Sealing assembly, on-board charger and vehicle

CN224852441UActive Publication Date: 2026-10-13SUZHOU INOSA UNITED POWER SYST CO LTD
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Patent Information

Application Number
CN202522524445.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-27
Publication Date
2026-10-13
Estimated Expiration
2035-11-27

AI Technical Summary

Technical Problem

[0004]本实用新型的主要目的是提出一种密封组件、车载充电机以及车辆,旨在解决上述现有的磁性器件的密封方案存在需要增加额外的密封圈压紧工装,导致生产效率低,且成本较高的问题

Benefits of technology

[0015]本实用新型的技术方案通过在磁性集成器件的支架上增设第一压紧件,并在散热装置的散热腔的内侧壁上增设与第一压紧件配合的第二压紧件,将磁性集成器件安装至散热装置的散热腔时,支架上的第一压紧件将与散热腔上的第二压紧件进行压紧配合连接,以在第一压紧件与第二压紧件的压紧配合下即可向引脚安装部与第一过线孔之间的密封圈提供压紧力,使得密封圈密封第一过线孔,这样在灌胶过程中,能够有效避免导热胶从第一过线孔处流出。因此,本方案通过直接采用第一压紧件与第二压紧件的设计来实现密封圈对第一过线孔的密封,省去了密封圈压紧工装的需求,从而解决了现有的磁性器件的密封方案存在需要增加额外的密封圈压紧工装,导致生产效率低,且成本较高的问题。

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Abstract

The utility model discloses a kind of sealing assembly, vehicle-mounted charger and vehicle, it is related to sealing technical field, sealing assembly includes heat dissipation device and magnetic integrated device;Heat dissipation device has heat dissipation cavity, and heat dissipation cavity is equipped with first wire hole;Magnetic integrated device includes magnetic assembly and support;Support is equipped with pin mounting portion, pin mounting portion is correspondingly set with first wire hole, pin mounting portion is equipped with second wire hole, and the pin of magnetic assembly is stretched out heat dissipation cavity via second wire hole and first wire hole;Sealing ring is equipped between pin mounting portion and first wire hole, support is equipped with first compression member, the inner side wall of heat dissipation cavity is equipped with the second compression member cooperation with first compression member, after first compression member and second compression member are connected, provide compression force to sealing ring, to make sealing ring seal first wire hole.This scheme has solved the sealing scheme of the existing magnetic device, needs to increase additional sealing ring compression tooling, leading to the problem of low production efficiency, and cost is higher.
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Description

Technical Field

[0001] This utility model relates to the field of sealing technology, and in particular to a sealing component, an on-board charger, and a vehicle. Background Technology

[0002] With the development of technology, new energy vehicles have been widely promoted. New energy vehicles are divided into pure electric vehicles and hybrid vehicles. Among them, OBC (Onboard Charger), DC-DC (Direct Current-Direct Current Converter), and PDU (Power Distribution Unit) are important components of electric vehicles.

[0003] In related technologies, the magnetic components of the on-board charger are located inside a heat dissipation cavity. The gap between the magnetic components and the heat dissipation cavity is filled with thermally conductive adhesive. The thermally conductive adhesive transfers the heat of the magnetic components to the heat dissipation cavity for heat dissipation. When the magnetic components are installed in the heat dissipation cavity, a through hole is opened on the bottom surface of the heat dissipation cavity so that the pins of the magnetic components can extend out of the through hole and make electrical connections with the external circuit board. In order to prevent the thermally conductive adhesive from overflowing from the through hole into the heat dissipation cavity during the filling process, a sealing ring needs to be set at the through hole. In the prior art, the sealing ring is generally installed on the bracket of the magnetic components. During installation, additional clamping fixtures are required to press the sealing ring to ensure the sealing effect. This solution has low production efficiency and high cost. Utility Model Content

[0004] The main purpose of this invention is to provide a sealing component, an on-board charger, and a vehicle, which aims to solve the problem that the existing sealing solutions for magnetic devices require additional sealing ring clamping fixtures, resulting in low production efficiency and high cost.

