Wet etching apparatus and solar cell

Abstract

The utility model provides a kind of wet etching equipment, comprising: alkali etching pool;First solid raw material adding device, including first discharge port, first discharge port is communicated with alkali etching pool by pipeline structure, and first solid raw material adding device is used to add solid alkali to alkali etching pool;Second solid raw material adding device, including second discharge port, second discharge port is communicated with alkali etching pool by pipeline structure, and second solid raw material adding device is used to add solid additive to alkali etching pool, and solid alkali and solid additive are mixed with water in pipeline structure to form etching liquid, solve the technical problem that wet etching equipment in prior art is volatile in the process of etching liquid proportioning.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic cell technology, and more specifically, to a wet etching apparatus and a solar cell. Background Technology

[0002] In existing wet etching equipment, the alkaline polishing tank often experiences chemical evaporation during solution preparation.

[0003] The information disclosed in the background section is only intended to enhance the understanding of the background art of the art described herein. Therefore, the background art may contain information that does not constitute prior art known to those skilled in the art in this country. Utility Model Content

[0004] The main objective of this invention is to provide a wet etching apparatus and a solar cell to solve the technical problem of easy volatilization of the etching solution during the preparation of the etching solution in the existing wet etching apparatus.

[0005] To achieve the above objectives, according to one aspect of the present invention, a wet etching apparatus is provided, comprising: an alkaline polishing tank; a first solid material adding device, including a first outlet, the first outlet being connected to the alkaline polishing tank via a pipeline structure, the first solid material adding device being used to add solid alkali to the alkaline polishing tank; and a second solid material adding device, including a second outlet, the second outlet being connected to the alkaline polishing tank via the pipeline structure, the second solid material adding device being used to add solid additives to the alkaline polishing tank, wherein the solid alkali and the solid additives are mixed with water in the pipeline structure to form an etching solution.

[0006] Furthermore, the alkaline polishing tank includes a first through hole and a second through hole, and the pipeline structure includes a first pipe and a second pipe. A portion of the first pipe is located inside the alkaline polishing tank. One end of the first pipe passes through the first through hole and is connected to one end of the first discharge port, and the other end passes through the second through hole and is connected to one end of the second discharge port. The two ends of the second pipe are respectively connected to the other ends of the first discharge port and the other ends of the second discharge port. The first pipe, the first discharge port, the second pipe, and the second discharge port form a circulation structure for mixing the solid alkali and the solid additive to form the etching solution. The portion of the first pipe located inside the alkaline polishing tank has an outlet, and the etching solution enters the alkaline polishing tank from the outlet.

[0007] Furthermore, the alkaline polishing tank includes a first through hole and a second through hole, and the pipeline structure includes a third pipeline, a fourth pipeline, and a fifth pipeline. The two ends of the third pipeline are respectively connected to one end of the first discharge port and the first through hole. The two ends of the fourth pipeline are respectively connected to one end of the second discharge port and the second through hole. The two ends of the fifth pipeline are respectively connected to the other end of the first discharge port and the other end of the second discharge port. The third pipeline, the fourth pipeline, the fifth pipeline, the first discharge port, the second discharge port, and the alkaline polishing tank constitute a circulation structure for mixing the solid alkali and the solid additive to form the etching solution.

[0008] Furthermore, the wet etching equipment also includes a pneumatic pump connected to the pipeline structure, which is used to drive the flow of liquid in the pipeline structure.

[0009] Furthermore, the first solid raw material adding device further includes a first pretreatment structure and a first inlet. The first pretreatment structure is located between the first inlet and the first outlet. The first inlet includes a storage area for the solid alkali and a first channel for the solid alkali to enter the first pretreatment structure. The second solid raw material adding device further includes a second pretreatment structure and a second inlet. The second pretreatment structure is located between the second inlet and the second outlet. The second inlet includes a storage area for the solid additive and a second channel for the solid additive to enter the second pretreatment structure. The first pretreatment structure and the second pretreatment structure are at least used for drying and weighing the solid alkali and the solid additive.

