Heat dissipation assembly and data processing device

Abstract

The application provides a heat dissipation assembly and a data processing device. The heat dissipation assembly comprises a mainboard, a data processing board and a first heat dissipation module. The data processing board is arranged on one side of the mainboard, and a plurality of first power supply chips are arranged on the side of the data processing board facing the mainboard. The first heat dissipation module comprises a first phase change heat conduction structure and a first fin. The first phase change heat conduction structure is in heat conduction contact with part of the first power supply chips, and the first fin is in heat conduction connection with the first phase change heat conduction structure. A plurality of first heat dissipation modules are arranged to dissipate heat from the first power supply chips located at different positions, thereby dissipating heat from all the first power supply chips. The first phase change heat conduction structure is arranged to transfer heat to the first fin through the state change of the phase change medium in the first phase change heat conduction structure, thereby efficiently dissipating heat from the first power supply chips, reducing or even avoiding the influence of the power consumption of the first power supply chips. The plurality of first heat dissipation modules are arranged to facilitate the installation of the heat dissipation assembly and improve the installation efficiency.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, specifically to a heat dissipation component and a data processing device. Background Technology

[0002] With the rapid development of data processing devices, these devices have more and more functions, which in turn requires more chips, leading to increased power consumption. Consequently, these devices need more efficient heat dissipation components to cool down.

[0003] Typically, a data processing device consists of a motherboard and a data processing board stacked together. Chips are mounted on the data processing board, requiring a heat dissipation module to cool them. However, a power chip is located on the side of the data processing board facing the motherboard. The gap between the motherboard and the data processing board is very small, making it difficult to arrange the heat dissipation module, increasing the difficulty of heat dissipation, and consequently affecting the power consumption of the power chip on the data processing board. Utility Model Content

[0004] In view of this, this application provides a heat dissipation component, which at least solves the problem of difficult heat dissipation of the power chip on the side of the data processing board facing the board body, thus affecting the power consumption of the power chip on the data processing board. This application also provides a data processing device including the above-mentioned heat dissipation component.

[0005] To achieve the above objectives, this application provides the following technical solution: A heat dissipation component, comprising: Motherboard; A data processing board is disposed on one side of the motherboard, and a plurality of first power chips are disposed on the side of the data processing board facing the motherboard; The first heat dissipation module includes a first phase change heat conduction structure and a first fin. The first phase change heat conduction structure is in thermal contact with a portion of the first power chip, and the first fin is in thermal connection with the first phase change heat conduction structure. The first heat dissipation module is provided in multiple units to dissipate heat from the first power chips located in different positions, thereby achieving heat dissipation for all the first power chips.

[0006] Optionally, the first phase change heat conduction structure includes: A heat spreader is disposed between the data processing board and the motherboard, and makes thermal contact with a portion of the first power chip. The first heat pipe has one end thermally connected to the heat spreader and the other end thermally contacted with the first fin.

[0007] Optionally, it also includes a bracket with one end connected to the first fin and the other end connected to the data processing board. Multiple brackets are provided and are located on both sides of the first heat pipe.

[0008] Optionally, multiple first fins are stacked, the first heat pipes are arranged in a bent manner, and at least two portions of each first fin are in thermal contact with the first heat pipes.

[0009] Optionally, the data processing board has a U-shaped notch to avoid the first heat pipe.

[0010] Optionally, the data processing board has a main chip and a second power chip disposed on the side opposite to the motherboard. The heat dissipation component includes a second heat dissipation module, which includes a second phase change heat conduction structure and a second fin. The second phase change heat conduction structure is in thermal contact with the main chip and the second power chip, and the second fin is connected to the second phase change heat conduction structure.

[0011] Optionally, multiple sets of the second fins are provided, and there is a clearance space between the multiple sets of the second fins to accommodate the first fins.

[0012] Optional, The second fin includes a longitudinal fin group and a plurality of transverse fin groups, and there is a clearance space between the plurality of transverse fin groups, and the longitudinal fin group is located at the bottom of the clearance space; The second phase change heat conduction structure includes a heat conduction plate and a second heat conduction pipe. The heat conduction plate is in thermal contact with the main chip and the second power chip. One end of the second heat conduction pipe is in thermal connection with the heat conduction plate, and the other end of the second heat conduction pipe passes through the transverse fin group and the longitudinal fin group and is in thermal contact with them.