[0005] To achieve the above objectives, this utility model proposes a sealing assembly, comprising: A heat dissipation device, wherein the heat dissipation device has a heat dissipation cavity, and the heat dissipation cavity has at least one first wire passage hole; A magnetic integrated device includes a magnetic component and a bracket. The bracket is disposed on one side of the magnetic component and adjacent to the inner side of the heat dissipation cavity where the first wire through hole is provided. The bracket is provided with at least one pin mounting part, which is corresponding to the first wire through hole. The pin mounting part is provided with at least one second wire through hole. The pins of the magnetic component extend out of the heat dissipation cavity through the second wire through hole and the first wire through hole. A sealing ring is provided between the pin mounting part and the first wire passage hole. A first clamping member is provided on the bracket. A second clamping member is provided on the inner wall of the heat dissipation cavity to cooperate with the first clamping member. After the first clamping member and the second clamping member are connected, they provide clamping force to the sealing ring so that the sealing ring seals the first wire passage hole.

[0006] In one embodiment, the pin mounting portion includes a sealing ring mounting portion and a pin guide portion protruding from the sealing ring mounting portion. The pin guide portion has at least one second wire-passing hole, and the pin guide portion passes through the first wire-passing hole.

[0007] In one embodiment, one of the second clamping member and the first clamping member is a buckle, and the other is a slot.

[0008] In one embodiment, multiple buckles are provided, and the multiple buckles are distributed at intervals along the circumference of the bracket. Multiple slots are provided, and the multiple slots are distributed at intervals along the extension direction of the inner sidewall of the heat dissipation cavity. The multiple buckles are arranged in a one-to-one correspondence with the multiple slots.

[0009] In one embodiment, the heat dissipation device includes a U-shaped liquid cooling plate, a water nozzle assembly, and a base plate, wherein the U-shaped liquid cooling plate, the base plate, and the water nozzle assembly enclose the heat dissipation cavity having a top opening; at least one first wire hole is formed on the base plate. The U-shaped liquid cooling plate includes a first heat dissipation section and a second heat dissipation section arranged opposite to each other, a plurality of the buckles are spaced apart on the periphery of the bracket, and a plurality of the slots are spaced apart on the bottom of the first heat dissipation section and the bottom of the second heat dissipation section; After the multiple buckles engage with the multiple slots, the gap between the side of the sealing ring mounting portion facing the base plate and the side of the base plate facing the sealing ring mounting portion is smaller than the thickness of the sealing ring in its natural state, thereby providing a clamping force for the sealing ring installed in the gap.

[0010] In one embodiment, the bracket has a flange around its periphery, and the buckle is disposed on the flange.

[0011] In one embodiment, the magnetic assembly includes at least two magnetic devices, which are integrated together via the support to form the magnetic integrated device.

[0012] In one embodiment, the magnetic device includes: Magnetic core, the magnetic core comprising a winding post; A winding frame, which is sleeved on the winding post; A coil, the coil being wound on the winding frame; The gap between the magnetic core, the coil, the winding frame and the heat dissipation cavity is used for potting thermally conductive adhesive.

[0013] To achieve the above objectives, this utility model also proposes an on-board charger, comprising: chassis; Circuit board; And the sealing components as described above; The circuit board and the sealing assembly are located inside the housing, and the pins of the magnetic integrated device extending from the heat dissipation cavity of the sealing assembly are electrically connected to the circuit on the circuit board.

[0014] To achieve the above objectives, this utility model also proposes a vehicle, characterized in that it includes an on-board charger as described above.

[0015] The technical solution of this utility model adds a first clamping member to the bracket of the magnetic integrated device and a second clamping member that cooperates with the first clamping member to the inner wall of the heat dissipation cavity of the heat dissipation device. When the magnetic integrated device is installed into the heat dissipation cavity of the heat dissipation device, the first clamping member on the bracket will clamp and connect with the second clamping member on the heat dissipation cavity. Under the clamping cooperation of the first clamping member and the second clamping member, a clamping force is provided to the sealing ring between the pin mounting part and the first wire passage hole, so that the sealing ring seals the first wire passage hole. In this way, during the potting process, the thermally conductive adhesive can be effectively prevented from flowing out of the first wire passage hole. Therefore, this solution achieves the sealing of the first wire passage hole by directly using the design of the first clamping member and the second clamping member, eliminating the need for the sealing ring clamping fixture. This solves the problem that existing sealing solutions for magnetic devices require additional sealing ring clamping fixtures, resulting in low production efficiency and high cost. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of an embodiment of the sealing assembly provided by this utility model; Figure 2 A partial exploded view of an embodiment of the sealing assembly provided by this utility model; Figure 3 A cross-sectional view of an embodiment of the sealing assembly provided by this utility model; Figure 4 for Figure 3A magnified view of a section at point A in the middle; Figure 5 A partial exploded view of an embodiment of the sealing assembly provided by this utility model; Figure 6 A schematic diagram of the structure of the magnetic integrated device in one embodiment of the sealing assembly provided by this utility model; Figure 7 An exploded view of the magnetic integrated device in one embodiment of the sealing assembly provided by this utility model.

