Submerged heat dissipation module and submerged heat dissipation device with same

Abstract

The utility model discloses an immersion heat dissipation module and immersion heat dissipation device with it, immersion heat dissipation device contains: a container, contains a working fluid, and at least two immersion heat dissipation modules, continuous arrangement in the container and immerse in the working fluid, and immersion heat dissipation module is respectively heat coupled to corresponding heating device. Immersion heat dissipation module contains: a flow guide casing contains a main casing and an end flow guide piece, and the main casing has an inlet face and defines a top wall with at least one top wall exit, and the end flow guide piece is heat coupled to the main casing on a side relative to the inlet face. A plurality of heat dissipation fins are arranged in the main casing, and at least one fluid driver is installed on the inlet face.

Description

Technical Field

[0001] This utility model relates to a cooling device, and more particularly to an immersion heat dissipation device, an active heat dissipation module, and an active airflow guide structure. Background Technology

[0002] Liquid cooling methods can generally be divided into direct contact liquid cooling and immersion liquid cooling. Immersion liquid cooling is further divided into two types: single-phase and two-phase. Single-phase immersion liquid cooling devices have a relatively simple structure. Because they are fanless, they offer advantages such as low noise and improved efficiency. The coolant remains in a single phase throughout the process, without undergoing a phase change, thus eliminating the need for hermetically sealed enclosures and pressure control.

[0003] The single-phase immersion liquid cooling system is designed for use in high-power and high-density collaborative computing servers. Under conditions of limited module spacing and stringent power requirements, the system described in this invention aims to reduce thermal interference between series-connected cooling modules, thereby improving the overall heat dissipation efficiency of each module. Utility Model Content

[0004] This invention provides a system with at least two single-phase immersion cooling modules. In particular, this system integrates a flow guiding mechanism into the single-phase immersion cooling system to prevent excessive mixing of heated fluid from multiple upstream modules with cooling fluid for multiple downstream modules.

[0005] One aspect of this utility model is an immersion heat dissipation device. The immersion heat dissipation device includes: a container holding a working fluid; and at least two immersion heat dissipation modules continuously arranged within the container and immersed in the working fluid, each immersion heat dissipation module being thermally coupled to a corresponding heat-generating device. Each immersion heat dissipation module includes: a flow guide housing comprising a main housing and end flow guides; the main housing has an inlet surface and a top wall defining at least one top wall outlet; and the end flow guides are thermally coupled to the main housing on the side opposite the inlet surface. Multiple heat dissipation fins are disposed within the main housing, and at least one fluid actuator is mounted on the inlet surface.

[0006] In one embodiment, at least two immersion heat dissipation modules are spaced apart by an adjustable distance.

[0007] In one embodiment, the end guide includes a guide backplate and a base, which together define the flow field development region.

[0008] In one embodiment, the top wall outlet is located in the top wall outlet region extending from the self-guiding backplate to the midpoint of the plurality of heat dissipation fins.

[0009] In one embodiment, the flow field development region has a length between 2 mm and 20 mm.

[0010] In one embodiment, the flow guide backplate is tilted at an angle between 0° and 45° relative to the flow field development region.

[0011] In one embodiment, the flow guide backplate includes one or more bends.

[0012] In one embodiment, the bend in the flow guide backplate is formed with at least two angled portions.

[0013] In one embodiment, the top wall outlet has multiple separate rectangular openings.

[0014] In one embodiment, the top wall outlets are arranged in a geometric array.

[0015] In one embodiment, the fluid actuator generates forced convection to transfer heated working fluid from multiple heat sink fins to the top wall outlet.

[0016] This utility model also provides an immersion heat dissipation module, which includes: A flow guide housing includes a main housing and an end flow guide, the main housing having an inlet face and a top wall defining at least one top wall outlet, and the end flow guide being coupled to the main housing on a side opposite to the inlet face; Multiple heat dissipation fins are disposed within the main housing; and At least one fluid actuator is installed on the inlet face.

[0017] In one embodiment, the end guide includes a flow guide backplate and a base, the flow guide backplate and the base together defining a flow field development region.

[0018] In one embodiment, the top wall outlet is located in a top wall outlet region extending from the backplate to a midpoint of the heat dissipation fins.

[0019] In one embodiment, the flow field development region has a length between 2 mm and 20 mm.

