High power heat sink device

Abstract

The utility model discloses a high -power heat abstractor, to be coupled to a heat source, and contain a heat conduction cavity and an insulating ring body. The heat conduction cavity has a heat absorption surface, a first chamber and a second chamber. The first chamber is closer to the heat absorption surface than the second chamber. The insulating ring body is arranged in the first chamber of the heat conduction cavity, and divides the first chamber into a main heat area and a first heat area that are not communicated. The main heat area is surrounded by the insulating ring body and communicated with the second chamber.

Description

Technical Field

[0001] This utility model relates to a high-power heat dissipation device, and more particularly to a high-power heat dissipation device with two heat dissipation chambers. Background Technology The technical principle of a vapor chamber is similar to that of a heat pipe, but the heat conduction method differs. A heat pipe uses one-dimensional linear heat conduction, while heat in a vapor chamber is conducted over a two-dimensional surface, resulting in higher efficiency. Specifically, a vapor chamber mainly consists of a cavity and a capillary structure. The cavity contains a hollow chamber for filling with a working fluid. The capillary structure is arranged within the hollow chamber. The heated portion of the cavity is called the evaporation zone. The heat dissipation portion is called the condensation zone. The working fluid absorbs heat and vaporizes in the evaporation zone, rapidly expanding throughout the cavity. In the condensation zone, it releases heat and condenses into a liquid state. Then, the liquid working fluid returns to the evaporation zone through the capillary structure, forming a cooling cycle.

[0002] Most vapor chambers and heat pipes operate independently, resulting in individual, planar or linear heat transfer rather than integrated, three-dimensional heat transfer, thus limiting their cooling efficiency. Some manufacturers have integrated vapor chambers and heat pipes to create three-dimensional heat transfer devices. However, the rapid development of technologies requiring high-speed computation, such as artificial intelligence, has led to increasingly higher demands for heat dissipation from electronic components. Current three-dimensional heat transfer devices are unable to handle the heat generated by operating electronic components, making them prone to localized dry burning and functional degradation. Therefore, preventing functional degradation and maintaining the cooling performance of three-dimensional heat transfer devices is one of the problems that researchers need to solve. Utility Model Content

[0003] The present invention provides a high-power heat dissipation device to avoid functional degradation of the high-power heat dissipation device and maintain its heat dissipation efficiency.

[0004] An embodiment of this utility model discloses a high-power heat dissipation device for thermal coupling to a heat source, and includes a heat-conducting cavity and an insulating ring. The heat-conducting cavity has a heat-absorbing surface, a first chamber, and a second chamber. The first chamber is closer to the heat-absorbing surface than the second chamber. The insulating ring is disposed in the first chamber of the heat-conducting cavity, dividing the first chamber into a non-connected main heat zone and a secondary heat zone. The main heat zone is surrounded by the insulating ring and communicates with the second chamber.

[0005] In the aforementioned high-power heat dissipation device, the main heat zone and the secondary heat zone of the first chamber are respectively filled with different types of coolant.

[0006] In the aforementioned high-power heat dissipation device, the freezing point of the coolant in the main heat zone is lower than that of the coolant in the secondary heat zone.

[0007] In the aforementioned high-power heat dissipation device, the coolant filling rate of the main heat zone differs from that of the secondary heat zone.

[0008] In the aforementioned high-power heat dissipation device, the coolant filling rate of the main heat zone is greater than that of the secondary heat zone.

[0009] In the aforementioned high-power heat dissipation device, the area of ​​the main heat zone is greater than or equal to 5% of the area of ​​the heat-absorbing surface and less than or equal to 80% of the area of ​​the heat-absorbing surface.

[0010] In the aforementioned high-power heat dissipation device, the first chamber or the second chamber is provided with a capillary structure, the coolant filling rate of the main heat zone is greater than or equal to 60% of the pore volume of the capillary structure, and the coolant filling rate of the secondary heat zone is greater than or equal to 50% and less than or equal to 130% of the pore volume of the capillary structure.

[0011] The aforementioned high-power heat dissipation device further includes multiple main heat pipes, which are disposed in the heat-conducting cavity and connected to the main heat zones of the second chamber and the first chamber.

[0012] In the aforementioned high-power heat dissipation device, the heat-conducting cavity further comprises a first region located above the heat-absorbing surface, and at least one of the main heat pipes is located outside the first region.

[0013] The aforementioned high-power heat dissipation device further includes multiple secondary heat pipes, which are disposed in the heat-conducting cavity and connected to the secondary heat zone of the first chamber.