[0010] Furthermore, both the first channel and the second channel have a switch structure, which is used to isolate or connect the storage area and the first preprocessing structure, and to isolate or connect the storage area and the second preprocessing structure.

[0011] Furthermore, both the first pretreatment structure and the second pretreatment structure include multiple functional areas, which are cavities in the first pretreatment structure and the second pretreatment structure, and the inlet of the functional area has a switch structure.

[0012] Furthermore, the functional area includes a weighing device and a hot air blower. The weighing device is located at the bottom of the functional area, which is the side of the functional area opposite to the feed inlet. The hot air blower is located on the side wall of the functional area.

[0013] Furthermore, both the first pretreatment structure and the second pretreatment structure include multiple functional areas, including a drying area and a weighing area. In the first solid raw material adding device, the drying area is connected to the first channel, the weighing area is located on the side of the drying area away from the first channel, a movable baffle is provided between the weighing area and the drying area, and a movable baffle is provided between the weighing area and the first discharge port. In the second solid raw material adding device, the drying area is connected to the second channel, the weighing area is located on the side of the drying area away from the second channel, a movable baffle is provided between the weighing area and the drying area, and a movable baffle is provided between the weighing area and the second discharge port.

[0014] According to another aspect of the present invention, a solar cell is provided, wherein the silicon wafer of the solar cell is cleaned using the aforementioned wet etching equipment.

[0015] By applying the technical solution of this utility model, a first solid raw material adding device and a second solid raw material adding device are set in the wet etching equipment. The first solid raw material adding device includes a first outlet, which is connected to the alkaline polishing tank through a pipeline structure. The first solid raw material adding device is used to add solid alkali to the alkaline polishing tank. The second solid raw material adding device includes a second outlet, which is connected to the alkaline polishing tank through a pipeline structure. The second solid raw material adding device is used to add solid additives to the alkaline polishing tank. The solid alkali and solid additives mix with water in the pipeline structure to form an etching solution. In this process of mixing solid chemicals, since the raw materials are all solid, there is no volatilization of the chemicals. After entering the pipeline structure, they quickly mix with water to form an etching solution, which directly enters the alkaline polishing tank. This avoids the volatilization and activity decay of the solution in the traditional solution mixing process, and solves the technical problem of easy volatilization of the solution in the process of mixing etching solution in existing wet etching equipment. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0017] Figure 1 A cross-sectional structural schematic diagram of a wet etching apparatus according to an embodiment of the present invention is shown;

[0018] Figure 2 A cross-sectional structural schematic diagram of another wet etching apparatus according to an embodiment of the present invention is shown;

[0019] Figure 3 A schematic diagram of the functional areas of a wet etching apparatus according to an embodiment of the present invention is shown.

[0020] The above figures include the following reference numerals:

[0021] 10. Alkali throwing tank; 20. First solid raw material adding device; 21. First discharge port; 22. First pretreatment structure; 23. First feed port; 231. Solid alkali storage area; 232. First channel; 30. Second solid raw material adding device; 31. Second discharge port; 32. Second pretreatment structure; 33. Second feed port; 331. Solid additive storage area; 332. Second channel; 41. First pipe; 42. Second pipe; 43. Third pipe; 44. Fourth pipe; 45. Fifth pipe; 50. Functional area; 51. Drying area; 52. Weighing area; 53. Movable baffle. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0024] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0025] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0026] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0027] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0028] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0029] In the accompanying drawings corresponding to the embodiments of this application, the thickness and area of ​​the layers are enlarged for better understanding and ease of description. When describing a component (such as a layer, film, region, or substrate) on or on the surface of another component, the component may be "directly" located on the surface of the other component, or there may be a third component between the two components. Conversely, when describing a component on the surface of another component, or when another component is formed or disposed on the surface of a component, it indicates that there is no third component between the two components. Furthermore, when describing a component as being "generally" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on a portion of the edge of the entire surface.