[0018] Explanation of icon numbers:

[0019] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0021] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0023] With the development of technology, new energy vehicles have been widely promoted. New energy vehicles are divided into pure electric vehicles and hybrid vehicles. Among them, OBC (Onboard Charger), DC-DC (Direct Current-Direct Current Converter), and PDU (Power Distribution Unit) are important components of electric vehicles.

[0024] In related technologies, the magnetic components of the on-board charger are located inside a heat dissipation cavity. The gap between the magnetic components and the heat dissipation cavity is filled with thermally conductive adhesive. The thermally conductive adhesive transfers the heat of the magnetic components to the heat dissipation cavity for heat dissipation. When the magnetic components are installed in the heat dissipation cavity, a through hole is opened on the bottom surface of the heat dissipation cavity so that the pins of the magnetic components can extend out of the through hole and make electrical connections with the external circuit board. In order to prevent the thermally conductive adhesive from overflowing from the through hole into the heat dissipation cavity during the filling process, a sealing ring needs to be set at the through hole. In the prior art, the sealing ring is generally installed on the bracket of the magnetic components. During installation, additional clamping fixtures are required to press the sealing ring to ensure the sealing effect. This solution has low production efficiency and high cost.

[0025] Based on the above problems, this utility model proposes a sealing component 100, which aims to solve the problem that the existing sealing schemes for magnetic devices require additional sealing ring clamping fixtures, resulting in low production efficiency and high cost.

[0026] Please see Figures 1 to 6 In one embodiment of this utility model, the sealing assembly 100 includes a heat dissipation device 10 and a magnetic integrated device 20; the heat dissipation device 10 has a heat dissipation cavity 11, and the heat dissipation cavity 11 has at least one first wire passage hole 111; the magnetic integrated device 20 includes a magnetic component 21 and a bracket 22, the bracket 22 is disposed on one side of the magnetic component 21 and adjacent to the inner side of the heat dissipation cavity 11 where the first wire passage hole 111 is located; the bracket 22 is provided with at least one pin mounting portion 221, the pin mounting portion 221 is correspondingly disposed to the first wire passage hole 111, and the pin mounting portion 221... At least one second wire-passing hole 2211 is provided. The pin 21a of the magnetic component 21 extends out of the heat dissipation cavity 11 through the second wire-passing hole 2211 and the first wire-passing hole 111. A sealing ring 222 is provided between the pin mounting part 221 and the first wire-passing hole 111. A first clamping member 223 is provided on the bracket 22. A second clamping member 112 that cooperates with the first clamping member 223 is provided on the inner side wall of the heat dissipation cavity 11. After the first clamping member 223 and the second clamping member 112 are connected, they provide clamping force to the sealing ring 222 so that the sealing ring 222 seals the first wire-passing hole 111.

[0027] The technical solution of this utility model adds a first clamping member 223 to the bracket 22 of the magnetic integrated device 20 and adds a second clamping member 112 that cooperates with the first clamping member 223 to the inner wall of the heat dissipation cavity 11 of the heat dissipation device 10. When the magnetic integrated device 20 is installed into the heat dissipation cavity 11 of the heat dissipation device 10, the first clamping member 223 on the bracket 22 will be clamped and connected with the second clamping member 112 on the heat dissipation cavity 11. Under the clamping cooperation of the first clamping member 223 and the second clamping member 112, a clamping force can be provided to the sealing ring 222 between the pin mounting part 221 and the first wire hole 111, so that the sealing ring 222 seals the first wire hole 111. In this way, during the potting process, the thermally conductive adhesive can be effectively prevented from flowing out of the first wire hole 111. Therefore, this solution achieves the sealing of the first wire hole 111 by directly using the design of the first clamping member 223 and the second clamping member 112, eliminating the need for the clamping fixture of the sealing ring 222. This solves the problem that the existing sealing solution of the magnetic device 211 requires the addition of an additional clamping fixture of the sealing ring 222, resulting in low production efficiency and high cost.