[0014] In the aforementioned high-power heat dissipation device, the heat-conducting cavity further comprises a first region located above the heat-absorbing surface, and the secondary heat pipes are configured to be completely disposed within the first region, completely disposed outside the first region, or partially disposed within the first region and partially disposed outside the first region.

[0015] In the aforementioned high-power heat dissipation device, at least one of the main heat pipes is located on one side of the heat-conducting cavity along its long axis.

[0016] In the aforementioned high-power heat dissipation device, the heat-conducting cavity has an air inlet side edge, the main heat zone heat pipes are located on the side of the heat-conducting cavity near the air inlet side edge in the long axis direction, and the distance from the main heat zone heat pipe closest to the air inlet side edge to the air inlet side edge is less than or equal to one-third of the long axis length of the heat-conducting cavity.

[0017] In the aforementioned high-power heat dissipation device, portions of the main heat pipes are located on the side of the heat-conducting cavity near the air inlet edge in the long axis direction.

[0018] The aforementioned high-power heat dissipation device further includes multiple main heat zone heat pipes, at least one of which is disposed in the heat-conducting cavity and connected to the main heat zone of the first chamber, and the number of the main heat zone heat pipes located on the side of the heat-conducting cavity near the air inlet edge in the long axis direction is greater than or equal to 10% of the total number of the main heat zone heat pipes and the secondary heat zone heat pipes.

[0019] In the aforementioned high-power heat dissipation device, the heat-conducting cavity includes a first heat-conducting shell, a second heat-conducting shell, and at least one partition plate. The at least one partition plate is located between the first heat-conducting shell and the second heat-conducting shell, and the first heat-conducting shell, the second heat-conducting shell, and the at least one partition plate are assembled to form a first chamber and a second chamber located on opposite sides of the at least one partition plate. The heat-absorbing surface is located on the side of the first heat-conducting shell away from the second heat-conducting shell. The partition plate has at least one opening. The at least one insulating ring is located in the first chamber, and the opposite sides of the at least one insulating ring are respectively connected to the first heat-conducting shell and the at least one partition plate to divide the first chamber into the main heat zone and the secondary heat zone. The main heat zone is connected to the second chamber through the at least one opening.

[0020] In the aforementioned high-power heat dissipation device, the thickness of the at least one partition plate is greater than or equal to 0.1 mm and less than or equal to 5 mm.

[0021] In the aforementioned high-power heat dissipation device, both the first chamber and the second chamber are provided with a capillary structure.

[0022] In the aforementioned high-power heat dissipation device, only the secondary heat zone of the first chamber is provided with a capillary structure.

[0023] According to the high-power heat dissipation device of the above embodiment, when the heat source power is low, the main heat zone and the secondary heat zone separated by the isolation ring are sufficient to dissipate heat from the heat source. When the heat source power is high, since the main heat zone, which deheats the area with the highest heat density in the heat source, is connected to the second chamber stacked in the first chamber, the coolant located in the second chamber can flow into the center of the main heat zone to jointly dissipate heat from the heat source, thus avoiding localized dry burning of the main heat zone due to hot spots. In this way, the high-power heat dissipation device can avoid localized dry burning and functional degradation, thereby maintaining the heat dissipation efficiency of the high-power heat dissipation device. This makes the high-power heat dissipation device suitable for heat sources such as higher-power chips or localized hot spots in a single chip.

[0024] The above description of the present utility model and the following description of the embodiments are used to demonstrate and explain the principle of the present utility model, and to provide a further explanation of the scope of the patent application of the present utility model. Attached Figure Description

[0025] Unless otherwise stated, the drawings illustrate the appearance of the novel object described in this utility model. Referring to the drawings, where the same element symbols denote similar parts in multiple views, examples of multiple liquid cooling systems, cooling circuits, and flexible tubes incorporating the principles currently disclosed are illustrated by way of example rather than limitation.

[0026] Figure 1 This is a perspective view of the high-power heat dissipation device according to the first embodiment of the present invention.

[0027] Figure 2 for Figure 1 An exploded view of a high-power heat dissipation device.

[0028] Figure 3 for Figure 1 A partially enlarged three-dimensional schematic diagram of a high-power heat dissipation device.

[0029] Figure 4 for Figure 1 A partially enlarged exploded view of a high-power heat dissipation device.

[0030] Figure 5 for Figure 1 A plan view of the heat-conducting cavity of a high-power heat dissipation device.

[0031] Figure 6 for Figure 1 A plan view of a high-power heat dissipation device.

[0032] Figure 7 For along Figure 6 A cross-sectional view of a high-power heat dissipation device along section 7-7.

[0033] Figure 8 for Figure 1 A cross-sectional schematic diagram of the flow of two coolants in the first and second chambers of a high-power heat dissipation device.

