An inverter and energy storage system

Abstract

The embodiment of the application provides an inverter and an energy storage system. It relates to the field of heat dissipation technology. The inverter comprises a box body, a heat exchanger, a thermosyphon heat dissipation assembly and an air cooling assembly. The heat exchanger is configured to exchange heat between hot air in the box body and external cold air. The thermosyphon heat dissipation assembly is arranged on the box body, and cooling liquid is arranged in the thermosyphon heat dissipation assembly. The thermosyphon heat dissipation assembly is configured to circulate the vaporized cooling liquid after the cooling liquid absorbs heat of the heat generating device inside the inverter and evaporates. The air cooling assembly is used for blowing air towards the heat exchanger and the thermosyphon heat dissipation assembly. The heat dissipation effect of the inverter is improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more particularly to an inverter and energy storage system. Background Technology

[0002] With the development of photovoltaic technology, the power of string inverters continues to break through, and the power of currently launched inverters can reach more than 400KW, with the maximum output power on the AC side reaching 500kW.

[0003] Existing inverters typically use external heat sinks, which mainly consist of a cooling fan and a finned heat sink module. The cooling fan drives air convection through the finned heat sink module, allowing the finned heat sink module on the inverter to absorb heat from the inverter and exchange heat with the ambient air, ultimately controlling the inverter temperature.

[0004] However, the above-mentioned heat dissipation method relies solely on the heat exchange between the finned heat dissipation module and the outside air, resulting in poor heat dissipation performance. Utility Model Content

[0005] This application provides an inverter and energy storage system to solve the problem of poor heat dissipation in existing inverters.

[0006] On one hand, embodiments of this application provide an inverter, including:

[0007] The enclosure contains heating elements.

[0008] A heat exchanger is installed on the housing and is configured to exchange heat between the hot air inside the housing and the cold air outside the housing.

[0009] A thermosiphon heat dissipation component is installed on the housing. The thermosiphon heat dissipation component contains coolant. The thermosiphon heat dissipation component is configured such that after the coolant absorbs the heat of the heat-generating device and evaporates, the vaporized coolant is circulated and cooled to liquefy.

[0010] An air-cooled assembly is disposed on the housing and is used to blow air toward the heat exchanger and the thermosiphon heat dissipation assembly.

[0011] In one possible implementation, the thermosiphon heat dissipation assembly includes an evaporator, a condenser, an evaporation tube, and a return tube. The evaporator is disposed on the housing and is used to contact the heat-generating device. The condenser is disposed on the housing. The evaporation tube is connected to the outlet of the evaporator and the inlet of the condenser, respectively. The return tube is connected to the inlet of the evaporator and the outlet of the condenser, respectively.

[0012] The coolant is configured such that, after vaporizing in the evaporator, it flows through the evaporation pipe into the condenser for cooling and liquefaction, and after liquefaction, it flows along the return pipe back into the evaporator to form a circulation.

[0013] In one possible implementation, the condenser includes a mounting bracket and a plurality of cooling plates. The mounting bracket is disposed on the housing, and the cooling plates are disposed on the mounting bracket. There is a gap between two adjacent cooling plates. The air-cooling assembly blows air toward the gap. The evaporator pipe and the return pipe are both connected to the mounting bracket, and the evaporator pipe and the return pipe are respectively connected to the cooling plates.

[0014] In one possible implementation, the cooling plate is provided with cooling channels arranged in a single layer within the cooling plate, with one end of the cooling channel connected to the return pipe and the other end connected to the evaporation pipe.

[0015] In one possible implementation, the thermosiphon cooling assembly further includes a mounting bracket, one end of which is connected to the evaporator and the other end of which is connected to the condenser to support the condenser.

[0016] In one possible implementation, a mounting slot is provided on the housing, the heating element is mounted in the mounting slot, and a portion of the heating element is located outside the mounting slot and in contact with the evaporator.

[0017] In one possible implementation, the thermosiphon cooling assembly further includes an air duct component connected to the housing and mounted on the condenser. The air duct component has openings on both sides, and the air duct component and the housing form an air guide channel. The air-cooling assembly blows air toward the air guide channel.