[0028] In this embodiment, the heat dissipation device 10 is a heat dissipation structure capable of exchanging heat with the thermally conductive adhesive and magnetic component 21 inside the casing. It can absorb the heat generated by the magnetic component 21 during operation through the thermally conductive adhesive, thereby cooling the magnetic component 21. In some embodiments, the heat dissipation device 10 may have water channels inside, which are filled with a heat dissipation medium, such as cooling water or cooling gas.

[0029] In practical applications, the second clamping member 112 and the first clamping member 223 can be a structure of buckle and slot, a structure of bolt and bolt hole, or other structures of mutual clamping, as long as they can provide pre-pressure to the sealing ring 222 under mutual cooperation.

[0030] Please see Figure 2 , Figure 4 In one embodiment of the present invention, the pin mounting portion 221 includes a sealing ring mounting portion 2212 and a pin guide portion 2213 protruding from the sealing ring mounting portion 2212. The pin guide portion 2213 has at least one second wire through hole 2211 and the pin guide portion 2213 passes through the first wire through hole 111.

[0031] With this configuration, during assembly, the sealing ring 222 can be pre-installed on the sealing ring mounting portion 2212 to position it, improving the installation reliability of the sealing ring 222. This prevents the position of the sealing ring 222 from changing during the assembly of the heat sink 10 and the magnetic integrated device 20, which would affect the sealing effect on the first wire passage hole 111. Furthermore, the design of the pin guide portion 2213 facilitates the extension of the pins 21a of the magnetic component 21 through the second wire passage hole 2211 and the first wire passage hole 111 into the heat sink cavity 11.

[0032] Please see Figures 2 to 6 In one embodiment of this utility model, one of the second clamping member 112 and the first clamping member 223 is a buckle, and the other is a slot.

[0033] With this design, by using a snap-fit ​​and slot-fit structure as the second clamping member 112 and the first clamping member 223, during the assembly process, when the magnetic integrated device 20 is installed into the heat dissipation cavity 11 of the heat dissipation device 10, the snap-fit ​​and slot-fit structure directly provides clamping force to the sealing ring 222 between the pin mounting part 221 and the first wire passage hole 111, so that the sealing ring 222 seals the first wire passage hole 111. Therefore, the snap-fit ​​and slot-fit design is not only convenient for assembly, but also eliminates the need for bolt holes, thus eliminating the need for an additional sealing structure for sealing bolt holes and simplifying the structural design.

[0034] In some embodiments, the buckle can be disposed on the bracket 22 and on the inner wall of the heat dissipation cavity 11.

[0035] In other embodiments, the buckle can be disposed on the inner wall of the heat dissipation cavity 11, and the slot can be disposed on the bracket 22.

[0036] Please see Figure 5 In one embodiment of this utility model, multiple buckles are provided, and the multiple buckles are distributed at intervals along the circumference of the bracket 22. Multiple slots are provided, and the multiple slots are distributed at intervals along the extension direction of the inner sidewall of the heat dissipation cavity 11.

[0037] With this configuration, multiple buckles and slots can be used to increase the clamping force provided to the sealing ring 222 through the cooperation of the multiple buckles and slots, thereby improving the sealing effect of the sealing ring 222 on the first wire hole 111.

[0038] Please see Figures 1 to 3In one embodiment of the present invention, the heat dissipation device 10 includes a U-shaped liquid cooling plate 12, a water nozzle assembly 13, and a base plate 14. The U-shaped liquid cooling plate 12, the base plate 14, and the water nozzle assembly 13 enclose a heat dissipation cavity 11 with a top opening. At least one first wire hole 111 is formed on the base plate 14. The U-shaped liquid cooling plate 12 includes a first heat dissipation section 121 and a second heat dissipation section 122 arranged opposite to each other. Multiple buckles are spaced apart around the periphery of the bracket 22, and multiple slots are spaced apart at the bottom of the first heat dissipation section 121 and the bottom of the second heat dissipation section 122. After the multiple buckles engage with the multiple slots, the gap between the side of the sealing ring mounting part 2212 facing the base plate 14 and the side of the base plate 14 facing the sealing ring mounting part 2212 is less than the thickness of the sealing ring 222 in its natural state, thereby providing a clamping force for the sealing ring 222 installed in the gap.

