A heat dissipation structure, a heat conduction structure and a heat sink thereof

Abstract

The application provides a heat dissipation structure, a heat conduction structure and a heat radiator thereof, relates to the field of heat dissipation structures, and discloses a heat dissipation structure, a heat conduction structure and a heat radiator thereof.

Description

Technical Field

[0001] This application relates to the field of heat dissipation structures, and more specifically, to a heat dissipation structure, a heat conduction structure, and a heat sink thereof. Background Technology

[0002] Electronic devices contain numerous electronic components that generate heat during operation and calculation. Excessive heat can affect the processing efficiency or lifespan of electronic devices. Therefore, the most common way to cool electronic devices is to add heat dissipation components such as heat sinks, heat fins, heat pipes, and vapor chambers for heat conduction. However, this structure cannot be tightly integrated with the electronics, so the current heat conduction structure needs to be improved, resulting in poor heat dissipation. Summary of the Invention

[0003] The purpose of this application is to provide a heat dissipation structure, a heat conduction structure and a heat sink, which can solve the above-mentioned technical problems.

[0004] This application provides a heat-conducting structure, including a base and a heat sink. The upper end of the base is provided with a snap-fit ​​groove, the two sides of the heat sink are provided with plug-in parts, the two ends of the heat sink are provided with extension parts, and the inner side of the heat sink is provided with a heat-conducting layer. The plug-in parts and the extension parts are all inserted into the snap-fit ​​groove. The side of the base away from the heat sink is provided with a plurality of evenly arranged heat dissipation fins.

[0005] Preferably, a protective film is provided on the thermally conductive layer, a relief opening is provided on one side of the heat sink, and one end of the protective film extends from the relief opening to the outside of the heat sink.

[0006] Preferably, the base and the heat sink are both made of metal or thermally conductive phase change material, and the base and the heat sink are integrally formed.

[0007] Preferably, a protective strip is provided on the other side of the heat sink, the protective strip is L-shaped, and one end of the protective strip extends out of the heat sink.

[0008] Preferably, the plug-in component is serrated.

[0009] A heat dissipation structure includes a heat sink, with plug-in components on both sides of the heat sink, extension components at both ends of the heat sink, and a heat-conducting layer on the inner side of the heat sink.

[0010] Preferably, the plug-in component is serrated.

[0011] A heat sink comprising the heat-conducting structure described in any of the preceding claims.

[0012] The beneficial effects of this utility model are: This utility model provides a heat dissipation structure, a heat conduction structure, and a heat sink. In use, the heat sink is first inserted into the snap-fit ​​groove of the base, so that the heat dissipation layer of the heat sink abuts against the base. Then, the heat sink is attached to the electronic device. The heat generated by the electronic device can be quickly dissipated through the heat sink, the heat conduction layer, and the base, which can effectively ensure the operation of the electronic device. In addition, this utility model has a simple structure, is easy to install, and is easy to insert and remove later. The pluggable heat sink also makes it easy to replace the heat conduction layer later. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the heat sink of this utility model; Figure 3 This is a schematic diagram of the heat sink of this utility model from another perspective; Figure 4 This is a front view of the heat sink of this utility model.

[0015] The reference numerals in the attached figures are as follows: 1. Base; 2. Heat sink; 3. Snap-in slot; 4. Insert; 5. Extension; 6. Thermal conductive layer; 7. Heat dissipation fins; 8. Protective film; 9. Clearance opening; 10. Protective strip. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0017] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0018] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0019] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0020] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0021] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] Example 1 like Figure 1-4As shown in the figure, this application provides a heat-conducting structure, including a base 1 and a heat sink 2. The upper end of the base 1 is provided with a snap-fit ​​groove 3. The heat sink 2 is provided with plug-in parts 4 on both sides and extension parts 5 at both ends. A heat-conducting layer 6 is provided on the inner side of the heat sink 2. The plug-in parts 4 and the extension parts 5 are all inserted into the snap-fit ​​groove 3. A plurality of evenly arranged heat dissipation fins 7 are provided on the side of the base 1 away from the heat sink 2. In use, the heat sink 2 is first inserted into the snap-fit ​​groove 3 of the base 1 so that the heat dissipation layer of the heat sink 2 abuts against the base 1. Then the heat sink 2 is attached to the electronic device. The heat generated by the electronic device can be quickly dissipated through the heat sink 2, the heat-conducting layer 6 and the base 1, which can effectively ensure the operation of the electronic device. In addition, the structure of this utility model is simple, easy to install, easy to insert and remove later, and the plug-in heat sink 2 can facilitate the replacement of the heat-conducting layer 6 later.