[0030] In the description of the embodiments of this application, when a component "includes" another component, other components are not excluded unless otherwise stated, and other components may be further included. Furthermore, when a component such as a layer, film, region, or plate is referred to as being "on / located" on another component, it can be "directly on" the other component (i.e., located on the surface of the other component with no other components between them), or it can have another component present in between. Moreover, when a component such as a layer, film, region, or plate is "directly located" on another component, or when a component such as a layer, film, region, or plate is located on the surface of another component, it indicates that no other components are located in between.

[0031] The terminology used in the description of the various embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various embodiments and the appended claims, the word "part" is also intended to include the plural form, unless the context clearly indicates otherwise. Components include layers, films, regions, or plates, etc.

[0032] The embodiments of this application will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this application to facilitate a better understanding of the application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0033] According to one aspect of this utility model, a wet etching apparatus is provided, such as... Figure 1 and Figure 2 As shown, it includes: an alkaline polishing tank 10; a first solid raw material adding device 20, including a first discharge port 21, which is connected to the alkaline polishing tank 10 through a pipeline structure, and the first solid raw material adding device 20 is used to add solid alkali to the alkaline polishing tank 10; and a second solid raw material adding device 30, including a second discharge port 31, which is connected to the alkaline polishing tank 10 through a pipeline structure, and the second solid raw material adding device 30 is used to add solid additives to the alkaline polishing tank 10, and the solid alkali and solid additives are mixed with water in the pipeline structure to form an etching solution.

[0034] By incorporating a first solid raw material adding device and a second solid raw material adding device into a wet etching apparatus, the first solid raw material adding device includes a first outlet connected to an alkaline polishing tank via a pipeline structure, and is used to add solid alkali to the alkaline polishing tank. The second solid raw material adding device includes a second outlet connected to the alkaline polishing tank via a pipeline structure, and is used to add solid additives to the alkaline polishing tank. The solid alkali and solid additives mix with water in the pipeline structure to form an etching solution. During the mixing process, since the raw materials are all solid, there is no volatile chemical evaporation. After entering the pipeline structure, they quickly mix with water to form the etching solution, which directly enters the alkaline polishing tank. This avoids the evaporation and activity decay of the chemical solution during the traditional solution mixing process, solving the technical problem of easy evaporation of the chemical solution during the mixing process in existing wet etching equipment.

[0035] In the above embodiments, the alkaline polishing tank is a chemical reaction vessel for etching the surface of silicon wafers. This application uses solid alkali and solid additives to prepare the etching solution, which is then mixed with water in a pipeline structure before entering the alkaline polishing tank. By using solid chemicals directly dissolved in water, compared to traditional liquid preparation, evaporation and activity decay are reduced, thereby improving etching efficiency and solution activity.

[0036] In the above embodiments, the first solid raw material adding device is equipped with a precise weighing module, which directly feeds the solid alkali into the circulation structure through the first discharge port, and quickly mixes it with water to form an alkali polishing solution, thereby improving the solution preparation speed and accuracy, reducing the activity decay cycle of the solution, and ensuring the quality stability of the etching solution.

[0037] In the above embodiments, the solid additive components may include: defoaming powder, active material, surface brightening powder, preservative powder, and silicon powder, with weights of 0.05-0.5g, 0.05-0.5g, 0.05-0.3g, 0.01-0.1g, and 0.5-5g, respectively, wherein the silicon powder accounts for 20%-50% of the total weight of the solid alkaline polishing additive. The presence of silicon powder during solution preparation activates the solution, eliminating the need for an additional dummy wafer running process and reducing the solution concentration.

