A press device for multilayer circuit board production

Abstract

The utility model discloses a kind of pressing device for multilayer circuit board production, it includes machine body, the machine body top is closely contacted with second hydraulic rod, the lower end of the second hydraulic rod is fixedly connected with first mould, the first mould is fixedly connected with pressing plate. Through the above structure, machine body inside is fixedly connected with turnover plate, turnover plate is closely contacted with isolation plate, second mould is arranged in the upper and lower of turnover plate, first rotating shaft is fixedly connected with one end of turnover plate, by being set up, die can be flexibly replaced, so that it is greatly shortened die replacement time, equipment utilization is improved, guaranteeing pressing parameter stability, improving product yield, the inside of machine body bottom is provided with second rotating shaft, fan is connected with the inside of second rotating shaft upper side, the inside both sides of machine body are fixedly connected with refrigerating plate, cooling device is set, so that it is greatly shortened die cooling time, improve die change efficiency, reduce operation risk, prolong die service life.

Description

Technical Field

[0001] This utility model relates to the field of multilayer circuit board technology, and in particular to a pressing device for the production of multilayer circuit boards. Background Technology

[0002] Multilayer circuit boards are core basic components of the electronic information industry. They are formed by bonding multiple inner circuit boards and prepregs under high temperature and pressure to form an integrated structure, which can achieve high-density circuit interconnection in a limited space. At present, multilayer circuit boards are widely used in consumer electronics, industrial control, aerospace and other fields. As downstream industries continue to increase their requirements for circuit density, signal transmission efficiency and reliability, their market demand and technical complexity are constantly growing. In the entire production process of multilayer circuit boards, the lamination process is the key step that determines product performance and yield.

[0003] However, most existing technologies lack flexible mold replacement, resulting in excessively long changeover times, high equipment idle rates, poor production continuity, large capacity fluctuations, high operational risks, significant safety hazards, unstable pressing parameters, and low product yield. Furthermore, the lack of rapid cooling after structural completion leads to excessively long cooling times, significantly extending the overall mold changeover cycle, wasting the advantages of parallel mold changeover, rendering the flipping plate useless, drastically increasing operational risks, highlighting safety hazards, shortening mold life, increasing pressing failure rates, and causing a surge in overall costs. Utility Model Content

[0004] The purpose of this utility model is to at least solve one of the technical problems existing in the prior art, and to provide a pressing device for the production of multilayer circuit boards. By setting up a flexible mold replacement device, the mold replacement time is greatly shortened, the equipment utilization rate is improved, the production interruption is reduced, the production capacity is ensured, the operational risk is reduced, the production safety is improved, the pressing parameters are kept stable, and the product yield is improved. At the same time, a cooling device is set up to greatly shorten the mold cooling time, improve the mold replacement efficiency, reduce the operational risk, eliminate the hidden dangers of high temperature operation, reduce thermal stress damage, and extend the service life of the mold.

[0005] This utility model also provides a pressing device for multilayer circuit board production, comprising a machine body, a second hydraulic rod in close contact with the top of the machine body, a first mold fixedly connected to the lower end of the second hydraulic rod, a pressure plate fixedly connected to the first mold, a flipping plate fixedly connected inside the machine body, an isolation plate in close contact with the flipping plate, second molds arranged above and below the flipping plate, a first rotating shaft fixedly connected to one end of the flipping plate, a first motor fixedly connected to one end of the first rotating shaft, a second rotating shaft arranged on the inner side of the bottom of the machine body, a fan connected to the inner side above the second rotating shaft, and cooling plates fixedly connected to both sides of the interior of the machine body, the cooling plates being located below the second molds.

[0006] According to the present invention, a pressing device for multilayer circuit board production is provided, wherein a second support frame is fixedly connected to one end of the first motor, and the second support frame is fixedly connected to the outside of the machine body.

[0007] According to the present invention, a pressing device for multilayer circuit board production is provided, wherein a second hydraulic column is fixedly connected above the second hydraulic rod, a third support frame is fixedly connected to the second hydraulic column, and the third support frame is fixedly connected above the machine body.

