Digital cockpit host and vehicle

CN224852439UActive Publication Date: 2026-10-13ECARX (HUBEI) TECHCO LTD
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Patent Information

Application Number
CN202522427283.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-17
Publication Date
2026-10-13
Estimated Expiration
2035-11-17

AI Technical Summary

Technical Problem

[0003]然而,为了满足EMC(ElectroMagnetic Compatibility,电磁兼容性)要求,目前的数字座舱主机的外壳上开设的通常是小尺寸的进风口和小尺寸的出风口,无法很好地满足散热需求

Benefits of technology

[0027]根据本申请实施例提供的技术方案,可选的,在所述下盖远离所述进风口的区域开设有多个蜂窝状的出风孔;

✦ Generated by Eureka AI based on patent content.

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  • Figure CN224852439U_ABST
    Figure CN224852439U_ABST
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Abstract

The application provides a digital cockpit host and a vehicle, the digital cockpit host comprising: an upper shell, a radiator, an air inlet plate, a mainboard and a lower cover; wherein the upper shell is a die casting, the upper shell is provided with an air inlet and an air outlet; the air inlet plate is a sheet metal part, a plurality of honeycomb-shaped first air inlet holes are formed in the air inlet plate, the opening rate of the first air inlet holes is greater than the allowable opening rate of the upper shell; the air inlet plate is fixedly connected at the air inlet of the upper shell; the mainboard is arranged below the radiator; the lower cover is assembled with the upper shell to form a cavity, and the radiator and the mainboard are installed in the cavity. By forming a large-sized air inlet on the host upper shell, and arranging the air inlet plate to be detachably connected with the air inlet, and the air inlet plate being a sheet metal part, the opening is facilitated and the opening rate is greater than that of the die casting, so that the electromagnetic interference signals entering the shell from the air inlet are effectively isolated while meeting the heat dissipation requirement.
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Description

Technical Field

[0001] This application relates to the field of digital cockpit main unit technology, specifically to a digital cockpit main unit and vehicle. Background Technology

[0002] Due to limited cockpit space, the size of the digital cockpit head unit (DHU) is restricted. Therefore, in terms of heat dissipation, the DHU cannot use a large fan, resulting in limited airflow. To meet the heat dissipation requirements, the size of the air inlet and outlet needs to be increased.

[0003] However, in order to meet EMC (Electromagnetic Compatibility) requirements, current digital cockpit main units typically have small air inlets and outlets on their casings, which cannot adequately meet heat dissipation needs.

[0004] In view of the above, this application is hereby submitted. Utility Model Content

[0005] This application aims to provide a digital cockpit main unit that meets heat dissipation requirements, takes into account EMC requirements, and helps extend the service life of the digital cockpit main unit casing.

[0006] In a first aspect, embodiments of this application provide a digital cockpit main unit, including:

[0007] Top case, heat sink, air intake plate, motherboard, and bottom cover;

[0008] The upper shell is a die-cast part, and an air inlet and an air outlet are provided on the upper shell;

[0009] The air inlet plate is a sheet metal part with multiple honeycomb-shaped first air inlet holes. The air inlet plate is fixedly connected to the air inlet of the upper shell. The opening ratio of the first air inlet holes is greater than the allowable opening ratio of the upper shell.

[0010] The motherboard is located below the heatsink;

[0011] The lower cover and the upper shell are assembled to form a cavity, and the heat sink and the motherboard are installed in the cavity.

[0012] Optionally, the technical solution provided in the embodiments of this application may also include a conductive element;

[0013] The two opposite outer walls of the radiator extend beyond the heat dissipation fins of the radiator, and the extended portions of the two opposite outer walls are close to the air inlet.

[0014] The conductive element is disposed on the motherboard. The conductive element is U-shaped and is located between the bottom surface of the motherboard and the motherboard, where the portions extending from the two opposite outer walls face each other. The conductive element is connected to the grounding terminal of the motherboard.

[0015] Optionally, the technical solution provided in the embodiments of this application may also include: an intake fan;

[0016] The intake fan is fixed to one end of the radiator near the air inlet and is positioned between the portions extending from the two opposite outer wall surfaces.