[0034] Figure 9 This is an exploded view of the high-power heat dissipation device according to the second embodiment of the present invention.

[0035] Figure 10 for Figure 9 A partially enlarged three-dimensional schematic diagram of a high-power heat dissipation device.

[0036] Figure 11 for Figure 9A partially enlarged exploded view of a high-power heat dissipation device.

[0037] Figure 12 for Figure 9 A plan view of the heat-conducting cavity of a high-power heat dissipation device.

[0038] Figure 13 for Figure 9 A plan view of a high-power heat dissipation device.

[0039] Figure 14 For along Figure 13 A cross-sectional view of a high-power heat dissipation device along section 14-14.

[0040] The attached figures are labeled as follows: 10,10A: High-power heat dissipation device 11,11A: Thermally conductive cavity 111: First heat-conducting shell 112: Second heat-conducting shell 113, 113A: Divider 1131, 1131A: Opening 114: Heat-absorbing surface 115: Inlet side edge 12,12A: Isolation ring 13: Main heat pipe 14: Subthermal heat pipe 15: Capillary structure 16: Support column A~J: Direction H1: Heat source L: Long axis S1, S1A: First chamber S11, S11A: Main hot zone S12, S12A: Subthermal zone S2: Second chamber Detailed Implementation Please see Figure 1 and Figure 2 . Figure 1 This is a perspective view of a high-power heat dissipation device according to an embodiment of the present invention. Figure 2 for Figure 1 An exploded view of a high-power heat dissipation device.

[0041] The high-power heat dissipation device 10 of this embodiment is used for thermal coupling to a heat source (not shown). The heat source is, for example, a high-power chip or a local hot spot in a single chip. The high-power heat dissipation device 10 includes a heat-conducting cavity 11, an insulating ring 12, multiple main heat pipes 13 and multiple secondary heat pipes 14. The heat-conducting cavity 11 includes a first heat-conducting shell 111, a second heat-conducting shell 112 and a partition plate 113.

[0042] Please refer to the following: Figure 3 and Figure 4 . Figure 3 for Figure 1 A partially enlarged three-dimensional schematic diagram of a high-power heat dissipation device. Figure 4 for Figure 1 A partially enlarged exploded view of a high-power heat dissipation device.

[0043] A partition plate 113 is located between the first heat-conducting shell 111 and the second heat-conducting shell 112, and the thickness of the partition plate 113 is, for example, greater than or equal to 0.1 mm and less than or equal to 5 mm. The heat-conducting cavity 11 has a heat-absorbing surface 114. The heat-absorbing surface 114 is thermally coupled to a heat source. Specifically, the heat-absorbing surface 114 refers to the area of ​​the region where the first heat-conducting shell 111 is in thermal contact with the heat source. In one embodiment, the heat-absorbing surface 114 is smaller than the area on the bottom side of the first heat-conducting shell 111. In other embodiments, the heat-absorbing surface 114 is located in the central region on the bottom side of the first heat-conducting shell 111. The heat-absorbing surface 114 is located on the side of the first heat-conducting shell 111 away from the second heat-conducting shell 112. Furthermore, the first heat-conducting shell 111, the second heat-conducting shell 112, and the partition plate 113 are assembled to form a first chamber S1 and a second chamber S2 located on opposite sides of the partition plate 113. That is, the second chamber S2 is stacked on top of the first chamber S1. The first chamber S1 is closer to the heat-absorbing surface 114 than the second chamber S2.

[0044] Please refer to the following: Figures 5 to 7 . Figure 5 for Figure 1 A plan view of the heat-conducting cavity of a high-power heat dissipation device. Figure 6 for Figure 1 A plan view of a high-power heat dissipation device. Figure 7 For along Figure 6 A cross-sectional view of a high-power heat dissipation device along section 7-7.

[0045] An insulating ring 12 is disposed in the first chamber S1 of the heat-conducting cavity 11. The opposite sides of the insulating ring 12 are connected to the first heat-conducting shell 111 and the partition plate 113, respectively, to divide the first chamber S1 into a non-connected main heat zone S11 and a secondary heat zone S12, with the main heat zone S11 surrounded by the insulating ring 12. The insulating ring 12 may be a separate element, for example, from the first heat-conducting shell 111 and the partition plate 113, but is not limited thereto. In other embodiments, the insulating ring may extend integrally from the first heat-conducting shell or from the partition plate. The main heat zone S11 corresponds to the region with the highest heat density in the heat source, and the heat density value of the region with the highest heat density is, for example, 100 watts per square centimeter (W / cm²). 2 In addition, the partition plate 113 has an opening 1131. The main hot zone S11 is connected to the second chamber S2 through the opening 1131.