[0038] In some alternative implementations, such as Figure 1 As shown, the alkaline polishing tank 10 includes a first through hole and a second through hole. The pipeline structure includes a first pipe 41 and a second pipe 42. A portion of the first pipe 41 is located inside the alkaline polishing tank 10. One end of the first pipe 41 passes through the first through hole and is connected to one end of the first outlet 21, while the other end passes through the second through hole and is connected to one end of the second outlet 31. The two ends of the second pipe 42 are respectively connected to the other ends of the first outlet 21 and the second outlet 31. The first pipe 41, the first outlet 21, the second pipe 42, and the second outlet 31 form a circulation structure for mixing solid alkali and solid additives to form an etching solution. The portion of the first pipe 41 located inside the alkaline polishing tank 10 has an outlet, from which the etching solution enters the alkaline polishing tank 10. The alkaline polishing tank 10, with its two through holes and pipeline structure, forms a highly efficient circulation system. The arrangement of the first pipe 41 and the second pipe 42 allows solid alkali and solid additives to mix within the circulation structure to form an etching solution, which is then carried by the water flow to the alkaline polishing tank. The solid alkali and solid additives can first circulate and mix within the circulation structure, and after thorough mixing, they enter the alkaline polishing tank 10 through the outlet of the first pipe 41. This circulation structure promotes sufficient contact and dissolution between water and solid chemicals, while also accelerating the solution preparation speed and improving mixing efficiency. This circulation structure also ensures the uniformity and stability of the etching solution.

[0039] In some alternative implementations, such as Figure 2As shown, the alkaline polishing tank 10 includes a first through hole and a second through hole. The pipeline structure includes a third pipe 43, a fourth pipe 44, and a fifth pipe 45. The two ends of the third pipe 43 are connected to one end of the first outlet 21 and the first through hole, respectively. The two ends of the fourth pipe 44 are connected to one end of the second outlet 31 and the second through hole, respectively. The two ends of the fifth pipe 45 are connected to the other ends of the first outlet 21 and the other ends of the second outlet 31, respectively. The third pipe 43, the fourth pipe 44, the fifth pipe 45, the first outlet 21, the second outlet 31, and the alkaline polishing tank 10 constitute a circulation structure for mixing solid alkali and solid additives to form an etching solution. By setting the third pipe 43 and the fourth pipe 44 in the alkaline polishing tank 10, the convenience of liquid entry, exit, and circulation is increased, which helps to accelerate the dissolution rate of solid chemicals. Secondly, the above-mentioned circulation structure is formed by the alkaline polishing tank 10, the third pipe 43, the fourth pipe 44, the fifth pipe 45, the first outlet 21, and the second outlet 31. Solid alkali and solid additives circulate in the circulation structure and are directly mixed in the alkaline polishing tank 10, ensuring that the liquid continuously circulates during the mixing process. This design allows the equipment to maintain the dynamic balance of the etching solution during the solution preparation process, avoiding the phenomenon of excessively high or low local concentration of the solution, and improving the stability and uniformity of etching.

[0040] In some optional embodiments, the wet etching equipment also includes a pneumatic pump connected to the piping structure. The pneumatic pump drives the liquid flow within the piping structure. The pneumatic pump provides sufficient power to accelerate the contact frequency between water and solid chemicals, making the dissolution process faster and reducing the decrease in activity caused by prolonged solution residence time, thereby improving etching quality and production efficiency. The use of the pneumatic pump accelerates the liquid flow rate in the circulation structure, ensuring rapid circulation and mixing of the etching solution, increasing the dissolution rate of solid chemicals, and enhancing the overall activity and stability of the etching solution. The aforementioned wet etching equipment integrates a pneumatic pump system to accelerate liquid flow within the circulation structure. The pneumatic pump is not shown in the figure; its location can be selected according to actual conditions and is not specifically limited.