[0017] According to the technical solution provided in the embodiments of this application, optionally, the conductive element is any one of the following:

[0018] Conductive foam, conductive rubber, conductive silicone, and metal shielding mesh.

[0019] Optionally, the technical solutions provided in the embodiments of this application may also include...

[0020] Air outlet panel;

[0021] The air outlet plate is a sheet metal part with multiple honeycomb-shaped air outlet holes. The air outlet plate is fixedly connected to the air outlet of the upper shell.

[0022] According to the technical solution provided in the embodiments of this application, optionally, it also includes: an exhaust fan;

[0023] The exhaust fan is fixed to one end of the radiator near the air outlet.

[0024] According to the technical solution provided in the embodiments of this application, optionally, the upper shell has a honeycomb-shaped second air inlet hole at a position near the air inlet, and the opening ratio of the second air inlet hole is less than the opening ratio of the first air inlet hole.

[0025] Optionally, a backplate may also be included in the technical solution provided in the embodiments of this application;

[0026] The back panel has multiple honeycomb-shaped air vents and openings that match the interface components of the motherboard.

[0027] According to the technical solution provided in the embodiments of this application, optionally, a plurality of honeycomb-shaped air outlet holes are provided in the area of ​​the lower cover away from the air inlet;

[0028] Multiple honeycomb-shaped air outlets are provided in the area of ​​the upper shell away from the air inlet.

[0029] Secondly, based on the same inventive concept, this application also provides a vehicle, which is equipped with a digital cockpit host provided in any embodiment.

[0030] In summary, this application proposes a digital cockpit main unit, comprising: an upper shell, a heat sink, an air inlet plate, a main board, and a lower cover; wherein, the upper shell is a die-cast part, and the upper shell has an air inlet and an air outlet; the air inlet plate is a sheet metal part, and has multiple honeycomb-shaped first air inlets, the air inlet plate being fixedly connected to the air inlets of the upper shell; the opening ratio of the first air inlets is greater than the allowable opening ratio of the upper shell; the main board is located below the heat sink; the lower cover is assembled with the upper shell to form a cavity, and the heat sink and the main board are installed in the cavity. By opening a relatively large air inlet on the upper shell of the main unit, and setting the air inlet plate to be detachably connected to the air inlet, and the air inlet plate being a sheet metal part, which facilitates opening holes and has an opening ratio greater than that of die-cast parts, the heat dissipation requirements are met while effectively isolating electromagnetic interference signals entering the housing from the air inlet. Furthermore, compared to directly opening numerous small holes on the upper shell, this method helps to extend the service life of the digital cockpit main unit housing. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of a digital cockpit main unit provided in an embodiment of this application. Figure 1 ;

[0032] Figure 2 This is a schematic diagram of the structure of a digital cockpit main unit provided in an embodiment of this application. Figure 2 ;

[0033] Figure 3 This is a schematic diagram of the structure of a heat sink and motherboard in a digital cockpit main unit provided in an embodiment of this application. Figure 1 ;

[0034] Figure 4 This is a schematic diagram of the structure of a heat sink and motherboard in a digital cockpit main unit provided in an embodiment of this application. Figure 2 ;

[0035] Figure 5 This is a schematic diagram of the structure of a digital cockpit main unit provided in an embodiment of this application. Figure 3 ;

[0036] Figure 6 This is a schematic diagram of the structure of a digital cockpit main unit provided in an embodiment of this application. Figure 4 ;

[0037] Figure 7 This is a schematic diagram of the structure of a digital cockpit main unit provided in an embodiment of this application. Figure 5 . Detailed Implementation

[0038] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the relevant utility model and not intended to limit the scope of the utility model. Furthermore, it should be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings.

[0039] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0040] Figure 1 This is a schematic diagram of the structure of a digital cockpit main unit provided in an embodiment of this application. See also... Figure 1 and Figure 5 The digital cockpit main unit includes: an upper shell 1, a radiator 3, an air intake 2, a mainboard 5, and a lower cover 9.

