Heat dissipation device based on silver-copper alloy welding ring and heat conduction plate

Abstract

The utility model discloses a heat dissipation device and heat conduction plate based on silver copper alloy welding ring, and the heat dissipation device contains: board body, is configured with a heating element and carries out thermal coupling, board cover, is installed in the board body, the board body and board cover jointly define a uniform temperature plate, at least one internal capillary structure, is arranged in the uniform temperature plate, a plurality of support columns are arranged in the uniform temperature plate, and a plurality of heat pipes, and each heat pipe extends through the through -hole formed in the board cover, wherein the heat pipe is bonded to the board cover through welding a welding ring at the interface between the heat pipe and the through -hole, and the material of the welding ring is silver copper alloy.

Description

Technical Field

[0001] This utility model relates to a heat dissipation device and a heat-conducting plate, particularly a heat dissipation device and a heat-conducting plate based on a silver-copper alloy welding ring. Background Technology

[0002] Traditionally, weld rings have been made primarily of copper. However, copper has a relatively high melting point of approximately 1,084°C (1,983°F), which means it requires significantly more energy to weld compared to materials with lower melting points. This additional energy requirement poses challenges, including increased manufacturing costs and accelerated wear on welding equipment. Furthermore, copper oxidizes readily upon contact with air, especially at elevated temperatures during welding. The resulting copper oxide layer forms a barrier that negatively impacts weld quality by hindering proper fusion between components.

[0003] In heat dissipation devices, thermal conductivity is a key factor affecting performance. The materials used must effectively dissipate heat from sensitive components to maintain operational stability and prevent overheating. While copper possesses high thermal conductivity, its limited weldability and oxidation resistance during manufacturing can reduce overall production efficiency and reliability. Therefore, developing solder ring material compositions that combine excellent thermal properties with improved weldability and oxidation resistance is crucial for advancing heat dissipation technology. Utility Model Content

[0004] In general, this utility model relates to a heat dissipation device and a heat-conducting plate. In some embodiments, and through non-limiting examples, this utility model provides a heat dissipation device and a heat-conducting plate based on a silver-copper alloy solder ring.

[0005] One embodiment of this utility model provides a heat dissipation device. The heat dissipation device includes a plate for thermally coupling to a heating element; a plate cover mounted on the plate, the plate and the plate cover together defining a heat spreader; at least one internal capillary structure disposed within the heat spreader; a plurality of support columns disposed within the heat spreader; and a plurality of heat pipes, wherein each heat pipe extends through a corresponding through hole formed in the plate cover; and a plurality of welding rings, wherein the heat pipe is joined to the plate cover by welding a welding ring at the interface between the heat pipe and the corresponding through hole, each welding ring being made of a silver-copper alloy.

[0006] In one embodiment, a welding ring is fitted onto each of these heat pipes.

[0007] In one embodiment, the welding ring is welded to secure and seal the junction between the heat pipe and the corresponding through hole.

[0008] In one embodiment, the welding ring has a circular shape.

[0009] In one embodiment, the welding ring has an outer diameter between 7.1 mm and 11.9 mm, and an inner diameter between 6.1 mm and 10.3 mm.

[0010] In one embodiment, the welding ring has an elliptical shape.

[0011] In one embodiment, the welding ring has a width between 8.55 mm and 15.05 mm, a thickness between 4.25 mm and 7.85 mm, and a corner radius between 1 mm and 3.5 mm.

[0012] In one embodiment, the welding ring has a rectangular shape.

[0013] In one embodiment, the welding ring has a width between 7.05 mm and 12.95 mm, a thickness between 4.25 mm and 7.85 mm, and a corner radius of less than 1 mm.

[0014] In one embodiment, the silver-copper alloy has a eutectic composition.

[0015] In one embodiment, each of the welding rings comprises a silver-copper alloy containing 66% to 76% silver and 24% to 34% copper.

[0016] In one embodiment, the silver-copper alloy comprises approximately 72% silver and 28% copper.

[0017] Another embodiment of this utility model provides a heat-conducting plate. The heat-conducting plate includes a plate body for thermally coupling to a heating element; a plate cover installed on the plate body, the plate cover and the plate body defining a closed internal cavity; at least one internal capillary structure disposed in the closed internal cavity; a plurality of support columns disposed in the closed internal cavity; and a metal bond formed between the plate cover and the plate body by soldering a solder paste, wherein the solder paste is made of a silver-copper alloy.

[0018] In one embodiment, solder paste is dispensed via a sprayer at the interface between the board body and the cover.