[0018] In one possible implementation, the inverter further includes a back cover disposed on the housing, forming a mounting cavity between the back cover and the housing, wherein the heat exchanger, the air-cooled assembly, and the thermosiphon heat dissipation assembly are all disposed within the mounting cavity, and the back cover is provided with an air inlet and an air outlet.

[0019] In one possible implementation, the back cover portion protrudes outside the housing, and multiple air outlets are provided, with the multiple air outlets respectively located on the four side walls at one end of the protruding portion of the back cover.

[0020] In one possible implementation, the inverter further includes a plurality of inverter inductors and a plurality of boost inductors, both of which are located within the mounting cavity and are connected to the housing.

[0021] On the other hand, this application also provides an energy storage system, including an energy storage battery and an inverter electrically connected to the energy storage battery.

[0022] This application provides an inverter and energy storage system. The inverter uses a heat exchanger on its casing to exchange heat between the hot air inside the casing and the cold air outside. A thermosiphon cooling component containing coolant is then installed. After the coolant absorbs heat from the heat-generating components and evaporates, it is circulated to cool and liquefy the vaporized coolant. An air-cooling component blows air towards the heat exchanger and the thermosiphon cooling component. Through the coordinated operation of the thermosiphon cooling component, the heat exchanger, and the air-cooling component, heat from the air inside the casing is exchanged through the heat exchanger. The thermosiphon cooling component achieves liquid cooling of the heat-generating components through the thermosiphon effect, and the air-cooling component provides forced convection cooling, thereby improving the inverter's heat dissipation effect to meet the heat dissipation requirements of high-power inverters. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0024] Figure 1 A schematic diagram of the rear structure of the inverter enclosure provided in this application;

[0025] Figure 2 A schematic diagram of the front structure of the inverter enclosure provided in this application;

[0026] Figure 3 This is an exploded structural diagram of the inverter provided in this application;

[0027] Figure 4 A front view of the heat dissipation duct at the back of the inverter provided in this application;

[0028] Figure 5 A side view of the heat dissipation duct at the back of the inverter provided in this application;

[0029] Figure 6 A schematic diagram of the thermosiphon cooling component in the inverter provided in this application;

[0030] Figure 7 for Figure 6 Exploded view of the structure of the medium-heat siphon cooling component;

[0031] Figure 8 for Figure 6 Schematic diagram showing the connection position between the heat-generating device and the thermosiphon heat dissipation assembly;

[0032] Figure 9 for Figure 6 Schematic diagram of the middle cooling plate;

[0033] Figure 10 A schematic diagram of another inverter provided in this application;

[0034] Figure 11 for Figure 10 Schematic diagram of the heat dissipation airflow of the inverter.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100. Cabinet; 110. Mounting slot; 120. Heating element; 121. Boost module; 122. Inverter module; 200. Heat exchanger; 300. Thermosiphon cooling assembly; 310. Evaporator; Cooling channel; 320. Condenser; 321. Mounting bracket; 322. Cooling plate; 3221. Cooling channel; 330. Evaporator tube; 340. Return pipe; 350. Mounting bracket; 360. Air duct component; 400. Air-cooled assembly; 410. Heat exchange fan; 420. Fan bracket; 500. Back cover; 510. Air inlet; 520. Air outlet; 530. Mounting cavity; 600. Inverter inductor; 700. Boost inductor.

[0037] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0038] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0039] With the development of photovoltaic technology, the power of string inverters continues to break through, and the power of currently launched inverters can reach more than 400KW, with the maximum output power on the AC side reaching 500kW.

[0040] Existing inverters typically use external heat sinks, which mainly consist of a cooling fan and a finned heat sink module. The cooling fan drives air convection through the finned heat sink module, allowing the finned heat sink module on the inverter to absorb heat from the inverter and exchange heat with the ambient air, ultimately controlling the inverter temperature.

[0041] However, the above-mentioned heat dissipation methods rely solely on the heat exchange between the finned heat dissipation module and the outside air, resulting in poor heat dissipation performance, which can no longer meet the heat dissipation requirements of existing high-power inverters.