[0041] The upper shell 1 is a die-cast part, and an air inlet 11 and an air outlet are provided on the upper shell 1. Figure 1 (Not shown in the image). The reason for using a die-cast upper shell 1 is that die-cast parts have high structural strength and rigidity, which can better protect their internal components. However, due to process limitations, the opening ratio of die-cast parts is limited. To solve the heat dissipation and electromagnetic compatibility problems, this application proposes a solution. Specifically, a large air inlet 11 and an air outlet (not shown in the image) are provided on the die-cast upper shell 1. Figure 1 (Not shown in the image), the purpose is to meet heat dissipation requirements. The preferred number of air inlets is one, but two or more can also be provided; this embodiment does not impose any restrictions.

[0042] To address electromagnetic compatibility issues, an air intake plate 2 is installed, fixedly connected to the air intake 11 of the upper casing 1, to minimize electromagnetic interference signals entering the host unit from the outside. Simultaneously, to meet heat dissipation requirements, the air intake plate 2 is made of sheet metal, as sheet metal is suitable for having numerous small holes, resulting in a high open area ratio. The open area ratio refers to the total area of ​​holes divided by the total area of ​​the material multiplied by 100%, usually expressed as a percentage, indicating "how many holes are drilled" in the material.

[0043] Specifically, multiple honeycomb-shaped first air inlet holes 21 are formed on the air inlet plate 2; the opening ratio of the first air inlet holes 21 is greater than the allowable opening ratio of the upper shell 1. The upper shell 1 is a die-cast part, and its allowable opening ratio can be the upper limit of the opening ratio on die-cast parts. For die-cast parts, due to the limitations of the die-casting process and the main structure, the upper limit of the allowable opening ratio can be 30% to 50%. For sheet metal parts, the opening ratio is higher, greater than the upper limit of the opening ratio on die-cast parts. For example, the opening ratio of the honeycomb-shaped air inlet holes formed on the air inlet plate of this sheet metal part can be 70% to 90%.

[0044] The motherboard 5 is located below the heat sink 3; the lower cover 9 and the upper shell 1 are assembled to form a cavity, and the heat sink 3 and the motherboard 5 are installed in the cavity.

[0045] and Figure 1 Correspondingly, refer to Figure 2 As shown, the airflow enters the housing of the digital cockpit main unit through the honeycomb-shaped first air inlet 21 on the air inlet plate 2 in the direction indicated by arrow A, and flows out of the housing of the digital cockpit main unit through the air outlet in the direction indicated by arrow B, thereby carrying away the heat inside the digital cockpit main unit and achieving the purpose of heat dissipation for the digital cockpit main unit.

[0046] By creating a relatively large air inlet 11 on the main unit's upper shell 1, the service life of the mold used to manufacture the die-cast upper shell can be increased. Furthermore, an air inlet plate 2 can be installed at the air inlet 11. This air inlet 11 is designed to be disassembled, and since the air inlet plate 2 is a sheet metal part, it can be stamped to form honeycomb-shaped air inlet holes. This facilitates hole opening and allows for a higher opening ratio than the die-cast part (i.e., higher than the allowable opening ratio of the die-cast upper shell 1). Therefore, by disassembling the air inlet, the opening ratio can be increased, effectively isolating electromagnetic interference signals entering the shell from the air inlet 11 while meeting heat dissipation requirements. Simultaneously, compared to directly creating numerous air inlets on the upper shell 1, this approach helps extend the service life of the digital cockpit main unit's outer shell.

[0047] In some embodiments, to further improve electromagnetic compatibility performance, the digital cockpit main unit also includes a conductive component for guiding electromagnetic interference signals entering the main unit from the air inlet or first air inlet to the ground, thereby improving the electromagnetic interference immunity of the digital cockpit control main unit. Specifically, see, for example... Figure 3 The diagram shows the structure of a heat sink and motherboard in a digital cockpit main unit. Two opposing outer walls of the heat sink 3 extend beyond the heat dissipation fins 32, and the extended portions 31 of the two opposing outer walls are close to the air inlet. Figure 3 (Not shown), the portions 31 extending from the two opposing outer walls and the end faces 33 of the heat sink fins 32 form a U-shaped cavity. A conductive element 4 is mounted on the motherboard 5. The conductive element 4 is U-shaped and located between the bottom surface of the motherboard 5 and the motherboard 5, with the portions 31 extending from the two opposing outer walls facing each other. The conductive element 4 is connected to the ground terminal of the motherboard 5. The portions 31 extending from the two opposing outer walls of the heat sink 3, the end faces 33 of the heat sink fins 32, and the conductive element 4 form a U-shaped cavity, effectively protecting the motherboard 5. Simultaneously, it guides electromagnetic interference signals entering the host from the air inlet or the first air inlet hole to the ground terminal, effectively isolating electromagnetic interference signals.

