A heat dissipation assembly and electronic device

Abstract

The utility model discloses an electronic equipment related to the technical field of radiator, especially discloses a radiator assembly and electronic equipment, including first radiating part is provided with at least one first radiating recess, second radiating part is connected in first radiating part, second radiating part is provided with at least one second radiating recess, a first radiating recess corresponds a first radiating recess and encloses and constitutes radiating channel, and the radiating channel is used for accommodating the device to be radiated, and the cover plate is arranged on first radiating part and second radiating part and blocks the slot of the one end of radiating channel away from the circuit board. Through the above-mentioned mode, the utility model discloses an embodiment can rely on the radiator assembly design of the above-mentioned split type, so that the volume of the radiator assembly can be selected according to actual needs, compared with the existing integrated capacitor radiator, the application can adapt to compact installation space, embed various electronic component gaps of electronic equipment, compatible with the existing layout on the circuit board, conducive to the integration and miniaturization of electronic equipment.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation component and electronic device. Background Technology

[0002] As an auxiliary device composed of a series of electronic components and circuits, a circuit board enables precise control and adjustment of electronic equipment. Simultaneously, the control circuit board also manages the circuit system within electronic equipment, optimizing and improving the circuitry to enhance the equipment's functionality and performance. During operation, MOSFETs and electrolytic capacitors among the electronic components generate significant heat due to power losses (such as on-resistance and switching losses). To facilitate heat dissipation from these heat-generating components, heat sinks are typically used to cool them down.

[0003] In the process of developing this utility model, the inventors discovered that: Currently, capacitor heat sinks for electronic components such as MOSFETs and electrolytic capacitors are integrated, mainly consisting of a groove structure for housing the components to be cooled and a large-area heat dissipation fin structure. In order to ensure heat dissipation efficiency, the volume of the heat dissipation fins is relatively large, which makes the space required by the capacitor heat sink on the circuit board too large. Moreover, the electronic components distributed on the circuit board of different components to be cooled are different, and the space available for the capacitor heat sink to dissipate heat is also limited. The large-volume integrated capacitor heat sink is not conducive to the development of circuit board integration and miniaturization. Utility Model Content

[0004] This utility model provides a heat dissipation component and an electronic device. The main technical problem it solves is that the existing integrated capacitor heat sink is too large and not suitable for the increasingly compact space layout of electronic devices, which affects the integration and miniaturization of electronic devices.

[0005] To solve the above-mentioned technical problems, the present invention provides a heat dissipation component that can be applied to a circuit board, including a first heat dissipation component, a second heat dissipation component, and a cover plate. The first heat dissipation component is provided with at least one first heat dissipation groove. The second heat dissipation component is connected to the first heat dissipation component and is provided with at least one second heat dissipation groove. One first heat dissipation groove corresponds to one first heat dissipation groove and surrounds it to form a heat dissipation channel. The heat dissipation channel is used to accommodate the device to be cooled. The cover plate is disposed on the first heat dissipation component and the second heat dissipation component and blocks the opening of the heat dissipation channel away from the circuit board.

[0006] Optionally, along the first direction, the surface of the first heat sink opposite to the first heat sink groove is provided with a plurality of first heat sink fins; and / or, along the first direction, the surface of the second heat sink opposite to the second heat sink groove is provided with a plurality of second heat sink fins.

[0007] Optionally, the first heat sink is provided with a first mating part, and the second heat sink is provided with a second mating part. The first mating part and the second mating part are connected to achieve a fixed connection between the first heat sink and the second heat sink by screwing, gluing, snapping, or magnetic attraction.

[0008] Optionally, the first mating part is a first hook and a first slot, the first hook and the first slot being located on both sides of the first heat dissipation groove, and the second mating part is a second hook and a second slot, the second hook and the second slot being located on both sides of the second heat dissipation groove, the first hook engaging with the second slot, and the second hook engaging with the first slot.

[0009] Optionally, along the second direction, both end faces of the first heat sink are provided with third heat sink fins; and / or, along the second direction, both end faces of the second heat sink are provided with fourth heat sink fins, wherein the first direction and the second direction are perpendicular.