[0019] In one embodiment, metallic bonds form an airtight seal around the enclosed internal chamber.

[0020] In one embodiment, the silver-copper alloy has a eutectic composition.

[0021] In one embodiment, the solder paste comprises a silver-copper alloy containing 66% to 76% silver and 24% to 34% copper.

[0022] In one embodiment, the silver-copper alloy comprises approximately 72% silver and 28% copper.

[0023] This utility model description only introduces some concepts in a simplified form; detailed descriptions will be provided in the subsequent embodiments section. This utility model description is not intended to identify key or essential features of the claimed target, nor is it intended to limit the scope of the claimed target. Attached Figure Description

[0024] Figure 1 It is a diagram illustrating the binary phase diagram of silver-copper alloys.

[0025] Figure 2 It is a table illustrating the theoretical melting point temperatures of different silver-copper compositions.

[0026] Figures 3A-3D It is a chart illustrating the melting behavior of various silver-copper alloy compositions analyzed using differential scanning calorimetry.

[0027] Figure 4 It is a table illustrating the thermal conductivity of different silver-copper alloys based on their respective compositions.

[0028] Figure 5 This is a side view of a heat dissipation device according to an embodiment of the present invention.

[0029] Figure 6 This is a side view of a heat-conducting plate according to another embodiment of the present invention.

[0030] Figure 7A It is a table that describes the specifications of weld rings with different shapes and sizes.

[0031] Figure 7B This describes three weld rings with circular cross-sections of different sizes.

[0032] Figure 7C This describes three weld rings with elliptical cross-sections of different dimensions.

[0033] Figure 7D This describes three weld rings with rectangular cross-sections of different sizes.

[0034] 102:Plate body 104: Plate Cover 106: Heat pipe 108: First protruding structure 110: Second protrusion structure 112: Heat spreader 114: Internal capillary structure 116: Support column 118: Through hole 120: Welding ring 200: Heat conduction plate 202:Plate body 204: Plate Cover 206: Protruding structure 208: Support column 210: Internal capillary structure 212: Solder paste 214: Injector 216:Inner chamber Detailed Implementation The various embodiments will now be described in detail with reference to the accompanying drawings, wherein the same reference numerals denote the same parts and components in the various views. Reference to the various embodiments does not limit the scope of the appended claims. Furthermore, any examples illustrated in this specification are merely illustrative of one of many possible embodiments and are not intended to limit the scope of the appended claims.

[0035] Reference Figures 1 to 2 . Figure 1 It is a diagram illustrating the binary phase diagram of silver-copper alloys. Figure 2 This is a table illustrating the theoretical melting point temperatures of different silver-copper compositions. Figure 1 As shown in the example, the vertical axis of the phase diagram represents temperature (°C), and the horizontal axis represents composition. The lower horizontal axis represents the weight percentage of copper, ranging from pure silver (0 wt% Cu) to pure copper (100 wt% Cu); the upper horizontal axis represents the corresponding atomic percentage of copper.

[0036] like Figure 1 As shown, copper (Cu) and silver (Ag) form a eutectic system at approximately 778°C. Its eutectic composition is approximately 28.2 wt% Cu and 71.8 wt% Ag. This indicates the lowest melting point in the silver-copper alloy system. In comparison, the melting point of pure copper is approximately 1081°C to 1084°C, while the melting point of pure silver is approximately 959°C. Figure 2 The data shown further confirms that the melting point of copper gradually decreases as the silver content increases. When the silver-copper alloy reaches the eutectic composition, its melting point drops significantly to 778.7°C, representing the lowest temperature at which the silver-copper alloy can completely transform into a liquid state.

[0037] The eutectic point is of particular importance for the design of solder rings in heat dissipation devices. Alloying copper and silver in a specific ratio allows the solder material to achieve a significantly lower melting point temperature without sacrificing thermal conductivity. This design allows for processing at lower temperatures, thereby reducing thermal stress on surrounding components and mitigating oxidation problems commonly found in high-temperature copper soldering. Therefore, silver-copper alloys at or near the eutectic composition offer the optimal balance between performance and manufacturability in high-performance heat dissipation applications.

[0038] Reference Figures 3A to 3D . Figures 3A-3DThis is a chart illustrating the melting behavior of various silver-copper alloy compositions analyzed using differential scanning calorimetry. Figures 3A to 3D In the diagram, the horizontal axis represents temperature (°C), showing the temperature range of the sample during heating or cooling in the DSC analysis, while the vertical axis represents heat flux (mW), indicating the heat absorbed or released by the sample as a function of temperature. DSC results are used to determine the melting initiation point (solidus temperature) and the melting completion point (liquidus temperature). In this invention, the term "melting point" refers to the liquidus temperature.

