controller

Abstract

The utility model provides a kind of controller, it is related to control device technical field, controller includes circuit board, patch power tube, heat-conducting silica gel pad and bottom shell;Circuit board is set in bottom shell, heat-conducting silica gel pad is set between circuit board and bottom shell;Patch power tube is set on circuit board, and circuit board is equipped with first through-hole and second through-hole;First through-hole is multiple, multiple first through-holes are interval arrangement, multiple first through-holes are all set in patch power tube outer side, and heat-conducting glue is respectively filled in multiple first through-holes, and the heat-conducting glue in first through-hole is in contact with heat-conducting silica gel pad;Second through-hole is located below patch power tube, and second through-hole is filled with metal heat-conducting part, and metal heat-conducting part is in contact with heat-conducting silica gel pad.Can accelerate circuit board heat dissipation, import heat to heat-conducting silica gel pad, heat-conducting silica gel pad imports heat to bottom shell, so that the circuit board below patch power tube rapidly cools down, to improve the heat dissipation performance of circuit board, so that the cooling rate of circuit board is improved.

Description

Technical Field

[0001] This utility model relates to the field of control device technology, and in particular to a controller. Background Technology

[0002] FR4 circuit boards are a common type of printed circuit board (PCB), whose substrate is mainly composed of glass fiber reinforced resin (FR4). This material is widely used in various electronic devices due to its excellent insulation properties.

[0003] Because the substrate of the FR4 circuit board is mainly composed of glass fiber reinforced resin, which has poor heat dissipation performance, the heat of the FR4 circuit board is not easily dissipated. Utility Model Content

[0004] The purpose of this invention is to provide a controller to solve the technical problem of poor heat dissipation performance of FR4 circuit boards in the prior art.

[0005] The controller provided by this utility model includes a circuit board, a surface-mount power transistor, a thermally conductive silicone pad, and a bottom shell; The circuit board is disposed inside the bottom shell, and the thermally conductive silicone pad is disposed between the circuit board and the bottom shell; The surface-mount power transistor is disposed on the circuit board, and the circuit board is provided with a first through hole and a second through hole; There are multiple first through holes, which are spaced apart and are all located on the outside of the surface-mount power transistor. Each of the multiple first through holes is filled with thermally conductive adhesive, and the thermally conductive adhesive in the first through hole is in contact with the thermally conductive silicone pad. The second through hole is located below the surface-mount power transistor, and the second through hole is filled with a metal thermal conductive element, which is in contact with the thermally conductive silicone pad.

[0006] Furthermore, there are multiple second through holes, which are spaced apart, and the metal heat-conducting component is solder paste.

[0007] Furthermore, the metal heat-conducting component is a copper block.

[0008] Furthermore, the controller also includes a surface-mount capacitor; the surface-mount capacitor is disposed on the circuit board; Multiple first through holes are disposed on the outside of the surface mount power transistor and the surface mount capacitor.

[0009] Furthermore, the circuit board is an FR4 circuit board.

[0010] Furthermore, the bottom shell is a metal bottom shell.

[0011] Furthermore, the controller also includes a top shell; The bottom shell has a cavity, and the circuit board and the thermally conductive silicone pad are both disposed within the cavity; The top shell is disposed on the bottom shell, and the top shell is connected to the bottom shell.

[0012] Furthermore, the top shell and the bottom shell are detachably connected.

[0013] Furthermore, the cavity is provided with potting compound.

[0014] Furthermore, there are multiple surface-mount power transistors, which are spaced apart; there are also multiple surface-mount capacitors, which are spaced apart.