[0042] This application provides an inverter and energy storage system. The inverter uses a heat exchanger on its casing to exchange heat between hot air inside the casing and cold air outside. A thermosiphon cooling component containing coolant is then installed. After the coolant absorbs heat from the heat-generating components and evaporates, it is circulated to cool and liquefy the vaporized coolant. An air-cooling component blows air towards the heat exchanger and the thermosiphon cooling component. Through the coordinated operation of the thermosiphon cooling component, the heat exchanger, and the air-cooling component, heat from the air inside the casing is exchanged through the heat exchanger. The thermosiphon cooling component achieves liquid cooling of the heat-generating components through the thermosiphon effect, and the air-cooling component provides forced convection cooling, thereby improving the inverter's heat dissipation effect to meet the heat dissipation requirements of high-power inverters.

[0043] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0044] This application provides an inverter, referring to... Figure 1 , Figure 2 and Figure 3 The inverter includes a housing 100, a heat exchanger 200, a thermosiphon cooling component 300, and an air-cooling component 400.

[0045] A heat exchanger 200 is installed on the housing 100 and is configured to exchange heat between the hot air inside the housing 100 and the cold air outside.

[0046] The enclosure 100 has a base plate and side walls surrounding the base plate, forming a cavity. The electrical components and circuitry of the inverter are installed inside the cavity. The inverter is primarily mounted on the base plate, but can also be mounted on the side walls. A heat exchanger 200 is installed outside the enclosure 100, specifically on the base plate. The heat exchanger 200 communicates with the internal cavity of the enclosure 100 to facilitate heat exchange between the air inside the enclosure 100 and the outside air.

[0047] For example, heat exchanger 200 may be an air-to-air heat exchanger (AAHX).

[0048] The thermosiphon heat dissipation component 300 is installed on the housing 100. Coolant is installed inside the thermosiphon heat dissipation component 300. The thermosiphon heat dissipation component 300 is configured such that after the coolant absorbs the heat of the heat-generating device 120 inside the inverter and evaporates, the vaporized coolant is circulated to cool and liquefy it.

[0049] The thermosiphon cooling component 300 is mounted on the bottom plate of the housing 100 and located outside the chamber of the housing 100. The thermosiphon cooling component 300 and the heat exchanger 200 are located on the same side of the bottom plate. The coolant in the thermosiphon cooling component 300 absorbs the heat generated by the heat-generating device 120 inside the housing 100 and vaporizes. Under the action of thermosiphon, the coolant circulates and liquefies within the thermosiphon cooling component 300, and then continues to absorb heat from the heat-generating device 120. By utilizing the thermosiphon effect, the main heat-generating device 120 is cooled by the coolant, which further improves the heat dissipation effect compared to air cooling.

[0050] A heating element 120 is installed inside the housing 100. This heating element 120 can be a major heat-generating electrical component inside the inverter. In this embodiment, taking the boost module 121 and inverter module 122 as examples, both the boost module 121 and inverter module 122 are mounted on the housing 100 and are close to or attached to the thermosiphon cooling assembly 300. In other embodiments, other electrical components can also be cooled, which will not be elaborated upon here.

[0051] The air-cooling component 400 is mounted on the enclosure and is used to blow air toward the heat exchanger 200 and the thermosiphon heat dissipation component 300.

[0052] The inverter also includes a back cover 500, which is mounted on the enclosure 100. A mounting cavity 530 is formed between the back cover 500 and the enclosure 100. The heat exchanger 200, the air-cooled assembly 400, and the thermosiphon cooling assembly 300 are all housed within the mounting cavity 530. The back cover 500 has an air inlet 510 and an air outlet 520. A cooling duct for the air-cooled assembly 400 is formed between the back cover 500 and the enclosure 100, with the air inlet 510 and the air outlet 520 serving as the two ends of the cooling duct.

[0053] Among them, reference Figure 4 and Figure 5 The air-cooled assembly 400 is mounted on the bottom plate of the enclosure 100, located outside the inverter cavity, so that the air-cooled assembly 400, heat exchanger 200, and thermosiphon cooling assembly 300 are on the same side of the bottom plate. The air-cooled assembly 400 blows air to form a heat dissipation airflow, thereby improving the heat exchange efficiency between the heat exchanger 200 and the thermosiphon cooling assembly located within the heat dissipation airflow and the air, thus further improving the heat dissipation effect.

