A heat dissipation liquid cooling plate with a flow guide structure

CN224852470UActive Publication Date: 2026-10-13NANTONG JIAFAN METAL MATERIALS TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202522349027.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-05
Publication Date
2026-10-13
Estimated Expiration
2035-11-05

AI Technical Summary

Technical Problem

[0003]针对现有技术的不足,本实用新型提供了一种具有导流结构的散热液冷板,设置有高效导流的铜制导流管组件和协同散热的鳍片与风扇结构,解决了背景技术提出的散热效率低、热交换不充分的问题

Benefits of technology

本实用新型中,通过设置的循环泵驱动铜制导流管内部填充的导热液体流动,配合铜制鳍片,形成高效的液冷循环与热交换结构,大幅提升了导热液体的循环效率,加快了热量的传导与散发,有效解决了散热效率低的问题。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of heat dissipation, and disclose a heat dissipation liquid cooling plate with flow guide structure, including shell subassembly, the shell subassembly is configured with initiative heat dissipation subassembly and flow guide subassembly, shell subassembly includes shell casing, the both ends of shell casing inboard wall are provided with a plurality of pipe assembly groove, the both ends of shell casing inboard wall still are provided with the pipe through groove that a plurality of pipe assembly grooves communicated with its corresponding side communicated. The utility model discloses the heat conduction liquid that fills in the copper flow guide pipe inside driven by the circulation pump is driven to flow, cooperates copper fin, forms efficient liquid cooling circulation and heat exchange structure, and the circulation efficiency of heat conduction liquid is greatly promoted, and the conduction and emission of heat are accelerated, effectively solve the problem that the heat dissipation efficiency is low.
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Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically a heat dissipation liquid cooling plate with a flow guiding structure. Background Technology

[0002] With the increasing power consumption of electronic devices, the application of liquid cooling plates is becoming more and more widespread. However, existing liquid cooling plates still have the following problems in use: First, the circulation efficiency of the flow guiding structure is low, and the flow of heat transfer fluid is not smooth, resulting in heat that cannot be quickly dissipated and the heat dissipation effect is limited; Second, the compatibility of heat exchange components is insufficient, and the heat exchange between the fins and the heat conduction plate and fan is not sufficient, which easily leads to local overheating. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a heat dissipation liquid cooling plate with a flow guiding structure, which is equipped with a high-efficiency flow guiding copper flow guiding pipe assembly and a fin and fan structure for synergistic heat dissipation, thus solving the problems of low heat dissipation efficiency and insufficient heat exchange mentioned in the background technology.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation liquid cooling plate with a flow guiding structure, comprising a shell assembly, wherein an active heat dissipation assembly and a flow guiding assembly are disposed on the shell assembly.

[0005] The outer casing assembly includes an outer casing. Multiple pipe assembly slots are provided at both ends of the inner wall of the outer casing for limiting and assembling the guide pipes, thus improving structural stability. Additionally, multiple pipe penetration slots are provided at both ends of the inner wall of the outer casing, corresponding to the multiple pipe assembly slots on their respective sides, for the guide pipes to pass through, ensuring the integrity of the flow path. A heat-conducting copper plate is fixedly connected to the bottom of the outer casing for quickly absorbing heat from the components to be cooled, providing a foundation for heat dissipation.

[0006] The active heat dissipation component includes a fan mount, which is fixedly connected to the top of the inner side of the outer casing. Two cooling fans are symmetrically installed inside the fan mount, which can generate strong airflow to accelerate heat exchange. The top of the fan mount is flush with the top of the outer casing to ensure the flatness of the structure.

[0007] The flow guiding assembly includes a circulation pump, which is fixedly installed at the center of the front end of the outer casing to provide power for the circulation of the heat-conducting liquid. A flow guiding pipe is connected to both the output and input ends of the circulation pump. The flow guiding pipe is assembled in a pipe assembly groove and passes through the groove. The flow guiding pipe is made of copper and filled with heat-conducting liquid. The copper material ensures excellent thermal conductivity, and the heat-conducting liquid achieves efficient heat transfer. Several copper fins are fixedly provided on the outer wall of the flow guiding pipe to increase the heat exchange area. The copper fins are located below the cooling fan and are fixedly welded to the bottom heat-conducting copper plate, achieving synergistic heat exchange of "liquid cooling + air cooling" and improving heat dissipation efficiency.

[0008] As a further improvement of this utility model, the thermally conductive copper plate is connected to the outer shell by bolts, which makes assembly and disassembly convenient. The lower surface of the thermally conductive copper plate is coated with a thermally conductive silicone grease layer to further enhance heat conduction.

[0009] As a further improvement of this utility model, the cooling fan and the fan base are installed by a snap-fit ​​connection, which facilitates maintenance and replacement, and the outer wall of the cooling fan is fitted with a shock-absorbing rubber ring to reduce operating noise and vibration.

[0010] As a further improvement of this utility model: the copper fins are distributed in an array on the outer wall of the guide tube, with a large and uniform heat exchange area, and the copper fins are connected to the guide tube by reflow welding, which is a firm connection with minimal thermal conductivity loss.