[0020] In one embodiment, the flow guide backplate is tilted at an angle between 0° and 45° relative to the flow field development region.

[0021] In one embodiment, the flow guide backplate includes one or more bends.

[0022] In one embodiment, the bend in the flow guide backplate is formed with at least two angled portions.

[0023] In one embodiment, the top wall outlet has multiple separate rectangular openings.

[0024] In one embodiment, the top wall outlet is arranged in a geometric array.

[0025] The advantage of this invention over existing technologies lies in its ability to promote efficient heat dissipation through both conduction and convection mechanisms. Multiple heat sink fins absorb heat through direct contact with the heating element below. Simultaneously, a fluid actuator generates forced convection, actively driving the heated working fluid from the heat sink fins to the top wall outlet located on the top wall of the guide housing. This forced convection configuration also helps prevent excessive mixing between the high-temperature fluid discharged from the upstream module and the low-temperature fluid approaching the downstream module, thus avoiding heat backflow. This design further enhances the heat dissipation efficiency of the series-connected cooling module.

[0026] This abstract aims to present several concepts in a simplified form, which will be further described in detail below. This content is not intended to identify key or essential characteristics of the requested objective, nor is it intended to limit the scope of the requested objective. Attached Figure Description

[0027] Figure 1A This is a schematic diagram of an immersion heat dissipation device according to an embodiment of the present invention.

[0028] Figure 1B and Figure 1D A graph illustrating the relationship between chip (heat-generating device) temperature and module spacing.

[0029] Figure 1C and Figure 1E A table illustrating the detailed temperature values ​​corresponding to the spacing between each module.

[0030] Figure 2A This is a schematic diagram illustrating multiple components of an immersion heat dissipation module according to an embodiment of the present invention.

[0031] Figure 2B To explain Figure 2A A schematic diagram of the immersion heat dissipation module from an external perspective.

[0032] Figure 2C To explain Figure 2A The diagram shows a longitudinal section of the immersion heat dissipation module.

[0033] Figure 2D and Figure 2E This table illustrates the detailed temperature and thermal resistance values ​​of chips (heat-generating devices) evaluated at different module spacings for immersion heat dissipation modules with or without end guides.

[0034] Figure 3A This is a longitudinal cross-sectional view illustrating an embodiment of the immersion heat dissipation module according to the present invention.

[0035] Figure 3B and Figure 3CA graph illustrating the relationship between chip (heating device) temperature and the length of the flow field development region.

[0036] Figure 3D A table illustrating detailed temperature values ​​for chips (heat-generating devices) of immersion heat dissipation modules coupled to different flow field development regions.

[0037] Figure 3E This table illustrates the detailed temperature and thermal resistance values ​​of the chip (heat-generating device) evaluated at different flow field development region lengths for immersion heat dissipation modules coupled to immersion heat dissipation modules with or without end guides.

[0038] Figure 4A This is a longitudinal cross-sectional view illustrating an embodiment of the immersion heat dissipation module according to the present invention.

[0039] Figure 4B A table illustrating the detailed temperature and thermal resistance of chips (heat-generating devices) coupled to immersion heat dissipation modules with or without end guides.

[0040] Figures 5A to 5C To explain Figure 2B The immersion cooling module shown has a top view of different top wall outlet areas.

[0041] Figure 5D and Figure 5E A graph illustrating the relationship between the temperature of the chip (heating device) and the range of the top wall outlet.

[0042] Figure 5F A table illustrating detailed temperature values ​​for chips (heat-generating devices) coupled to immersion heat dissipation modules with different top wall outlet ranges.

[0043] Figure 6A The top view is shown to illustrate an immersion heat dissipation module according to an embodiment of the present invention.

[0044] Figure 6B A table illustrating the detailed temperature and thermal resistance of chips (heat-generating devices) coupled to immersion heat dissipation modules with or without end guides.

[0045] Figure 7A The top view is shown to illustrate an immersion heat dissipation module according to an embodiment of the present invention.

[0046] Figure 7B The top view is shown to illustrate an immersion heat dissipation module according to an embodiment of the present invention.

[0047] Figure 7C A table illustrating the detailed temperature and thermal resistance of chips (heat-generating devices) coupled to immersion heat dissipation modules with or without end guides.

[0048] Figure 8A To explain Figure 3A The diagram shows a longitudinal section of the immersion heat dissipation module.