[0054] For example, the air-cooling assembly 400 can be a plurality of heat exchange fans 410, which are installed in a single row on the housing 100, and the airflow of the plurality of cooling fans is the same.

[0055] For example, to improve heat dissipation, the heat dissipation fins on the heat exchanger 200 are arranged parallel to the heat dissipation duct so as to share the heat dissipation duct and improve the airflow efficiency between the heat dissipation fins of the heat exchanger 200. This, in turn, improves the heat dissipation effect of the heat exchanger 200.

[0056] Both the heat exchanger 200 and the thermosiphon cooling component 300 are located within the heat dissipation duct. Through the cooperation of multiple heat dissipation structures, the heat of the air inside the housing 100 is exchanged through the heat exchanger 200, and the thermosiphon cooling component 300 achieves efficient transfer of heat from the heat-generating device 120 through the thermosiphon effect. Then, the air-cooled component 400 provides forced convection cooling in a unified heat dissipation duct, thereby improving the heat dissipation effect of the inverter to meet the heat dissipation requirements of high-power inverters.

[0057] In one possible implementation, refer to Figure 6 and Figure 7 The thermosiphon heat dissipation assembly 300 includes an evaporator 310, a condenser 320, an evaporation tube 330, and a return pipe 340. The evaporator 310 is mounted on the housing 100 and is used to contact the heating device 120. The condenser 320 is mounted on the housing 100. The evaporation tube 330 is connected to the outlet of the evaporator 310 and the inlet of the condenser 320, respectively. The return pipe 340 is connected to the inlet of the evaporator 310 and the outlet of the condenser 320, respectively.

[0058] The coolant is configured such that after vaporizing in the evaporator 310, it flows through the evaporator pipe 330 into the condenser 320 for cooling and liquefaction. After liquefaction, the coolant flows along the return pipe 340 back into the evaporator 310 to form a circulation.

[0059] The thermosiphon cooling assembly 300 is arranged in a split configuration. The evaporator 310 is fixed to the bottom plate of the housing 100, closely positioned to be near the inverter's heat-generating components 120. The condenser 320 is also fixed to the bottom plate of the housing 100, and is connected to the evaporator 310 via an evaporation pipe 330 and a return pipe 340. This split design allows the installation positions of the evaporator 310 and condenser 320 to be adjusted according to the inverter's spatial layout, thus maximizing space utilization and improving heat dissipation while reducing the inverter's overall size.

[0060] For example, the evaporator 310, the condenser 320 and the base plate can be fixed by means of bonding, welding, screw connection, snap-fit ​​connection, etc.

[0061] For example, both the evaporator pipe 330 and the return pipe 340 are configured with multiple pipes to improve the flow efficiency of coolant between the evaporator 310 and the condenser 320, thereby further improving the heat dissipation effect.

[0062] In the embodiments of this application, three evaporator tubes 330 and two return tubes 340 are provided. The evaporator tubes 330 are arranged side by side and evenly distributed between the evaporator 310 and the condenser 320 to make full use of the condenser 320, reduce the redundancy of the condenser 320, and further improve the heat dissipation effect. The two return tubes 340 are located at both ends of the evaporator 310 and connected to both ends of the condenser 320, thereby improving the return flow capacity.

[0063] For example, refer to Figure 3 and Figure 8 To improve heat dissipation, a mounting slot 110 is provided on the housing 100, and the heating element 120 is installed in the mounting slot 110. Some of the heating elements 120 are located outside the mounting slot 110 and in contact with the evaporator 310.

[0064] In this example, taking the boost module 121 and inverter module 122 as examples, the heat-generating device 120 in the inverter is installed in the corresponding mounting slot 110 so that the heat-generating device 120 is attached to the substrate of the evaporator 310. The evaporator 310 directly dissipates heat from the heat-generating device 120, improving the heat dissipation effect of the inverter. This is to accommodate high-power inverters.