[0010] Optionally, the shape of the first heat dissipation groove is adapted to a part of the shape of the device to be cooled, and the shape of the second heat dissipation groove is adapted to another part of the shape of the device to be cooled.

[0011] Optionally, the shape of the cover plate is adapted to the shape of the slot at the end of the heat dissipation channel away from the circuit board, and the cross-sectional area of ​​the cover plate is larger than the cross-sectional area of ​​the slot of the heat dissipation channel.

[0012] Optionally, the heat dissipation assembly includes at least two screw connectors. Both ends of the cover plate are provided with first screw holes. The end of the first heat dissipation component away from the circuit board is provided with a second screw hole. The end of the second heat dissipation component away from the circuit board is provided with a third screw hole. One screw connector passes through one of the first screw holes and is screwed into the second screw hole. The other screw connector passes through another of the second screw holes and is screwed into the third screw hole.

[0013] Optionally, the cover plate has a plurality of third heat dissipation fins on the surface opposite to the heat dissipation channel.

[0014] To solve the above-mentioned technical problems, another technical solution adopted by this utility model is: to provide an electronic device, including a circuit board and the above-mentioned heat dissipation component, wherein an electrolytic capacitor is disposed on the circuit board and the electrolytic capacitor is housed in the heat dissipation channel of the heat dissipation component.

[0015] The beneficial effects of this utility model embodiment are as follows: Unlike existing technologies, this utility model embodiment provides a heat dissipation component including a first heat dissipation element, a second heat dissipation element, and a cover plate. The first heat dissipation element is provided with at least one first heat dissipation groove. The second heat dissipation element is connected to the first heat dissipation element and is provided with at least one second heat dissipation groove. Each first heat dissipation groove corresponds to a first heat dissipation groove and together they form a heat dissipation channel. The heat dissipation channel is used to accommodate the device to be cooled. The cover plate is disposed on the first heat dissipation element and the second heat dissipation element and blocks the opening of the heat dissipation channel away from the circuit board. Through the above structure, this utility model embodiment can utilize a split-type structural design, allowing the heat dissipation component to be flexibly selected in terms of volume and shape according to the actual installation space and heat dissipation requirements inside the electronic device when applied to electronic devices. This breaks through the space limitations of traditional integrated capacitor heat sinks. Furthermore, this heat dissipation component is better suited for compact installation environments, can be embedded in the gaps between various components of electronic devices, and is compatible with the existing layout on the circuit board, thereby effectively supporting the further development of electronic devices towards high integration and miniaturization. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of a heat dissipation component provided in an embodiment of the present invention; Figure 2 This is an exploded structural diagram of a heat dissipation component applied to a circuit board according to an embodiment of the present invention.

[0018] Icon labels: 100. Heat dissipation components; 1. First heat sink; 11. First heat sink groove; 12. First heat sink fin; 13. First mating part; 131. First hook; 132. First slot; 14. Second screw hole; 2. Second heat sink; 21. Second heat sink groove; 22. Second heat sink fin; 23. Second mating part; 231. Second hook; 232. Second slot; 24. Third screw hole; 3. Cover plate; 31. First screw hole; 4. Heat dissipation channel; 5. Screw-in fittings; X, first direction; Y, second direction; Z, third direction; 200. Circuit board; 201. Component to be cooled. Detailed Implementation