[0008] According to the present invention, a pressing device for multilayer circuit board production is provided, wherein a heating plate is fixedly connected between the second mold and the flipping plate, and the second mold is threadedly connected with four bolts.

[0009] According to the present invention, a pressing device for multilayer circuit board production has two slots on the upper part of the second mold and two inserts fixedly connected to the lower part of the first mold.

[0010] According to the present invention, a pressing device for multilayer circuit board production is provided, wherein a transparent glass door is fixedly connected to the bottom of the machine body.

[0011] According to the present invention, a pressing device for multilayer circuit board production is provided, wherein a first hydraulic rod is fixedly connected to the left side of the machine body, the right end of the first hydraulic rod is in close contact with a movable plate, a first hydraulic column is fixedly connected to the left end of the first hydraulic rod, the first hydraulic column is fixedly connected to a first support frame, and the first support frame is fixedly connected to the outside of the machine body.

[0012] According to the present invention, a pressing device for multilayer circuit board production is provided, wherein a second motor is fixedly connected to the lower end of the second rotating shaft, the second motor is fixedly connected to a fourth support frame, and the fourth support frame is fixedly connected to the bottom of the machine body.

[0013] Beneficial effects:

[0014] 1. The machine body is fixedly connected to a flip plate, which is in close contact with an isolation plate. Second molds are set above and below the flip plate. A first rotating shaft is fixedly connected to one end of the flip plate, and a first motor is fixedly connected to one end of the first rotating shaft. The molds can be flexibly replaced, which greatly shortens the mold replacement time, improves equipment utilization, reduces production interruption, ensures continuous production capacity, reduces operational risks, improves production safety, ensures stable pressing parameters, and improves product yield.

[0015] 2. A second rotating shaft is provided on the inner side of the bottom of the machine body. A fan is connected to the inner side above the second rotating shaft. Cooling plates are fixedly connected to both sides of the inside of the machine body. The cooling plates are located below the second mold. By setting up a cooling device, the mold cooling time is greatly shortened, the mold changing efficiency is improved, the operational risk is reduced, the hidden dangers of high temperature operation are eliminated, thermal stress damage is reduced, and the service life of the mold is extended. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 This is a perspective view of a laminating device for multilayer circuit board production according to the present invention.

[0018] Figure 2 This is a front view of a laminating device for multilayer circuit board production according to the present invention.

[0019] Figure 3 This is a top view of a laminating device for multilayer circuit board production according to the present invention;

[0020] Figure 4 In this utility model Figure 1 Enlarged view of point A in the middle;

[0021] Figure 5 In this utility model Figure 1 Enlarged view of point B in the middle.

[0022] Legend:

[0023] 1. Body; 2. Isolation plate; 3. Flip-over plate; 4. Transparent glass door; 5. Movable plate; 6. First hydraulic rod; 7. First hydraulic column; 8. First support frame; 9. First rotating shaft; 10. First motor; 11. Second support frame; 12. Third support frame; 13. Second hydraulic column; 14. Second hydraulic rod; 15. First mold; 16. Insert block; 17. Second mold; 18. Slot; 19. Bolt; 20. Heating plate; 21. Cooling plate; 22. Fan; 23. Second rotating shaft; 24. Second motor; 25. Pressure plate; 26. Fourth support frame. Detailed Implementation

[0024] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0025] Reference Figure 1-5This utility model discloses a pressing device for multilayer circuit board production, comprising a body 1, a second hydraulic rod 14 in close contact with the top of the body 1, a first mold 15 fixedly connected to the lower end of the second hydraulic rod 14, a pressure plate 25 fixedly connected to the first mold 15, a flipping plate 3 fixedly connected inside the body 1, an isolation plate 2 in close contact with the flipping plate 3, a second mold 17 provided above and below the flipping plate 3, a first rotating shaft 9 fixedly connected to one end of the flipping plate 3, a first motor 10 fixedly connected to one end of the first rotating shaft 9, a second rotating shaft 23 provided on the inner side of the bottom of the body 1, a fan 22 connected to the inner side above the second rotating shaft 23, and cooling plates 21 fixedly connected to both sides of the interior of the body 1, the cooling plates 21 being located below the second mold 17.