[0039] Figure 3A In the study, alloy sample 1 contained 66 wt% copper and 34 wt% silver. The solidus temperature was approximately 775.2°C, and the liquidus temperature was approximately 940°C. These results indicate that a higher copper content is associated with a wider melting range.

[0040] Figure 3B In the sample 2, alloy contains 45 wt% copper and 55 wt% silver. The solidus temperature is approximately 773.7°C, and the liquidus temperature is approximately between 860°C and 870°C. Compared with Figure 3A, both the solidus and liquidus temperatures are lower, reflecting the effect of increasing the silver content on reducing the melting range.

[0041] exist Figure 3C In the sample, alloy 3 contains 28 wt% copper and 72 wt% silver. Both the solidus and liquidus temperatures are approximately 784°C. This indicates a eutectic composition where the alloy exhibits a distinct and uniform melting point. The eutectic point is defined as the specific component in a binary alloy system that simultaneously melts or solidifies at a single, lowest temperature, forming a fine and uniform microstructure upon solidification. Eutectic alloys do not exhibit a melting range but rather transition directly from solid to liquid at the eutectic temperature.

[0042] exist Figure 3D In the sample, alloy sample 4 contains 7.5 wt% copper and 92.5 wt% silver. The solidus and liquidus temperatures are both approximately 886.5°C. Data shows that the melting point increases when the silver content exceeds the eutectic composition.

[0043] Therefore, the melting behavior of silver-copper alloys depends on their composition. As the silver content increases, the melting temperature decreases, reaching its lowest point at a eutectic composition of 28 wt% copper and 72 wt% silver. Above this eutectic point, further increases in silver content raise the melting point. The eutectic alloy (Sample 3) exhibits the most ideal melting characteristics for low-temperature welding applications while maintaining excellent thermal conductivity.

[0044] See Figure 4 . Figure 4It is a table illustrating the thermal conductivity of different silver-copper alloys based on their respective compositions. Figure 4 The table summarizes the experimental results obtained using the steady-state method, which is used to determine how the thermal conductivity (K) is affected by different silver / copper ratios.

[0045] The thermal conductivity (K) was measured using the steady-state method. In the steady-state method, one end of each sample is in contact with a heat source, and the other end is in contact with a heat sink to ensure a unidirectional and stable heat flow. Thermocouples are attached to both ends of the sample to measure the temperature difference (ΔT = T1 - T2) when thermal equilibrium is reached. The final value is then calculated using the formula... The thermal conductivity was calculated, where K is the thermal conductivity (W / m·K), Q is the input power (W), L is the sample length (m), and A is the cross-sectional area (m²). 2 ΔT is the temperature difference (K) between the two ends of the sample.

[0046] like Figure 4 As shown, the thermal conductivity of pure copper (sample 1) was measured to be 394.39 W / m·K. The thermal conductivity significantly improved upon the introduction of silver into the alloy. Sample 2 (with a moderate silver content) had a thermal conductivity of 416.95 W / m·K, while Sample 3 (72 wt% silver and 28 wt% copper) achieved the highest thermal conductivity of all tested samples at 420.60 W / m·K. These results demonstrate that increasing the silver content in copper-based alloys improves thermal conductivity. The trend indicates that silver-copper alloys with a composition of approximately 72 wt% silver and approximately 28 wt% copper exhibit superior heat dissipation performance and are highly suitable for high-efficiency welding and thermal management applications.

[0047] See Figure 5 . Figure 5 This is a side view of a heat dissipation device according to an embodiment of the present invention. Figure 5 For example, the heat dissipation device includes a plate 102, a plate cover 104, and multiple heat pipes 106.

[0048] In one embodiment, the first protrusion 108 extends from the plate 102 in a direction away from the cover 104. The second protrusion 110 further extends from the first protrusion 108 in the same direction. The second protrusion 110 is used for direct thermal contact with a heat-generating element (not shown, such as a central processing unit (CPU), graphics processing unit (GPU), or similar electronic device). Therefore, heat generated by the element flows to the plate 102 via the second protrusion 110 and the first protrusion 108, thereby thermally coupling the plate 102 to the heat-generating element.

