Heat dissipation device for outdoor base station

Abstract

The utility model discloses a heat abstractor for outdoor base station, include: bottom shell, condensing component, baffle, evaporation component and a plurality of pipelines, the inside cavity of bottom shell is configured as condensing area, and the top of bottom shell has open end, condensing component sets up in the condensing area, baffle is installed on the open end, and the top of baffle is configured as evaporation area, evaporation component sets up in the evaporation area, and the both ends of every pipeline are communicated with condensing component and evaporation component respectively, and the refrigerant circulates and flow between condensing component and evaporation component through the pipeline.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation device for outdoor base stations. Background Technology

[0002] Outdoor communication base stations generate a lot of heat during operation, which may cause them to overheat, leading to decreased performance and even damage to electronic components due to the continuous increase in temperature.

[0003] Existing outdoor communication base stations mostly use pumps or fans for heat dissipation. Pumps or fans increase energy consumption during operation, which is not conducive to building green base stations. At the same time, due to the harsh working environment of the heat dissipation devices of existing outdoor communication base stations, the heat dissipation devices need to be maintained more frequently, which increases maintenance costs.

[0004] Therefore, there is an urgent need to develop a heat dissipation device for outdoor base stations that overcomes the above-mentioned defects. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides a heat dissipation device for outdoor base stations, comprising: The bottom shell has an internal cavity configured as a condensation zone, and the top of the bottom shell has an open end; A condensation assembly is disposed in the condensation zone; A partition is installed on the open end, and an evaporation zone is configured above the partition. An evaporation assembly is disposed in the evaporation zone; Multiple pipes are provided, with both ends of each pipe connected to the condensing component and the evaporating component, respectively, and the refrigerant circulates between the condensing component and the evaporating component through the pipes.

[0006] The aforementioned heat dissipation device, wherein the condensation assembly includes: A condenser is disposed in the condensation zone, and one end of the pipeline is connected to the condenser; A first fin unit is disposed in the bottom shell and connected to the condenser. The first fin unit has a first microchannel, which is connected to the condenser.

[0007] In the aforementioned heat dissipation device, the condenser includes at least one condenser manifold group, each condenser manifold group includes two condenser manifolds, the condenser manifolds are connected to the evaporation component through the pipeline, the first fin unit includes at least one first fin group, the two ends of the first fin group are respectively connected to the two condenser manifolds, the first fin group is configured with the first microchannel, and the two condenser manifolds are connected through the first microchannel.

[0008] The aforementioned heat dissipation device, wherein each of the first fin groups comprises: Multiple first channel plates, each first channel plate having its two ends respectively inserted into two condenser manifolds of a condenser manifold group, each first channel plate having at least one first microchannel connecting its two ends, the refrigerant flowing between the two condenser manifolds through the first microchannel; Multiple first fins, each first fin being disposed between two adjacent first channel plates, and the first fin being clamped and fixed by the two adjacent first channel plates.

[0009] The aforementioned heat dissipation device, wherein the evaporation assembly comprises: An evaporator is disposed in the evaporation zone, and the other end of the pipeline is connected to the evaporator; A second fin unit is disposed on the partition and connected to the evaporator. The second fin unit has a second microchannel, which is connected to the evaporator.

[0010] In the aforementioned heat dissipation device, the evaporator includes at least one evaporator manifold group, each of the evaporator manifold groups includes two evaporator manifolds, the evaporator manifolds are connected to the condenser manifolds through the pipeline, the second fin unit includes at least one second fin group, the two ends of the second fin group are respectively connected to the two evaporator manifolds, the second fin group is configured with a second microchannel, and the two evaporator manifolds are connected through the second microchannel.

[0011] The aforementioned heat dissipation device, wherein each of the second fin groups comprises: Multiple second channel plates, each second channel plate having its two ends respectively inserted into two evaporator manifolds of an evaporator manifold assembly, each second channel plate having at least one second microchannel connecting its two ends, the refrigerant flowing between the two evaporator manifolds through the second microchannel; Multiple second fins, each second fin being disposed between two adjacent second channel plates, and the second fin being clamped and fixed by the two adjacent second channel plates.

[0012] In the aforementioned heat dissipation device, the first fin unit is inclinedly disposed in the bottom shell.

[0013] In the aforementioned heat dissipation device, the second fin unit is inclinedly disposed on the partition plate.