[0019] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0021] This application provides a heat dissipation component 100 applied to a circuit board 200 of an electronic device. Please refer to [link to relevant documentation]. Figure 1 and Figure 2The heat dissipation assembly 100 includes a first heat dissipation component 1, a second heat dissipation component 2, and a cover plate 3. The first heat dissipation component 1 is provided with at least one first heat dissipation groove 11. The second heat dissipation component 2 is connected to the first heat dissipation component 1 and is provided with at least one second heat dissipation groove 21. One first heat dissipation groove 11 corresponds to another first heat dissipation groove 11 and together they form a heat dissipation channel 4. The heat dissipation channel 4 is used to accommodate the device 201 to be cooled (e.g., electrolytic capacitor, MOSFET, etc.). The cover plate 3 is disposed on the first heat dissipation component 1 and the second heat dissipation component 2 and blocks the opening of the heat dissipation channel 4 at the end away from the circuit board 200, so that the heat dissipation channel 4 can be sealed by the cover plate 3 to prevent external foreign objects (e.g., dust, water, etc.) from entering the heat dissipation channel 4. Through the above structure, relying on the separate design of the first heat sink 1, the second heat sink 2, and the cover plate 3, the heat dissipation component 100 of this application can be embedded in the gaps between various components of electronic devices during actual installation, and is compatible with the existing layout on the circuit board 200. This effectively supports the further development of electronic devices towards high integration and miniaturization. Furthermore, due to the separate structural design, the volume and shape of the first heat sink 1 and the second heat sink 2 of the heat dissipation component 100 can be selected according to the layout of the circuit board 200 to be installed. Compared with the existing integrated heat sink, when laying out electronic components, electronic devices using the heat dissipation component 100 of this application do not need to set up a large avoidance area for the components that need heat dissipation, thus improving the space utilization rate on the circuit board 200 of the electronic device.

[0022] Understandably, the shape of the first heat dissipation groove 11 is adapted to the shape of the device to be cooled, and the shape of the second heat dissipation groove 21 is adapted to the shape of the device to be cooled 201, so that the device to be cooled 201 can fit against the inner wall of the heat dissipation channel 4, ensuring that the heat generated by the device to be cooled 201 can be transferred to the heat dissipation component 100 in a timely manner.

[0023] It is understood that the number of the first heat dissipation groove 11 and the second heat dissipation groove 21 is the same, and the number of the first heat dissipation groove 11 and the second heat dissipation groove 21 is a positive integer greater than or equal to one. For example, in this embodiment, the number of the first heat dissipation groove 11 and the second heat dissipation groove 21 is two, so that the number of heat dissipation channels 4 formed is also two.

[0024] It should be noted that the shape and volume of the first heat sink 1 and the second heat sink 2 are selected according to the actual installation space required. It is only necessary to ensure that the heat dissipation channel 4 formed by the first heat sink 1 and the second heat sink 2 can completely enclose the device 201 to be dissipated. Specifically, the overall shape of the first heat sink 1 and the second heat sink 2 after connection includes, but is not limited to, a cube, an irregular shape, or a spherical shape. For example, in this embodiment, the shape of the first heat sink 1 and the second heat sink 2 after connection is a cube.

[0025] In some embodiments, the inner wall of the first heat dissipation groove 11 is coated with a first thermally conductive adhesive layer (not shown), and the inner wall of the second heat dissipation groove 21 is coated with a second thermally conductive adhesive layer (not shown). This allows the first thermally conductive adhesive layer to wrap around a portion of the heat dissipation device 201 and the second thermally conductive adhesive layer to wrap around another portion of the heat dissipation device 201 when the heat dissipation assembly 100 is installed on the heat dissipation device 201. This ensures that the heat dissipated by the heat dissipation device 201 during operation can be uniformly and quickly transferred to the first heat dissipation component 1 and the second heat dissipation component 2 through the first and second thermally conductive adhesive layers, respectively. This avoids the formation of cavities between the heat dissipation device 201 and the inner wall of the first heat dissipation groove 11, and between the inner walls of the heat dissipation device 201 and the second heat dissipation groove 21, which would affect the heat dissipation efficiency.

[0026] In some embodiments, along the first direction X, a plurality of first heat dissipation fins 12 are provided on the surface of the first heat dissipation component 1 facing away from the first heat dissipation groove 11. The first heat dissipation fins 12 are used to increase the contact area between the first heat dissipation component 1 and the surrounding environment, thereby improving the heat dissipation capacity of the first heat dissipation component 1; and / or, along the first direction X, a plurality of second heat dissipation fins 22 are provided on the surface of the second heat dissipation groove 21 facing away from the second heat dissipation groove 21. The second heat dissipation component 2 is used to increase the contact area between the second heat dissipation component 2 and the surrounding environment, thereby improving the heat dissipation capacity of the second heat dissipation component 2.