[0013] Optionally, both the main chip and the second power chip include multiple components, and there is a height difference between the main chips, between the second power chips, or between the main chip and the second power chip. The heat-conducting plate includes a convex portion and a concave portion with a height difference, and the convex portion and the concave portion respectively make thermal contact with the main chip and / or the second power chip.

[0014] A data processing apparatus, comprising the heat dissipation component described in any of the preceding claims.

[0015] The heat dissipation assembly provided in this application includes a motherboard, a data processing board, and a first heat dissipation module. The data processing board is disposed on one side of the motherboard, and multiple first power chips are disposed on the side of the data processing board facing the motherboard. The first heat dissipation module includes a first phase change heat conduction structure and first fins. The first phase change heat conduction structure has thermal contact with some of the first power chips, thus exchanging heat with the first power chips through the first phase change heat conduction structure. The phase change medium within the first phase change heat conduction structure undergoes a phase change and transfers heat to the first fins. The heat from the first fins is then directly transferred to the external environment through convection heat exchange with the system's cold air, thereby achieving heat dissipation for the first power chips. Here, by setting up the first phase change heat conduction structure, heat is transferred to the first fins through the change in the state of the phase change medium within the first phase change heat conduction structure, which can efficiently dissipate heat from the first power chips, thereby reducing or even avoiding impact on the power consumption of the first power chips.

[0016] Furthermore, multiple first heat dissipation modules are configured to dissipate heat from the first power chips located at different positions, thereby achieving heat dissipation for all the first power chips. By using multiple first phase-change heat conduction structures within these modules to dissipate heat from the first power chips at different locations, the heat dissipation problem in a compact space is transformed into a heat dissipation problem on a large, flat surface, thus alleviating heat dissipation pressure and ensuring stable operation of the first power chips. Moreover, by using multiple first heat dissipation modules to dissipate heat from the first power chips together, the heat dissipation efficiency of the first modules is improved, and the use of multiple first heat dissipation modules facilitates installation and improves installation efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the heat dissipation component provided in this embodiment.

[0019] Figure 2 This is an exploded view of the heat dissipation component.

[0020] Figure 3 This is a schematic diagram of the structure of the first heat dissipation module.

[0021] Figure 4 This is a schematic diagram of the second heat dissipation module and its protective frame.

[0022] Figure 5 This is a schematic diagram of the data processing board.

[0023] Figure 6 This is a top view of the data processing panel.

[0024] Figure 7 This is a bottom view of the data processing board.

[0025] Figure 8 This is a cross-sectional view of the motherboard, data processing board, and first heat dissipation module.

[0026] Figure 9 This is a cross-sectional view of the motherboard, data processing board, and second heat dissipation module.

[0027] Figure 10 for Figure 9 A magnified view of a portion of the image.

[0028] Figures 1 to 10 middle: 1-Motherboard, 2-Data processing board, 3-First heat dissipation module, 4-Bracket, 5-Second heat dissipation module, 6-Protective frame, 7-Clearing space; 21-First power chip, 22-Main chip, 23-Second power chip, 24-U-shaped notch, 31-First phase change heat conduction structure, 32-First fin, 51-Second phase change heat conduction structure, 52-Second fin; 311-Heat spreader, 312-First heat pipe, 511-Heat plate, 512-Second heat pipe, 521-Transverse fin assembly, 522-Vertical fin assembly; 5111 - Convex plate portion, 5112 - Concave plate portion, 5121 - First heat-conducting portion, 5122 - Second heat-conducting portion. Detailed Implementation

[0029] This application provides a heat dissipation component that at least solves the problem of difficult heat dissipation for the power chip on the side of the data processing board facing the board body, which affects the power consumption of the power chip. This application also provides a data processing device including the above-mentioned heat dissipation component.