[0026] Specifically, the second mold 17 is fixed to the flip plate 3 by bolts 19.

[0027] The first motor 10 is fixedly connected to a second support frame 11 at one end, and the second support frame 11 is fixedly connected to the outside of the machine body 1.

[0028] Specifically, the working principle of hydraulic transmission is mainly based on Pascal's principle, which states that in a closed liquid system, the pressure applied to the liquid will be evenly transmitted to all parts of the liquid. Under the action of hydraulic transmission, the second hydraulic column 13 drives the second hydraulic rod 14 and the pressure plate 25 to move up and down, so that the extruded material can be formed.

[0029] A second hydraulic column 13 is fixedly connected above the second hydraulic rod 14, and a third support frame 12 is fixedly connected to the second hydraulic column 13. The third support frame 12 is fixedly connected above the machine body 1.

[0030] Specifically, the core working principle of the heating plate 20 is the directional conversion of electrical energy into heat energy. The input electrical energy is converted into heat energy through a specific heating element, and then transferred to the heated object through heat transfer. At the same time, the temperature is precisely controlled by the temperature control system to ensure that the heating process is safe and stable. The heating plate 20 heats the second mold 17, so that the materials inside the mold are permanently bonded into a whole.

[0031] A heating plate 20 is fixedly connected between the second mold 17 and the flipping plate 3, and the second mold 17 is threaded with four bolts 19.

[0032] Specifically, under the action of hydraulic transmission, the first hydraulic column 7 pushes the movable plate 5 through the first hydraulic rod 6. The contact surfaces of the movable plate 5 and the second mold 17 are magnetic contact surfaces that attract each other, which can achieve a tight fit. When the movable plate 5 completely closes the second mold 17, the first hydraulic rod 6 will retract and leave the movable plate 5.

[0033] Two slots 18 are provided on the upper part of the second mold 17, and two inserts 16 are fixedly connected to the lower part of the first mold 15.

[0034] Specifically, the first motor 10 drives the first rotating shaft 9 to rotate, causing the flip plate 3 to rotate. By rotating the flip plate 3, the mold can be changed quickly and flexibly, which greatly shortens the mold change time, improves equipment utilization, reduces production interruption, ensures continuous production capacity, reduces operational risks, improves production safety, ensures stable pressing parameters, and improves product yield.

[0035] A transparent glass door 4 is fixedly connected to the bottom of the main body 1.

[0036] Specifically, the second motor 24 drives the second rotating shaft 23 to rotate, causing the fan 22 to rotate and utilize strong air convection for heat dissipation.

[0037] A first hydraulic rod 6 is fixedly connected to the left side of the machine body 1. The right end of the first hydraulic rod 6 is in close contact with a movable plate 5. A first hydraulic column 7 is fixedly connected to the left end of the first hydraulic rod 6. A first support frame 8 is fixedly connected to the first hydraulic column 7. The first support frame 8 is fixedly connected to the outside of the machine body 1.

[0038] Specifically, the working principle of the cooling plate 21 is based on the thermoelectric effect. It achieves heat transfer through the directional heat transport of semiconductor materials. Its core is to use current to drive heat to move from the low temperature region to the high temperature region, thereby achieving the purpose of cooling. The cooling plate 21 cools the internal pressing cavity of the machine body 1, thereby achieving rapid cooling of the replacement second mold 17, which greatly shortens the mold cooling time, improves mold changing efficiency, reduces operational risks, eliminates the hidden dangers of high temperature operation, reduces thermal stress damage, and extends the service life of the mold.

[0039] The lower end of the second rotating shaft 23 is fixedly connected to the second motor 24, and the second motor 24 is fixedly connected to the fourth support frame 26, which is fixedly connected to the lower part of the machine body 1.

[0040] Specifically, the second mold 17 and the first mold 15 are connected by a slot 18 and a plug 16.