[0027] Understandably, the outer contour lines of the first heat dissipation fin 12 and the second heat dissipation fin 22 need to be compatible with the overall shape of the first heat dissipation component 1 and the second heat dissipation component 2 after they are combined.

[0028] The connection between the first heat sink 1 and the second heat sink 2 includes, but is not limited to: permanent fixed connection, such as welding, fusion, crimping, electromagnetic connection, etc.; or detachable connection, such as magnetic attraction, adhesive bonding, snap-fit, screw connection, etc.

[0029] For example, in some preferred embodiments, the first heat sink 1 and the second heat sink 2 are connected in a detachable manner. The first heat sink 1 is provided with a first mating part 13, and the second heat sink 2 is provided with a second mating part 23. The first mating part 13 and the second mating part 23 are connected to achieve a fixed connection of the first heat sink 1 and the second heat sink 2 by screwing, gluing, snapping, or magnetic attraction.

[0030] For further details, please refer to Figure 2The first mating part 13 consists of a first hook 131 and a first slot 132, which are located on both sides of the first heat dissipation groove 11. The second mating part 23 consists of a second hook 231 and a second slot 232, which are located on both sides of the second heat dissipation groove 21. The first hook 131 engages with the second slot 232, and the second hook 231 engages with the first slot 132. The detachable connection between the first heat dissipation component 1 and the second heat dissipation component 2 is achieved through the engagement of the first hook 131 and the second slot 232, and the second hook 231 and the second slot 232. Furthermore, the first hook 131 and the second slot 232, as well as the second hook 231 and the first slot 132, provide a continuous and stable locking force, tightly pulling the two heat dissipation components together. This constant pressure ensures that the first heat sink 1 and the second heat sink 2 maintain close physical contact with the surface of the internal heat sink 201 (such as MOSFETs and capacitors), thereby reducing contact thermal resistance and ensuring that heat can be efficiently conducted from the device to the heat dissipation assembly 100.

[0031] Understandably, the first mating part 13 can also be two hook structures, and the second mating part 23 can be two slot structures. The hook structures and the slot structures engage with each other, thereby realizing the detachable connection between the first heat sink 1 and the second heat sink 2.

[0032] In other embodiments, the first mating part 13 consists of two first magnetic attractors, which are respectively fixed on both sides of the first heat dissipation groove 11. The second mating part 23 consists of two second magnetic attractors, which are respectively fixed on both sides of the second heat dissipation groove 21. One of the first magnetic attractors and one of the second magnetic attractors can attract each other, and the other first magnetic attractor and the second magnetic attractor can attract each other, so that the first heat dissipation component 1 and the second heat dissipation component 2 are connected.

[0033] Understandably, in order to ensure the connection strength between the first heat sink 1 and the second heat sink 2, the first magnetic attractor and the second magnetic attractor are preferably magnets with strong magnetic fields, such as neodymium magnets.

[0034] In some embodiments, please refer to Figure 2 The shape of the cover plate 3 is adapted to the shape of the opening of the heat dissipation channel 4 at the end away from the circuit board 200, and the cross-sectional area of ​​the cover plate 3 is larger than the cross-sectional area of ​​the opening of the heat dissipation channel 4. This structure allows the cover plate 3 to completely cover the opening of the heat dissipation channel 4, preventing foreign objects from entering through the opening. Furthermore, the adaptation of the cover plate 3's shape to the opening of the heat dissipation channel 4 at the end away from the circuit board 200 reduces the volume of material required for the cover plate 3, thereby ensuring that the electronic device using the heat dissipation component 100 meets the lightweight design requirements.

[0035] Furthermore, when the cover plate 3 covers the opening of the heat dissipation channel 4, the cover plate 3 abuts against the heat dissipation device 201 contained in the heat dissipation channel 4, so that the heat at the end of the heat dissipation device 201 can be transferred to the cover plate 3, thereby further ensuring the heat dissipation effect of the heat dissipation component 100 on the heat dissipation device 201.

[0036] Understandably, the cover plate 3 can be disposed on the first heat sink 1 and the second heat sink 2 in ways including but not limited to: screw connection, snap connection, magnetic attraction, etc.