[0014] The aforementioned heat dissipation device further includes at least one valve head installed on the pipeline for introducing refrigerant into the condensing assembly and the evaporating assembly.

[0015] In the aforementioned heat dissipation device, at least one of the condenser manifold groups is not connected to each other.

[0016] In the aforementioned heat dissipation device, at least one of the evaporator manifolds is not connected to each other.

[0017] Compared with related technologies, the heat dissipation device of this utility model has several advantages. First, based on siphon heat dissipation technology, it eliminates the need for additional pumps or fans, reducing energy consumption and helping to lower the PUE value of the base station. Second, it has no moving parts, reducing maintenance requirements, improving system stability, and has a simple structure and low cost. In addition, based on the high heat transfer efficiency of siphon heat dissipation technology, it can quickly and effectively dissipate heat from the base station, making it suitable for scenarios such as high-density computing nodes within the base station. Attached Figure Description

[0018] Figure 1 This is a three-dimensional schematic diagram of the heat dissipation device of this utility model from one perspective.

[0019] Figure 2 This is a three-dimensional schematic diagram of the heat dissipation device of this utility model from another perspective.

[0020] Figure 3 This is a schematic diagram showing the connection between the evaporator and condenser components.

[0021] Figure 4 This is a schematic diagram showing the connection of the manifold, fins, and channel plate.

[0022] Figure 5 This is a schematic diagram of the channel plate structure.

[0023] The attached figures are labeled as follows: Bottom shell: 11; Condensation zone: P1; Open terminal: 111; Condensation assembly: 12; Condenser: 121; Condensate manifold assembly: 1211; Condenser manifold: G1; First fin unit: 122; First fin group: 1221; First channel board: B1; First fin: F1; First microchannel: T1; Partition: 13; Evaporation zone: P2; Evaporation components: 14; Evaporator: 141; Evaporator manifold assembly: 1411; Evaporator manifold: G2; Second fin unit: 142; Second fin group: 1421; Second channel board: B2; Second fin: F2; Second microchannel: T2; Piping: 15; Slot: C. Detailed Implementation

[0024] Please refer to Figures 1-2 , Figure 1 This is a three-dimensional schematic diagram of the heat dissipation device of this utility model from one perspective; Figure 2 This is a three-dimensional schematic diagram of the heat dissipation device of this utility model from another perspective. For example... Figures 1-2 As shown, a heat dissipation device for an outdoor base station according to this utility model includes: a bottom shell 11, a condensing assembly 12, a partition 13, an evaporating assembly 14, and multiple pipes 15. The internal cavity of the bottom shell 11 is configured as a condensing zone P1, and the top of the bottom shell 11 has an open end 111. The condensing assembly 12 is disposed in the condensing zone P1. The partition 13 is installed on the open end 111, and the upper part of the partition 13 is configured as an evaporating zone P2. The evaporating assembly 14 is disposed in the evaporating zone P2. The two ends of each pipe 15 are respectively connected to the condensing assembly 12 and the evaporating assembly 14, and the refrigerant circulates between the condensing assembly 12 and the evaporating assembly 14 through the pipe 15.

[0025] Please refer to Figure 3 , Figure 3 This is a schematic diagram showing the connection between the evaporator and condenser components. Figure 3 As shown, and please refer to Figures 1-2 The condensing assembly 12 includes a condenser 121 and a first finned unit 122. The condenser 121 is disposed in the condensing zone P1, and one end of the pipe 15 is connected to the condenser 121. The first finned unit 122 is disposed in the bottom shell 11 and connected to the condenser 121. The first finned unit 122 has a first microchannel T1, which is connected to the condenser 121. The evaporating assembly 14 includes an evaporator 141 and a second finned unit 142. The evaporator 141 is disposed in the evaporating zone P2, and the other end of the pipe 15 is connected to the evaporator 141. The second finned unit 142 is disposed on the partition 13 and connected to the evaporator 141. The second finned unit 142 has a second microchannel T2, which is connected to the evaporator 141.

[0026] In this embodiment, the first fin unit 122 is inclinedly disposed on the bottom shell 11, and the second fin unit 142 is inclinedly disposed on the partition plate 13.