[0049] Figure 8B This is a longitudinal cross-sectional view illustrating an embodiment of the immersion heat dissipation module according to the present invention.

[0050] Figure 8C and Figure 8D A graph illustrating the relationship between chip (heating device) temperature and the tilt angle of the backplane.

[0051] Figure 8E A table illustrating detailed temperature values ​​for chips (heat-generating devices) coupled to immersion heat dissipation modules with different backplane tilt angles.

[0052] The attached figures are labeled as follows: 10: Immersion cooling system 11, 11A, 11B, 11F: Immersion heat dissipation modules 111: Flow guide shell 112: Heat dissipation fins 1121: Midpoint 113: Fluid Driver 12: Container 13: Module spacing 14: Heating device 20:Main shell 201: Entrance surface 202: Sidewall 203: Top Wall 204: Top wall outlet 205: Top wall exit area 206: Side section 30: End guide 301: Guide sidewall 302: Flow field development region 303: Airflow Guide Backplate 304: Inclination Angle FD: Flow direction Detailed Implementation Each embodiment will be described in detail with reference to the accompanying drawings, wherein like reference numerals denote the same components and parts in each drawing. The description of the embodiments should not limit the scope of the appended claims. Furthermore, any examples described herein are only a part of the many possible embodiments and are not intended to limit the scope of the claims.

[0053] Please refer to Figures 1A to 1E , Figure 1A This is a schematic diagram of an immersion heat dissipation device according to an embodiment of the present invention. Figure 1B and Figure 1D A graph illustrating the relationship between chip (heat-generating device) temperature and module spacing. Figure 1C and Figure 1E A table illustrating the detailed temperature values ​​corresponding to the spacing between each module.

[0054] For example, such as Figure 1A As shown, the immersion cooling device 10 includes a container 12, at least two immersion cooling modules 11, and at least one heating element 14. In one embodiment, the immersion cooling module 11 is a forced convection immersion cooling module. The heating element 14 is mounted inside or on the container 12, which is filled with a working fluid WF, such as coolant. Figure 1A In the example shown, the immersion heat dissipation device 10 includes two immersion heat dissipation modules 11. However, the number of immersion heat dissipation modules is not limited to this example and may be varied in other embodiments.

[0055] In one embodiment, the immersion heat dissipation device 10 is vertically oriented, and the fluid flow direction FD is opposite to the gravity direction G. (e.g., immersion) Figure 1A In the example shown, two immersion heat dissipation modules 11 are arranged in series and separated by a module spacing 13, which is defined as the vertical distance between the two immersion heat dissipation modules 11. Each immersion heat dissipation module 11 is mounted on a corresponding heating device 14. For example, the lower immersion heat dissipation module 11 serves as an upstream module coupled to the upstream heating device, and the upper immersion heat dissipation module 11 serves as a downstream module coupled to the downstream heating device. During operation, the modules passively contact the working fluid WF for heat exchange, while the heated working fluid WF is actively driven towards the rear of the immersion heat dissipation module 11 via forced convection along the flow direction FD.

[0056] In some embodiments, the heat dissipation performance of the system changes as the module spacing 13 changes. Figure 1B and Figure 1C An example illustrating the relationship between module spacing 13 and the temperature of the two heating devices 14, for example, a two-chip component operating in low power mode. Figure 1C Four datasets corresponding to different module spacings 13 are presented, labeled as heatsink spacings 1 to 4. As shown in the figure, when the module spacing 13 increases from 0 mm to 25 mm to 26 mm to 50 mm, the temperature of the downstream heat-generating device 14, i.e., chip 2, decreases by approximately 1.25°C. Further increasing the module spacing to 51 mm to 75 mm further reduces the temperature of the downstream heat-generating device, i.e., chip 2, by approximately 2.05°C.

[0057] Figure 1D and Figure 1EThis illustrates an example of the temperature relationship between the module spacing 13 and the two heating elements 14, i.e., an example of the temperature relationship between the two chip components when they are operating in high-power mode. Figure 1E Four datasets corresponding to different module spacings 13 are presented, labeled as heatsink spacings 1 to 4. As shown in the figure, when the module spacing 13 increases from 0 mm to 25 mm to 26 mm to 50 mm, the temperature of the downstream heat-generating device 14, i.e., chip 2, decreases by approximately 1.54°C. Further increasing the module spacing to 51 mm to 75 mm further reduces the temperature of the downstream heat-generating device 14, i.e., chip 2, by approximately 2.74°C.