[0037] For example, in this embodiment, the cover plate 3 is connected to the first heat sink 1 and the second heat sink 2 by screwing. Specifically, the heat dissipation assembly 100 also includes at least two screwing members 5. Both ends of the cover plate 3 are provided with first screw holes 31. The end of the first heat sink 1 away from the circuit board 200 is provided with a second screw hole 14, and the end of the second heat sink 2 away from the circuit board 200 is provided with a third screw hole 24. One screwing member 5 passes through one first screw hole 31 and is screwed into the second screw hole 14, and the other screwing member 5 passes through another second screw hole 14 and is screwed into the third screw hole 24. Through this method, the cover plate 3 is screwed onto the first heat sink 1 and the second heat sink 2. Because the cover plate 3 is screwed across the first heat sink 1 and the second heat sink 2, it can exhibit a reinforcing rib-like effect, enhancing the structural strength of the connection between the first heat sink 1 and the second heat sink 2, thereby reducing the impact of external forces such as vibration on the overall structural strength of the heat dissipation assembly 100.

[0038] Understandably, the number of first screw holes 31 is the same as the sum of the number of second screw holes 14 and third screw holes 24, to ensure that the cover plate 3 can be smoothly connected to the first heat sink 1 and the second heat sink 2. Furthermore, the number of first screw holes 31 is a positive integer greater than or equal to two, and the number of second screw holes 14 and third screw holes 24 are each a positive integer greater than or equal to one.

[0039] In some embodiments, the surface of the cover plate 3 facing away from the heat dissipation channel 4 is provided with a plurality of third heat dissipation fins (not shown in the figure). The third heat dissipation fins are used to increase the contact area between the cover plate 3 and the surrounding environment, thereby improving the heat dissipation capacity of the cover plate 3 for the heat dissipation device 201 housed in the heat dissipation channel 4, and further improving the heat dissipation capacity of the heat dissipation assembly 100.

[0040] This application also provides an embodiment of an electronic device, which includes a circuit board 200 and the aforementioned heat dissipation component 100. An electrolytic capacitor is disposed on the circuit board 200 and is housed in the heat dissipation channel 4 of the heat dissipation component 100.

[0041] Understandably, the heat dissipation component 100 may be fixed to the circuit board 200 in the following ways: screw connection, snap connection, glue connection, etc., or a combination of at least two of these methods.

[0042] For example, in some embodiments, the heat dissipation assembly 100 is fixed to the circuit board 200 by screwing. Specifically, the electronic device includes multiple screws, and the circuit board 200 is provided with at least two mounting screw holes. Along the third direction Z, the first heat sink 1 and the second heat sink 2 are respectively provided with a first mounting through hole and a second mounting through hole. Some screws pass through the first mounting through hole and are screwed into one of the mounting screw holes, while other screws pass through the second mounting through hole and are screwed into the other mounting screw hole, thereby realizing the screwing of the heat dissipation assembly 100 to the circuit board 200. The first direction X, the second direction Y, and the third direction Z are all perpendicular to each other.

[0043] It should be noted that for the specific structure and function of the heat dissipation component 100, please refer to the above embodiments, which will not be repeated here.

[0044] In this embodiment, this application provides a heat dissipation component 100 and an electronic device. The heat dissipation component 100 includes a first heat dissipation element 1, a second heat dissipation element 2, and a cover plate 3. The first heat dissipation element 1 is provided with at least one first heat dissipation groove 11. The second heat dissipation element 2 is connected to the first heat dissipation element 1 and is provided with at least one second heat dissipation groove 21. One first heat dissipation groove 11 corresponds to another first heat dissipation groove 11 and surrounds each other to form a heat dissipation channel 4. The heat dissipation channel 4 is used to accommodate the device 201 to be cooled (e.g., electrolytic capacitor, MOSFET, etc.). The cover plate 3 is disposed on the first heat dissipation element 1 and the second heat dissipation element 2 and blocks the opening of the heat dissipation channel 4 away from the circuit board 200, so that the heat dissipation channel 4 can be sealed by the cover plate 3 to prevent external foreign objects (e.g., dust, water, etc.) from entering the heat dissipation channel 4. Through the above structure, relying on the separate design of the first heat sink 1, the second heat sink 2, and the cover plate 3, the heat dissipation component 100 of this application can be embedded in the gaps between various components of electronic devices during actual installation, and is compatible with the existing layout on the circuit board 200. This effectively supports the further development of electronic devices towards high integration and miniaturization. Furthermore, due to the separate structural design, the volume and shape of the first heat sink 1 and the second heat sink 2 of the heat dissipation component 100 can be selected according to the layout of the circuit board 200 to be installed. Compared with the existing integrated heat sink, when laying out electronic components, electronic devices using the heat dissipation component 100 of this application do not need to set up a large avoidance area for the components that need heat dissipation, thus improving the space utilization rate on the circuit board 200 of the electronic device.