[0027] The condenser 121 includes at least one condenser manifold group 1211, and each condenser manifold group 1211 includes two condenser manifolds G1. The condenser manifolds G1 are connected to the evaporation assembly 14 through the pipe 15. The first fin unit 122 includes at least one first fin group 1221, and the two ends of the first fin group 1221 are respectively connected to the two condenser manifolds G1. The first fin group 1221 is equipped with a first microchannel T1, which connects the two condenser manifolds. G1; The evaporator 141 includes at least one evaporator manifold group 1411, each of the evaporator manifold groups includes two evaporator manifolds G2, the evaporator manifolds G2 are connected to the condenser manifolds G1 through the pipe 15, the second fin unit 142 includes at least one second fin group 1421, the two ends of the second fin group 1421 are respectively connected to the two evaporator manifolds G2, the second fin group 1421 is provided with a second microchannel T2, and the two evaporator manifolds G2 are connected through the second microchannel T2.

[0028] In this embodiment, the preferred implementation is that the condenser 121 includes three sets of condenser manifold groups 1211 and the evaporator 141 includes three sets of evaporator manifold groups 1411. However, this utility model does not limit the number of condenser manifold groups 1211 and evaporator manifold groups 1411. When the number of condenser manifold groups 1211 and evaporator manifold groups 1411 is increased or decreased, the number of the first fin group 1221 and the second fin group 1421 should also be increased or decreased accordingly.

[0029] It should be noted that in this embodiment, at least one of the condenser manifold groups 1211 is not connected to each other and at least one of the evaporator manifold groups 1411 is not connected to each other. Specifically, a condenser manifold group 1211 is connected to an evaporator manifold group 1411 only through a corresponding pipeline.

[0030] Please refer to Figures 4-5 , Figure 4 This is a schematic diagram showing the connection of the manifold, fins, and channel plate. Figure 5 This is a schematic diagram of the channel plate structure. (Example) Figures 4-5 As shown, and please refer to Figure 3Each first fin assembly 1221 includes: a plurality of first channel plates B1 and a plurality of first fins F1. Each first channel plate B1 has its two ends respectively inserted into two condenser manifolds G1 of a condenser manifold assembly 1211. Each first channel plate B1 has at least one first microchannel T1 connecting its two ends. The refrigerant flows between the two condenser manifolds G1 through the first microchannel T1. Each first fin F1 is disposed between two adjacent first channel plates B1, and the first fin F1 is clamped and fixed by the two adjacent first channel plates B1. Each second fin group 1421 includes: multiple second channel plates B2 and multiple second fins F2. Each second channel plate B2 has its two ends respectively inserted into two evaporator manifolds G2 of an evaporator manifold group 1411. Each second channel plate B2 has at least one second microchannel T2 connecting its two ends, through which the refrigerant flows between the two evaporator manifolds G2. Each second fin F2 is disposed between two adjacent second channel plates B2, and the second fin F2 is clamped and fixed by the two adjacent second channel plates B2. The microchannels increase the heat exchange area and heat exchange capacity of the fin unit.

[0031] In this embodiment, both the condenser manifold G1 and the evaporator manifold G2 are provided with multiple slots C, and the first channel plate B1 and the second channel plate B2 are correspondingly inserted and connected to the slots C.

[0032] It should be noted that, in Figure 5 In this embodiment, the cross-sections of microchannels TI and T2 are rectangular, but this invention is not limited to this. In other embodiments, the cross-sections of TI and T2 may also be other shapes, such as triangles, quadrilaterals outside the initial rectangle, and other polygons. Furthermore, this invention does not limit the number of microchannels.

[0033] In one embodiment of this invention, the cross-sectional shapes of microchannels TI and T2 may be the same or different.

[0034] Please refer to the following: Figure 1 The heat dissipation device of this utility model further includes at least one valve head 16 and an upper cover 17. The valve head 16 is installed on the pipe 15 for inputting refrigerant into the condenser assembly 12 and the evaporator assembly 14. The upper cover 17 is installed on the partition and covers the evaporator assembly 14. The upper cover 17 has an opening 171, which exposes at least a portion of the second fin unit 142.

[0035] In summary, the heat dissipation device of this invention, based on siphon cooling technology, eliminates the need for additional pumps or fans, reducing energy consumption and helping to lower the PUE value of the base station. Furthermore, the heat dissipation device of this invention has no moving parts, reducing maintenance requirements, improving system stability, and is simple in structure and inexpensive. Additionally, the heat dissipation device of this invention, based on siphon cooling technology, has high heat transfer efficiency and can quickly and effectively dissipate heat from the base station, making it suitable for scenarios such as high-density computing nodes within base stations.