[0058] Please refer to Figures 2A to 2E . Figure 2A This is a schematic diagram illustrating multiple components of an immersion heat dissipation module according to an embodiment of the present invention. Figure 2B To explain Figure 2A A schematic diagram of the immersion heat dissipation module from an external perspective. Figure 2C To explain Figure 2A The diagram shows a longitudinal section of the immersion heat dissipation module. Figure 2D and Figure 2E A table illustrating the detailed temperature and thermal resistance values ​​of the two heating devices 14 (i.e., two chip components) evaluated at different module spacings, with or without end-conductors, to illustrate immersion heat dissipation modules coupled to them.

[0059] like Figures 2A to 2C In the example shown, the immersion heat dissipation module 11 includes a flow guide housing 111, a plurality of heat dissipation fins 112, and at least one fluid actuator 113. In one embodiment, the immersion heat dissipation module 11 is configured as a forced convection immersion heat dissipation module suitable for mounting on the heat-generating device 14.

[0060] In one embodiment, the flow guide housing 111 includes a main housing 20 and an end flow guide 30. The main housing 20 includes an inlet surface 201 that serves as a mounting surface for a fluid actuator 113. Opposite sidewalls 202 extend rearward from the inlet surface 201 and are spanned between the two sidewalls by a top wall 203. The inlet surface 201, sidewalls 202, and top wall 203 together define a partially enclosed channel surrounding a plurality of heat dissipation fins 112. The end flow guide 30 is attached to the outlet inlet surface of the main housing 20 at the top wall outlet 204 (opposite to the inlet surface) and is used to guide the discharged working fluid WF to flow in a streamlined manner, thereby reducing turbulence and reducing mixing between the high-temperature fluid discharged from the upstream module and the cooling fluid approaching the downstream module.

[0061] During operation, the working fluid WF is drawn into the inlet surface 201 via the fluid actuator 113. The working fluid WF then flows through the main housing 20 and is guided through multiple heat dissipation fins 112, and is discharged through the top wall outlet 204. The working fluid WF is guided along a controlled path through multiple heat dissipation fins 112 that are thermally coupled to the heat dissipation device 14.

[0062] In one embodiment, the immersion cooling module 11 promotes efficient heat dissipation through both conduction and convection mechanisms. Multiple heat sink fins 112 absorb heat through direct contact with the underlying heat-generating device 140. Simultaneously, a fluid actuator 113 generates forced convection, actively driving the heated working fluid WF from the heat sink fins 112 to a top wall outlet 204 located on the top wall 203 of the flow guide housing 111. This forced convection configuration also helps prevent excessive mixing between the high-temperature fluid discharged from the upstream module and the low-temperature fluid approaching the downstream module. By avoiding such heat backflow, this design improves the heat dissipation efficiency of the series-connected cooling module.

[0063] In one embodiment, the end guide 30 further enhances the thermal management efficiency of the immersion heat dissipation modules 10 arranged in series. For example... Figure 2D and Figure 2E As shown in the example, experimental data show that under both low and high power conditions, the presence of the end flow guide 30 can reduce the temperature of the downstream heating device 14, i.e., the chip 2.

[0064] For example, when the heating device 14 operates in low-power mode, and the module spacing 13 is as follows: Figure 1A When the spacing is defined as between 26 mm and 50 mm, the temperature of the downstream heating element, i.e., chip 2, decreases by approximately 2.69°C, corresponding to a decrease in thermal resistance of approximately 9.04% compared to a system without the end guide 30. During high-power operation with the same module spacing, the temperature decrease of the same chip component, i.e., chip 2, increases to approximately 6.52°C, corresponding to a reduction in thermal resistance of 15.22%.

[0065] Furthermore, despite the reduced module spacing 13, the performance improvement remains significant. For example, when the heating element 14 operates in low-power mode and the module spacing is set to 0 mm to 25 mm, the temperature of the downstream heating element 14 (i.e., chip 2) decreases by approximately 1.7°C, corresponding to a decrease in thermal resistance of approximately 5.25%. At the same spacing, during high-power operation, the temperature of the same chip component (i.e., chip 2) decreases by approximately 6.28°C, and the thermal resistance decreases by approximately 14.73%. The results from the dataset demonstrate that even with the minimum module spacing, the inclusion of the end guide 30 still provides significant benefits.