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] like Figures 1 to 10As shown in the figure, this application embodiment provides a heat dissipation component, which mainly includes a motherboard 1, a data processing board 2, and a first heat dissipation module 3. The motherboard 1 is the core hardware platform in the data processing device, and its main functions are to realize hardware connection and coordination, realize power management and stability, and control the system and expansion. It is the core carrier of the data path. The data processing board 2 is also known as the AI ​​board component. The AI ​​board component is a hardware module that integrates an AI acceleration chip and is designed for efficient execution of neural network calculations. The data processing board 2 is disposed on one side of the motherboard 1. Multiple first power chips 21 are disposed on the side of the data processing board 2 facing the motherboard 1. The power chips are the core components in electronic devices responsible for power conversion, distribution, and management. The first heat dissipation module 3 includes a first phase change heat conduction structure 31 and a first fin 32. The first phase change heat conduction structure 31 is in thermal contact with part of the first power chip 21, and the first fin 32 is in thermal connection with the first phase change heat conduction structure 31. Thus, when the first power chip 21 located on the side of the data processing board 2 facing the motherboard 1 is in working condition and its temperature rises, the phase change medium in the first phase change heat conduction structure 31 absorbs the heat from the first power chip 21. The phase change medium with the increased temperature becomes gaseous. The gaseous phase change medium pushes the gas to flow towards the low-pressure area, i.e., the cold end. The gaseous high-temperature phase change medium moves upward along the first phase change heat conduction structure 31. The gaseous phase change medium condenses into liquid at the cold end and flows back to the position where the first phase change heat conduction structure 31 is in thermal contact with the first power chip 21. The heat transferred by the gaseous phase change medium to the first fin 32 is directly transferred to the environment through convection heat exchange with the cold air of the system. Furthermore, since there are too many first power chips 21, the heat generated is relatively large. In this application, by setting multiple first heat dissipation modules 3 to dissipate heat from the first power chips 21 in different areas, the heat dissipation efficiency of the first power chips 21 and the heat dissipation effect of multiple first power chips 21 can be improved.

[0032] Multiple first heat dissipation modules 3 are provided to dissipate heat from the first power chips 21 located at different positions, thereby achieving heat dissipation for all the first power chips 21. For example, two first heat dissipation modules 3 are arranged opposite each other on both sides of the data processing board 2, mirroring each other. This facilitates the arrangement of the first heat dissipation modules 3, especially the arrangement of the first fins 32, improving space utilization and assembly efficiency of the heat dissipation components. It should be noted that the number of first heat dissipation modules 3 is not limited; three, four, or even more modules can be provided.

[0033] For example, the phase change medium in the first phase change heat conduction structure 31 can be water, ethanol, acetone, ammonia, chlorofluorocarbons, etc.

[0034] The heat dissipation assembly described above incorporates a first phase-change heat-conducting structure 31. Through the change in the state of the phase-change medium within the first phase-change heat-conducting structure 31, heat is transferred to the first fins 32, efficiently dissipating heat from the first power chip 21 and thus reducing or even eliminating any impact on the power consumption of the first power chip 21. Furthermore, multiple first heat dissipation modules 3 are configured to dissipate heat from the first power chips 21 located at different positions, achieving heat dissipation for all the first power chips 21. By having multiple first phase-change heat-conducting structures 31 in multiple first heat dissipation modules 3 dissipate heat from the first power chips 21 located at different positions, the heat dissipation problem in a compact space is transformed into a heat dissipation problem in a large planar space, thereby alleviating heat dissipation pressure and ensuring stable operation of the first power chip 21. Moreover, by using multiple first heat dissipation modules 3 to dissipate heat from the first power chip 21 together, the heat dissipation efficiency of the first module is improved, and the use of multiple first heat dissipation modules 3 facilitates installation of the first heat dissipation modules, improving the installation efficiency of the first module.