[0045] It should be noted that while the preferred embodiments of this utility model are provided in the specification and accompanying drawings, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of this utility model; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this utility model specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A heat dissipation component applied to a circuit board, characterized in that, include: The first heat sink is provided with at least one first heat sink groove; The second heat sink is connected to the first heat sink. The second heat sink is provided with at least one second heat sink groove. One of the first heat sink grooves corresponds to one of the first heat sink grooves and surrounds each other to form a heat sink channel. The heat sink channel is used to accommodate the device to be cooled. A cover plate is disposed on the first heat sink and the second heat sink and blocks the opening of the heat dissipation channel away from the circuit board.

2. The heat dissipation assembly according to claim 1, characterized in that, Along the first direction, a plurality of first heat dissipation fins are provided on the surface of the first heat dissipation component opposite to the first heat dissipation groove; And / or, along the first direction, a plurality of second heat dissipation fins are provided on the surface of the second heat dissipation component opposite to the second heat dissipation groove.

3. The heat dissipation assembly according to claim 2, characterized in that, The first heat sink is provided with a first mating part; The second heat sink is provided with a second mating part, and the first mating part and the second mating part are connected to achieve a fixed connection between the first heat sink and the second heat sink by screwing, gluing, snapping or magnetic attraction.

4. The heat dissipation assembly according to claim 3, characterized in that, The first mating part is a first hook and a first slot, and the first hook and the first slot are respectively located on both sides of the first heat dissipation groove; The second mating part is a second hook and a second slot. The second hook and the second slot are located on both sides of the second heat dissipation groove, respectively. The first hook is engaged with the second slot, and the second hook is engaged with the first slot.

5. The heat dissipation assembly according to claim 2, characterized in that, Along the second direction, both end faces of the first heat sink are provided with third heat sink fins; And / or, along the second direction, both end faces of the second heat sink are provided with fourth heat sink fins, and the first direction and the second direction are perpendicular.

6. The heat dissipation assembly according to claim 1, characterized in that, The shape of the first heat dissipation groove is adapted to a part of the shape of the device to be cooled, and the shape of the second heat dissipation groove is adapted to another part of the shape of the device to be cooled.

7. The heat dissipation assembly according to claim 1, characterized in that, The shape of the cover plate is adapted to the shape of the slot at the end of the heat dissipation channel away from the circuit board, and the cross-sectional area of ​​the cover plate is larger than the cross-sectional area of ​​the slot of the heat dissipation channel.

8. The heat dissipation assembly according to claim 7, characterized in that, The heat dissipation assembly includes at least two screwed components; Both ends of the cover plate are provided with first screw holes; The first heat sink has a second screw hole at its end away from the circuit board, and the second heat sink has a third screw hole at its end away from the circuit board. One of the screw connectors passes through the first screw hole and is screwed into the second screw hole, and the other screw connector passes through the other second screw hole and is screwed into the third screw hole.

9. The heat dissipation assembly according to claim 1, characterized in that, The surface of the cover plate opposite to the heat dissipation channel is provided with several third heat dissipation fins.

10. An electronic device, characterized in that, Includes a circuit board and a heat dissipation component as described in any one of claims 1-9; An electrolytic capacitor is provided on the circuit board, and the electrolytic capacitor is housed in the heat dissipation channel of the heat dissipation component.

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