[0065] In the embodiments of this application, both the boost module 121 and the inverter module 122 are set in three groups. In other embodiments, they can be changed according to actual needs, which will not be elaborated here.

[0066] In one possible implementation, refer to Figure 6 and Figure 8 The condenser 320 includes a mounting bracket 321 and multiple cooling plates 322. The mounting bracket 321 is mounted on the housing 100, and the cooling plates 322 are evenly distributed on the mounting bracket 321. There is a gap between two adjacent cooling plates 322. The air-cooling assembly 400 blows air toward the gap. The evaporator pipe 330 and the return pipe 340 are both connected to the mounting bracket 321 and communicate with the cooling plates 322.

[0067] The mounting bracket 321 consists of two parallel mounting plates, with multiple cooling plates 322 evenly distributed between them. Piping structures are installed within the mounting plates to connect the cooling plates 322, which are then connected to the evaporator pipe 330 and the return pipe 340, forming a closed thermosiphon loop. The evaporator 310 constitutes a parallel microchannel two-phase heat exchange array. The cooling plates 322, through their evenly distributed installation, form directional laminar flow cooling air ducts parallel to the heat dissipation air ducts, thereby improving the heat dissipation effect of the cooling plates 322 through airflow. The coolant is distributed through the evaporator pipe 330 to the microchannels within each cooling plate 322, dissipating heat, and then the two-phase mixture is returned to the evaporator 310 through the return pipe 340 to complete a closed-loop phase change cycle.

[0068] In one possible implementation, refer to Figure 6 and Figure 8 Cooling channel 3221 is provided inside cooling plate 322. Cooling channel 3221 is arranged in a single layer inside cooling plate 322. One end of cooling channel 3221 is connected to return pipe 340 and the other end is connected to evaporation pipe 330.

[0069] For example, the cooling channel 3221 and the cooling plate 322 are integrally formed. Furthermore, the cooling channel 3221 and the cooling plate 322 can be integrally formed using an aluminum extrusion process.

[0070] By arranging multiple cooling channels 3221 evenly in the cooling plate 322 in a single layer, the flow path of the coolant is improved, thereby increasing the heat dissipation time of the coolant and thus improving the heat dissipation effect.

[0071] For example, the cooling plate 322 is also provided with heat dissipation fins, which increase the contact area between the cooling plate 322 and the air to improve the heat dissipation effect. The heat dissipation fins can be corrugated fins to further increase the contact area with the air.

[0072] In one possible implementation, the thermosiphon heat dissipation assembly 300 further includes a fixing bracket 350, one end of which is connected to the evaporator 310 and the other end of which is connected to the condenser 320 to support the condenser 320.

[0073] For example, the fixing bracket 350 is an L-shaped bracket, with one end of the fixing bracket 350 fixed to the condenser 320 and the other end fixed to the evaporator 310, so as to further support the protruding condenser 320 and improve the stability of the condenser 320.

[0074] For example, the fixed bracket 350 is welded to the condenser 320, and the fixed bracket 350 is welded to the evaporator 310. Two fixed brackets 350 are provided to improve the support effect.

[0075] In one possible implementation, the thermosiphon heat dissipation assembly 300 further includes an air duct 360, which is connected to the housing 100 and mounted on the condenser 320. The air duct 360 and the housing 100 form an air guide channel, and the air-cooling assembly 400 blows air toward the air guide channel.

[0076] Specifically, the air duct component 360 has a Z-shaped structure and is mounted on the condenser 320, forming an airflow channel for the condenser 320. The airflow channel formed by the air duct component 360 coincides with the heat dissipation channel. The air duct component 360 serves a guiding function.

[0077] When the heat emitted by the heating device 120 is transferred to the evaporator 310, the coolant in the evaporator 310 absorbs the heat and expands, forming an upward airflow. Under the pressure difference between the evaporator 310 and the condenser 320, the steam enters the cooling channel 3221 in the condenser 320 through the evaporation pipe 330. The cooling plate 322 and the cooling channel 3221 carry away the heat through air cooling. The airflow after being cooled in the cooling channel 3221 gradually liquefies. After liquefaction, it flows back to the bottom of the condenser 320 under its own gravity and flows back to the return cavity of the evaporator 310 through the return pipe 340, thus forming a heat dissipation cycle and realizing the heat dissipation of the heating device 120.