[0035] In some embodiments, please refer to Figure 3 , Figure 7 and Figure 8The first phase change heat conduction structure 31 includes a heat spreader 311 and a first heat pipe 312. The heat spreader 311 is disposed between the data processing board 2 and the main board 1 and makes thermal contact with a portion of the first power chip 21. One end of the first heat pipe 312 is thermally connected to the heat spreader 311, and the other end is thermally contacted with the first fin 32. It should be noted that the connection method between the first heat pipe 312 and the heat spreader 311 is not limited here. For example, the first heat pipe 312 and the heat spreader 311 can be connected through each other, that is, the phase change medium can flow in the heat spreader 311 and the first heat pipe 312; the first heat pipe 312 and the heat spreader 311 can also be thermally contacted, and both the first heat pipe 312 and the heat spreader 311 contain a phase change medium. Specifically, taking the through connection of the first heat pipe 312 and the heat spreader 311 as an example, the heat generated by the first power chip 21 during operation is transferred to the heat spreader 311 through heat conduction. This heat, in the form of latent heat, heats the phase change medium inside the heat spreader 311 and vaporizes it. The volume of the vaporization area expands to high pressure, pushing the gas to flow to the low-pressure area, i.e., the cold end. Since the first heat pipe 312 and the heat spreader 311 are a through cavity, the gas will flow to the cold end of the first heat pipe 312. After the gas transfers heat to the cold end of the first heat pipe 312, it condenses into liquid. Under the capillary action of the capillary structure on the inner wall of the heat spreader 311 and the first heat pipe 312, the liquid flows back to the hot end of the heat spreader 311 that contacts the first power chip 21, thus forming a heat transfer cycle. Furthermore, the heat transferred to the first heat pipe 312 is transferred to the first fin 32 through heat conduction. Then, the first fin 32 convections with the cold air of the system and finally transfers the heat to the environment. With this configuration, the heat spreader 311 transfers the heat generated by the first power chip 21 from the bottom of the data processing board 2 to the upper spacious space, solving the problem of insufficient heat dissipation in the compact space between the data processing board 2 and the motherboard 1. Furthermore, the heat spreader 311 and the first heat pipe 312 are internally connected and contain a phase change medium, which can efficiently dissipate heat from the first power chip 21 to ensure stable operation of the first power chip 21.

[0036] For example, the vapor chamber 311 can be a VC (Vapor Chamber). A VC is a high-efficiency heat dissipation device that utilizes the principle of phase change heat transfer. Its core structure is a sealed vacuum metal cavity containing a small amount of working liquid (such as pure water or a low-boiling-point liquid). When the device heats up, the liquid evaporates and quickly conducts heat to the entire cavity surface, achieving efficient heat dissipation.

[0037] In some embodiments, the height limit between the data processing board 2 and the motherboard 1 is typically 8mm, while the height of the first power chip 21 is typically 3.5mm. Therefore, the maximum installation height of the heat spreader 311 is only 4.5mm, ensuring that the height of the heat spreader is 2.5mm to 3.5mm. The ultra-thin heat spreader 311, with its ultra-thin construction, ensures that it can be positioned between the data processing board 2 and the motherboard 1, where the gap is small. This ensures excellent heat dissipation for the first power chip 21 while preventing the heat spreader 311 from being damaged.

[0038] For example, the thickness of the heat spreader 311 can be 2.5mm, 2.6mm, 2.7mm, 3mm, 3.2mm, 3.4mm, 3.5mm, etc. Of course, the thickness of the heat spreader 311 can also be 2mm, 2.3mm, 3.8mm, 4mm, 4.2mm, etc.

[0039] Since the heat spreader 311 and the first fin 32 are connected only by the first heat pipe 312, the stress point of the first heat dissipation module 3 is located at the position of the first heat pipe 312. This results in poor support stability of the first heat pipe 312 for the first fin 32, making the first heat pipe 312 prone to bending and affecting its structural stability. Therefore, in some embodiments, please refer to... Figure 1 and Figure 3 The heat dissipation assembly also includes a bracket 4, one end of which is connected to the first fin 32 and the other end of which is connected to the data processing board 2. Here, by setting the bracket 4 fixed to the data processing board 2 and the first fin 32, the problem of poor connection strength between the first heat pipe 312 and the first fin 32 is solved, improving the structural strength of the first fin 32 and thus enhancing the structural stability of the first heat dissipation module 3. Furthermore, multiple brackets 4 are provided, each located on both sides of the first heat pipe 312. This further enhances the support force of the bracket 4 on the first fin 32, ensuring balanced force distribution on the first fin 32 and further improving the stability of the support provided by the bracket 4.

[0040] In some embodiments, please refer to Figure 3 and Figure 8Multiple first fins 32 are stacked, and the first heat pipes 312 are arranged in a curved pattern. This increases the contact area between the first heat pipes 312 and the first fins 32, thereby improving the heat exchange efficiency between them and enhancing the heat dissipation efficiency of the first heat dissipation module 3 for the first power chip 21. Furthermore, it is ensured that at least two parts of each first fin 32 are in thermal contact with the first heat pipe 312, meaning that each first fin 32 undergoes at least two heat exchanges with the first heat pipe 312. This ensures the uniformity of heat exchange between each first fin 32 and the first heat pipe 312, fully utilizing the heat exchange effect of each first fin 32 and further improving its heat dissipation capacity.