[0036] Therefore, the embodiments of this utility model are sufficient to achieve the above-mentioned objectives and advantages, and can also achieve the essential effects that should be possessed. The specific embodiments described above are merely illustrative examples, and those skilled in the art can make various modifications and equivalent implementations after understanding the content of this utility model. Except for the contents described in the following claims, the disclosed structural and design details are not limited. Therefore, it is understood that the specific embodiments described above can be changed, combined, or modified, and all such changes should be considered to be covered within the scope and spirit of this utility model. Furthermore, it should be understood that the constituent elements of this embodiment are not mutually exclusive, and those skilled in the art can arbitrarily combine the constituent elements according to design requirements.

Claims

1. A heat dissipation device for outdoor base stations, characterized in that, include: The bottom shell has an internal cavity configured as a condensation zone, and the top of the bottom shell has an open end; A condensation assembly is disposed in the condensation zone; A partition is installed on the open end, and an evaporation zone is configured above the partition. An evaporation assembly is disposed in the evaporation zone; Multiple pipes are provided, with both ends of each pipe connected to the condensing component and the evaporating component, respectively, and the refrigerant circulates between the condensing component and the evaporating component through the pipes.

2. The heat dissipation device as described in claim 1, characterized in that, The condensation assembly includes: A condenser is disposed in the condensation zone, and one end of the pipeline is connected to the condenser; A first fin unit is disposed in the bottom shell and connected to the condenser. The first fin unit has a first microchannel, which is connected to the condenser.

3. The heat dissipation device as described in claim 2, characterized in that, The condenser includes at least one condenser manifold group, each of the condenser manifold groups includes two condenser manifolds, the condenser manifolds are connected to the evaporation assembly through the pipeline, the first fin unit includes at least one first fin group, the two ends of the first fin group are respectively connected to the two condenser manifolds, the first fin group is configured with the first microchannel, and the two condenser manifolds are connected through the first microchannel.

4. The heat dissipation device as described in claim 3, characterized in that, Each of the first fin groups includes: Multiple first channel plates, each first channel plate having its two ends respectively inserted into two condenser manifolds of a condenser manifold group, each first channel plate having at least one first microchannel connecting its two ends, the refrigerant flowing between the two condenser manifolds through the first microchannel; Multiple first fins, each first fin being disposed between two adjacent first channel plates, and the first fin being clamped and fixed by the two adjacent first channel plates.

5. The heat dissipation device as described in claim 4, characterized in that, The evaporation assembly includes: An evaporator is disposed in the evaporation zone, and the other end of the pipeline is connected to the evaporator; A second fin unit is disposed on the partition and connected to the evaporator. The second fin unit has a second microchannel, which is connected to the evaporator.

6. The heat dissipation device as described in claim 5, characterized in that, The evaporator includes at least one evaporator manifold group, each of the evaporator manifold groups includes two evaporator manifolds, the evaporator manifolds are connected to the condenser manifolds through the pipeline, the second fin unit includes at least one second fin group, the two ends of the second fin group are respectively connected to the two evaporator manifolds, the second fin group is configured with a second microchannel, and the two evaporator manifolds are connected through the second microchannel.

7. The heat dissipation device as described in claim 6, characterized in that, Each of the second fin groups includes: Multiple second channel plates, each second channel plate having its two ends respectively inserted into two evaporator manifolds of an evaporator manifold assembly, each second channel plate having at least one second microchannel connecting its two ends, the refrigerant flowing between the two evaporator manifolds through the second microchannel; Multiple second fins, each second fin being disposed between two adjacent second channel plates, and the second fin being clamped and fixed by the two adjacent second channel plates.

8. The heat dissipation device as described in claim 2, characterized in that, The first fin unit is inclinedly disposed in the bottom shell.

9. The heat dissipation device as described in claim 5, characterized in that, The second fin unit is inclinedly disposed on the partition plate.

10. The heat dissipation device as claimed in claim 1, characterized in that, It also includes at least one valve head installed on the pipeline for introducing refrigerant into the condensing assembly and the evaporating assembly.

11. The heat dissipation device as described in claim 3, characterized in that, At least one of the condenser manifolds is not connected to each other.

12. The heat dissipation device as described in claim 6, characterized in that, At least one of the evaporator manifolds is not connected to each other.

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