[0078] The back cover 500 and the enclosure 100 form an independent mounting cavity 530. The heat exchanger 200, the air-cooled component 400 and the thermosiphon heat dissipation component 300 are all set in the mounting cavity 530, which avoids the heat dissipation structure from damaging the layout of the internal electrical components of the inverter, and can also meet the sealing and heat dissipation requirements of the inverter.

[0079] In one possible implementation, the back cover 500 protrudes out of the housing 100, and multiple air outlets 520 are provided, with the multiple air outlets 520 respectively located on the four side walls of one end of the protruding part of the back cover 500.

[0080] Specifically, the back cover 500 is L-shaped, and the air outlets 520 are located on the four side walls of the protruding part of the back cover 500, thereby increasing the airflow direction and dispersing it in all directions to improve the heat dissipation effect at the air outlets 520. The air inlet 510 is located at the end of the back cover 500 away from the air inlet 510. The air inlet 510 is directly opposite the heat dissipation air duct to avoid the air duct turning.

[0081] In one possible implementation, refer to Figure 10 and Figure 11The inverter also includes multiple inverter inductors 600 and multiple boost inductors 700. The inverter inductors 600 and boost inductors 700 are all located in the mounting cavity 530. The inverter inductors 600 and boost inductors 700 are all connected to the enclosure 100. The inverter inductors 600 and boost inductors 700 are all located on the heat dissipation duct.

[0082] For example, two boost inductors 700 are configured, and the two boost inductors 700 are arranged side by side at one end of the air inlet 510. Three inverter inductors 600 are configured, and the three inverter inductors 600 are arranged side by side at one end of the air outlet 520.

[0083] For example, the air-cooled assembly 400 is disposed between the heat exchanger 200 and the boost inductor 700, the condenser 320 is located on the side of the heat exchanger 200 away from the air-cooled assembly 400, and the inverter inductor 600 is located on the side of the condenser 320 away from the heat exchanger 200. The air-cooled assembly 400 draws air from the boost inductor 700 and blows it towards the heat exchanger 200, forming a heat dissipation airflow channel. Through a reasonable structural arrangement, the heat dissipation airflow channel of the air-cooled assembly 400 is maximized, and it is compatible with the inverter inductor 600, the boost inductor 700, the heat exchanger 200, and the condenser 320, reducing the external size of the inverter and improving the integration of the inverter.

[0084] In other examples, the thermosiphon heat dissipation assembly 300 can also be an integrated structure of the condenser 320 and the evaporator 310, in order to reduce the size of the thermosiphon heat dissipation assembly 300 and facilitate installation.

[0085] For example, two condensers 320 can be configured to further improve heat dissipation. In this embodiment, the inverter inductor 600 needs to be repositioned, with two inverter inductors 600 installed at one end of the condenser 320, parallel to the condenser 320, and the other inverter inductor 600 installed near the boost inductor 700, parallel to the boost inductor 700.

[0086] For example, the air-cooled assembly 400 may also include a fan bracket 420, on which multiple cooling fans are bolted. The housing 100 is also provided with a slide rail, which is riveted to the back cover 500. The fan bracket 420 is slidably connected to the slide rail and slides along the length of the fans to adjust the position of the fans.

[0087] This application also provides an energy storage system, including an energy storage battery and an inverter electrically connected to the energy storage battery. The inverter is electrically connected to the energy storage battery.

[0088] The energy storage system provided in this application embodiment includes an inverter that uses a heat exchanger 200 installed on a housing 100 to exchange heat between the hot air inside the housing 100 and the cold air outside. A thermosiphon cooling component 300, containing coolant, is then installed. After the coolant absorbs heat from the heat-generating device 120 and evaporates, it is circulated and liquefied. An air-cooling component 400 is used to blow airflow, forming a heat dissipation duct. Both the heat exchanger 200 and the thermosiphon cooling component 300 are located within this duct. Through the coordinated operation of these multiple heat dissipation structures, heat from the air inside the housing 100 is exchanged through the heat exchanger 200, and the thermosiphon cooling component 300 efficiently transfers heat from the heat-generating device 120 through the thermosiphon effect. Finally, the air-cooling component 400 forces convection heat dissipation within the unified heat dissipation duct, thereby improving the inverter's heat dissipation effect to meet the heat dissipation requirements of high-power inverters.