[0041] To improve the accuracy of weighing solid chemicals, in some alternative implementation methods, such as Figure 1 and Figure 2As shown, the first solid raw material addition device 20 further includes a first pretreatment structure 22 and a first inlet 23. The first pretreatment structure 22 is located between the first inlet 23 and the first outlet 21. The first inlet 23 includes a storage area 231 for solid alkali and a first channel 232 for solid alkali to enter the first pretreatment structure 22. The second solid raw material addition device 30 further includes a second pretreatment structure 32 and a second inlet 33. The second pretreatment structure 32 is located between the second inlet 33 and the second outlet 31. The second inlet 33 includes a storage area 331 for solid additives and a second channel 332 for solid additives to enter the second pretreatment structure 32. The first pretreatment structure 22 and the second pretreatment structure 32 are at least used for drying and weighing solid alkali and solid additives. The first and second solid raw material addition devices respectively integrate pretreatment structures for drying and weighing solid chemicals. This pretreatment design ensures that the solid chemicals are in optimal condition before being added to the circulation structure, improving the controllability of the mixing process and the accuracy of the drug solution ratio. The introduction of the pretreatment structure greatly improves the accuracy of solid chemical weighing and the efficiency of etching solution preparation. Solid chemicals undergo rigorous drying and weighing before being added to the circulation system, avoiding significant deviations in the final solution concentration due to water content or weight variations. This ensures that each solution preparation achieves ideal etching conditions, thereby improving production quality and consistency.

[0042] In some optional embodiments, both the first and second channels have a switching structure. This switching structure isolates or connects the storage area and the first pretreatment structure, and also isolates or connects the storage area and the second pretreatment structure. The switching structure can be a mechanical gate or a movable baffle, providing a temporary storage location for solid alkali and solid additives, allowing them to enter the functional area only when mixing is required, thus making the wet etching equipment more practical.

[0043] In some alternative implementations, such as Figure 1 and Figure 2 As shown, both the first pretreatment structure 22 and the second pretreatment structure 32 include multiple functional zones 50. Each functional zone 50 is a cavity within the first pretreatment structure 22 and the second pretreatment structure 32, and each functional zone 50 has a switch structure at its inlet. These multiple functional zones 50 are independent cavities with their own inlets. The functional zones 50 can pretreatment solid raw materials, removing other substances such as water. Furthermore, they are equipped with switch structures to prevent leakage of solid alkali and solid additives added during rotation of the pretreatment structure, and to allow the solid raw materials to fall out when needed.

[0044] To further refine the solution formulation, in some optional embodiments, the functional zone includes a weighing device and a hot air blower. The weighing device is located at the bottom of the functional zone, opposite the inlet, while the hot air blower is positioned on the side wall of the functional zone. The weighing device's placement at the bottom ensures immediate contact with the solid alkali or additive upon entry into the chamber, enabling instant weighing. This bottom-mounted weighing device reflects the weight change of the solid chemicals in real time, avoiding errors that can occur with traditional manual weighing. The hot air blower, located on the side wall, provides a directional hot airflow to efficiently remove moisture from the solid chemicals. Its blowing direction can be perpendicular to the direction of the solid chemicals' descent or along the horizontal direction of their distribution to promote uniform heating and rapid drying. This ensures that the solid additive is completely dry before being added to the circulation structure, preventing moisture from affecting the etching solution concentration. By directly feeding the solid raw material into the water through the outlet to form the etching solution, this method allows for direct normal production without additional activation steps, improving production efficiency and reducing the risk of contamination.