[0011] As a further improvement of this utility model: a mounting base is fixedly connected to one end of the outer side wall of the outer shell, and an oblong hole is provided between the upper and lower side walls of the mounting base to facilitate the installation and fixation of the device and adapt to different installation scenarios; a wear-resistant metal sleeve is provided on the inner wall of the oblong hole to improve the durability of the installation structure.

[0012] As a further improvement of this utility model: the outer shell is made of aluminum alloy, which is lightweight and has a certain thermal conductivity, and the outer surface of the outer shell is anodized to improve its corrosion and rust resistance.

[0013] As a further improvement of this utility model, the heat-conducting liquid filled in the guide tube is a water-based coolant with a large heat capacity and good heat conduction effect. In addition, sealing rubber gaskets are provided at both ends of the guide tube to ensure the sealing of the circulation system and prevent leakage of the heat-conducting liquid.

[0014] Compared with the prior art, the beneficial effects of this utility model are: In this invention, a circulating pump drives the flow of the heat-conducting liquid inside the copper guide tube, which, together with copper fins, forms a highly efficient liquid cooling circulation and heat exchange structure. This significantly improves the circulation efficiency of the heat-conducting liquid, accelerates heat conduction and dissipation, and effectively solves the problem of low heat dissipation efficiency.

[0015] In this invention, the cooling fan of the active heat dissipation component works in synergy with the copper fins and the thermally conductive copper plate to achieve a composite heat dissipation of "liquid cooling + air cooling", which enhances the sufficiency of heat exchange, avoids local overheating, and further improves the overall heat dissipation performance. Attached Figure Description

[0016] Figure 1 The overall three-dimensional structure of this utility model Figure 1 ; Figure 2The overall three-dimensional structure of this utility model Figure 2 ; Figure 3 This is a three-dimensional, disassembled view of the present invention. Figure 4 This is a perspective view of the outer shell assembly and the active heat dissipation assembly of this utility model; Figure 5 This is a perspective view of the flow guiding component of this utility model.

[0017] In the diagram: 1. Outer shell assembly; 2. Active cooling assembly; 3. Airflow guide assembly; 11. Outer shell; 12. Pipe assembly slot; 13. Pipe through slot; 14. Mounting base; 15. Waist-shaped hole; 16. Thermally conductive copper plate; 21. Fan mount; 22. Cooling fan; 31. Circulation pump; 32. Airflow guide pipe; 33. Copper fins. Detailed Implementation

[0018] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0019] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] Please see Figures 1-5 In this embodiment of the present invention, a heat dissipation liquid cooling plate with a flow guiding structure includes a shell assembly 1, on which an active heat dissipation assembly 2 and a flow guiding assembly 3 are disposed.

[0022] The outer casing assembly 1 includes an outer casing 11. Multiple tube assembly slots 12 are provided at both ends of the inner sidewall of the outer casing 11 for limiting the assembly of the guide tube 32 and improving structural stability. Multiple tube insertion slots 13 are also provided at both ends of the inner sidewall of the outer casing 11, which are connected to the multiple tube assembly slots 12 on the corresponding side, for the guide tube 32 to pass through, ensuring the integrity of the flow path. A heat-conducting copper plate 16 is fixedly connected to the bottom of the outer casing 11 for quickly absorbing the heat of the component to be cooled, providing a basis for heat dissipation.

[0023] The active heat dissipation component 2 includes a fan mount 21, which is fixedly connected to the top of the inner side of the outer casing 11. Two cooling fans 22 are symmetrically installed inside the fan mount 21, which can generate strong airflow to accelerate heat exchange. The top of the fan mount 21 is flush with the top of the outer casing 11 to ensure the flatness of the structure.

[0024] The flow guiding component 3 includes a circulation pump 31, which is fixedly installed on the outer front end of the outer casing 11 to provide power for the circulation of the heat-conducting liquid. The output and input ends of the circulation pump 31 are each connected to a flow guiding pipe 32. The flow guiding pipe 32 is assembled in the pipe assembly groove 12 and passes through the pipe through groove 13. The flow guiding pipe 32 is a copper pipe body and is filled with heat-conducting liquid. The copper material ensures excellent thermal conductivity, and the heat-conducting liquid achieves efficient heat transfer. Several copper fins 33 are fixedly provided on the outer wall of the flow guiding pipe 32 to increase the heat exchange area. The copper fins 33 are located below the cooling fan 22 and are fixedly welded to the bottom heat-conducting copper plate 16 to achieve "liquid cooling + air cooling" heat exchange synergy and improve heat dissipation efficiency.

[0025] The thermally conductive copper plate 16 is connected to the outer casing 11 by bolts, which makes assembly and disassembly convenient. The lower surface of the thermally conductive copper plate 16 is coated with a thermally conductive silicone grease layer to further enhance heat conduction.