[0041] Since the vapor chamber 311 of the first heat dissipation module 3 is located between the data processing board 2 and the motherboard 1, and the first fins 32 are located on the side of the data processing board 2 away from the motherboard 1, the first fins 32 and the vapor chamber 311 are connected by a first heat pipe 312. To achieve this connection, the first heat pipe 312 needs to undergo unnecessary bending, which affects the overall appearance and structure of the heat dissipation assembly and the movement rate of the cooling medium within the first heat pipe 312, thus affecting the heat exchange efficiency. Therefore, in some embodiments, please refer to... Figures 5 to 7 The data processing board 2 has a U-shaped notch 24 to avoid the first heat pipe 312. This design facilitates the placement of the first heat pipe 312, which passes through the U-shaped notch 24 and connects to the first fin 32. This allows for the arrangement of the first heat pipe 312 without affecting the overall appearance of the heat dissipation assembly or the movement rate of the cooling medium in the first heat pipe 312, thus ensuring the heat exchange efficiency of the first heat dissipation module 3.

[0042] In some embodiments, please refer to Figure 2 , Figure 4 and Figure 5The data processing board 2 has a main chip 22 and a second power chip 23 disposed on the side opposite to the motherboard 1. The heat dissipation component includes a second heat dissipation module 5, which includes a second phase change heat conduction structure 51 and a second fin 52. The second phase change heat conduction structure 51 is in thermal contact with the main chip 22 and the second power chip 23, and the second fin 52 is connected to the second phase change heat conduction structure 51. Specifically, when the heat dissipation component is in operation, the heat generated by the main chip 22 and the second power chip 23 is transferred to the second phase change heat conduction structure 51. The phase change medium in the second phase change heat conduction structure 51 absorbs the heat generated by the main chip 22 and the second power chip 23 and vaporizes into gas. Since this area is in a gaseous state, it is a high-pressure area, which drives the gas to flow towards the low-pressure area, i.e., the cold end. The cold end is the area of ​​the second phase change heat conduction structure 51 near the second fin 52. The gas condenses into liquid in the area of ​​the second phase change heat conduction structure 51 and flows back to the area where the second phase change heat conduction structure 51 contacts the main chip 22 and the second power chip 23 through the capillary structure on the surface of the second phase change heat conduction structure 51, thus forming a heat transfer cycle. The second fin 52 absorbs the heat from the second phase change heat conduction structure 51 and exchanges heat with the external environment, so that the heat transferred from the second phase change heat conduction structure 51 to the second fin 52 is transferred to the external environment through heat exchange with the environment. This configuration, through the phase change of the phase change medium, can improve the heat dissipation efficiency of the main chip 22 and the second power chip 23.

[0043] In some embodiments, please refer to Figure 4 and Figure 9 Multiple sets of second fins 52 are provided, meaning that multiple sets of second fins 52 are provided, and all sets of second fins 52 are in thermal contact with the second phase change heat conduction structure 51. In this way, multiple sets of second fins 52 work together to dissipate heat from the phase change medium within the second phase change heat conduction structure 51, thereby improving the heat dissipation efficiency of the second heat dissipation module 5. Furthermore, there is a clearance space 7 between the multiple sets of second fins 52 to accommodate the first fin 32. That is, the first fin 32 is placed within the clearance space 7 between the second fins 52, which allows the first fin 32 and the second fin 52 to be more tightly arranged on the side of the data processing board 2 away from the motherboard 1, improving the compactness of the arrangement of the first fin 32 and the second fin 52 in the heat dissipation assembly; and it can also rationally allocate limited space, improve space utilization, and simultaneously solve the heat dissipation problems of the first power chip 21, the main chip 22, and the second power chip 23 on both sides of the data processing board 2.

[0044] In some embodiments, please refer to Figure 4 and Figure 9The second fin 52 includes a longitudinal fin group 522 and multiple transverse fin groups 521, with a clearance space 7 between the multiple transverse fin groups 521. The longitudinal fin group 522 is located at the bottom of the clearance space 7. For example, taking two transverse fin groups 521 as an example, the two transverse fin groups 521 are respectively located at both ends of the length direction of the data processing board 2. As can be seen from the above embodiment, the first heat dissipation module 3 is provided in multiple ways. When two first heat dissipation modules 3 are provided, the two first fins 32 can be arranged at both ends of the width direction of the data processing board 2, or the two first fins 32 can be arranged between the two transverse fins. This can further improve the compactness of the arrangement of the first fins 32 and the second fins 52, thereby improving the utilization rate of the first fins 32 and the second fins 52 while ensuring the heat dissipation efficiency of the first heat dissipation module 3 and the second heat dissipation module 5.