[0066] The experimental results show that the proposed forced convection immersion cooling configuration with integrated end-effectors provides significant advantages in heat dissipation performance under different power loads and module spacings. This design is particularly suitable for high-power-density applications where space constraints and heat dissipation efficiency are key design factors.

[0067] Please refer to Figures 3A to 3E . Figure 3A This is a longitudinal cross-sectional view illustrating an embodiment of the immersion heat dissipation module according to the present invention. Figure 3B and Figure 3C A graph illustrating the relationship between the temperature of the two heating devices (i.e., two chip components) and the length of the flow field development region. Figure 3D A table illustrating the detailed temperature values ​​of the two heating elements (i.e., two chip components) of an immersion heat dissipation module coupled to different flow field development regions. Figure 3E This table illustrates the detailed temperature and thermal resistance values ​​of two heating elements (i.e., two chip components) evaluated at different flow field development region lengths for immersion heat dissipation modules coupled to immersion heat dissipation modules with or without end guides.

[0068] like Figure 3A The example shown is an immersion heat dissipation module 11A and Figure 2A The immersion heat dissipation module 11 shown is similar to the one described below, so only the differences will be described below, and the same parts will not be described again. In one embodiment, the end guide 30 of the immersion heat dissipation module 11A includes a pair of guide sidewalls 301, a flow field development region 302, and a guide backplate 303. In this embodiment, the base of the end guide 30 is defined by the flow field development region 302. The flow field development region 302 is located immediately downstream of the plurality of heat dissipation fins 112 in the direction toward the guide backplate 303, and has a length range of 0 mm to 20 mm.

[0069] In one embodiment, the flow field development region 302 is designed to provide space for the working fluid WF to mix after exiting the plurality of heat sink fins 112. This mixing process helps to prevent the working fluid temperature from creating localized hot spots at the outlet of the immersion heat dissipation module 11, which could otherwise reduce the heat dissipation efficiency of downstream modules. Furthermore, the flow field development region 302, defined as the gap between the ends of the plurality of heat sink fins 112 and the flow guide backplate 303, can also be optimized to minimize pressure drop across the module.

[0070] like Figures 3B to 3DThe example table illustrates experimental data on the temperature performance of two chips in a heat-generating device coupled to an immersion heat sink coupled to an immersion heat sink module 11A, with varying flow field development region 302 lengths. For instance, as the length of the flow field development region 302 increases from 2 mm to 17 mm, the average temperature remains relatively stable, fluctuating between 69.07°C and 69.16°C. Chip 1 exhibits a slight decreasing trend in temperature with increasing region length, from 68.48°C at 2 mm to 67.95°C at 17 mm. Conversely, chip 2 exhibits a slight increasing trend in temperature, from 69.85°C at 2 mm to 70.20°C at 17 mm. Despite slight variations in individual temperatures, the overall average temperature of the chips remains stable, indicating that within the tested range, the length of the flow field development region has a limited impact on the overall average thermal performance.

[0071] like Figure 3E As illustrated, when the heating device 14 is operating, implementing a flow field development region 302 with a length between 2 mm and 10 mm can result in a considerable performance improvement. Compared to a system without the end guide 30, the average temperature of the heating device 14 (i.e., the two-chip component) can be reduced by up to 1.31°C. Furthermore, in this configuration, the thermal resistance of the downstream heating device 14 (i.e., chip 2) can be reduced by approximately 8.88%, demonstrating the effectiveness of the flow field development region 302 in improving overall thermal management performance.

[0072] Please refer to Figures 4A to 4B . Figure 4A This is a longitudinal cross-sectional view illustrating an embodiment of the immersion heat dissipation module according to the present invention. Figure 4B A table illustrating the detailed temperature and thermal resistance values ​​of the two heating elements 14 (i.e., two chips) coupled to an immersion heat dissipation module with or without end guides.

[0073] like Figure 4A The example shown is an immersion heat dissipation module 11B with Figure 3A The immersion heat dissipation module 11B shown is similar to the one described below; therefore, only the differences will be described below, and the same parts will not be repeated. In one embodiment, the immersion heat dissipation module 11B does not include a flow field development region. That is, the length of the flow field development region is 0 mm. For example, the rear end of the end guide 30 is formed by a guide backplate 303.