[0046] The main heating zone S11 and the secondary heating zone S12 are filled with different types of coolants, for example. These coolants can be water, alcohols such as methanol or ethanol, acetone, ammonia, dielectric fluids such as fluorinated liquids, or refrigerants. Furthermore, in this embodiment, both the first chamber S1 and the second heat-conducting shell 112 are provided with a capillary structure 15. By providing the capillary structure 15, the cooling fluid can absorb heat from the heat source, vaporize, and then flow back through the capillary structure 15. The capillary structure 15 provided in the main heating zone S11 can also be used to increase the boiling or evaporation surface area.

[0047] In this embodiment, the coolant located in the main heating zone S11 flows to the second chamber S2 through the opening 1131. The coolant filling rate in the main heating zone S11 is, for example, greater than that in the secondary heating zone S12, but this is not a limitation. In other embodiments, the coolant filling rate in the main heating zone may be less than or equal to that in the secondary heating zone. Here, the filling rate refers to the ratio of the actual coolant filling amount to the saturated coolant filling amount, while the saturated coolant filling amount is the product of the capillary volume, the capillary porosity, and the coolant density.

[0048] Furthermore, the area of ​​the main hot zone S11 is, for example, greater than or equal to 5% of the area of ​​the heat-absorbing surface 114, and less than or equal to 80% of the area of ​​the heat-absorbing surface 114. That is to say, the area of ​​the main hot zone S11 is, for example, greater than or equal to 5% of the area of ​​the heat source region, and less than or equal to 80% of the area of ​​the heat source region.

[0049] In this embodiment, the freezing point of the coolant in the main heating zone S11 is, for example, lower than that of the coolant in the secondary heating zone S12. For instance, the coolant in the secondary heating zone S12 is water, while the coolant in the main heating zone S11 is an alcohol such as methanol or ethanol, a dielectric fluid such as a fluorinated liquid, or a refrigerant—a liquid with a freezing point lower than water. When the ambient temperature of the high-power heat dissipation device 10 is lower than the freezing point of the coolant in the secondary heating zone S12, the coolant in the secondary heating zone S12 will solidify, while the coolant in the main heating zone S11 can remain liquid and flow normally. In this way, the coolant in the main heating zone S11 can heat the solidified coolant in the secondary heating zone S12, causing the coolant in the secondary heating zone S12 to melt back into a liquid state and resume normal flow.

[0050] These main heat pipes 13 are disposed in the heat-conducting cavity 11 and connect the main heat zone S11 of the second chamber S2 and the first chamber S1. A first region is defined by the heat-absorbing surface 114 within the heat-conducting cavity 11 and above it. At least one of these main heat pipes 13 is located outside the first region. That is, at least one of these main heat pipes 13 is located outside the region above the heat-absorbing surface 114 of the heat-conducting cavity 11. Furthermore, these main heat pipes 13 are located on opposite sides of the heat-conducting cavity 11 along its long axis L, resulting in a symmetrical design of the high-power heat dissipation device 10, which avoids installers from setting the high-power heat dissipation device 10 in the wrong direction, but is not a limitation thereof. In one embodiment, these main heat pipes 13 are arranged asymmetrically. To improve the utilization efficiency of the fins (not shown) used to install these main heat pipes 13 and these secondary heat pipes 14, these main heat pipes 13 and these secondary heat pipes 14 may also be arranged in an alternating pattern. In another embodiment, these secondary heat pipes 14 are located on opposite sides of the heat-conducting cavity 11 along its long axis L. Furthermore, a portion of these main heat pipes 13 are located within the first region. Another portion of these main heat pipes 13 are located outside the first region and near its periphery. According to the two embodiments described above, the number of these main heat pipes 13 can be reduced, for example, by 20%, and the reduced portion can be replaced by these secondary heat pipes 14.

[0051] One side of the heat-conducting cavity 11 is close to a heat dissipation device (not shown), such as a fan. Specifically, the heat-conducting cavity 11 has an air inlet side 115. The air inlet side 115 is close to the fan and has high heat dissipation efficiency. A portion of the main heat pipes 13 are located on the side of the heat-conducting cavity 11 close to the air inlet side 115 along the long axis L. In this way, the coolant in the main heat zone S11, after being heated and vaporized into a gaseous state, flows from the main heat zone S11 through the second chamber S2 to these main heat pipes 13, and can be cooled by the cooling airflow generated by the heat dissipation device, such as a fan, flowing from the air inlet side 115 through these main heat pipes 13, thereby dissipating heat from the gaseous coolant located in these main heat pipes 13.