[0045] Based on the above embodiments, please refer to the following for further details. Figure 4 and Figure 9 The second phase change heat conduction structure 51 includes a heat conduction plate 511 and a second heat conduction pipe 512. The heat conduction plate 511 is in thermal contact with the main chip 22 and the second power chip 23. One end of the second heat conduction pipe 512 is thermally connected to the heat conduction plate 511, and the other end of the second heat conduction pipe 512 passes through the transverse fin group 521 and the longitudinal fin group 522 and is in thermal contact with them. This arrangement allows the second heat conduction pipe 512 to pass through more of the transverse fin group 521 and the longitudinal fin group 522, thereby improving the heat exchange efficiency between the second heat conduction pipe 512 and the transverse fin group 521 and the longitudinal fin group 522, and thus improving the heat dissipation effect of the second heat dissipation module 5 on the main chip 22 and the second power chip 23.

[0046] Specifically, the other end of the second heat pipe 512 includes at least one first heat-conducting portion 5121 that passes through and is in thermal contact with the longitudinal fin assembly 522, and at least one second heat-conducting portion 5122 that passes through and is in thermal contact with the transverse fin assembly 521. Furthermore, the number of first heat-conducting portions 5121 and second heat-conducting portions 5122 is not limited here; one or more of each can be provided. By providing multiple first heat-conducting portions 5121 and second heat-conducting portions 5122, the heat exchange efficiency between the second fin 52 and the second heat pipe 512 can be further improved, thereby enhancing the heat dissipation efficiency for the main chip 22 and the second power chip 23.

[0047] It should be noted that the heat-conducting plate 511 can be made of copper, aluminum, or VC, etc.

[0048] In some embodiments, please refer to Figure 10The main chip 22 and the second power chip 23 each include multiple chips. There is a height difference between the main chips 22, between the second power chips 23, or between the main chips 22 and the second power chips 23. The heat-conducting plate 511 includes a convex plate portion 5111 and a concave plate portion 5112 with a height difference, and the convex plate portion 5111 and the concave plate portion 5112 are in thermal contact with the main chip 22 and / or the second power chip 23, respectively. Specifically, this embodiment includes the following three implementation methods: Multiple main body chips 22 are provided, with height differences between them. The heat-conducting plate 511 includes a convex plate portion 5111 and a concave plate portion 5112 with height differences. The convex plate portion 5111 and the concave plate portion 5112 respectively abut against the main body chips 22 with height differences. This improves the heat exchange efficiency between the convex plate portion 5111 and the concave plate portion 5112 and the main body chips 22, thereby improving the heat dissipation efficiency of the main body chips 22 (not shown in the figure); Multiple second power chips 23 are provided, with height differences between them. The heat-conducting plate 511 includes a convex plate portion 5111 and a concave plate portion 5112 with height differences. The convex plate portion 5111 and the concave plate portion 5112 respectively abut against the second power chips 23 with height differences. This improves the heat exchange efficiency between the convex plate portion 5111 and the concave plate portion 5112 and the second power chips 23, thereby improving the heat dissipation efficiency of the second power chips 23 (see Figure). Figure 10 There is a height difference between the main chip 22 and the second power chip 23. The heat-conducting plate 511 includes a convex plate portion 5111 and a concave plate portion 5112 with a height difference. The convex plate portion 5111 and the concave plate portion 5112 respectively abut against the main chip 22 and the second power chip 23 with a height difference. This can improve the heat exchange efficiency between the convex plate portion 5111 and the concave plate portion 5112 and the second power chip 23 and the main chip 22, thereby improving the heat dissipation efficiency of the second power chip 23 and the main chip 22.