[0039] With this configuration, the magnetic integrated device 20 can be installed in reverse into the heat dissipation cavity 11 formed by the U-shaped liquid cooling plate 12, the base plate 14, and the water nozzle assembly 13. With the engagement of multiple clips and slots, the gap between the side of the sealing ring mounting part 2212 facing the base plate 14 and the side of the base plate 14 facing the sealing ring mounting part 2212 is smaller than the thickness of the sealing ring 222 in its natural state. This provides sufficient clamping force for the sealing ring 222 installed in the gap, thereby fully compressing the sealing ring 222 and improving the sealing effect of the sealing ring 222 on the first wire hole 111.

[0040] In some embodiments, the U-shaped liquid cooling plate 12 further includes a connecting heat dissipation section 123 that connects the first heat dissipation section 121 and the second heat dissipation section 122. The first heat dissipation section 121, the second heat dissipation section 122 and the connecting heat dissipation section 123 can be integrally formed, or they can be connected together by means of bonding, plugging, screwing or other methods.

[0041] Please see Figure 2 , Figure 5 , Figure 6 In one embodiment of this utility model, the bracket 22 has a flange 224 around its periphery, and a buckle is provided on the flange 224.

[0042] This design, by placing the buckle on the flange 224 around the perimeter of the bracket 22, makes it easier to install the buckle while ensuring that the buckle does not affect the original function of the bracket 22.

[0043] Please see Figure 2 In some embodiments, the flange 224 is provided with a clearance hole located on the rear side of the buckle. During the assembly process, the buckle can deform toward the clearance hole. The design of the clearance hole provides clearance space for the buckle's deformation, allowing the buckle to deform more smoothly and achieve installation in conjunction with the slot.

[0044] Please see Figure 2 In one embodiment of the present invention, the magnetic component 21 includes at least two magnetic devices 211, and the at least two magnetic devices 211 are integrated together by a bracket 22 to form a magnetic integrated device 20.

[0045] This design, employing at least two magnetic components 211, enables the circuit to perform multiple functions such as absorption, isolation, filtering, transmission, and energy storage, thereby enhancing the circuit's functionality. Furthermore, by integrating at least two magnetic components 211 together using a bracket 22, the structure's compactness is improved, reducing its size. Simultaneously, the wiring between the individual magnetic components 211 can be shortened, reducing the losses of the magnetic components 211.

[0046] Please see Figure 7 In one embodiment of the present invention, the magnetic device 211 includes a magnetic core 2111, a winding frame 2112, and a coil 2113; the magnetic core 2111 includes a winding post; the winding frame 2112 is sleeved on the winding post; the coil 2113 is wound on the winding frame 2112; the gap between the magnetic core 2111, the coil 2113, the winding frame 2112 and the heat dissipation cavity 11 is used for potting thermally conductive adhesive.

[0047] With this setup, during assembly, the winding frame 2112 can be first placed on the winding post of the magnetic core 2111, and then the coil 2113 can be wound around the winding frame 2112 to form a magnetic device 211. Then, at least two magnetic devices 211 are installed on the bracket 22 to form a magnetic integrated device 20. The magnetic integrated device 20 is then installed into the heat dissipation cavity 11 of the heat dissipation device 10. With the cooperation of the second clamping member 112 and the first clamping member 223, a clamping force is provided to the sealing ring 222 so that the sealing ring 222 effectively seals the first wire hole 111. At the same time, the magnetic integrated device 20 is placed entirely in the heat dissipation cavity 11, so that the gap between the magnetic core 2111, the coil 2113, the winding frame 2112 and the heat dissipation cavity 11 forms a potting cavity. Then, thermally conductive adhesive is poured into the potting cavity, so that the heat generated by the magnetic device 211 can be transferred to the heat dissipation device 10 through the thermally conductive adhesive, so that the heat dissipation device 10 can effectively dissipate heat from the magnetic device 211.

[0048] This utility model also proposes an on-board charger, which includes a housing, a circuit board and a sealing assembly 100. The specific structure of the sealing assembly 100 is as described in the above embodiments. Since this on-board charger adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0049] The circuit board and sealing assembly 100 are located inside the housing, and the pins 21a of the magnetic integrated device 20 extending from the heat dissipation cavity 11 of the sealing assembly 100 are electrically connected to the circuit on the circuit board.