[0052] The distance from the main heat pipe 13 closest to the air inlet edge 115 to the air inlet edge 115 is, for example, less than or equal to one-third of the length of the major axis L of the heat conduction cavity 11. For example, the length of the major axis L is 150 mm, and the distance from the main heat pipe 13 closest to the air inlet edge 115 to the air inlet edge 115 is 49.5 mm.

[0053] These secondary heat pipes 14 are disposed in the heat-conducting cavity 11 and communicate with the secondary heat zone S12 of the first chamber S1. In one embodiment, these secondary heat pipes 14 are located within a first region. That is, these secondary heat pipes 14 are located within the region above the heat-absorbing surface 114 of the heat-conducting cavity 11, but are not limited thereto. In one embodiment, these secondary heat pipes 14 are located outside the region above the heat-absorbing surface 114 of the heat-conducting cavity 11. In another embodiment, some of these secondary heat pipes 14 are located within the first region, and others are located outside the first region. That is, some of these secondary heat pipes 14 are located within the region above the heat-absorbing surface 114 of the heat-conducting cavity 11, and others are located outside the region above the heat-absorbing surface 114 of the heat-conducting cavity 11. For example, two of these secondary heat pipes 14 are located outside the first region and replace the two main heat pipes 13 adjacent to the first region, while the remaining secondary heat pipes 14 are located within the first region. By providing these secondary heat pipes 14, heat source dissipation can be further improved. In addition, the number of these main heat pipes 13 located on the side of the heat-conducting cavity 11 near the air inlet edge 115 in the long axis L direction is, for example, greater than or equal to 10% of the total number of these main heat pipes 13 and these secondary heat pipes 14.

[0054] In this embodiment, when the heat source power is low, the main heat zone S11 and the secondary heat zone S12 separated by the insulating ring 12 are sufficient to dissipate heat from the heat source. When the heat source power is high, since the main heat zone S11, which deheats the area with the highest heat density in the heat source, is connected to the second chamber S2 stacked on the first chamber S1, the coolant located in the second chamber S2 can flow into the center of the main heat zone S11 to jointly dissipate heat from the heat source, thus avoiding localized dry burning of the main heat zone S11 due to hot spots. In this way, the high-power heat dissipation device 10 can be prevented from localized dry burning and functional degradation, thereby maintaining the heat dissipation efficiency of the high-power heat dissipation device 10, and making the high-power heat dissipation device 10 suitable for heat sources with localized hot spots, such as those in higher-power chips or single chips.

[0055] In detail, when the power of the main heat source area corresponding to the main heat source area of ​​the heat source in the main heat zone S11 is, for example, greater than or equal to 70% of the total power of the heat source, the main heat zone S11 can supply a larger power load to improve the heat dissipation efficiency of the heat source because the coolant filling amount in the main heat zone S11 is greater than that in the secondary heat zone S12. When the power of the main heat source area corresponding to the main heat source area of ​​the heat source in the main heat zone S11 is, for example, less than 70% of the total power of the heat source, the design of the coolant filling rate of the main heat zone S11 being, for example, greater than or equal to 60% of the pore volume of the capillary structure 15 and less than or equal to 80% of the volume of the first chamber S1, allows the main heat zone S11 to form a mechanism of boiling and evaporation due to overfilling of coolant. In this way, the situation of local dry burning of the main heat zone S11 due to excessively high temperature of the heat source can be avoided. In addition, the coolant filling rate in the secondary heat zone S12 is, for example, greater than or equal to 50% of the pore volume of the capillary structure 15 and less than or equal to 130%.

[0056] In this embodiment, the high-power heat dissipation device 10 may further include a plurality of support columns 16. These support columns 16 protrude from the first heat-conducting shell 111 and the partition plate 113, respectively. The support columns 16 disposed on the first heat-conducting shell 111 protrude toward the partition plate 113 and at least partially abut against the partition plate 113, and the support columns 16 disposed on the partition plate 113 protrude toward the second heat-conducting shell 112 and abut against the second heat-conducting shell 112, at least partially. In this way, the high-power heat dissipation device 10 can be prevented from expanding or deforming after being heated by the support of these support columns 16.

[0057] In this embodiment, the high-power heat dissipation device 10 may further include a heat dissipation fin assembly (not shown). The heat dissipation fin assembly is disposed on the main heat pipes 13 and the secondary heat pipes 14 to further improve the heat dissipation efficiency of the high-power heat dissipation device 10.

[0058] In this embodiment, the number of partition plates 113 is one, so that the heat-conducting cavity 11 is divided into two chambers S1 and S2 by the partition plate 113, but it is not limited thereto. In other embodiments, the number of partition plates may be two or more, so that the heat-conducting cavity is divided into multiple chambers by these partition plates.