[0049] In one embodiment, the cover 104 is fixed to the plate body 102 to form a sealed heat spreader 112. At least one internal capillary structure 114 is provided within the heat spreader 112 to promote capillary reflux of the condensed working fluid. Furthermore, a plurality of support columns 116 are provided within the heat spreader 112 to ensure structural integrity under vacuum or thermal stress conditions.

[0050] In one embodiment, each heat pipe 106 extends through a through-hole 118 located in a cover plate 104. Each heat pipe 106 is secured to the cover plate 104 by a weld ring 120 welded to the heat pipe 106 and located at the interface between the heat pipe and the through-hole 118. The welded weld ring 120 secures and seals the joint between the heat pipe 106 and the through-hole 118. In some embodiments, the weld ring 120 comprises a silver-copper alloy containing about 66 wt% to 76 wt% silver and 24 wt% to 34 wt% copper. In one embodiment, the silver-copper alloy has a eutectic composition of about 72 wt% silver and 28 wt% copper. As previously described, the eutectic composition provides a low and well-defined melting point, enabling a reliable and uniform bond to be achieved with minimal thermal stress during the welding process. The welding ring 120 is used to create a metallic bond between the heat pipe 106 and the cover plate 104, thereby establishing an airtight seal around the heat pipe 106 and ensuring effective heat conduction between the heat pipe 106 and the heat spreader 112.

[0051] by Figure 5 For example, the weld ring 120 has a circular shape. However, this embodiment is not limited to this. In other embodiments, the weld ring may be elliptical, rectangular, or any other shape suitable for forming a fixed and thermally conductive seal between the heat pipe 106 and the through-hole 118. The specifications of different weld ring sizes will be described later.

[0052] See Figure 6 . Figure 6 This is a side view of a heat-conducting plate according to another embodiment of the present invention. Figure 6 In the example, the heat-conducting plate 200 includes a plate body 202 and a plate cover 204. The plate cover 204 is coupled to the plate body 202 to define a closed internal chamber 216.

[0053] In one embodiment, the protrusion structure 206 extends from the plate body 202 in a direction away from the cover 204. The protrusion structure 206 is used to make direct thermal contact with a heat-generating element (not shown, such as a CPU, GPU, or similar electronic device). Therefore, the heat generated by the element flows through the protrusion structure 206 to the plate body 202, thereby thermally coupling the plate body 202 to the heat-generating element.

[0054] In one embodiment, at least one internal capillary structure 210 is provided in the enclosed internal chamber 216 to facilitate capillary reflux of the condensed working fluid. Furthermore, the enclosed internal chamber 216 is also provided with a plurality of support columns 208 to ensure structural integrity under vacuum conditions and to prevent mechanical deformation caused by thermal cycling.

[0055] In one embodiment, a metallic bond (not shown) is formed between the cover 204 and the body 202 by solder paste 212, which is applied at the interface between the body 202 and the cover 204 via an injector 214. This metallic bond forms an hermetically sealed area around the internal chamber to prevent leakage of working fluid and ensure the stability of internal pressure during operation. In some embodiments, the solder paste 212 comprises a silver-copper alloy containing approximately 66 wt% to 76 wt% silver and 24 wt% to 34 wt% copper. In one embodiment, the silver-copper alloy has a eutectic composition of approximately 72 wt% silver and 28 wt% copper. As previously described, the eutectic composition provides a low and well-defined melting point, enabling a reliable and consistent bond to be achieved with minimal thermal stress during soldering.

[0056] See Figures 7A to 7D . Figure 7A It is a table that describes the specifications of weld rings with different shapes and sizes. Figure 7B This describes three weld rings with circular cross-sections of different sizes. Figure 7C This describes three weld rings with elliptical cross-sections of different dimensions. Figure 7D Describe three weld rings with rectangular cross-sections of different dimensions. For example... Figure 7A As shown in the table, the weld rings are divided into three categories based on the geometry of the sealing cross-section: circular, elliptical, and rectangular. Each category is further subdivided into three size specifications: D6, D8, and D10.

[0057] exist Figure 7B In this case, the outer diameter of the circular welding ring ranges from 7.1 mm to 11.9 mm, and the inner diameter ranges from 6.1 mm to 10.3 mm. Figure 7C In the case of elliptical welding rings, the width ranges from 8.55 mm to 15.05 mm, the thickness ranges from 4.25 mm to 7.85 mm, and the angular radius ranges from 1 mm to 3.5 mm. Figure 7D In the case of rectangular welding rings, the width ranges from 7.05 mm to 12.95 mm, the thickness ranges from 4.25 mm to 7.85 mm, and the corner radius is less than 1 mm.