[0041] Working principle: First, the multilayer circuit board to be pressed is placed into the second mold 17 above the flip plate 3. Then, the second mold 17 is fixed to the flip plate 3 with bolts 19. Under the action of hydraulic transmission, the second hydraulic column 13 drives the second hydraulic rod 14 and the pressure plate 25 to move up and down. The second mold 17 and the first mold 15 are connected by slots 18 and inserts 16, which allows the extruded material to be formed. The heating plate 20 between the second mold 17 and the flip plate 3 is activated. The heating plate 20 heats and keeps the interior of the second mold 17 warm. During the process, the semi-cured sheet melts and becomes sticky, laying the foundation for interlayer bonding. Under the action of hydraulic transmission, the first hydraulic column 7 pushes the movable plate 5 through the first hydraulic rod 6. The contact surfaces of the movable plate 5 and the second mold 17 above each other attract each other. The magnetic contact surface allows for a tight fit. Once the movable plate 5 completely closes the second mold 17, the first hydraulic rod 6 retracts away from the movable plate 5, activating the first motor 10 on the second support frame 11. The first motor 10 drives the first rotating shaft 9 and the flipping plate 3 to rotate 180°. The spare second mold 17 below the flipping plate 3 rotates to the pressing station, while the mold already in use above rotates to the cooling station. Then, the second motor 24 drives the second rotating shaft 23 to rotate, causing the fan 22 to rotate. Strong air convection is used for heat dissipation, and the cooling plate 21 cools the pressing cavity inside the machine body 1, achieving rapid cooling of the replaced second mold 17. This significantly shortens the mold cooling time, improves mold changing efficiency, reduces operational risks, eliminates the hidden dangers of high-temperature operation, reduces thermal stress damage, and extends the service life of the mold.

[0042] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A laminating apparatus for multilayer circuit board production, comprising a body (1), characterized in that: The top of the machine body (1) is in close contact with a second hydraulic rod (14), the lower end of the second hydraulic rod (14) is fixedly connected to a first mold (15), the first mold (15) is fixedly connected to a pressure plate (25), the inside of the machine body (1) is fixedly connected to a flip plate (3), the flip plate (3) is in close contact with an isolation plate (2), the top and bottom of the flip plate (3) are provided with second molds (17), one end of the flip plate (3) is fixedly connected to a first rotating shaft (9), one end of the first rotating shaft (9) is fixedly connected to a first motor (10), the bottom inner side of the machine body (1) is provided with a second rotating shaft (23), the upper inner side of the second rotating shaft (23) is connected to a fan (22), the inside of the machine body (1) is fixedly connected to both sides of the inside of the machine body (1), the cooling plate (21) is located below the second mold (17).

2. The laminating device for multilayer circuit board production according to claim 1, characterized in that, The first motor (10) is fixedly connected to a second support frame (11) at one end, and the second support frame (11) is fixedly connected to the outside of the machine body (1).

3. The laminating device for multilayer circuit board production according to claim 1, characterized in that, A second hydraulic column (13) is fixedly connected above the second hydraulic rod (14), and a third support frame (12) is fixedly connected to the second hydraulic column (13). The third support frame (12) is fixedly connected above the machine body (1).

4. The laminating device for multilayer circuit board production according to claim 1, characterized in that, A heating plate (20) is fixedly connected between the second mold (17) and the flipping plate (3), and the second mold (17) is threaded with four bolts (19).

5. A laminating device for multilayer circuit board production according to claim 1, characterized in that, The second mold (17) has two slots (18) on its upper part, and the first mold (15) has two plugs (16) fixedly connected to its lower part.

6. A laminating apparatus for multilayer circuit board production according to claim 1, characterized in that, A transparent glass door (4) is fixedly connected to the bottom of the body (1).

7. A laminating apparatus for multilayer circuit board production according to claim 1, characterized in that, A first hydraulic rod (6) is fixedly connected to the left side of the machine body (1). The right end of the first hydraulic rod (6) is in close contact with a movable plate (5). A first hydraulic column (7) is fixedly connected to the left end of the first hydraulic rod (6). A first support frame (8) is fixedly connected to the first hydraulic column (7). The first support frame (8) is fixedly connected to the outside of the machine body (1).

8. A laminating apparatus for multilayer circuit board production according to claim 1, characterized in that, The second rotating shaft (23) is fixedly connected to the lower end of the second motor (24), and the second motor (24) is fixedly connected to the fourth support frame (26), which is fixedly connected to the lower part of the machine body (1).

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