[0059] In this embodiment, the main heating zone S11 is connected to the second chamber S2, but this is not a limitation. In other embodiments, the main heating zone may also be connected to the first chamber.

[0060] In this embodiment, the main heating zone S11 and the secondary heating zone S12 are filled with different types of coolant, but this is not a limitation. In other embodiments, the main heating zone and the secondary heating zone may be filled with the same type of coolant.

[0061] In this embodiment, the coolant filling rate of the main heating zone S11 is greater than that of the secondary heating zone S12, but this is not a limitation. In other embodiments, the coolant filling rate of the main heating zone may simply be different from that of the secondary heating zone.

[0062] In this embodiment, there are multiple main heat pipes 13 and multiple secondary heat pipes 14, but this is not a limitation. In other embodiments, there may be only one main heat pipe and one secondary heat pipe.

[0063] In this embodiment, both the first chamber S1 and the second chamber S2 are provided with capillary structures 15, but this is not a limitation. In other embodiments, the first chamber may be, for example, a thermosiphon chamber, with capillary structures only provided in the secondary heating zone of the first chamber, so that after the gaseous cooling fluid in the second chamber condenses into a liquid state, it flows back to the main heating zone by gravity. Alternatively, the second chamber may be, for example, a thermosiphon chamber, and capillary structures are provided in both the main heating zone and the secondary heating zone of the first chamber. The filling rate of the thermosiphon chamber refers to the ratio of the actual amount of coolant filled to the product of the chamber volume and the density of the coolant.

[0064] Please see Figure 8 . Figure 8 for Figure 1 A cross-sectional schematic diagram of two coolants flowing in the first and second chambers of a high-power heat dissipation device. In this embodiment, the first heat-conducting shell 111 of the high-power heat dissipation device 10 is thermally coupled to the heat source H1 through the heat-absorbing surface 114. When the heat from the heat source H1 is transferred to the main heat zone S11 through the heat-absorbing surface 114, the coolant in the main heat zone S11 absorbs heat and vaporizes into a gaseous state, flowing along direction A through the opening 1131 to the second chamber S2. Then, the gaseous coolant flows along direction B in the second chamber S2, and then flows from the second chamber S2 along direction C to the heat pipes 13 of these main heat zones. Furthermore, when the heat from the heat source H1 is transferred to the secondary heat zone S12 through the heat-absorbing surface 114, the coolant in the secondary heat zone S12 absorbs heat and vaporizes into a gaseous state, flowing from the first chamber S1 along direction D to the heat pipes 14 of these secondary heat zones and along direction E in the secondary heat zone S12.

[0065] When the vaporized coolant is cooled and condensed into a liquid state on the main heat pipes 13, it flows from the main heat pipes 13 in the opposite direction of direction C to the second chamber S2. Then, the liquid coolant flows in the second chamber S2 in the opposite direction of direction B, and then flows through the opening 1131 in the opposite direction of direction A to the main heat zone S11, thus completing the cooling cycle of the main heat zone S11, the second chamber S2, and the main heat pipes 13. Furthermore, when the vaporized coolant is cooled and condensed into a liquid state on the secondary heat pipes 14, it flows from the secondary heat pipes 14 in the opposite direction of direction D to the first chamber S1 and flows back in the secondary heat zone S12 in the opposite direction of direction E, thus completing the cooling cycle of the secondary heat zone S12 and the secondary heat pipes 14.

[0066] In this embodiment, the number of insulating rings 12 and the number of openings 1131 are both single, but this is not a limitation. For other embodiments, please refer to... Figures 9 to 11 . Figure 9 This is an exploded view of the high-power heat dissipation device according to the second embodiment of the present invention. Figure 10 for Figure 9 A partially enlarged three-dimensional schematic diagram of a high-power heat dissipation device. Figure 11 for Figure 9 A partially enlarged exploded view of a high-power heat dissipation device.

[0067] The high-power heat dissipation device 10A of this embodiment is similar to the high-power heat dissipation device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the high-power heat dissipation device 10A includes a plurality of insulating rings 12A, and the partition plate 113A of the heat-conducting cavity 11A has a plurality of openings 1131A. These insulating rings 12A are, for example, cylindrical. These insulating rings 12A divide the first chamber S1A into a plurality of non-connected main heat zones S11A and secondary heat zones S12A. These main heat zones S11A are connected to the second chamber S2 through these openings 1131A.

[0068] Please refer to the following: Figures 12 to 14 . Figure 12 for Figure 9 A plan view of the heat-conducting cavity of a high-power heat dissipation device. Figure 13 for Figure 9 A plan view of a high-power heat dissipation device. Figure 14 For along Figure 13 A cross-sectional view of a high-power heat dissipation device along section 14-14.