[0049] Since the heatsink 511 is located on the side of the data processing board 2 away from the motherboard 1, and the heatsink 511 is in thermal contact with the main chip 22 and the second power chip 23, placing the heatsink 511 directly on the main chip 22 and the second power chip 23 may cause the heatsink 511 to damage the main chip 22 and the second power chip 23. Therefore, in some embodiments, please refer to... Figure 4The heat dissipation assembly includes a protective frame 6 located between the heat-conducting plate 511 and the data processing board 2, and the protective frame 6 is located on the circumferential outer side between the main body chip 22 and the second power chip 23. This arrangement provides support for the heat-conducting plate 511, preventing it from directly pressing against the main body chip 22 and the second power chip 23, thus avoiding damage. Furthermore, the protective frame 6 also protects the main body chip 22 and the second power chip 23 on their circumferential outer side.

[0050] It should be noted that the heat dissipation component in this application can be used in vertically powered AI cards, or in other electronic devices that require efficient heat dissipation and have a compact size.

[0051] Furthermore, the heat dissipation components in this application can be combined with heat dissipation methods such as air cooling and liquid cooling to further improve the heat dissipation effect.

[0052] This application also provides a data processing apparatus including the above-mentioned heat dissipation component. Since the data processing apparatus includes the above-mentioned heat dissipation component, the beneficial effects of the heat dissipation component on the data processing apparatus are described above and will not be repeated here.

[0053] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0054] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0055] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0056] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0057] It should be understood that the qualifying terms “first,” “second,” “third,” “fourth,” “fifth,” and “sixth” used in the description of the embodiments of this application are only used to more clearly illustrate the technical solutions and are not intended to limit the scope of protection of this application.

[0058] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A heat dissipation component, characterized in that, include: Motherboard; A data processing board is disposed on one side of the motherboard, and a plurality of first power chips are disposed on the side of the data processing board facing the motherboard; The first heat dissipation module includes a first phase change heat conduction structure and a first fin. The first phase change heat conduction structure is in thermal contact with a portion of the first power chip, and the first fin is in thermal connection with the first phase change heat conduction structure. The first heat dissipation module is provided in multiple units to dissipate heat from the first power chips located in different positions, thereby achieving heat dissipation for all the first power chips.

2. The heat dissipation assembly according to claim 1, characterized in that, The first phase change heat conduction structure includes: A heat spreader is disposed between the data processing board and the motherboard, and makes thermal contact with a portion of the first power chip. The first heat pipe has one end thermally connected to the heat spreader and the other end thermally contacted with the first fin.

3. The heat dissipation assembly according to claim 2, characterized in that, It also includes a bracket with one end connected to the first fin and the other end connected to the data processing board. Multiple brackets are provided and are located on both sides of the first heat pipe.

4. The heat dissipation assembly according to claim 2, characterized in that, Multiple first fins are stacked, the first heat pipes are arranged in a curved manner, and at least two parts of each first fin are in thermal contact with the first heat pipe.

5. The heat dissipation assembly according to claim 2, characterized in that, The data processing board has a U-shaped notch to avoid the first heat pipe.

6. The heat dissipation assembly according to any one of claims 1-5, characterized in that, The data processing board has a main chip and a second power chip on the side opposite to the motherboard. The heat dissipation component includes a second heat dissipation module, which includes a second phase change heat conduction structure and a second fin. The second phase change heat conduction structure is in thermal contact with the main chip and the second power chip, and the second fin is connected to the second phase change heat conduction structure.

7. The heat dissipation assembly according to claim 6, characterized in that, The second fin is provided in multiple sets, and there is a clearance space between the multiple sets of the second fin to accommodate the first fin.

8. The heat dissipation assembly according to claim 7, characterized in that, The second fin includes a longitudinal fin group and a plurality of transverse fin groups, and there is a clearance space between the plurality of transverse fin groups, and the longitudinal fin group is located at the bottom of the clearance space; The second phase change heat conduction structure includes a heat conduction plate and a second heat conduction pipe. The heat conduction plate is in thermal contact with the main chip and the second power chip. One end of the second heat conduction pipe is in thermal connection with the heat conduction plate, and the other end of the second heat conduction pipe passes through the transverse fin group and the longitudinal fin group and is in thermal contact with them.

9. The heat dissipation assembly according to claim 8, characterized in that, The main chip and the second power chip each include multiple components. There is a height difference between the main chips, between the second power chips, or between the main chips and the second power chips. The heat-conducting plate includes a convex plate portion and a concave plate portion with a height difference, and the convex plate portion and the concave plate portion respectively make thermal contact with the main chip and / or the second power chip.

10. A data processing apparatus, characterized in that, Includes the heat dissipation component as described in any one of claims 1-9.

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