[0048] The conductive element is any one of the following:

[0049] Conductive foam, conductive rubber, conductive silicone, and metal shielding mesh.

[0050] In some implementations, to further improve heat dissipation, the digital cockpit main unit further includes an intake fan to accelerate airflow into the digital cockpit control unit, thereby accelerating heat dissipation. For example... Figure 4 As shown, the intake fan 6 is fixed to one end of the heat sink 3 near the air inlet and is positioned between the portions extending from two opposite outer wall surfaces.

[0051] In some embodiments, to further improve heat dissipation and electromagnetic compatibility performance, the digital cockpit main unit further includes: an air vent 7; the air vent 7 is a sheet metal part with multiple honeycomb-shaped air vents 71, and the air vent 7 is fixedly connected to the air outlet of the upper shell 1; an air vent fan 8; the air vent fan 8 is fixed to the radiator 3 at one end near the air outlet. Figure 5 As shown, the digital cockpit control host includes an upper shell 1, a heat sink 3, an air inlet plate 2, a main board 5, an air inlet fan 6, an air outlet plate 7, an air outlet fan 8, a lower cover 9, and a back plate 10. The back plate 10 has an opening adapted to the interface components of the main board 5. The upper shell 1 has a honeycomb-shaped second air inlet 12 near the air inlet 11, and the opening ratio of the second air inlet 12 is less than that of the first air inlet 21. The upper shell 1 is a die-cast part, and has an air inlet 11 and an air outlet (…). Figure 5 (Not explicitly shown); the air intake plate 2 is a sheet metal part with multiple honeycomb-shaped first air intake holes 21. The air intake plate 2 is fixedly connected to the air intake port 11 of the upper shell 1. The opening ratio of the first air intake holes 21 is greater than the allowable opening ratio of the upper shell 1. The main board 5 is located below the heat sink 3. The lower cover 9 is assembled with the upper shell 1 to form a cavity, and the heat sink 3 and the main board 5 are installed in the cavity.

[0052] In some embodiments, to improve heat dissipation, the back panel of the digital cockpit main unit has multiple honeycomb-shaped air vents and openings that match the interface components of the motherboard. Multiple honeycomb-shaped air vents are also provided on the lower cover in the area away from the air inlet; similarly, multiple honeycomb-shaped air vents are provided on the upper shell in the area away from the air inlet. Correspondingly, see reference... Figure 6 and Figure 7As shown, the digital cockpit main unit includes an upper shell 1, a heat sink 3, an air inlet 11, a motherboard 5, an intake fan 6, a lower cover 9, and a back plate 10. The back plate 10 has multiple honeycomb-shaped air outlets 101 and openings 102 that match the interface components of the motherboard 5. Multiple honeycomb-shaped air outlets 91 are located on the lower cover 9 in the area away from the air inlet 11; multiple honeycomb-shaped air outlets 13 are located on the upper shell 1 in the area away from the air inlet 11. Two opposing outer wall surfaces of the heat sink 3 extend beyond the heat dissipation fins 32 at one end near the air inlet 11; the extended portions 31 of the two opposing outer wall surfaces are close to the air inlet 11, and these extended portions 31 and the end faces 33 of the heat dissipation fins 32 form a U-shaped cavity space. The conductive component 4 is disposed on the motherboard 5 and is located between the two opposite outer wall extensions 31 and the motherboard 5 in a U-shape, forming a cavity. The conductive component 4 is connected to the ground terminal of the motherboard 5 to protect the motherboard 5 and effectively isolate electromagnetic interference signals. The motherboard 5 is disposed below the heat sink 3; the lower cover 9 and the upper shell 1 are assembled to form a cavity, and the heat sink 3 and the motherboard 5 are installed in the cavity.