[0069] In this embodiment, when heat from heat source H1 is transferred to the main heat zones S11A through heat-absorbing surface 114, the coolant in these main heat zones S11A absorbs heat and vaporizes into a gaseous state, flowing along direction F through the openings 1131A to the second chamber S2. Then, the gaseous coolant flows along direction G within the second chamber S2, and then from the second chamber S2 along direction H to the heat pipes 13 in the main heat zones. Furthermore, when heat from heat source H1 is transferred to the secondary heat zones S12A through heat-absorbing surface 114, the coolant in the secondary heat zones S12A absorbs heat and vaporizes into a gaseous state, flowing from the first chamber S1A along direction I to the heat pipes 14 in the secondary heat zones and along direction J within the secondary heat zones S12A.

[0070] When the vaporized coolant is cooled and condensed into a liquid state on the main heat pipes 13, it flows from the main heat pipes 13 in the opposite direction of direction H to the second chamber S2. Then, the liquid coolant flows in the second chamber S2 in the opposite direction of direction G, and then flows through the openings 1131A in the opposite direction of direction F to the main heat pipes S11A, thus completing the cooling cycle of the main heat pipes S11A, the second chamber S2, and the main heat pipes 13. Furthermore, when the vaporized coolant is cooled and condensed into a liquid state on the secondary heat pipes 14, it flows from the secondary heat pipes 14 in the opposite direction of direction I to the first chamber S1A and flows back in the opposite direction of direction J to the secondary heat pipe S12A, thus completing the cooling cycle of the secondary heat pipes S12A and the secondary heat pipes 14.

[0071] According to the high-power heat dissipation device of the above embodiment, when the heat source power is low, the main heat zone and the secondary heat zone separated by the isolation ring are sufficient to dissipate heat from the heat source. When the heat source power is high, since the main heat zone, which deheats the area with the highest heat density in the heat source, is connected to the second chamber stacked in the first chamber, the coolant located in the second chamber can flow into the center of the main heat zone to jointly dissipate heat from the heat source, thus avoiding localized dry burning of the main heat zone due to hot spots. In this way, the high-power heat dissipation device can avoid localized dry burning and functional degradation, thereby maintaining the heat dissipation efficiency of the high-power heat dissipation device. This makes the high-power heat dissipation device suitable for heat sources such as higher-power chips or localized hot spots in a single chip.

[0072] In detail, when the power of the main heat source area corresponding to the main heat source is, for example, greater than or equal to 70% of the total power of the heat source, the main heat source area can supply a larger power load to improve the heat dissipation efficiency of the heat source because the coolant filling volume of the main heat source area is greater than that of the secondary heat source area. When the power of the main heat source area corresponding to the main heat source is, for example, less than 70% of the total power of the heat source, the design of the coolant filling rate of the main heat source area being, for example, greater than or equal to 60% of the pore volume of the capillary structure 15 and less than or equal to 80% of the volume of the first chamber, allows the main heat source area to form a mechanism of boiling and evaporation due to overfilling of coolant. In this way, the situation of local dry burning in the main heat source area due to excessively high heat source temperature can be avoided.

[0073] Furthermore, since the freezing point of the coolant in the main heating zone is lower than that in the secondary heating zone, when the ambient temperature of the high-power heat dissipation device is lower than the freezing point of the coolant in the secondary heating zone, the coolant in the secondary heating zone will solidify, while the coolant in the main heating zone can remain liquid and flow normally. In this way, the coolant in the main heating zone can be used to heat the solidified coolant in the secondary heating zone, causing it to melt back into a liquid state and resume normal flow.

[0074] In other embodiments, through specific fin design, high-power heat dissipation devices can achieve different heat exchange efficiencies in different areas. Furthermore, in typical heat dissipation devices, some areas can effectively transfer heat, while other areas may have lower efficiency. According to the high-power heat dissipation device of this invention, the main heat pipe can be strategically positioned in areas of high heat exchange efficiency. By optimizing the placement of the main heat pipe, the overall heat transfer efficiency can be maximized through areas with high thermal conductivity. In other words, through the aforementioned method, the heat dissipation process can be concentrated at the point of highest heat dissipation efficiency, ensuring that the high-power heat dissipation device operates optimally, thereby improving the performance and reliability of the cooling system.

[0075] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A high-power heat dissipation device, characterized in that, For thermal coupling to a heat source, the high-power heat dissipation device includes: A heat-conducting cavity having a heat-absorbing surface, a first chamber, and a second chamber, wherein the first chamber is closer to the heat-absorbing surface than the second chamber; and At least one insulating ring is disposed in the first chamber of the heat-conducting cavity, dividing the first chamber into a main heat zone and a secondary heat zone that are not connected. The main heat zone is surrounded by the at least one insulating ring and is connected to the second chamber.