[0023] In this embodiment, a protective film 8 is provided on the heat-conducting layer 6, and a clearance opening 9 is provided on one side of the heat sink 2. One end of the protective film 8 extends from the clearance opening 9 to the outside of the heat sink 2. Specifically, when the heat-conducting layer 6 is installed on the base 1, the side of the protective film 8 is pulled out to prevent damage to the heat-conducting layer 6 during the installation process. The protective film 8 is a relatively hard plastic layer.

[0024] In this embodiment, to further improve heat dissipation efficiency, both the base 1 and the heat sink 2 are made of metal or thermally conductive phase change material, and the base 1 and the heat sink 7 are integrally formed.

[0025] In this embodiment, a protective strip 10 is provided on the other side of the heat sink 2. The protective strip 10 is L-shaped and one end of the protective strip 10 extends out of the heat sink 2. Specifically, the protective strip 10 of this utility model also needs to be pulled out after installation.

[0026] In this embodiment, to ensure the stability of the connection between the plug and the base 1 and to increase friction, the plug 4 is serrated.

[0027] Example 2 like Figure 2-4 As shown, a heat dissipation structure includes a heat sink 2, plug-in parts 4 are provided on both sides of the heat sink 2, extension parts 5 are provided at both ends of the heat sink 2, a heat-conducting layer 6 is provided on the inner side of the heat sink 2, and the plug-in parts 4 are serrated.

[0028] For smaller electronic devices, this invention can be used to install them directly without the base 1, or to replace the heat sink 2 if the heat dissipation layer is damaged.

[0029] Example 3 like Figure 1As shown, a heat sink includes the heat-conducting structure described in the above embodiment. The heat sink of this utility model can be equipped with one or at least two heat-conducting structures depending on the size of the electronic device. The specific number can be installed according to the requirements.

[0030] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A thermally conductive structure, characterized in that: The device includes a base and a heat sink. The base has a snap-fit ​​groove at its upper end. The heat sink has plug-in parts on both sides and extension parts at both ends. The heat sink has a heat-conducting layer on its inner side. The plug-in parts and the extension parts are inserted into the snap-fit ​​groove. The base has a plurality of evenly arranged heat dissipation fins on the side away from the heat sink.

2. The thermally conductive structure according to claim 1, characterized in that: A protective film is provided on the thermally conductive layer, and a clearance opening is provided on one side of the heat sink. One end of the protective film extends from the clearance opening to the outside of the heat sink.

3. The thermally conductive structure according to claim 1, characterized in that: Both the base and the heat sink are made of metal or thermally conductive phase change material, and the base and the heat sink are integrally formed.

4. The thermally conductive structure according to claim 1, characterized in that: A protective strip is provided on the other side of the heat sink. The protective strip is L-shaped and one end of the protective strip extends out of the heat sink.

5. A thermally conductive structure according to claim 1, characterized in that: The plug-in component is serrated.

6. A heat dissipation structure, characterized in that: It includes a heat sink, with plug-in components on both sides of the heat sink, extension components at both ends of the heat sink, and a heat-conducting layer on the inner side of the heat sink.

7. A heat dissipation structure according to claim 6, characterized in that: The plug-in component is serrated.

8. A radiator, characterized in that, Includes the thermally conductive structure according to any one of claims 1 to 7.

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