[0053] When assembling the digital cockpit control unit, firstly, the heat sink 3 is fixed to the upper shell 1 with screws, forming a cavity between the heat sink 3 and the upper shell 1 at the intake fan 6. Then, the intake fan 6 is installed into the cavity, the motherboard 5 is fixed below the heat sink 3, the lower cover 9 is fixed with screws, and finally, the backplate 10 is fixed with screws. The upper shell 1 has a large opening at the intake fan 6 to facilitate heat dissipation. The internal heat sink 3, upper shell 1, motherboard 5, and grounded conductive foam form a cavity, effectively isolating electromagnetic interference signals.

[0054] By opening a relatively large air inlet 11 on the main unit's upper casing 1, the heat dissipation requirements are met to the maximum extent. At the same time, the lower edge of the heat sink 3 near the air inlet 11 is connected to the grounding terminal of the motherboard 5 through a conductive component 4 to achieve grounding, effectively isolating electromagnetic interference signals entering the casing from the air inlet 11, so that the digital cockpit main unit meets EMC requirements.

[0055] By opening a large air inlet in the upper shell 1, not only can the heat dissipation requirements be met, but the service life of the upper shell 1 can also be extended.

[0056] It should be noted that the terminology used in this application is for the purpose of describing specific embodiments only and is not intended to limit the scope of this application. As shown in the specification and claims of this application, unless the context clearly indicates otherwise, words such as "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. The terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, or apparatus. Without further limitations, an element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, or apparatus that includes said element.

[0057] It should also be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," "linked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0058] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this application. The above descriptions are only preferred embodiments of this application. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this utility model, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the concept and technical solution of the utility model to other occasions without modification, should all be considered within the scope of protection of this application.

Claims

1. A digital cockpit main unit, characterized in that, include: Top case, heat sink, air intake plate, motherboard, and bottom cover; The upper shell is a die-cast part, and an air inlet and an air outlet are provided on the upper shell; The air inlet plate is a sheet metal part with multiple honeycomb-shaped first air inlet holes. The air inlet plate is fixedly connected to the air inlet of the upper shell. The opening ratio of the first air inlet holes is greater than the allowable opening ratio of the upper shell. The motherboard is located below the heatsink; The lower cover and the upper shell are assembled to form a cavity, and the heat sink and the motherboard are installed in the cavity.

2. The digital cockpit main unit according to claim 1, characterized in that, It also includes conductive components; The two opposite outer walls of the radiator extend beyond the heat dissipation fins of the radiator, and the extended portions of the two opposite outer walls are close to the air inlet. The conductive element is disposed on the motherboard. The conductive element is U-shaped and is located between the bottom surface of the motherboard and the motherboard, where the portions extending from the two opposite outer walls face each other. The conductive element is connected to the grounding terminal of the motherboard.

3. The digital cockpit main unit according to claim 2, characterized in that, Also includes: Air intake fan; The intake fan is fixed to one end of the radiator near the air inlet and is positioned between the portions extending from the two opposite outer wall surfaces.

4. The digital cockpit main unit according to claim 2, characterized in that, The conductive element is any one of the following: Conductive foam, conductive rubber, conductive silicone, and metal shielding mesh.

5. The digital cockpit main unit according to claim 1, characterized in that, This also includes the air vent; The air outlet plate is a sheet metal part with multiple honeycomb-shaped air outlet holes. The air outlet plate is fixedly connected to the air outlet of the upper shell.

6. The digital cockpit main unit according to claim 1, characterized in that, Also includes: Exhaust fan; The exhaust fan is fixed to one end of the radiator near the air outlet.

7. The digital cockpit main unit according to claim 1, characterized in that, The upper shell has a honeycomb-shaped second air inlet near the air inlet, and the opening ratio of the second air inlet is less than that of the first air inlet.

8. The digital cockpit main unit according to claim 1, characterized in that, It also includes the back panel; The back panel has multiple honeycomb-shaped air vents and openings that match the interface components of the motherboard.

9. The digital cockpit main unit according to claim 1, characterized in that, Multiple honeycomb-shaped air outlets are provided in the area of ​​the lower cover away from the air inlet; Multiple honeycomb-shaped air outlets are provided in the area of ​​the upper shell away from the air inlet.

10. A vehicle, characterized in that, The vehicle is equipped with a digital cockpit main unit as described in any one of claims 1-9.