2. The high-power heat dissipation device as described in claim 1, characterized in that, The primary and secondary thermal zones of the first chamber are respectively filled with different types of coolant.

3. The high-power heat dissipation device as described in claim 2, characterized in that, The freezing point of the coolant in the primary heat zone is lower than that in the secondary heat zone.

4. The high-power heat dissipation device as described in claim 1, characterized in that, The coolant filling rate of the main heat zone differs from that of the secondary heat zone.

5. The high-power heat dissipation device as described in claim 4, characterized in that, The coolant filling rate of the main heat zone is greater than that of the secondary heat zone.

6. The high-power heat dissipation device as described in claim 1, characterized in that, The area of ​​the main heat zone is greater than or equal to 5% of the area of ​​the heat-absorbing surface and less than or equal to 80% of the area of ​​the heat-absorbing surface.

7. The high-power heat dissipation device as described in claim 4, characterized in that, The first chamber or the second chamber is provided with a capillary structure, the coolant filling rate of the main hot zone is greater than or equal to 60% of the pore volume of the capillary structure, and the coolant filling rate of the secondary hot zone is greater than or equal to 50% and less than or equal to 130% of the pore volume of the capillary structure.

8. The high-power heat dissipation device as described in claim 1, characterized in that, It also includes multiple main heat pipes, which are disposed in the heat-conducting cavity and connected to the main heat zone of the second chamber and the first chamber.

9. The high-power heat dissipation device as described in claim 8, characterized in that, The heat-conducting cavity further has a first region located above the heat-absorbing surface, and at least one of the main heat pipes is located outside the first region.

10. The high-power heat dissipation device as described in claim 1, characterized in that, It also includes multiple secondary heat pipes, which are disposed in the heat-conducting cavity and connected to the secondary heat zone of the first chamber.

11. The high-power heat dissipation device as described in claim 10, characterized in that, The heat-conducting cavity further includes a first region located above the heat-absorbing surface, and the secondary heat pipes are configured to be completely disposed within the first region, completely disposed outside the first region, or partially disposed within the first region and partially disposed outside the first region.

12. The high-power heat dissipation device as described in claim 8, characterized in that, At least one of the main heat pipes is located on one side of the heat-conducting cavity along its long axis.

13. The high-power heat dissipation device as described in claim 12, characterized in that, The heat-conducting cavity has an air inlet side edge, and the main heat zone heat pipes are located on the side of the heat-conducting cavity closer to the air inlet side edge in the long axis direction. The distance from the main heat zone heat pipe closest to the air inlet side edge to the air inlet side edge is less than or equal to one-third of the long axis length of the heat-conducting cavity.

14. The high-power heat dissipation device as described in claim 13, characterized in that, The portions of these main heat pipes are located on the side of the heat-conducting cavity near the air inlet edge along the long axis.

15. The high-power heat dissipation device as described in claim 10, characterized in that, It further includes multiple main heat zone heat pipes, at least one of which is disposed in the heat-conducting cavity and connected to the main heat zone of the first chamber, and the number of the main heat zone heat pipes located on the side of the heat-conducting cavity near the air inlet edge in the long axis direction is greater than or equal to 10% of the total number of the main heat zone heat pipes and the secondary heat zone heat pipes.

16. The high-power heat dissipation device as described in claim 1, characterized in that, The heat-conducting cavity includes a first heat-conducting shell, a second heat-conducting shell, and at least one partition plate. The at least one partition plate is located between the first heat-conducting shell and the second heat-conducting shell. The first heat-conducting shell, the second heat-conducting shell, and the at least one partition plate are connected to form a first chamber and a second chamber located on opposite sides of the at least one partition plate. The heat-absorbing surface is located on the side of the first heat-conducting shell away from the second heat-conducting shell. The partition plate has at least one opening. The at least one insulating ring is located in the first chamber, and the opposite sides of the at least one insulating ring are respectively connected to the first heat-conducting shell and the at least one partition plate to divide the first chamber into the main heat zone and the secondary heat zone. The main heat zone is connected to the second chamber through the at least one opening.

17. The high-power heat dissipation device as described in claim 16, characterized in that, The thickness of at least one partition plate is greater than or equal to 0.1 mm and less than or equal to 5 mm.

18. The high-power heat dissipation device as described in claim 1, characterized in that, Both the first chamber and the second chamber are provided with a capillary structure.

19. The high-power heat dissipation device as described in claim 1, characterized in that, Only the subthermal zone of the first chamber has a capillary structure.

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