, a 1oz power plane layer, a 1oz signal layer, a 1oz ground plane layer, and a 1oz bottom signal layer.

[0021] Using the above-mentioned device, the integrated multi-layer PCB structure integrates three major areas without additional assembly, adapting to the space requirements of miniaturized portable devices and reducing the overall volume occupied; the functional division of each area is clearly defined, ensuring the integrity of the power supply, signal transmission, and interface output links, and ensuring the stable operation of the entire backplane function.

[0022] To address the issue that stress concentration occurs in the connector during insertion and removal of traditional rigid backplates, which can easily lead to component damage and cannot be adapted to non-linear layouts, this embodiment provides an implementation method.

[0023] In one embodiment, the flexible cable is a flexible printed circuit board with bendable characteristics.

[0024] Using the above-mentioned device, the slight bending characteristic of the middle soft area (flexible cable) can buffer the stress generated during the insertion and removal process, protect the connector and the backplane body, reduce the risk of component damage, and improve durability; the flexible structure breaks through the limitations of the rigid structure, can adapt to the non-linear spatial layout of miniaturized equipment, and improve the adaptability of the backplane in different devices.

[0025] To address the problem of inconvenient installation caused by the chaotic layout of traditional backplane power connectors and space conflicts when interfacing with the motherboard, this embodiment provides an implementation method.

[0026] In one embodiment, the power auxiliary module and the power connector are located on the side of the first board area away from the external motherboard, forming a rear-out power access structure.

[0027] Using the above-mentioned device, the rear-out power supply access structure avoids the motherboard docking side, preventing component interference during installation and improving installation convenience; the power supply introduction path is independent, reducing interference with motherboard signals and improving power supply stability; the power supply component layout is clear, allowing for quick location of the power supply access component during later maintenance, reducing maintenance difficulty.

[0028] To address the issues of unreasonable placement of traditional backplane motherboard interfaces, susceptibility to signal and power transmission interference, and low docking efficiency, this embodiment provides an implementation method.

[0029] In one embodiment, the power auxiliary module and the power connector are located on the side of the first board area away from the external motherboard.

[0030] Using the above-mentioned device, the front-mounted motherboard docking structure allows the backplane and motherboard to be directly aligned, shortening the power signal transmission path, reducing signal delay, and ensuring stable power signal interaction.

[0031] In one embodiment, the second board area integrates all functional chips (referring to all functional chips on the backplane), and all functional chips are located on the same surface of the left-side rigid board, facilitating quick positioning and operation during later maintenance and debugging. The high-speed interface group includes a display interface, a high-speed data interface, and a network port. The display interface is used to transmit image signals, the high-speed data interface is used to transmit high-speed data, and the network port is used to realize network connection, covering the diverse high-speed signal output needs of miniaturized devices. The expansion interface group includes a plug-in connector, which can be connected to the high-speed interface group via a flexible board or other boards. The expansion interface group can change the interface form according to the external motherboard requirements and structural height requirements, improving the flexibility and versatility of the backplane. The second board area is provided with at least one mechanical fixing hole, and the mechanical fixing hole is equipped with a fixing component (such as a screw) to fix the second board area to the external mounting carrier, avoiding poor interface contact due to loosening during use.

[0032] In one embodiment, the single-ended impedance of the first and second board areas is 50Ω, corresponding to a linewidth of 8.5mil. The single-ended impedance of the flexible cable is 50Ω, corresponding to a linewidth of 9mil. The differential impedances of the first board area, the second board area, and the flexible cable are 90Ω and 100Ω, respectively. The 90Ω impedance corresponds to a linewidth combination of 7mil / 6mil (i.e., a linewidth of 7mil and a signal line spacing of 6mil), and the 100Ω impedance corresponds to a linewidth combination of 6mil / 6mil. The impedance control requirements for each area are consistent to ensure no impedance abrupt changes during high-speed signal transmission, reducing signal reflection and attenuation. The outer surface of the backplane is covered with a three-proof coating (such as acrylic resin or silicone resin), which effectively isolates interference factors such as humidity, dust, and temperature changes in the external environment, improving the backplane's environmental resistance and adapting to harsh working environments.

[0033] In one embodiment, the power transmission path of the first board area is as follows: external power supply, synchronization module and power connector, internal power wiring of the first board area, motherboard docking part, and external motherboard. The path is clear and orderly, avoiding mutual interference between power transmission and signal transmission and ensuring stable power supply. The high-speed signal transmission path is as follows: first board area, flexible cable, second board area, high-speed interface group / expansion interface group, and external device, realizing direct transmission of high-speed signals without interconnection, reducing signal breakpoints and reducing transmission loss.

[0034] The following description, in conjunction with a preferred embodiment, illustrates the content involved in the above embodiments.

[0035] A VPX rigid-flex backplane includes a first board area, a second board area, and a flexible cable. The first board area has two rear-facing J0 modules, a JL-type power connector, and a front-facing motherboard signal interface on one side. The second board area has three high-speed interface groups on one side and a mating connector on the other side, allowing connection to the high-speed interface groups via a rigid-flex board or other boards. The first board area is made of 18 layers of board material with a thickness of 4mm; the second board area is made of 12 layers of board material with a thickness of 1.4mm; the flexible cable is made of 4 layers of board material with a thickness of 0.5mm, possessing slight bending characteristics to buffer stress during backplane insertion and removal. The remaining space in the second board area houses functional chips and has six mechanical mounting holes.

[0036] The embodiments of this utility model have been described in detail above, but the content described is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made in accordance with the claims of this utility model should still fall within the patent coverage of this utility model.

Claims

1. A rigid-flex VPX backplane, characterized in that, include: The first board area includes up to 18 layers of board material with a thickness of 3.8mm to 4.2mm. The first board area is provided with a power auxiliary module, a power connector and a motherboard signal interface. The second board area includes up to 12 layers of board material with a thickness of 1.3mm to 1.5mm. A high-speed interface group is provided on one side of the second board area, and an expansion interface group is provided on the other side. A flexible cable is used to connect the first board area and the second board area. The flexible cable includes up to four layers of board material with a thickness of 0.48 mm to 0.52 mm.

2. The VPX rigid-flex backplane according to claim 1, characterized in that: The flexible cable is a flexible printed circuit board.

3. The VPX rigid-flex backplane according to claim 1, characterized in that: The power auxiliary module and the power connector are located on the side of the first board area away from the external motherboard.

4. The VPX rigid-flex backplane according to claim 1 or 3, characterized in that: The motherboard signal interface is located on the side of the first board area facing the external motherboard.

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