[0058] Weld rings of various shapes and sizes can be flexibly adapted to different interface geometries between heat pipes and plates. Selecting the appropriate weld ring shape and size based on structural and thermal design requirements enhances mechanical stability and improves sealing performance during the welding process. This improves the reliability and thermal efficiency of the integrated heat transfer system.

[0059] Therefore, the embodiments of this utility model are suitable for achieving the aforementioned effects and advantages, as well as their inherent advantages. The specific embodiments described above are merely illustrative and can be modified and implemented in different but equivalent ways. Those skilled in the art can apply them after understanding the content of this utility model. Furthermore, except as described in the following claims, this utility model does not limit structural or design details. It is thus evident that the foregoing specific illustrative embodiments can be modified, combined, or varied, and all such variations fall within the scope and spirit of this utility model. Of course, the embodiments of this utility model are merely examples and various modifications can be made without departing from their spirit and scope. Moreover, it should be understood that the aspects in different embodiments are not mutually exclusive, and those skilled in the art can combine them according to design requirements.

[0060] The embodiments of the present invention can also be implemented without unstated elements and / or optional elements. Although the composition and methods described herein use terms such as “comprising,” “containing,” or “including,” they may also be “substantially constituted by” or “consisting of.” All the values ​​and ranges described above may vary. When a numerical range is used in the invention, any value or interval within that range is considered to be invention. In particular, each range (e.g., “about a to about b,” “about a to b,” or “about ab”) should be understood to include all values ​​and intervals within that range. Furthermore, the terms used in the claims have their ordinary and common meanings unless expressly defined by the patentee. The indefinite article “a” used in the claims should be interpreted as including one or more of the elements it refers to.

Claims

1. A heat dissipation device based on a silver-copper alloy solder ring, characterized in that, Include: A plate for thermal coupling to a heating element; A cover plate is installed on the plate body, and the plate body and the cover plate together define a temperature equalization plate; At least one internal capillary structure is disposed within the heat exchange plate; Multiple support columns are installed inside the temperature distribution plate; as well as Multiple heat pipes, each of which extends through a corresponding through-hole formed in the plate cover; Multiple welding rings are provided, wherein the heat pipe is joined to the plate cover by welding a welding ring at the interface between the heat pipe and the corresponding through hole, and each welding ring is made of silver-copper alloy.

2. The heat dissipation device as described in claim 1, characterized in that, The welding ring is fitted onto each of these heat pipes.

3. The heat dissipation device as described in claim 1, characterized in that, The welding ring is welded to fix and seal the joint between the heat pipe and the corresponding through hole.

4. The heat dissipation device as described in claim 1, characterized in that, The welding ring has a circular shape.

5. The heat dissipation device as described in claim 4, characterized in that, The welding ring has an outer diameter ranging from 7.1 mm to 11.9 mm and an inner diameter ranging from 6.1 mm to 10.3 mm.

6. The heat dissipation device as described in claim 1, characterized in that, The welding ring has an elliptical shape.

7. The heat dissipation device as described in claim 6, characterized in that, The weld ring has a width between 8.55 mm and 15.05 mm, a thickness between 4.25 mm and 7.85 mm, and a corner radius between 1 mm and 3.5 mm.

8. The heat dissipation device as described in claim 1, characterized in that, The welding ring has a rectangular shape.

9. The heat dissipation device as described in claim 8, characterized in that, The weld ring has a width between 7.05 mm and 12.95 mm, a thickness between 4.25 mm and 7.85 mm, and a corner radius of less than 1 mm.

10. The heat dissipation device as claimed in claim 1, characterized in that, This silver-copper alloy has a eutectic composition.

11. A heat-conducting plate based on a silver-copper alloy solder ring, characterized in that, Include: A plate for thermal coupling to a heating element; A cover is installed on the plate body, and the cover and the plate body define a closed internal cavity; At least one internal capillary structure is disposed within the closed internal cavity; Multiple support columns are disposed within the enclosed internal cavity; and A metallic bond is formed between the cover and the body of the board by soldering a solder paste, wherein the solder paste is made of a silver-copper alloy.

12. The heat-conducting plate as described in claim 11, characterized in that, The solder paste is applied at the interface between the plate body and the plate cover using a sprayer.

13. The heat-conducting plate as described in claim 11, characterized in that, The metallic bond forms an airtight seal around the enclosed internal cavity.

14. The heat-conducting plate as described in claim 11, characterized in that, This silver-copper alloy has a eutectic composition.

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