[0089] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. An inverter, characterized in that, include: A housing (100) is provided with a heating element (120) inside the housing (100); A heat exchanger (200) is disposed on the housing (100) and the heat exchanger (200) is configured to exchange heat between hot air inside the housing (100) and cold air outside. A thermosiphon heat dissipation component (300) is disposed on the housing (100). The thermosiphon heat dissipation component (300) contains a coolant. The thermosiphon heat dissipation component (300) is configured such that after the coolant absorbs the heat of the heat-generating device (120) and evaporates, the vaporized coolant is circulated and cooled to liquefy. An air-cooled assembly (400) is disposed on the housing (100) and is used to blow air toward the heat exchanger (200) and the thermosiphon heat dissipation assembly (300).

2. The inverter according to claim 1, characterized in that, The thermosiphon heat dissipation assembly (300) includes an evaporator (310), a condenser (320), an evaporation tube (330), and a return pipe (340). The evaporator (310) is mounted on the housing (100) and is used to contact the heating device (120). The condenser (320) is mounted on the housing (100). The evaporation tube (330) is connected to the outlet of the evaporator (310) and the inlet of the condenser (320) respectively. The return pipe (340) is connected to the inlet of the evaporator (310) and the outlet of the condenser (320) respectively. The coolant is configured such that, after vaporizing in the evaporator (310), it flows through the evaporation pipe (330) into the condenser (320) for cooling and liquefaction. After liquefaction, the coolant flows along the return pipe (340) back into the evaporator (310) to form a circulation.

3. The inverter according to claim 2, characterized in that, The condenser (320) includes a mounting bracket (321) and a plurality of cooling plates (322). The mounting bracket (321) is disposed on the housing (100). The cooling plates (322) are evenly distributed on the mounting bracket (321). There is a gap between two adjacent cooling plates (322). The air-cooling assembly (400) blows air toward the gap. The evaporator (330) and the return pipe (340) are both connected to the mounting bracket (321). The evaporator (330) and the return pipe (340) are respectively connected to the cooling plates (322).

4. The inverter according to claim 3, characterized in that, The cooling plate (322) is provided with a cooling channel (3221), which is arranged in a single layer in the cooling plate (322). One end of the cooling channel (3221) is connected to the return pipe (340), and the other end is connected to the evaporation pipe (330).

5. The inverter according to claim 2, characterized in that, The thermosiphon heat dissipation assembly (300) also includes a fixing bracket (350), one end of which is connected to the evaporator (310) and the other end is connected to the condenser (320) to support the condenser (320).

6. The inverter according to claim 2, characterized in that, The housing (100) has an installation groove (110) and the heating element (120) is installed in the installation groove (110). Part of the heating element (120) is located outside the installation groove (110) and in contact with the evaporator (310).

7. The inverter according to claim 2, characterized in that, The thermosiphon heat dissipation assembly (300) also includes an air duct component (360), which is connected to the housing (100). The air duct component (360) is mounted on the condenser (320), and the air duct component (360) and the housing (100) form an air guide channel. The air-cooling assembly (400) blows air toward the air guide channel.

8. The inverter according to any one of claims 1-7, characterized in that, It also includes a back cover (500), which is disposed on the housing (100). An installation cavity (530) is formed between the back cover (500) and the housing (100). The heat exchanger (200), the air-cooled assembly (400), and the thermosiphon heat dissipation assembly (300) are all disposed in the installation cavity (530). The back cover (500) is provided with an air inlet (510) and an air outlet (520).

9. The inverter according to claim 8, characterized in that, It also includes multiple inverter inductors (600) and multiple boost inductors (700), both of which are located within the mounting cavity (530) and are connected to the housing (100).

10. An energy storage system, characterized in that, It includes an energy storage battery and an inverter as described in any one of claims 1-9, which is electrically connected to the energy storage battery.

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