[0045] In some alternative implementations, such as Figure 3 As shown, both the first and second pretreatment structures include multiple functional areas, including a drying area 51 and a weighing area 52. In the first solid raw material adding device, the drying area 51 is connected to the first channel, and the weighing area 52 is located on the side of the drying area 51 away from the first channel. A movable baffle 53 is provided between the weighing area 52 and the drying area 51, and a movable baffle 53 is provided between the weighing area 52 and the first discharge port. In the second solid raw material adding device, the drying area 51 is connected to the second channel, and the weighing area 52 is located on the side of the drying area 51 away from the second channel. A movable baffle 53 is provided between the weighing area 52 and the drying area 51, and a movable baffle 53 is provided between the weighing area 52 and the second discharge port. Solid raw materials first enter the drying zone 51 through the first / second channel. Then, by adjusting the movable baffle 53, the solid raw materials are guided to the weighing zone 52 for precise weighing. Finally, by opening another set of movable baffles 53, the weighed solid raw materials are directly conveyed to the first / second discharge port and enter the circulation structure. The existence of the drying zone 51 ensures that the moisture content of the solid chemicals is strictly controlled before weighing, avoiding deviations in the etching solution concentration caused by excessive moisture. The weighing zone 52 controls the amount of solid chemicals added through precise measurement, avoiding the impact of excessive or insufficient addition on the etching effect. The use of movable baffles 53 provides flexible control for the transfer of solid chemicals between the drying zone 51 and the weighing zone 52, ensuring not only the continuity of chemical processing but also avoiding cross-contamination between different processing stages, improving the reliability and efficiency of pretreatment.

[0046] To reduce the residue of solid raw materials in the functional areas, in the above optional embodiments, the wet etching equipment may further include a vibrator located on the sidewall of the functional area. The vibrator is used to shake off the solid alkali and solid additives adhering to the sidewall of the functional area. This can further improve the utilization rate of solid raw materials and improve the accuracy of the prepared etching solution.

[0047] According to another aspect of the present invention, a solar cell is provided, wherein the silicon wafer of the solar cell is cleaned using a wet etching apparatus.

[0048] The data obtained from testing the above-mentioned solar cells are as follows:

[0049]

[0050] As can be seen from the table above, the quality of silicon wafers cleaned using the wet etching equipment of this application is significantly improved, and the consumption of silicon wafers is also low (weight reduction range).

[0051] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0052] 1) The wet etching equipment proposed in this application includes a first solid raw material adding device and a second solid raw material adding device. The first solid raw material adding device includes a first outlet, which is connected to an alkaline polishing tank via a pipeline structure. The first solid raw material adding device is used to add solid alkali to the alkaline polishing tank. The second solid raw material adding device includes a second outlet, which is connected to the alkaline polishing tank via a pipeline structure. The second solid raw material adding device is used to add solid additives to the alkaline polishing tank. The solid alkali and solid additives mix with water in the pipeline structure to form an etching solution. During the mixing process, since the raw materials are all solid, there is no volatilization. After entering the pipeline structure, they quickly mix with water to form the etching solution, which directly enters the alkaline polishing tank. This avoids the volatilization and activity decay of the solution in traditional solution preparation processes, solving the technical problem of easy volatilization of the solution during the preparation of the etching solution in existing wet etching equipment.

[0053] 2) The wet etching equipment proposed in this application includes first and second solid raw material addition devices integrated with pretreatment structures for drying and weighing solid chemicals. This pretreatment design ensures that the solid chemicals are in optimal condition before being added to the circulation structure, improving the controllability of the mixing process and the accuracy of the reagent ratio. The introduction of the pretreatment structure greatly improves the accuracy of solid chemical weighing and the efficiency of etching solution preparation. The solid chemicals undergo rigorous drying and weighing before being added to the circulation structure, avoiding significant deviations in the final reagent concentration due to water content or weight variations, ensuring that each solution preparation achieves ideal etching conditions, thereby improving production quality and consistency.

[0054] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wet etching apparatus, characterized in that, include: Alkali slurry tank; A first solid raw material adding device includes a first discharge port, which is connected to the alkali scouring tank through a pipeline structure. The first solid raw material adding device is used to add solid alkali to the alkali scouring tank. The second solid raw material adding device includes a second discharge port, which is connected to the alkaline polishing tank through the pipeline structure. The second solid raw material adding device is used to add solid additives to the alkaline polishing tank. The solid alkali and the solid additives are mixed with water in the pipeline structure to form an etching solution.