[0074] In one embodiment, the flow guide backplate 303 guides the working fluid WF to the top wall outlet 204 located on the top wall of the flow guide housing (e.g., Figure 2A and Figure 2B (As shown). During the operation of multiple immersion heat dissipation modules 11 arranged in series, the flow guide backplate 303 can prevent the heated working fluid discharged from the upstream module from directly entering the downstream module.

[0075] like Figure 4B As illustrated in the example, experimental results show that when the heat-generating device 14 is operating, the backplate 303 can reduce the temperature of the downstream heat-generating device, i.e., the chip 2, by up to 3.29°C compared to a system without the backplate 30. Furthermore, the backplate 303 can also reduce the thermal resistance of the downstream heat-generating device, i.e., the chip 2, by approximately 10.07%, demonstrating the excellent effect of the backplate in improving overall heat dissipation performance.

[0076] Please refer to Figures 5A to 5C ,as well as Figure 2B . Figures 5A to 5C To explain Figure 2B The immersion cooling module shown is viewed from above with different top wall outlet areas. Figure 5D and Figure 5E A graph illustrating the relationship between the temperature of the two heating devices 14, i.e., the two chip components, and the range of the top wall outlet. Figure 5F A table illustrating the detailed temperature values ​​of the two heating devices 14, i.e., the two chip components, coupled to an immersion heat dissipation module with different top wall outlet ranges.

[0077] like Figures 5A to 5C As illustrated, the flow guide housing 111 includes a top wall 203 defining a top wall outlet 204. In one embodiment, the top wall outlet 204 is located within a designated area referred to as the top wall outlet region 205. The top wall outlet region 205 extends from the flow guide backplate 303 to a point halfway down the length of the plurality of heat dissipation fins 112, i.e., to the midpoint 1121 of the heat dissipation fins 112. Figure 2C As shown. In some embodiments, the location, size, and shape of the top wall outlet 204 within the top wall outlet region 205 are not limited. The top wall outlet 204 may take any planar shape or combination thereof, and the number of such outlets may be one or more.

[0078] like Figure 5A In the example shown, the top wall outlet 204 is located at the top of the end guide 30, and there is no opening on the top surface of the main housing 20. Alternatively... Figure 5B and Figure 5C In other examples shown, the top wall outlet 204 can span the top of both the heat dissipation fins 112 and the end guide 30, and can include combinations of different sizes and shapes such as rectangular and arcuate.

[0079] When the top wall outlet area 205 extends to the midpoint of the heat dissipation fins 112, cooling efficiency is improved compared to a configuration where it is only located at the top of the end guide 30. For example... Figure 5D and Figure 5EThe experimental data shown indicates that during operation, the temperature of the upstream heating device 14, i.e. chip 1, can decrease by a maximum of 0.19°C, the temperature of the downstream heating device 14, i.e. chip 2, can decrease by a maximum of 0.06°C, and the average temperature of the two heating devices 14, i.e. the two chip components, can decrease by a maximum of 0.12°C.

[0080] Please refer to Figures 6A to 6B . Figure 6A The top view is shown to illustrate an immersion heat dissipation module according to an embodiment of the present invention. Figure 6B This table illustrates the detailed temperature and thermal resistance values ​​of two heating elements, i.e., two chip components, coupled to an immersion heat dissipation module with or without end guides.

[0081] like Figure 6A The example shown is an immersion heat dissipation module 11C and Figure 2A The immersion heat dissipation module 11 shown is similar, so only the differences will be described below, and the same parts will not be repeated. In one embodiment, a plurality of top wall outlets 204 are formed in the top wall outlet region 205. For example, the top wall outlets 204 of the immersion heat dissipation module 11C consist of several separate rectangular openings. However, this embodiment is not limited to this. In other embodiments, the number, size, and position of the top wall outlets 204 are not limited and can be selected according to the required flow field distribution. By properly arranging the position of the top wall outlets 204, the pressure drop and temperature can be effectively reduced.