[0015] The controller provided by this utility model includes a circuit board, a surface-mount power transistor, a thermally conductive silicone pad, and a base shell. The circuit board is disposed inside the base shell, and the thermally conductive silicone pad is disposed between the circuit board and the base shell. The surface-mount power transistor is disposed on the circuit board, and the circuit board has a first through hole and a second through hole. There are multiple first through holes, which are spaced apart and are all located outside the surface-mount power transistor. Each of the multiple first through holes is filled with thermally conductive adhesive, and the thermally conductive adhesive in the first through hole is in contact with the thermally conductive silicone pad. The second through hole is located below the surface-mount power transistor and is filled with a metal thermally conductive element, which is in contact with the thermally conductive silicone pad. Multiple first through-holes are spaced apart on the circuit board outside the surface-mount power transistor. Each first through-hole is filled with thermally conductive adhesive, forming a first thermally conductive pillar. The end of the first thermally conductive pillar facing the thermally conductive silicone pad contacts and adheres to the thermally conductive silicone pad, thereby accelerating heat dissipation from the circuit board and transferring heat to the thermally conductive silicone pad. The thermally conductive silicone pad then transfers the heat to the bottom shell, rapidly cooling the circuit board outside the surface-mount power transistor. Furthermore, a second through-hole is provided on the circuit board below the surface-mount power transistor. The second through-hole is filled with a metal thermally conductive component. The end of the metal thermally conductive component facing the thermally conductive silicone pad contacts and adheres to the thermally conductive silicone pad, thereby accelerating heat dissipation from the circuit board and transferring heat to the thermally conductive silicone pad. The thermally conductive silicone pad then transfers the heat to the bottom shell, rapidly cooling the circuit board below the surface-mount power transistor, thus improving the heat dissipation performance of the circuit board and increasing the cooling rate of the circuit board. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a partial schematic diagram of the controller provided in an embodiment of the present utility model; Figure 2 This is a top view of the circuit board of the controller provided in this embodiment of the utility model; Figure 3 This is an exploded view of the controller provided in an embodiment of the present invention; Figure 4 This is a cross-sectional view of the controller provided in an embodiment of this utility model.

[0018] Icons: 1-Circuit board; 11-First through hole; 12-Second through hole; 2-Surface mount power transistor; 3-Surface mount capacitor; 4-Thermal conductive silicone pad; 5-Bottom shell; 6-Top shell; 7-Snap ring; 71-Elastic abutment part. Detailed Implementation

[0019] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0020] This invention provides a controller, and several embodiments are given below to describe the controller provided by this invention in detail.

[0021] The controller provided in this embodiment, such as Figures 1 to 4 As shown, the device includes a circuit board 1, a surface-mount power transistor 2, a thermally conductive silicone pad 4, and a base shell 5. The circuit board 1 is disposed inside the base shell 5, and the thermally conductive silicone pad 4 is disposed between the circuit board 1 and the base shell 5. The surface-mount power transistor 2 is disposed on the circuit board 1, and the circuit board 1 has a first through hole 11 and a second through hole 12. There are multiple first through holes 11, which are spaced apart and are all located outside the surface-mount power transistor 2. Each of the multiple first through holes 11 is filled with thermally conductive adhesive, and the thermally conductive adhesive in the first through hole 11 is in contact with the thermally conductive silicone pad 4. The second through hole 12 is located below the surface-mount power transistor 2, and the second through hole 12 is filled with a metal thermally conductive component, which is in contact with the thermally conductive silicone pad 4.

[0022] The bottom shell 5 includes a bottom surface, a thermally conductive silicone pad 4 is attached to the bottom surface, and a circuit board 1 is attached to the thermally conductive silicone pad 4. The circuit board 1 is pressed against the bottom surface to press the thermally conductive silicone, so that the thermally conductive silicone is pressed between the circuit board 1 and the bottom surface.

[0023] The surface mount power transistor 2 is mounted on the circuit board 1 and can be surface-mounted together with it, reducing labor and lowering costs.

[0024] Multiple first through holes 11 are spaced apart on the circuit board 1 outside the surface-mount power transistor 2. Each first through hole 11 is filled with thermally conductive adhesive, forming a first thermally conductive pillar. The end of the first thermally conductive pillar facing the thermally conductive silicone pad 4 contacts and adheres to the thermally conductive silicone pad 4, thereby accelerating heat dissipation of the circuit board 1 and transferring heat to the thermally conductive silicone pad 4. The thermally conductive silicone pad 4 then transfers the heat to the bottom shell 5, causing the circuit board 1 outside the surface-mount power transistor 2 to cool down rapidly. Furthermore, a second through hole 12 is provided on the circuit board 1 below the surface-mount power transistor 2. The second through hole 12 is filled with a metal thermally conductive element. The end of the metal thermally conductive element facing the thermally conductive silicone pad 4 contacts and adheres to the thermally conductive silicone pad 4, thereby accelerating heat dissipation of the circuit board 1 and transferring heat to the thermally conductive silicone pad 4. The thermally conductive silicone pad 4 then transfers the heat to the bottom shell 5, causing the circuit board 1 below the surface-mount power transistor 2 to cool down rapidly, thus improving the heat dissipation performance of the circuit board 1 and increasing its cooling rate.