[0026] The cooling fan 22 and the fan base 21 are installed by a snap-fit ​​connection, which is convenient for maintenance and replacement. The outer wall of the cooling fan 22 is fitted with a shock-absorbing rubber ring to reduce operating noise and vibration.

[0027] Copper fins 33 are arranged in an array on the outer wall of the flow guide tube 32, with a large and uniform heat exchange area. The copper fins 33 are connected to the flow guide tube 32 by reflow welding, which ensures a strong connection and minimal thermal conductivity loss.

[0028] A mounting base 14 is fixedly connected to one end of the outer wall of the outer casing 11. An oblong hole 15 is provided between the upper and lower side walls of the mounting base 14 to facilitate the installation and fixation of the device and adapt to different installation scenarios. A wear-resistant metal sleeve is provided on the inner wall of the oblong hole 15 to improve the durability of the installation structure.

[0029] The outer casing 11 is made of aluminum alloy, which is lightweight and has a certain thermal conductivity. The outer surface of the outer casing 11 is anodized to improve its corrosion and rust resistance.

[0030] The heat-conducting liquid filled in the guide tube 32 is a water-based coolant with a large heat capacity and good heat conduction effect. Furthermore, sealing rubber gaskets are provided at both ends of the guide tube 32 to ensure the airtightness of the circulation system and prevent leakage of the heat-conducting liquid.

[0031] The working principle of this utility model is as follows: In use, the heat-conducting copper plate 16 is attached to the surface of the electronic component to be cooled. The heat of the electronic component is quickly conducted through the heat-conducting copper plate 16 to the copper fins 33 and the heat-conducting liquid in the guide tube 32. The circulating pump 31 drives the heat-conducting liquid to circulate in the guide tube 32, carrying the heat to the copper fins 33. At the same time, the cooling fan 22 is started to generate airflow, which accelerates the heat exchange between the copper fins 33 and the outside world, thereby realizing the efficient composite heat dissipation of "liquid cooling heat absorption + air cooling heat dissipation", quickly dissipating the heat of the electronic component and ensuring that it operates within a safe temperature range.

[0032] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation liquid cooling plate with a flow guiding structure, comprising a housing assembly (1), wherein an active heat dissipation assembly (2) and a flow guiding assembly (3) are disposed on the housing assembly (1), characterized in that: The outer casing assembly (1) includes an outer casing (11), with multiple pipe assembly slots (12) opened at both ends of the inner sidewall of the outer casing (11), and pipe through slots (13) opened at both ends of the inner sidewall of the outer casing (11) communicating with the multiple pipe assembly slots (12) on the corresponding side. A heat-conducting copper plate (16) is fixedly connected to the bottom of the outer casing (11). The active heat dissipation component (2) includes a fan mount (21), which is fixedly connected to the top of the inner side of the outer shell (11). Two cooling fans (22) are symmetrically installed inside the fan mount (21), and the top of the fan mount (21) is flush with the top of the outer shell (11). The flow guiding component (3) includes a circulation pump (31), which is fixedly installed at the middle of the front end of the outer shell (11). The output end and input end of the circulation pump (31) are each connected to a flow guiding pipe (32). The flow guiding pipe (32) is assembled in the pipe assembly groove (12) and passes through the pipe through groove (13). The flow guiding pipe (32) is a copper pipe body and is filled with heat-conducting liquid. Several copper fins (33) are fixedly provided on the outer wall of the flow guiding pipe (32). The copper fins (33) are located below the cooling fan (22) and are fixedly welded to the bottom heat-conducting copper plate (16).

2. The heat dissipation liquid cooling plate with a flow guiding structure according to claim 1, characterized in that: The thermally conductive copper plate (16) is connected to the outer shell (11) by bolt fixing, and the lower surface of the thermally conductive copper plate (16) is coated with a thermally conductive silicone grease layer.

3. A heat dissipation liquid cooling plate with a flow guiding structure according to claim 1, characterized in that: The cooling fan (22) and the fan base (21) are installed by snap-fit ​​connection, and the outer wall of the cooling fan (22) is fitted with a shock-absorbing rubber ring.

4. A heat dissipation liquid cooling plate with a flow guiding structure according to claim 1, characterized in that: The copper fins (33) are arranged in an array on the outer wall of the guide tube (32), and the copper fins (33) are connected to the guide tube (32) by reflow welding.

5. A heat dissipation liquid cooling plate with a flow guiding structure according to claim 1, characterized in that: A mounting base (14) is fixedly connected to one end of the outer wall of the outer shell (11). A waist-shaped hole (15) is provided between the upper and lower side walls of the mounting base (14). A wear-resistant metal sleeve is provided on the inner wall of the waist-shaped hole (15).

6. A heat dissipation liquid cooling plate with a flow guiding structure according to claim 1, characterized in that: The outer shell (11) is made of aluminum alloy and the outer surface of the outer shell (11) is anodized.

7. A heat dissipation liquid cooling plate with a flow guiding structure according to claim 1, characterized in that: The heat-conducting liquid filled in the guide pipe (32) is a water-based coolant, and sealing rubber gaskets are provided at both ends of the guide pipe (32).