2. The wet etching apparatus according to claim 1, characterized in that, The alkaline polishing tank includes a first through hole and a second through hole. The pipeline structure includes a first pipe and a second pipe. A portion of the first pipe is located inside the alkaline polishing tank. One end of the first pipe passes through the first through hole and is connected to one end of the first discharge port. The other end passes through the second through hole and is connected to one end of the second discharge port. The two ends of the second pipe are respectively connected to the other ends of the first discharge port and the other ends of the second discharge port. The first pipe, the first discharge port, the second pipe, and the second discharge port form a circulation structure for mixing the solid alkali and the solid additive to form the etching solution. The portion of the first pipe located inside the alkaline polishing tank has an outlet, from which the etching solution enters the alkaline polishing tank.

3. The wet etching apparatus according to claim 1, characterized in that, The alkaline polishing tank includes a first through hole and a second through hole. The pipeline structure includes a third pipeline, a fourth pipeline, and a fifth pipeline. The two ends of the third pipeline are respectively connected to one end of the first discharge port and the first through hole. The two ends of the fourth pipeline are respectively connected to one end of the second discharge port and the second through hole. The two ends of the fifth pipeline are respectively connected to the other end of the first discharge port and the other end of the second discharge port. The third pipeline, the fourth pipeline, the fifth pipeline, the first discharge port, the second discharge port, and the alkaline polishing tank constitute a circulation structure for mixing the solid alkali and the solid additive to form the etching solution.

4. The wet etching apparatus according to claim 1, characterized in that, The wet etching equipment also includes a pneumatic pump connected to the pipeline structure, which is used to drive the flow of liquid in the pipeline structure.

5. The wet etching apparatus according to claim 1, characterized in that, The first solid raw material adding device further includes a first pretreatment structure and a first inlet. The first pretreatment structure is located between the first inlet and the first outlet. The first inlet includes a storage area for the solid alkali and a first channel for the solid alkali to enter the first pretreatment structure. The second solid raw material adding device further includes a second pretreatment structure and a second inlet. The second pretreatment structure is located between the second inlet and the second outlet. The second inlet includes a storage area for the solid additive and a second channel for the solid additive to enter the second pretreatment structure. The first pretreatment structure and the second pretreatment structure are at least used to dry and weigh the solid alkali and the solid additive.

6. The wet etching apparatus according to claim 5, characterized in that, Both the first channel and the second channel have a switch structure, which is used to isolate or connect the storage area and the first preprocessing structure, and to isolate or connect the storage area and the second preprocessing structure.

7. The wet etching apparatus according to claim 5, characterized in that, Both the first pretreatment structure and the second pretreatment structure include multiple functional areas, which are cavities in the first pretreatment structure and the second pretreatment structure, respectively. The inlet of each functional area has a switch structure.

8. The wet etching apparatus according to claim 7, characterized in that, The functional area includes a weighing device and a hot air blower. The weighing device is located at the bottom of the functional area, which is the side of the functional area opposite to the feed inlet. The hot air blower is located on the side wall of the functional area.

9. The wet etching apparatus according to claim 5, characterized in that, Both the first pretreatment structure and the second pretreatment structure include multiple functional areas, including a drying area and a weighing area. In the first solid raw material adding device, the drying area is connected to the first channel, and the weighing area is located on the side of the drying area away from the first channel. A movable baffle is provided between the weighing area and the drying area, and a movable baffle is provided between the weighing area and the first discharge port. In the second solid raw material adding device, the drying area is connected to the second channel, and the weighing area is located on the side of the drying area away from the second channel. A movable baffle is provided between the weighing area and the drying area, and a movable baffle is provided between the weighing area and the second discharge port.

10. A solar cell, characterized in that, The silicon wafer of the solar cell is cleaned using the wet etching equipment described in any one of claims 1 to 9.

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