[0025] The walls of the first through-hole 11 and the second through-hole 12 can be coated with copper to enhance thermal conductivity. The thermally conductive adhesive can be thermally conductive silicone.

[0026] In one optional embodiment, there are multiple second through holes 12, which are spaced apart, and the metal heat-conducting component is solder paste.

[0027] Multiple second through holes 12 are spaced apart on the circuit board 1 below the surface mount power transistor 2. Each second through hole 12 is filled with solder paste, and the solder paste in each second through hole 12 forms a second heat-conducting pillar. The end of the second heat-conducting pillar facing the heat-conducting silicone pad 4 contacts and adheres to the heat-conducting silicone pad 4, thereby accelerating the heat dissipation of the circuit board 1 and conducting heat to the heat-conducting silicone pad 4. The heat-conducting silicone pad 4 conducts heat to the bottom shell 5, so that the circuit board 1 on the outside of the surface mount power transistor 2 cools down rapidly.

[0028] In another alternative embodiment, the metal heat conductor is a copper block.

[0029] A second through hole 12 is provided on the circuit board 1 below the surface mount power transistor 2. A copper block is filled and fixed in the second through hole 12. The end of the copper block facing the thermal conductive silicone pad 4 contacts and adheres to the thermal conductive silicone pad 4, thereby accelerating the heat dissipation of the circuit board 1 and conducting the heat to the thermal conductive silicone pad 4. The thermal conductive silicone pad 4 conducts the heat to the bottom shell 5, so that the circuit board 1 on the outside of the surface mount power transistor 2 cools down rapidly.

[0030] The copper block can be snapped into the second through hole 12 or bonded to the second through hole 12.

[0031] Furthermore, the controller also includes a surface mount capacitor 3; the surface mount capacitor 3 is disposed on the circuit board 1; a plurality of first through holes 11 are disposed on the outside of the surface mount power transistor 2 and the surface mount capacitor 3.

[0032] The surface mount capacitor 3 is mounted on the circuit board 1 and can be surface-mounted together with it using SMT, reducing labor and lowering costs.

[0033] Multiple through-holes are spaced apart on the circuit board 1, and multiple through-holes are located on the outside of the surface mount power transistor 2 and surface mount capacitor 3, which enables the circuit board 1 on the outside of the surface mount power transistor 2 and surface mount capacitor 3 to cool down rapidly.

[0034] Furthermore, circuit board 1 is FR4 circuit board 1.

[0035] The FR4 circuit board 1 has a lower cost and a more integrated hardware circuit layout, with all circuits laid out on a single circuit board 1. This simplifies circuit routing and manufacturing processes, reducing production difficulty and improving production efficiency.

[0036] Furthermore, the bottom shell 5 is a metal bottom shell 5.

[0037] The bottom shell 5 is a metal bottom shell 5, which gives the bottom shell 5 good heat dissipation performance. The bottom shell 5 can be an aluminum bottom shell 5 or a copper bottom shell 5, etc.

[0038] Furthermore, the controller also includes a top shell 6; the bottom shell 5 has a cavity inside, and the circuit board 1 and the thermally conductive silicone pad 4 are both disposed in the cavity; the top shell 6 is disposed on the bottom shell 5, and the top shell 6 is connected to the bottom shell 5.

[0039] A thermally conductive silicone pad 4 is disposed on the bottom surface of the cavity, and the circuit board 1 is disposed on the thermally conductive silicone pad 4. A retaining spring 7 is also fixedly disposed in the bottom shell 5. The retaining spring 7 has an elastic abutment part 71, which abuts against the surface mount power tube 2, thereby abutting the circuit board 1 against the thermally conductive silicone pad 4, and clamping the thermally conductive silicone pad 4 between the circuit board 1 and the bottom surface of the cavity.

[0040] The retaining ring 7 is installed using a fixture for quick assembly. The retaining ring 7 presses against the surface-mount power transistor 2, causing the circuit board 1 to press against the thermally conductive silicone pad 4. The thermally conductive silicone pad 4 then contacts the heat dissipation surface of the bottom shell 5. The installation method of the retaining ring 7 is quick, efficient, and saves labor costs.

[0041] The top shell 6 and the bottom shell 5 can be fixedly connected or detachably connected.

[0042] Furthermore, the top shell 6 and the bottom shell 5 are detachably connected.