[0082] like Figure 6B As illustrated, experimental data show the immersion performance of the immersion heat dissipation module 11C when the heat-generating device 14 is operating. For example, the presence of the end guide 30 can reduce the temperature of the downstream heat-generating device 14, i.e., the chip 2, by up to 3.05°C compared to a system without a guide structure. Furthermore, the thermal resistance of the downstream heat-generating device 14, i.e., the chip 2, can be reduced by up to 9.34%.

[0083] Please refer to Figures 7A to 7C . Figure 7A The top view is shown to illustrate an immersion heat dissipation module according to an embodiment of the present invention. Figure 7B The top view is shown to illustrate an immersion heat dissipation module according to an embodiment of the present invention. Figure 7C This table illustrates the detailed temperature and thermal resistance values ​​of two heating elements, i.e., two chip components, coupled to an immersion heat dissipation module with or without end guides.

[0084] like Figure 7A The example shown is an immersion heat dissipation module 11D and Figure 2AThe immersion heat dissipation module 11 shown is similar to the one described below; therefore, only the differences will be described below, and the same parts will not be repeated. In one embodiment, the top wall outlet 204 of the immersion heat dissipation module 11D is arranged in a geometric array with multiple openings. However, this embodiment is not limited to this. In other embodiments, the top wall outlets may be arranged irregularly, staggered, or optimized according to specific flow field dynamics, heat distribution, or structural constraints.

[0085] like Figure 7B The example shown is the immersion heat dissipation module 11E and... Figure 7A The immersion heat dissipation module 11D shown is similar, so only the differences will be described below, and the same parts will not be repeated. Both sides 206 of the immersion heat dissipation module 11E are connected to the end guide 30, forming a rectangular top wall outlet 204. However, this embodiment is not limited to this. In other embodiments, one or more top wall outlets 204 of arbitrary size and shape can be formed in the top wall outlet region 205 according to cooling requirements.

[0086] like Figure 7C The example shown demonstrates the performance of the immersion heat dissipation module 11E during the operation of the heat-generating device 14. For instance, the presence of the end guide 30 can reduce the temperature of the downstream heat-generating device 14, i.e., chip 2, by up to 2.77°C compared to a system without a guide structure. Furthermore, the thermal resistance of the downstream heat-generating device 14 (i.e., chip 2) can also be reduced by up to 8.42%.

[0087] Please refer to Figures 8A to 8E . Figure 8A To explain Figure 3A The diagram shows a longitudinal section of the immersion heat dissipation module. Figure 8B This is a longitudinal cross-sectional view illustrating an embodiment of the immersion heat dissipation module according to the present invention. Figure 8C and Figure 8D A graph illustrating the relationship between the temperature of the two heating elements (i.e., the two chip components) and the tilt angle of the flow guide backplate. Figure 8E A table illustrating the detailed temperature values ​​of two heating elements, or two chip components, coupled to an immersion heat dissipation module with different backplane tilt angles.

[0088] like Figure 8A As shown in the example, the end guide 30 includes a guide backplate 303 and a flow field development region 302, as shown in the example. Figure 3A As shown, a flow guide backplate tilt angle 304 is formed between the two. In one embodiment, the tilt angle 304 may range from 0° to 45°.

[0089] like Figure 8B The example shown is an immersion heat dissipation module 11A and Figure 3AThe immersion heat dissipation module 11A shown is similar, so only the differences will be described below, and the same parts will not be described again. In one embodiment, the flow guide back plate 303 of the end flow guide structure 30 may form one or more bends 308.

[0090] According to this embodiment, when the tilt angle 304 of the flow guide backplate is set to 30°, the temperature of the downstream heating device 14, i.e. the chip 2, can be reduced by about 0.28°C during operation compared to the configuration with a tilt angle of 0°.

[0091] Therefore, the embodiments disclosed in this specification are indeed suitable for achieving the purposes and advantages described in this specification, and can also achieve their inherent benefits. The specific embodiments disclosed above are for illustrative purposes only, and the embodiments disclosed in this specification can be modified and implemented in different but equivalent ways by those skilled in the art after understanding the content of this specification. In addition, unless otherwise stated in the following claims, this specification is not intended to limit the structural or design details. It is therefore understood that the embodiments specifically described above can be changed, combined or modified, and all such modifications should be covered within the spirit and scope of this utility model. Of course, the disclosed embodiments are only exemplary embodiments, and various modifications can still be made without departing from the spirit and scope of this utility model. Furthermore, those skilled in the art should understand that the various aspects of the embodiments are not mutually exclusive and can be arbitrarily combined according to design requirements.