[0050] Understandably, when the magnetic integrated device 20 is first installed into the heat dissipation cavity 11 of the heat dissipation device 10, the first clamping member 223 on the bracket 22 will be clamped and connected with the second clamping member 112 on the heat dissipation cavity 11. Under the clamping and connection of the first clamping member 223 and the second clamping member 112, a clamping force can be provided to the sealing ring 222 between the pin mounting part 221 and the first wire passage hole 111, so that the sealing ring 222 seals the first wire passage hole 111. In this way, during the potting process, the thermally conductive adhesive can be effectively prevented from flowing out of the first wire passage hole 111. Then, the assembled sealing assembly 100 is installed into the housing so that the pins 21a of the sealing assembly 100 extend from the heat dissipation cavity 11 to smoothly achieve electrical connection with the circuit board on the housing.

[0051] This utility model also proposes a vehicle that includes an on-board charger. The specific structure of the on-board charger is as described in the above embodiments. Since this vehicle adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0052] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A sealing assembly, characterized in that, include: A heat dissipation device, wherein the heat dissipation device has a heat dissipation cavity, and the heat dissipation cavity has at least one first wire passage hole; A magnetic integrated device includes a magnetic component and a bracket. The bracket is disposed on one side of the magnetic component and adjacent to the inner side of the heat dissipation cavity where the first wire through hole is provided. The bracket is provided with at least one pin mounting part, which is corresponding to the first wire through hole. The pin mounting part is provided with at least one second wire through hole. The pins of the magnetic component extend out of the heat dissipation cavity through the second wire through hole and the first wire through hole. A sealing ring is provided between the pin mounting part and the first wire passage hole. A first clamping member is provided on the bracket. A second clamping member is provided on the inner wall of the heat dissipation cavity to cooperate with the first clamping member. After the first clamping member and the second clamping member are connected, they provide clamping force to the sealing ring so that the sealing ring seals the first wire passage hole.

2. The sealing assembly as claimed in claim 1, characterized in that, The pin mounting portion includes a sealing ring mounting portion and a pin guide portion protruding from the sealing ring mounting portion. The pin guide portion has at least one second wire through hole, and the pin guide portion passes through the first wire through hole.

3. The sealing assembly as claimed in claim 2, characterized in that, One of the second clamping member and the first clamping member is a buckle, and the other is a slot.

4. The sealing assembly as claimed in claim 3, characterized in that, The bracket has multiple buckles that are spaced apart along its circumference. It also has multiple slots that are spaced apart along the extension direction of the inner sidewall of the heat dissipation cavity. Each buckle corresponds to one of the slots.

5. The sealing assembly as claimed in claim 4, characterized in that, The heat dissipation device includes a U-shaped liquid cooling plate, a water nozzle assembly, and a base plate. The U-shaped liquid cooling plate, the base plate, and the water nozzle assembly together form the heat dissipation cavity with a top opening. At least one first wire hole is formed on the base plate. The U-shaped liquid cooling plate includes a first heat dissipation section and a second heat dissipation section arranged opposite to each other, a plurality of the buckles are spaced apart on the periphery of the bracket, and a plurality of the slots are spaced apart on the bottom of the first heat dissipation section and the bottom of the second heat dissipation section; After the multiple buckles engage with the multiple slots, the gap between the side of the sealing ring mounting portion facing the base plate and the side of the base plate facing the sealing ring mounting portion is smaller than the thickness of the sealing ring in its natural state, thereby providing a clamping force for the sealing ring installed in the gap.

6. The sealing assembly as claimed in claim 5, characterized in that, The bracket has a flange around its perimeter, and the buckle is located on the flange.

7. The sealing assembly as claimed in any one of claims 1 to 6, characterized in that, The magnetic assembly includes at least two magnetic devices, which are integrated together by the bracket to form the magnetic integrated device.

8. The sealing assembly as claimed in claim 7, characterized in that, The magnetic device includes: Magnetic core, the magnetic core comprising a winding post; A winding frame, which is sleeved on the winding post; A coil, the coil being wound on the winding frame; The gap between the magnetic core, the coil, the winding frame and the heat dissipation cavity is used for potting thermally conductive adhesive.

9. An on-board charger, characterized in that, include: chassis; Circuit board; And the sealing assembly as described in any one of claims 1 to 8; The circuit board and the sealing assembly are located inside the housing, and the pins of the magnetic integrated device extending from the heat dissipation cavity of the sealing assembly are electrically connected to the circuit on the circuit board.

10. A vehicle, characterized in that, Includes the on-board charger as described in claim 9.