[0043] It facilitates the assembly and disassembly of the top shell 6 and the bottom shell 5, and the connection method can be a threaded connection or a detachable connection, etc. In this embodiment, the top shell 6 and the bottom shell 5 are connected by screws.

[0044] Furthermore, the cavity is filled with potting compound.

[0045] The potting compound completely covers the circuit board 1, thereby conducting heat to the base shell 5, achieving the function of heat conduction and cooling. In addition, the potting compound can also play a role in waterproofing and preventing vibration.

[0046] The potting compound can be thermally conductive silicone.

[0047] Furthermore, there are multiple surface-mount power transistors 2, which are spaced apart.

[0048] In this embodiment, there are six surface-mount power transistors 2, arranged in two rows. The two rows of surface-mount power transistors 2 are spaced apart along a first direction, and each row includes three surface-mount power transistors 2 spaced apart along a second direction. The first direction is perpendicular to the second direction, and both the first direction and the second direction are horizontal.

[0049] Furthermore, there are multiple surface mount capacitors 3, which are spaced apart.

[0050] In this embodiment, there are two surface mount capacitors 3, which are spaced apart.

[0051] The controller also uses a socket instead of a wiring harness, allowing for quick connection to circuit board 1, improving production efficiency, reducing incorrect connections, and minimizing the need for extensive training. The wireless design also reduces the space occupied by the casing and provides better waterproofing.

[0052] The controller provided in this embodiment is assembled as follows: the PCBA is reflowed (after SMT mounting of the circuit board 1, the plug-in terminals and surface-mount capacitors 3 are inserted into the circuit board 1 and wave soldered), the thermal conductive silicone pad 4 is attached to the bottom surface of the bottom shell 5, then the PCBA is installed inside the bottom shell 5, the PCBA is placed on the thermal conductive silicone pad 4, the retaining clip 7 is installed and fixed with screws, the thermal conductive silicone is potted and completely sealed, and finally the top shell 6 is fastened and fixed with screws.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A controller, characterized in that, It includes a circuit board (1), a surface mount power transistor (2), a thermally conductive silicone pad (4), and a bottom case (5); The circuit board (1) is disposed inside the bottom shell (5), and the thermally conductive silicone pad (4) is disposed between the circuit board (1) and the bottom shell (5); The surface-mount power transistor (2) is disposed on the circuit board (1), and the circuit board (1) is provided with a first through hole (11) and a second through hole (12); There are multiple first through holes (11), and the multiple first through holes (11) are spaced apart. All the multiple first through holes (11) are located on the outside of the patch power tube (2). Each of the multiple first through holes (11) is filled with thermally conductive adhesive, and the thermally conductive adhesive in the first through hole (11) is in contact with the thermally conductive silicone pad (4). The second through hole (12) is located below the patch power tube (2), and the second through hole (12) is filled with a metal thermal conductive element, which is in contact with the thermally conductive silicone pad (4).

2. The controller according to claim 1, characterized in that, There are multiple second through holes (12), and the multiple second through holes (12) are spaced apart. The metal heat-conducting component is solder paste.

3. The controller according to claim 1, characterized in that, The metal heat-conducting component is a copper block.

4. The controller according to claim 1, characterized in that, The controller also includes a surface mount capacitor (3); the surface mount capacitor (3) is disposed on the circuit board (1); Multiple first through holes (11) are disposed on the outside of the surface mount power transistor (2) and the surface mount capacitor (3).

5. The controller according to claim 1, characterized in that, The circuit board (1) is an FR4 circuit board (1).

6. The controller according to claim 1, characterized in that, The bottom shell (5) is a metal bottom shell (5).

7. The controller according to claim 1, characterized in that, The controller also includes a top shell (6); The bottom shell (5) has a cavity inside, and the circuit board (1) and the thermally conductive silicone pad (4) are both disposed inside the cavity; The top shell (6) is disposed on the bottom shell (5), and the top shell (6) is connected to the bottom shell (5).

8. The controller according to claim 7, characterized in that, The top shell (6) is detachably connected to the bottom shell (5).

9. The controller according to claim 7, characterized in that, The cavity contains potting compound.

10. The controller according to claim 4, characterized in that, There are multiple surface mount power transistors (2), and the multiple surface mount power transistors (2) are arranged at intervals; there are multiple surface mount capacitors (3), and the multiple surface mount capacitors (3) are arranged at intervals.

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