[0092] The embodiments disclosed in this specification can be suitably implemented even without undisclosed components and / or optional components. While the compositions and methods described herein are described as “comprising,” “containing,” or “including” various elements or steps, they can also be interpreted as “essentially composed of” or “entirely composed of.” All numerical values ​​and ranges disclosed herein are subject to variation. When a numerical range is disclosed, any value or subrange within that range is considered specifically disclosed. For example, any disclosed numerical range “from about a to about b” (or equivalent statements) encompasses all specific values ​​and subranges within that range. Furthermore, the terms used in the claims, unless expressly defined, should be taken in their general, ordinary sense. The indefinite article “a” used in the claims is hereby defined as meaning “one or more” of the elements it refers to.

Claims

1. An immersion-type heat dissipation device, characterized in that, Include: A container holding a working fluid; and At least two submersible heat dissipation modules are arranged in series within the container and immersed in the working fluid, and each of the at least two submersible heat dissipation modules is thermally coupled to a corresponding heating device. The at least two submersible heat dissipation modules include: A flow guide housing includes a main housing and an end flow guide, the main housing having an inlet face and a top wall defining at least one top wall outlet, and the end flow guide being thermally coupled to the main housing on one side opposite to the inlet face; Multiple heat dissipation fins are disposed within the main housing; and At least one fluid actuator is installed on the inlet face.

2. The immersion heat dissipation device as described in claim 1, characterized in that, The at least two immersion heat dissipation modules are spaced at an adjustable interval.

3. The immersion heat dissipation device as described in claim 1, characterized in that, The end guide includes a flow guide backplate and a base, which together define a flow field development region.

4. The immersion heat dissipation device as described in claim 3, characterized in that, The top wall outlet is located in a top wall outlet area extending from the backplate to a midpoint of the heat dissipation fins.

5. The immersion heat dissipation device as described in claim 3, characterized in that, The flow field development region has a length between 2 mm and 20 mm.

6. The immersion heat dissipation device as described in claim 3, characterized in that, The flow guide backplate is tilted at an angle between 0° and 45° relative to the flow field development region.

7. The immersion heat dissipation device as described in claim 3, characterized in that, The flow guide backplate includes one or more bends.

8. The immersion heat dissipation device as described in claim 7, characterized in that, The bend in the flow guide backplate forms at least two angled portions.

9. The immersion heat dissipation device as described in claim 1, characterized in that, The top wall outlet has multiple separate rectangular openings.

10. The immersion heat dissipation device as described in claim 1, characterized in that, The top wall outlets are arranged in a geometric array.

11. The immersion heat dissipation device as described in claim 1, characterized in that, The fluid drive generates forced convection to transfer the heated working fluid from the heat sink fins to the top wall outlet.

12. An immersion heat dissipation module, characterized in that, Include: A flow guide housing includes a main housing and an end flow guide, the main housing having an inlet face and a top wall defining at least one top wall outlet, and the end flow guide being coupled to the main housing on a side opposite to the inlet face; Multiple heat dissipation fins are disposed within the main housing; and At least one fluid actuator is installed on the inlet face.

13. The immersion heat dissipation module as described in claim 12, characterized in that, The end guide includes a flow guide backplate and a base, which together define a flow field development region.

14. The immersion heat dissipation module as described in claim 13, characterized in that, The top wall outlet is located in a top wall outlet area extending from the backplate to a midpoint of the heat dissipation fins.

15. The immersion heat dissipation module as described in claim 13, characterized in that, The flow field development region has a length between 2 mm and 20 mm.

16. The immersion heat dissipation module as described in claim 13, characterized in that, The flow guide backplate is tilted at an angle between 0° and 45° relative to the flow field development region.

17. The immersion heat dissipation module as described in claim 13, characterized in that, The flow guide backplate includes one or more bends.

18. The immersion heat dissipation module as described in claim 17, characterized in that, The bend in the flow guide backplate forms at least two angled portions.

19. The immersion heat dissipation module as described in claim 12, characterized in that, The top wall outlet has multiple separate rectangular openings.

20. The immersion heat dissipation module as described in claim 12, characterized in that, The top wall outlets are arranged in a geometric array.

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